JP3313665B2 - Heat pipe installation status monitoring device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and apparatus for monitoring the installation status of heat pipes, and more particularly to heat radiation for dissipating operating heat generated during the operation of components inside an electronic device. According to a preferred embodiment, heat generated by electronic components during the use of the computer is attached to the CPU side housing inside the CPU side housing member of the notebook computer. The present invention relates to a method and an apparatus for monitoring a state of installation of a heat pipe for transmitting heat to a display-side housing member and monitoring a state of dissipating the heat from the display-side housing member.

[0002]

2. Description of the Related Art Some electronic components used in computers generate heat during normal operation. Among them, microprocessors generate a great deal of heat. Without the ability to remove heat from such heat-generating components, the temperature of those components can rise and eventually reach high enough to reduce their reliability or shorten their life. And may even adversely affect components surrounding the component. In recent years, this has become an increasingly serious problem because the power consumption of microprocessors and other electronic components has increased, and the heat generated accordingly has also increased.

[0003] The structure of current notebook or sub-notebook computers is based on a central processing unit (CP).
U) and a display-side housing that houses a display. The display-side housing is pivotally connected to the CPU-side housing so that it also functions as a lid. . That is, when storing and carrying the computer,
The computer is closed by closing the display side housing, and the keyboard portion of the computer is exposed by opening the display side housing. The display-side housing or lid-side housing contains various components other than the display assembly, however, of the heat generated during operation of the computer, it is generated inside the display-side housing. Heat is a very small fraction.

Generally, most of the heat generated during the operation of a small computer is dissipated by the increase in the surface temperature of the CPU side housing. When the forced circulation of air is not performed inside the CPU side housing, heat is removed from the CPU side housing only by natural convection and radiation. In order to radiate heat from the CPU side housing, two kinds of phenomena, not only the heat spreading to the CPU side housing, but also natural convection and radiation must occur on the surface of the CPU side housing. .

When heat is removed from a surface by natural convection (as opposed to forced convection) or by radiation, the amount of heat that can be removed depends on the surface area of the surface where natural convection or radiation occurs, The upper limit is determined by the temperature difference between the surface and the surrounding environment (eg, air). In a notebook computer, the surface temperature of a housing component such as a housing must not be so high that a user of the computer feels uncomfortable. However, in a computer designed with special emphasis on miniaturization, such as a notebook computer, the surface area of the housing is inevitably small. It is inevitable that the surface temperature increases in accordance with the amount of heat generated.
These two conditions, that is, the condition that the surface temperature must be maintained at a relatively low temperature, and the condition that the relatively large surface area must dissipate a relatively large amount of operating heat are basically contradictory. Things.

Therefore, for designers of small computers such as notebook computers, in order to dissipate heat to the surrounding environment by using two types of heat transfer mechanisms, natural convection and radiation, there is room for available surface area. It is important to actually use as much of the part as possible. When the heat transfer amount per unit time is the same, the average surface temperature of the housing can be reduced as the area of the surface of the housing that is provided for heat transfer is larger.

[0007] In this regard, the back side of the display side housing of a notebook computer has not been fully utilized so far. That is, during the operation of the computer, the temperature rise generated on the back surface of the display-side housing was very small, if not negligible. On the other hand, the surface temperature of the CPU-side housing has reached a high temperature at which the user feels something strange when touched.

A device manufactured by adopting a method in which heat generated in a CPU-side housing during operation of a computer is efficiently transferred to a display-side housing, and then dissipated from the display-side housing into ambient air. Does not exist so far. As described above, the method generally used for heat dissipation until now is to use a fan, dissipate heat from the surface of the CPU-side housing, or use both of them in combination. Until now, the clear use of the display-side housing as the heat dissipating member itself has not been performed. Also, no attempt has been made to actively transfer heat between the CPU-side housing and the display-side housing.

By utilizing the display-side housing, it is possible to significantly increase the area of the entire surface of the computer housing member which functions to dissipate the heat of operation by convection and radiation.
That is to be expected. However, there has been great difficulty in efficiently using the surface of the display-side housing as a heat radiation surface for dissipating heat generated in the CPU-side housing. The difficulty is
This is because the display-side housing rotates between the open position and the closed position with respect to the CPU-side housing, which is the main body-side housing of the computer. Heat transfer between two points fixed to each other is generally not difficult, but heat transfer between two points whose relative positions change is particularly difficult for notebook and sub-notebook types. However, it is not easy for a computer in which a restriction that it must be made small is imposed.

A conventional method and apparatus for monitoring the installation state of a heat pipe will be described in detail with reference to the drawings.

FIGS. 3A and 3B are a perspective view and a partial sectional view showing a first conventional example (for example, see Japanese Patent Application Laid-Open No.
187284).

