JP3977341B2 - Heat dissipation hinge structure for electronic devices - Google Patents

Description

  The present invention is applied to an electronic device in which a pair of housings are connected so as to be openable and closable via a hinge mechanism such as a notebook personal computer, for example, and a heat dissipation hinge structure for radiating heat-generating components such as an internal CPU It is about.

  An example of the heat dissipation hinge structure of this type of electronic device is one applied to a notebook personal computer (hereinafter abbreviated as a personal computer) (see, for example, Patent Document 1). In the heat dissipation hinge structure disclosed in Patent Document 1, a CPU side housing and a display side housing of a personal computer are connected so as to be openable and closable via a pair of left and right hinge mechanisms, and a CPU stored in the CPU side housing is generated. One hinge mechanism is used to transmit the heat to the display-side housing and dissipate it.

  In the CPU side housing, the evaporation side end of the heat pipe is connected to the heat transfer block on the CPU, and the heat pipe protrudes into the display side housing through a circular hole formed in the CPU side housing. A metal hinge member is fixed in the display-side housing, and the condensation side end of the heat pipe is inserted into an insertion portion provided through the hinge member. A so-called slitting process is applied to the insertion portion of the hinge member, and the condensation side end portion of the heat pipe is rotatably held within the insertion portion with an appropriate sliding resistance by the elastic force of the hinge member itself. .

Since the circular hole and the insertion part of the hinge member are provided so that the other side hinge mechanism and the opening / closing axis line coincide with each other, when opening and closing both housings, one hinge mechanism uses the condensation side end of the heat pipe. The hinge member pivots around the center to guide the opening and closing of the housing.
As is well known, the heat pipe is configured to perform heat transfer using latent heat of vaporization of the working fluid sealed inside. Therefore, the heat generated by the CPU in accordance with the operation of the personal computer is transmitted to the hinge member through the heat pipe, and is radiated from the hinge member to the display-side housing having a relatively low temperature. In this personal computer, in order to obtain a higher heat dissipation effect, consideration is given to heat transfer from the hinge member to the display-side housing via another heat pipe.
Japanese Patent Laid-Open No. 10-187284

In the above-described heat dissipation hinge structure of a personal computer, opening and closing is guided by a heat pipe having a hollow structure and insufficient strength in one hinge mechanism, which may cause damage to the heat pipe.
SUMMARY OF THE INVENTION An object of the present invention is to provide a heat dissipation hinge structure for an electronic device that can improve the strength of the hinge mechanism and prevent problems such as breakage of a heat pipe.

In order to achieve the above object, according to the first aspect of the present invention, a radiating hinge member is provided at a connecting portion of a pair of housings that can be opened and closed with respect to each other, and the radiating hinge member is rotated on an opening / closing axis of the two housings. In the heat dissipation hinge structure of the electronic device that connects the heat pipe movably and dissipates the heat of the heat-generating component provided in one housing to the other housing side via the heat pipe and the heat dissipation hinge member,
The heat dissipating hinge member is provided with a positioning hole on the same axis as the supporting shaft of the fixed hinge of the hinge mechanism for guiding the opening and closing of the two housings, and the supporting shaft of the fixed hinge rotates in the positioning hole. The positioning hole excluding the fitting portion is opened upward to form a pipe receiving groove, and the heat pipe is rotatably held in the pipe receiving groove. It is a feature . Therefore, both housings are guided to open and close by the hinge mechanism regardless of the heat pipe, so that excessive external force does not act on the heat pipe, so that the damage is prevented and the heat pipe rotates during assembly. Since the center automatically matches the opening / closing axis of the hinge mechanism, it is possible to prevent an excessive force from acting on the heat pipe when the housing opens / closes around the opening / closing axis.

The invention according to claim 2 is characterized in that, in the invention according to claim 1, the fixed hinge of the hinge mechanism comprises only a support shaft, and the support shaft is press-fitted and fixed in the positioning hole. In this case, the heat dissipating hinge member also functions as the fixed hinge, and rotates around the support shaft while the bearing portion of the movable hinge is in sliding contact to guide the opening and closing of the housings 1 and 2. Thus, the omission of the fixed hinge 4 can reduce the number of parts, and the hinge mechanism can be downsized to increase the effective space in the housing .

