JPH10209659A - Cooling system with cooling fan - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a cooling system having a cooling fan which has high cooling ability to a heat generation part and prevents temperature rise in a part provided to areas excepting a heat generation part. SOLUTION: In a cooling system with a cooling fan 5, which is provided with a blade 7 is rotated and driven for generating cooling air flow inside a metallic housing 6, a fixing groove 8 is formed in the housing 6. In the heat pipe 3, one end part thereof is connected to a heat generation part to enable heat conduction and the other end part is arranged along the attaching groove 8 to enable heat conduction.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a cooling system using a cooling fan and a heat pipe.

[0002]

2. Description of the Related Art In the field of computers, the output of electronic elements such as arithmetic processing units has been increasing with the increase in functions and processing speed. Various devices for cooling electronic elements have been proposed.

[0003] As one example, in the related art, a microfan is installed inside a case of a personal use computer (hereinafter, referred to as a personal computer), and heat generated from an electronic element together with flowing air generated by the microfan is used as a case. There is a cooling device configured to be discharged to the outside of the device.

On the other hand, one end of the heat pipe is connected to the electronic element so as to be able to conduct heat, and the other end of the heat pipe is connected to an aluminum plate attached to the back surface of the keyboard (the surface on the side of the personal computer case). There is a cooling device configured to be disposed on an electromagnetic shield plate and use this as a heat dissipation surface.

[0005]

By the way, there is a strong demand for miniaturization and weight reduction of computers, and therefore, naturally, the space occupied by the cooling device in the internal space of the case is extremely limited.

However, a cooling device using a microfan has a configuration in which air flows in the space of a case where many components are densely packed, and these components have a large flow resistance. In addition, these parts are apt to get stuck, and in addition, these parts inevitably rise in temperature in places where they come into positive contact with the heated air flow. In order to eliminate both, the micro fan itself must be a large one with strong wind force, and therefore, this type of cooling device has not been a suitable means for a computer in which reduction in size and weight is desired.

On the other hand, a cooling device employing a heat pipe has a structure in which an electromagnetic shield plate provided inside a case is used as a heat dissipation surface, so that the heat of the electronic element transported by the working fluid of the heat pipe is reduced. Is naturally discharged into the case. Therefore, although it is possible to cool the electronic element, heat is easily trapped in the internal space of the case,
There has been a problem that existing components other than the electronic elements are heated.

The present invention has been made in view of the above circumstances, and has as its object to provide a cooling system having a high cooling capacity for a heat generating portion and having a cooling fan capable of preventing a temperature increase of components provided other than the heat generating portion. It is the purpose.

[0009]

In order to achieve the above object, the invention according to the first aspect of the present invention is a rotary drive for generating a cooling air flow inside a metal housing. In a cooling system having a cooling fan provided with blades, a mounting groove is formed in the housing, and the other end of a heat pipe having one end connected to the heat generating portion so as to be able to exchange heat is provided along the mounting groove. It is characterized by being arranged so as to be able to exchange heat.

Therefore, according to the first aspect of the present invention, when the heat generating portion generates heat, the heat is first transmitted to one end of the heat pipe. Then, the working fluid in the liquid phase is heated and evaporates, and the working fluid vapor flows toward the end of the heat pipe container which is disposed on the cooling fan having a low internal pressure, and the housing takes heat away. To condense. Also,
When the cooling fan is operated, the blades are driven to rotate, causing air to flow, and the heat of the heat generating portion of the housing flows to the other together with the air.

Therefore, even when the cooling system according to the first aspect of the present invention is installed in a closed space such as a housing,
Heat does not accumulate in the internal space of the housing, the heat generating portion is cooled well, and there is no possibility that other components provided in the housing are unnecessarily heated.

Also, since the heat pipe is attached to the housing while being fitted in the attachment groove,
It is excellent in the so-called mountability between the heat pipe and the cooling fan.

The invention according to claim 2 is characterized in that a metal case is provided for covering a portion of the heat pipe attached to the housing.

Therefore, according to the second aspect of the present invention, both the condensing portion of the heat pipe is covered with the metal housing and the case, and the heat transfer area between the heat pipe and the cooling fan is the first aspect. Since the cooling capacity is larger than that of the invention, the cooling capacity is further improved.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to FIGS. The example shown here is an example applied to cooling of a CPU mounted on a notebook personal computer. Reference numeral 1 indicates a personal computer case. The personal computer case 1 is a hollow container formed of a metal panel such as a plastic panel or a magnesium alloy. A display (both not shown) which can be freely opened and closed within a predetermined range around a rotation axis is provided on an upper surface portion of the personal computer case 1 in FIG.

A printed circuit board (not shown) is provided substantially horizontally near the bottom inside the personal computer case 1. A CPU 2 corresponding to a heat generating portion of the present invention is mounted on the upper surface of the printed circuit board in FIG.
One end of the heat pipe 3 and the heat transfer block 4 are attached to the upper surface of the CPU 2. More specifically, as an example, the heat pipe 3 employs a copper container having a circular cross section, in which pure water is sealed as a working fluid. The heat pipe 3 has flexibility and can bend the middle part of the container freely.