  As described above, according to the heat dissipation hinge structure of the electronic device according to the first aspect of the present invention, since the opening and closing of the housing is guided by the hinge mechanism regardless of the heat pipe, an excessive external force does not act on the heat pipe. Troubles such as breakage can be prevented in advance, and the center of rotation of the heat pipe automatically matches the opening / closing axis of the hinge mechanism during assembly, so that the heat pipe can be more reliably prevented from being broken and assembled. Simplification of work can be achieved.

According to the heat radiation hinge structure of the electronic device of the second aspect of the invention, since the opening and closing of the housing is guided by the hinge mechanism regardless of the heat pipe, the heat pipe is not damaged by an excessive external force. In addition to the effect of the first aspect of the invention that trouble can be prevented, the number of parts can be reduced by omitting the fixed hinge, and the hinge mechanism can be miniaturized to increase the effective space in the housing .

Hereinafter, an embodiment in which the present invention is embodied in a heat dissipation hinge structure of a notebook personal computer will be described.
As shown in the perspective view of the assembled state of FIG. 1 and the exploded perspective view of FIG. 2, the personal computer of the present embodiment can be expressed roughly by connecting the CPU side housing 1 and the display side housing 2 to a pair of left and right hinge mechanisms 3. Although not shown, a keyboard is provided on the CPU side housing 1 and a liquid crystal display is provided on the display side housing 2 (not shown). Both housings 1 and 2 are opened / closed about the opening / closing axis L of the hinge mechanism 3 to switch between a closed storage position including the keyboard and the liquid crystal display and a use position opened by exposing the keyboard and the liquid crystal display. It is possible.

The CPU-side housing 1 and the display-side housing 2 are manufactured by bending an aluminum plate, and each has a thin box shape in which a surface on which a keyboard and a liquid crystal display are disposed is opened. The two hinge mechanisms 3 have the same configuration and are symmetrical with each other, and are each composed of a fixed hinge 4 and a movable hinge 5.
Hereinafter, the left hinge mechanism 3 will be described as an example. The fixed hinge 4 is bent into an L shape from a stainless steel plate, and one side surface thereof is fixed to the bottom surface in the CPU side housing 1 by screws 6a and nuts 6b. At the same time, a support shaft 4a is fixed to the other side surface along the opening / closing axis L of the housings 1 and 2. The movable hinge 5 is made of a stainless steel plate, and the base end side thereof is fixed to the bottom surface in the display side housing 2 by screws 6a and nuts 6b, and the tip end side thereof is curved to form a cylindrical bearing portion 5a. Yes. The support shaft 4a of the fixed hinge 4 is inserted into the bearing portion 5a of each movable hinge 5, and the CPU side housing 1 and the display side housing 2 are arranged around the support shaft 4a (that is, the opening / closing axis L) as described above. Opens and closes.

The housings 1 and 2 may be manufactured by molding plastic or magnesium alloy. In this case, the nut 6b may be integrally formed with the housings 1 and 2. Moreover, the fixed hinge 4 and the movable hinge 5 should just be an elastic body, for example, may be manufactured with phosphor bronze.
The personal computer is used with the display side housing 2 opened upward in a posture in which the CPU side housing 1 is placed on a desk. However, due to the elasticity of the bearing portion 5a, an appropriate sliding distance is provided between the personal computer and the internal support shaft 4a. Since consideration is given to generating dynamic resistance, the display-side housing 2 can be fixed at an arbitrary angle.

  As shown in the enlarged sectional views of FIGS. 2 and 3, a heat radiating hinge member 7 made of aluminum die casting is disposed on the left side of the left hinge mechanism 3, and a mounting surface 7a extending downward is provided with a screw. It is fixed to the bottom surface in the CPU side housing 1 by 6a and nut 6b. The radiating hinge member 7 has a positioning hole 8 penetrating on the same axis as the support shaft 4a of the fixed hinge 4, and a holding hole 9 penetrating in parallel to the lower side thereof. The distal end of the support shaft 4a of the fixed hinge 4 is pivotably fitted to the positioning hole 8 from the right side, and the positioning hole 8 is opened upward to remove the pipe receiving groove 10 except for the fitting portion. Forming. An extension guide portion 11 having a circular arc cross section is formed on both sides of the pipe receiving groove 10, and a latching groove 12 is formed below the both extension guide portions 11. The heat dissipation hinge member 7 may be made of a material having good thermal conductivity such as an aluminum extruded material or copper.

  On the other hand, a printed circuit board 15 on which electronic components for performing arithmetic processing are mounted is stored in the CPU side housing 1. In this embodiment, heat is radiated to the CPU 16 as a heat generating component on the printed circuit board 15. Measures are taken. On the CPU 16, a heat transfer plate 17 having a substantially equal square shape is disposed in close contact, and one side of the heat transfer plate 17 is formed in a cylindrical shape so that the evaporation side end 18a of the first heat pipe 18 is formed. It is fixed by caulking. The first heat pipe 18 is bent at right angles along the periphery in the CPU side housing 1, and the other end side condensation side end 18 b is press-fitted and fixed in the holding hole 9 of the heat radiation hinge member 7. The radiating hinge member 7 is caulked from the side surface to prevent detachment.

  An evaporation side end 19a of the second heat pipe 19 is disposed in the pipe receiving groove 10 of the heat dissipation hinge member 7, and a pipe fixing bracket 20 bent from an elastic material such as a stainless steel plate or phosphor bronze is provided from above. It is fitted. A latching portion 20a is formed at the lower ends of both side surfaces of the pipe fixing bracket 20, and the pipe fixing bracket 20 radiates heat by latching the latching portion 20a on the latching groove 12 of the radiating hinge member 7 by its own elasticity. The hinge member 7 is fixed. A pressing portion 20b that is curved downward is formed on the upper surface of the pipe fixing bracket 20. The pressing portion 20b elastically presses the evaporation side end portion 19a of the second heat pipe 19 from above, so that the inside of the pipe receiving groove 10 Holds in a rotatable manner.

Here, in this embodiment, the second heat pipe 19 functions as a heat pipe, and the pipe fixing bracket 20 functions as a pipe fixing member. The second heat pipe 19 is bent at a right angle, and its condensing side end 19b is arranged along the periphery in the display side housing 2, and is fixed to the housing by a fixing plate 21 bent from an aluminum plate into a substantially L shape. 2 is fixed.
In addition, between the second heat pipe 19 and the pipe receiving groove 10 or the pipe fixing bracket 20, in order to reduce external force and wear acting on the second heat pipe 19 when the housings 1 and 2 are opened and closed, heat conductive grease is used. The sliding resistance is reduced as much as possible by filling. The heat conductive grease also has an advantage of improving heat transfer efficiency from the heat radiation hinge member 7 to the second heat pipe 19 by eliminating the air layer.

  The first heat pipe 18 and the second heat pipe 19 described above perform heat transfer using the latent heat of vaporization of the working fluid sealed inside, and the operation principle is well known, so only an outline is given. explain. The heat pipes 18 and 19 are made of a metal material having good thermal conductivity such as copper and aluminum, and both ends thereof are closed to have a sealed space inside. The surface of the heat pipes 18 and 19 is nickel-plated, and a wick structure such as a groove is lined inside, and a hydraulic fluid suitable for the material of the heat pipes 18 and 19 such as water, acetone, or the like. After a predetermined amount of chlorofluorocarbon or the like is sealed, the pressure is reduced to a predetermined pressure in advance.