On the other hand, the heat transfer block 4 includes a CPU
2 is provided as needed to promote heat transfer between the heat pipe 2 and the heat pipe 3, and is a plate-like body made of copper or an aluminum alloy as an example.
A concave portion is formed in the lower surface of the heat pipe 3 in accordance with the shape of the container of the heat pipe 3. And this heat transfer block 4
Is C in a state where the heat pipe 3 is tightly fitted in the concave portion.
It is tightly fixed to the upper surface of the PU 2 by appropriate means (not shown). Therefore, CPU 2 and heat pipe 3
Means that heat can be transmitted to each other.

On the other hand, a micro fan 5 corresponding to the cooling fan of the present invention is provided at the bottom of the personal computer case 1. The micro fan 5 is an axial fan having a configuration in which a rotating impeller 7 is provided coaxially inside a cylindrical metal housing 6. A semicircular mounting groove 8 that follows the container shape of the heat pipe 3 is formed in the outer peripheral portion of the housing 6. The other end of the heat pipe 3 is attached to the groove so as to be fitted therein. That is, the heat pipe 3 is provided along the outer periphery of the housing 6. Therefore, the heat pipe 3 and the micro fan 5 are configured to be able to exchange heat with each other.

The outer peripheral portion of the housing 6 is covered by a case 9 made of a metal such as aluminum or copper, for example. More specifically, the case 9 has a configuration in which, as an example, two blocks 10 and 11 divided in the vertical direction in FIG. 3 are connected. These blocks 1
A semicircular mounting groove 12 following the outer shape of the heat pipe 3 has a semicircular mounting groove 12 following the outer shape of the housing 6, that is, a semicircular mounting groove 12 corresponding to the outer shape of the housing 6. Is formed. Although not particularly shown, the blocks 10 and 11 are configured to be easily detachable from each other by means such as fitting.

The upper block 1 shown in FIG.
A groove 13 having a width approximately equal to the diameter of the heat pipe 3 is formed on the right side surface of the block 0, and the groove 13 is connected to the mounting groove 12 of the lower block 11. That is, in a state where the two blocks 10 and 11 are mounted on the housing 6, the mounting groove 8 of the housing 6 and the case 9
With the mounting groove 12, a circular hollow portion following the container of the heat pipe 3 is formed on the outer peripheral portion of the housing 6, and a part thereof is communicated with the outside of the case 9 by the groove portion 13.

A part of the heat pipe 3 arranged along the outer periphery of the housing 6 is
Is stored along. With this configuration, the heat pipe 3 does not protrude from the right side surface of the case 9 in FIG.

The micro fan 5 configured as described above
Is an exhaust hole (not shown) provided in the personal computer case 1.
Are fixed to the personal computer case 1 by appropriate means in a state of being disposed in the vicinity of. That is, when the micro fan 5 is operated, the air A inside the personal computer case 1 enters the inside of the housing 6 from the CPU 2 side and is sent out through the exhaust hole.

The intermediate portion of the heat pipe 3 is appropriately bent so as to pass through a gap between parts (not shown) provided inside the personal computer case 1, that is, a so-called dead space. The height of the microfan 5 in the installed state is set to be larger than the height of the CPU 2. Therefore, the end of the heat pipe 3 provided on the microfan 5 is provided on the CPU 2. It is located above the end. In addition, if necessary, the outer peripheral portion of the heat pipe 3 at an intermediate portion that does not come into contact with the CPU 2 and the micro fan 5 may be heat-insulated and coated. The heat released to the internal space can be reduced.

Next, the operation of the present invention configured as described above will be described. First, the micro fan 5 is operated. Then, the air A in the personal computer case 1 flows through the inside of the housing 6 of the micro fan 5 and flows out of the personal computer case 1 through the exhaust hole in the direction of the arrow.

On the other hand, when the CPU 2 generates heat due to energization accompanying the use of the personal computer, the heat is transmitted to one end of the heat pipe 3 and the heat transfer block 4. In this case, since the outer peripheral portion of the heat pipe 3 is covered with the heat transfer block 4, the heat of the CPU 2 is favorably transmitted to the heat pipe 3, and the working fluid stored at the bottom of the container is heated. And evaporate. Therefore, heat pipe 3
Of these, the inner surface of the end attached to the heat transfer block 4 serves as an evaporator.

The working fluid that has turned into steam flows toward the end provided in the microfan 5 having a low internal pressure and temperature, and the housing 6 and the case 9 take heat and condense. Therefore, the inner surface of this end portion of the heat pipe 3 becomes a condensing portion. In that case, in the above specific example,
Since the entire outer surface of the portion of the heat pipe 3 connected to the microfan 5, that is, the substantially entire condensing portion is covered by the housing 6 and the case 9, the space between the heat pipe 3 and the microfan 5 Thermal resistance is small.

As described above, since the heat pipe 3 is disposed with a gradient, the operation mode is the bottom heat mode, and the evaporation / condensation cycle of the working fluid is smoothly performed. , Heat transport capacity will be higher. The working fluid that has condensed and returned to the liquid phase flows along the inner surface of the intermediate portion of the container and returns to the evaporating portion, where it is heated and evaporated again.