During the operation of the personal computer configured as described above, the heat dissipation action of the CPU 16 is exhibited as described below.
When the CPU 16 generates heat with the operation of the personal computer, the heat is concentrated on the evaporation side end portion 18a of the first heat pipe 18 via the heat transfer plate 17 to evaporate the internal working fluid. Due to the evaporation at this time, the internal pressure of the evaporation side end 18a rises, and the generated steam flows to the condensation side end 18b having a lower pressure, and is cooled and condensed in the condensation side end 18b. This condensate is returned to the evaporation side end 18a through the wick structure by capillary action, and is evaporated again by the heat from the CPU 16. By repeating this cycle, the latent heat of vaporization is transmitted from the CPU 16 side to the heat radiation hinge member 7 via the first heat pipe 18 and further radiated from the heat radiation hinge member 7 to the CPU side housing 1. A part of the heat transmitted to the heat dissipation hinge member 7 is transmitted to the display-side housing 2 through a similar heat transfer cycle repeated in the second heat pipe 19. Since the display-side housing 2 has a relatively low temperature without storing electronic components therein, heat can be radiated more efficiently than the CPU-side housing 1.

  Here, as described above, the evaporation side end portion 19 a of the second heat pipe 19 is pressed against the pressing portion 20 b of the pipe fixing bracket 20, and thus is always in close contact with the inner wall of the pipe receiving groove 10 of the radiating hinge member 7. Sufficient contact area is secured. Therefore, heat transfer from the heat dissipation hinge member 7 to the second heat pipe 19 is ensured, and a large heat dissipation effect can be obtained also in the display-side housing 2.

  On the other hand, as apparent from the above description, in the present embodiment, the right hinge mechanism (not shown) is of course, and the left hinge mechanism 3 is also independent of the heat pipes 18 and 19 at all. It is configured to function as a hinge. That is, as described in JP-A-10-187284, the heat pipes 18 and 19 are not used for opening and closing guidance, so that an excessive external force does not act on the heat pipes 18 and 19, and the damage is prevented. Can be prevented. This type of notebook-type personal computer receives unexpected handling such as holding the display-side housing 2 and lifting it, but can sufficiently withstand such handling.

Next, an assembling procedure of the heat dissipation hinge structure of the personal computer configured as described above, particularly a connection procedure between the evaporation side end 19a of the second heat pipe 19 and the heat dissipation hinge member 7 will be described.
When connecting the second heat pipe 19 and the heat dissipation hinge member 7, the heat dissipation hinge member 7 and the fixed hinge 4 are fixed to the CPU side housing 1 in advance, and the movable hinge 5 is attached to the support shaft 4 a of the fixed hinge 4. The bearing 5a is fitted. Further, the condensation side end 18b of the first heat pipe 18 from the CPU 16 side is press-fitted into the holding hole 9 of the heat dissipation hinge member 7. On the other hand, the second heat pipe 19 is fixed to the display-side housing 2 by a fixing plate 21.

  In this state, when the left and right movable hinges 3 are fixed to the normal position of the display-side housing 2 by screws 6a and nuts 6b, the evaporation side end 19a of the second heat pipe 19 is naturally in the pipe receiving groove 10 of the heat dissipation hinge member 7. Arranged from above. Next, when the pipe fixing bracket 20 is fitted into the heat dissipation hinge member 7 from above, the latching portions 20a on both sides are guided by the extended guide portions 11 of the heat dissipation hinge member 7 as shown in FIG. After being separated once while being bent, it is latched in the latching groove 12 of the heat dissipation hinge member 7 as shown in FIG. As a result, the pipe fixing bracket 20 is fitted on the heat dissipation hinge member 7 and is pressed by the pressing portion 20b so that the evaporation side end portion 19a of the second heat pipe 19 is held in the pipe receiving groove 10.

Needless to say, it is possible to assemble by a procedure other than the above, but even in that case, the second heat pipe 19 and the heat radiation hinge member 7 are connected in the same manner as described above.
Thus, in order to connect the second heat pipe 19 and the heat dissipation hinge member 7 during assembly, the evaporation side end portion 19a of the second heat pipe 19 is disposed in the pipe receiving groove 10, and the pipe fixing metal fitting from above. It is only necessary to fit 20 in. Therefore, as compared with the conventional example described in the publication in which the heat pipes 18 and 19 need to be inserted along the opening / closing axis L, the assembling work is very easy, and as a result, the assembling work of the personal computer can be simplified.

  On the other hand, when both the housings 1 and 2 are opened and closed, the evaporation side end 19 a of the second heat pipe 19 absorbs a change in angle with the heat radiation hinge member 7 while rotating in the pipe receiving groove 10. Therefore, the evaporation side end 19a of the second heat pipe 19 needs to be positioned on the same axis (that is, on the opening / closing axis L) with respect to the support shaft 4a of the fixed hinge 4a that is the opening / closing center. If the center of the part 19a and the support shaft 4a is deviated, the second heat pipe 19 is bent each time it is opened and closed, which may cause damage. In this embodiment, the evaporating side end portion 19a of the second heat pipe 19 can be easily and reliably secured to the supporting shaft 4a by fitting the supporting shaft 4a of the fixed hinge 4 into the positioning hole 8 of the heat dissipation hinge member 7. This avoids troubles such as breakage of the heat pipe 19 and greatly contributes to simplification of the assembly work.

As an embodiment of the invention of claim 2, for example, as shown in FIG. 5, the fixed hinge 4 fixed to the CPU side housing 1 is omitted and only the support shaft 4 a is provided, and the support shaft 4 a is used as the heat radiation hinge member 7. The positioning hole 8 may be press-fitted and fixed. In this case, the radiating hinge member 7 also functions as the fixed hinge 4 and rotates while the bearing portion 5a of the movable hinge 5 is in sliding contact with the periphery of the support shaft 4a to guide the opening and closing of the housings 1 and 2. To do. Since the number of parts can be reduced by omitting the fixed hinge 4 as described above, the hinge mechanism 3 can be miniaturized and the effective space in the housings 1 and 2 can be expanded. In addition to the functions and effects described in the above embodiment, In addition, the effect of reducing the manufacturing cost and the effect of expanding the degree of freedom of the installation layout of the substrate and the like can be obtained.

  In the above embodiment, the heat of the CPU 16 stored in the CPU side housing 1 is transmitted to the display side housing 2 through the first heat pipe 18, the heat dissipation hinge member 7, and the second heat pipe 19. The layout can be changed in various ways. For example, as in the prior art described in the publication, the heat dissipation hinge member 7 is fixed to the display-side housing 2, and the heat dissipation hinge member 7 is connected to the condensation side end 18b of the first heat pipe 18 from the CPU 16 side. The two heat pipes 19 may be omitted. Even in such a configuration, if the pipe receiving groove 10 of the heat radiation hinge member 7 is aligned with the opening / closing axis L, the housings 1 and 2 can be opened and closed without any trouble, and the heat of the CPU 16 can be transferred to the first heat pipe 18. The heat can be radiated to the display side housing 2 via the heat radiation hinge member 7.

  On the other hand, when the heat-generating component such as the CPU 16 is in the proximity of the opening / closing axis L, the first heat pipe 18 may be omitted. FIG. 6 shows an example of such a configuration. A heat transfer block 31 is formed integrally with the heat dissipation hinge member 7 and fixed to the CPU side housing 1 with screws 6a and nuts 6b. Since one side of the heat transfer block 31 is in close contact with the CPU 16, the heat of the CPU 16 is transmitted to the heat dissipation hinge member 7 side through the heat transfer block 31. Since the heat transfer block 31 is made of a material having good heat conductivity such as copper, gold, silver, graphite, and the heat conduction path from the CPU 16 to the heat dissipation hinge member 7 is short, the first heat pipe 18 is used. Even if not, the heat of the CPU 16 is sufficiently transmitted to the heat radiating hinge member 7 side and can be radiated to the display side housing 2 through the second heat pipe 19.