On the other hand, the heat of the CPU 2 transmitted from the heat pipe 3 to the micro fan 5 is conducted to almost the entire area of the housing 6. Since the flow of the air A is generated inside the housing 6, the CP held by the microfan 5
The heat of U2 is carried by the air A to the outside of the personal computer case 1 via the exhaust hole. Therefore, heat does not accumulate inside the personal computer case 1 and overheating of the CPU 2 during use of the personal computer is prevented.

As described above, while the heat of the CPU 2 is collected in the metal housing 6 by the heat pipe 3, the heat is exhausted to the outside of the personal computer case 1 by the blowing of the micro fan 5. There is an advantage that heat is not collected in the internal space, the cooling capacity is improved as compared with the conventional cooling structure, and an excessive temperature rise of existing parts other than the CPU 2 is prevented. Furthermore, in the above specific example, the heat pipe 3 and the microfan 5 have good mountability, and excellent cooling ability can be obtained from this point as well.

In the above example, since the heat is transferred from the CPU 2 to the micro fan 5 by using the heat pipe 3, the CPU 2 is normally installed near the wall of the personal computer case 1. There is no need to make them adjacent to each other.
The degree of freedom of the layout of PU2 is improved. Further, since the heat pipe 3 is disposed in the dead space, the size of the personal computer case 1 can be reduced as compared with the conventional cooling structure.

Although the cooling of the CPU of the notebook type personal computer has been exemplified in the above specific example, the present invention is not limited to the above specific example. For example, an electronic device mounted on a desktop personal computer, a server, etc. It can also be applied to Further, instead of the heat pipe 3 of a container having a circular cross section, for example, a heat pipe having a container shape flattened in a rectangular shape can be used.

Next, another embodiment of the present invention will be described with reference to FIG. The example shown here is an example in which two grooves 13 are provided in the case 9. The heat pipe 3 is provided on the left side and right side of the block 10 located at the top in FIG.
Each of the grooves 13 has a width approximately the same as the diameter of the groove 13. These grooves 13 are provided in the mounting grooves 8 of the housing 6.
And the mounting groove 12 of the block 11 located below. One end of the heat pipe 3 is inserted into each groove 13, and the heat pipes 3 are arranged along the outer periphery of the housing 6. Accordingly, the housing 6 has a configuration in which the two heat pipes 3 are connected so as to be able to exchange heat.

Here, the other ends of the two heat pipes are:
The heat pipes may be provided in the same heat generating section, or one heat pipe may be provided in a CPU, for example, and the other heat pipe may be provided in another existing part. Therefore, according to the above configuration, there is an advantage that a plurality of heat generating units can be cooled in parallel. In addition, there is an advantage that not only a single tube heat pipe but also a loop heat pipe can be applied.

[0034]

As is apparent from the above description, according to the present invention, the mounting groove is formed in the housing, and the other end of the heat pipe having one end connected to the heat generating portion so as to be able to exchange heat is mounted. Since the heat exchanging section is provided along the groove, the cooling capacity for the exothermic section can be improved more than ever before, while preventing the temperature rise other than the exothermic section.

According to the second aspect of the present invention,
Since the metal case that covers the portion of the heat pipe attached to the housing is provided, the heat transfer area between the heat pipe and the cooling fan is larger than that of the first embodiment, and as a result, the cooling capacity is increased. Can be further improved.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a specific example of the present invention.

FIG. 2 is a schematic view showing a micro fan.

FIG. 3 is a schematic diagram showing a case.

FIG. 4 is a schematic diagram showing a state in which a heat pipe is connected to a microfan.

FIG. 5 is a schematic view showing a case having a configuration having two grooves.

[Explanation of symbols]

1 ... PC case, 2 ... CPU, 3 ... Heat pipe, 5 ... Micro fan, 6 ... Housing, 7 ...
Impeller, 8 mounting groove, 9 case, 12 mounting groove, 13 groove.

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Inventor Masataka Mochizuki 1-5-1, Kiba, Koto-ku, Tokyo Inside Fujikura Co., Ltd. (72) Koichi Masuko 1-5-1, Kiba, Koto-ku, Tokyo Stock Company Inside Fujikura Ltd. (72) Inventor Kazuhiko Goto 1-5-1 Kiba, Koto-ku, Tokyo Co., Ltd. Inside Fujikura Co., Ltd. (72) Inventor Yuji Saito 1-1-5-1 Kiba, Koto-ku, Tokyo Co., Ltd.

Claims (2)

[Claims] 1. A cooling system having a cooling fan provided with a rotationally driven blade for generating a cooling air flow inside a metal housing, wherein a mounting groove is formed in the housing, A cooling system having a cooling fan, characterized in that the other end of a heat pipe having one end connected to a heat generating part so as to be able to exchange heat is arranged along a mounting groove so as to be able to exchange heat. 2. The cooling system according to claim 1, further comprising a metal case that covers a portion of the heat pipe attached to the housing.