  FIG. 7 is another example of FIG. 6. In this example, the heat transfer block 41 is a separate member from the heat dissipation hinge member 7, and one side of the heat transfer block 41 is attached to the mounting surface of the heat dissipation hinge member 7. 7a is fixed to the CPU side housing 1 by screws 6a and nuts 6b, and the other side of the heat transfer block 41 is in close contact with the CPU 16 via the heat transfer plate. As with the heat transfer block 31 described above, the heat transfer block 41 and the heat transfer plate 42 are made of copper, gold, silver, graphite or the like, so that the heat of the CPU 16 is transferred to the heat transfer plate 42 and the heat transfer block 41. Then, it is sufficiently transmitted to the heat radiating hinge member 7 side. Also in these other examples of FIGS. 6 and 7, the connection state of the second heat pipe 19 with respect to the heat dissipation hinge member 7 is exactly the same as that of the above-described embodiment, so that the pipe receiving groove 10 of the heat dissipation hinge member 7 is assembled at the time of assembly. The evaporation side end portion 19a of the second heat pipe 19 is disposed inside, and the pipe fixing metal fitting 20 is fitted from above, and can be connected very easily.

  On the other hand, in the said Example, although the heat radiation effect | action was acquired by transmitting the heat | fever of CPU16 to the display side housing 2, you may add another heat dissipation path | route. 8 to 11 show an example in which a heat dissipation path using the heat sink 50 is added based on the example of the heat dissipation hinge structure shown in FIG. 6, and the configuration thereof will be described below. A heat transfer block 31 is disposed on the CPU 16 via a heat conductive rubber 53, and a heat sink 50 is integrally formed with the heat transfer block 31 and the heat dissipation hinge member 7 by aluminum die casting. These members 7, 31, 50 are fixed to the CPU side housing 1 by screws 52 using the boss portions 50 a of the heat sink 50 in addition to the above-described screws 6 a and nuts 6 b. Of course, copper, gold, silver, graphite or the like can be used as the material of the heat sink 50 in the same manner as the heat transfer blocks 31 and 41 described above. The heat sink 50 is formed with a cooling air passage 51 that opens upward. The cooling air passage 51 extends rightward from the heat transfer block 31 and is curved backward, and is formed in a slit shape formed on the side surface of the CPU side housing 1. The exhaust port 54 communicates with the outside. A motor 55a of a cooling fan 55 is disposed on the bottom wall 51a of the cooling air passage 51. Although not shown, the motor 55a is press-fitted and fixed in a recess formed in the bottom wall 51a, and wiring of the motor 55a is performed. Are electrically connected to the printed circuit board 15. The cooling air passage 51 is closed from above by an aluminum cover 56, and the internal cooling fan 55 is exposed upward through a circular air inlet 56 a formed in the cover 56.

  The heat transfer block 31 described above is set to a sufficient plate thickness and has a heat storage function as a so-called heat spreader, and quickly absorbs the heat generated by the CPU 16. Further, since the bottom wall 51a of the cooling air passage 51 is also set to have a sufficient thickness, the heat absorbed by the heat transfer block 31 passes through the low wall 51a and the side wall 51b and the cover 56, that is, the cooling air passage 51. It is promptly transmitted to the entire inner wall. When the cooling fan 55 is rotationally driven by the motor 55a during the operation of the personal computer, the air in the CPU-side housing 1 flows from the intake port 56a into the cooling air passage 51 as shown by arrows in FIGS. When the air is introduced and discharged from the exhaust port 54 and passes through the cooling air passage 51, the heat is taken away from the inner wall and efficiently radiated to the outside. Accordingly, the heat of the CPU 16 can be radiated more reliably, and the amount of heat transmitted to the display side housing 2 through the heat radiating hinge member 7 is reduced, so that the temperature rise of the heat radiating hinge member 7 accompanying heat transfer is assumed. There is no need to ensure the heat resistance of the housings 1 and 2, and the effect that the degree of freedom of material setting can be expanded is also obtained.

  In order to improve heat transfer, for example, a heat pipe 64 may be incorporated in the heat sink 60 as shown in FIGS. In this example, contrary to the above example, the cooling air passage 61 of the heat sink 60 is opened downward and closed by the cover 62, and air is introduced from below by the cooling fan 63 via the intake port 62a of the cover 62. It is configured. And the plate | board thickness of the upper wall 61a of the cooling ventilation path 61 is set large, the pipe groove 61b is formed along the cooling ventilation path 61 in the upper surface of the upper wall 61a, and thermally conductive grease is put in the pipe groove 61b. After the application, the heat pipe 64 is press-fitted and fixed. If comprised in this way, the heat absorbed by the heat-transfer block 31 can be rapidly transmitted to the whole inner wall of the cooling air passage 61 through the heat pipe 64.

  Further, in the above embodiment, the CPU side housing 1 and the display side housing 2 are manufactured from an aluminum plate having good heat dissipation and used for heat dissipation of the CPU 16. However, when the housings 1 and 2 are made of plastic, they are so high. Since the heat dissipation effect cannot be expected, an existing aluminum electromagnetic shield plate provided in the housings 1 and 2 is used for heat dissipation. Specifically, in the above embodiment, the condensation side end 19b of the second heat pipe 19 is connected to the electromagnetic shield plate in the display side housing 2, or the first heat pipe 18 is extended from the CPU 16 to the opposite side. Then, it may be configured by connecting to an electromagnetic shield plate under the keyboard. In the latter case, the working fluid is evaporated at the center of the first heat pipe 18 connected to the CPU 16, and the working fluid is condensed at both ends of the pipe, thereby providing a heat radiation effect.

  On the other hand, in the above embodiment, heat dissipation measures are taken for the purpose of the CPU 16, but the heat-generating component that requires heat dissipation is not particularly limited to the CPU 16, and may be used for heat dissipation of, for example, a transformer and a power supply unit. .

It is a fragmentary perspective view which shows the assembly state of the thermal radiation hinge structure of the electronic device of an Example. It is a fragmentary perspective view which shows a decomposition | disassembly state. It is an expanded sectional view which shows the detail of a thermal radiation hinge member. It is an expanded sectional view when fitting a pipe fixing metal fitting. It is a fragmentary perspective view which shows the assembly state of another example which abbreviate | omitted the fixed hinge. It is a fragmentary perspective view which shows the assembly state of another example which abbreviate | omitted the 1st heat pipe. It is a fragmentary perspective view which shows the assembly state of the other another example which abbreviate | omitted the 1st heat pipe. It is a fragmentary perspective view which shows the assembly state of the other example which added the heat dissipation path using a cooling fan. It is a fragmentary perspective view which shows the decomposition | disassembly state of another example which added the thermal radiation path | route using a cooling fan. It is a fragmentary top view which shows the other example which added the heat dissipation path | route using a cooling fan. It is a fragmentary sectional side view which shows another example which added the thermal radiation path | route using a cooling fan. It is a fragmentary top view which shows the other example which added the thermal radiation path | route using a cooling fan. It is a fragmentary sectional side view which shows the other example to which the heat dissipation path using a cooling fan was added.

Explanation of symbols

1 CPU side housing 2 Display side housing 3 Hinge mechanism 5 Movable hinge (hinge member)
7 Radiating hinge member 16 CPU (heat generating component)
19 Second heat pipe L Open / close axis

Claims (2)

A heat dissipating hinge member is disposed at a connecting portion of a pair of housings that can be opened and closed mutually, and a heat pipe is connected to the heat dissipating hinge member so as to be rotatable on the opening / closing axis of the two housings. In the heat dissipation hinge structure of the electronic device that dissipates the heat of the heat-generating component provided in one housing to the other housing side via the hinge member,
The heat dissipating hinge member is provided with a positioning hole on the same axis as the supporting shaft of the fixed hinge of the hinge mechanism for guiding the opening and closing of the two housings, and the supporting shaft of the fixed hinge rotates in the positioning hole. The positioning hole excluding the fitting portion is opened upward to form a pipe receiving groove, and the heat pipe is rotatably held in the pipe receiving groove. A heat dissipating hinge structure for electronic devices. 2. The heat dissipation hinge structure for an electronic device according to claim 1, wherein the fixed hinge of the hinge mechanism includes only a support shaft, and the support shaft is press-fitted and fixed into the positioning hole .

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