The computer 10 includes a CPU side housing member 12 which is a main body side housing member, and a display side housing member 14 which is a lid side housing member. The CPU-side housing 12 has a substantially rectangular parallelepiped overall shape, and includes a bottom wall portion 16 and a peripheral wall portion 18 rising from the bottom wall portion 16. Further, the corner of the peripheral wall portion 18 is formed as a concave portion 18a which is recessed inward. The upper surface side of the CPU side housing 12 has an open opening 20, and a keyboard assembly (not shown) is horizontally mounted so as to close the opening 20. Various computer circuit components are housed in the CPU side housing 12, and a printed circuit board 22 is shown in the figure as a typical example thereof. The printed circuit board 22 is attached to the bottom wall 16. Various heat-generating components (components that generate heat during operation) are mounted on the printed circuit board 22, and the processor chip 24 is shown as a typical example of the heat-generating components. Processor chip 24 is mounted on top of printed circuit board 22.

The display side housing 14 has a CPU
It is formed in a substantially rectangular parallelepiped shape conforming to the shape of the side housing 12, and has a top wall portion 26 and a peripheral wall portion 28 having a shape hanging down from the top wall portion 26. The lower surface side of the display-side housing 14 is an open opening 30, and a display screen 32 is mounted so as to close the opening 30. The display screen 32 has a metal outer frame 34. Generally, the CPU side housing 12 includes a processor chip 24 shown as a representative example here.
In addition, various heat-generating components (not shown) are accommodated, while the display-side housing 14 accommodates relatively few heat-generating components or devices.
Therefore, in a conventional notebook computer having a general structure, during operation, the temperature felt when touching the CPU side housing is considerably higher than when touching the display side housing. At this time, each housing dissipates the heat generated inside itself to the surrounding environment mainly by a heat transfer mechanism of radiation and natural convection. As the operating speed of notebook computers has increased and the processing capacity has increased, CP
The load of the operating heat inside the U-side housing is also increasing, and therefore the surface temperature of the CPU-side housing is approaching a high temperature that makes the user feel uncomfortable.
Accordingly, there has been a growing urgency for a more powerful heat radiation method that surpasses the conventional method of radiating heat to the surrounding environment by radiation and natural convection from the CPU side housing.

This demand for enhancing the function of dissipating the heat generated by the CPU-side housing of the notebook computer has been further strengthened by the current trend toward further miniaturization of the computer. As a matter of course, when the size of the computer is reduced, the surface area of the CPU-side housing that functions to radiate the operating heat generated inside the CPU-side housing to the surrounding environment by radiation and natural convection also decreases. In recent notebook-type and sub-notebook-type computers, the size of the housing that covers the surrounding space has been reduced, so that the operating heat generated inside the CPU-side housing, such as an internal cooling fan, is discharged to the outside. With a general auxiliary method, it is extremely difficult to incorporate a cooling fan or the like, and even if incorporated, a sufficient effect cannot be obtained.

On the other hand, the operating heat generated by the processor 24 (and possibly other heat-generating components) is
The heat can be transferred to the display-side housing 14, and the large surface area of the display-side housing 14 is used to increase radiation to the surrounding environment of the CPU-side housing 12 and heat radiation by convection.
In order to do this, a heat dissipating friction hinge mechanism 36 having a special structure is used. The notebook computer further includes another hinge mechanism (not shown), which has a general structure. The hinge mechanism 36 cooperates with the hinge mechanism (not shown) to pivotally connect the display-side housing 14 to both rear corners of the CPU-side housing 12, thereby causing the display-side housing 14 to be substantially upright. It is rotatable between a use position and a substantially horizontal closed position (not shown).

The hinge mechanism 36 not only performs the above-mentioned pivoting function, but also functions to transfer, that is, conduct heat, a large amount of heat generated by the processor 24 to the display-side housing 14. In order to perform the function of transferring heat, the hinge mechanism 36 is configured to use a thermosiphon heat pipe 38. The thermosiphon heat pipe itself is
It is generally known. This heat pipe 3
8 is capable of transferring heat to and from the processor 24;
The heat pipe 38 defines a part of the heat radiation hinge mechanism 36 in a unique configuration.

The heat pipe 38 includes a copper outer tube 40.
And has both ends sealed, and has an evaporating end 38a for receiving heat and a condensing end 38b for releasing the received heat. The inside of the heat pipe 38 is depressurized, and an appropriate amount of evaporative and condensable heat transfer liquid such as water is sealed therein. The inner surface of the outer tube 40 of the heat pipe 38 is coated over its entire length with a suitable impregnating material 42 having a capillary action.

The operation system of the heat pipe 38 is a general one. That is, the evaporation side end 38a of the heat pipe 38
When the heat is transferred to the evaporating liquid, the liquid impregnated in the impregnating material on the inner surface of the evaporating end 38a evaporates to vapor, and the vapor passes through the internal space of the heat pipe 38 and condenses to the condensing end. 38b and this heat pipe 3
At the condensation side end 38b of FIG. 8, heat is removed from the vapor. This cools the steam at the condensing side end 38b of the heat pipe, so that the steam condenses and returns to a liquid,
The liquid is absorbed by the impregnating material 40 on the inner surface of the condensing side end 38b and returned to the evaporating side end 38a of the heat pipe 38 by capillary action. Then, by evaporating again at the evaporating side end 38a, the thermosiphon heat transfer cycle described above is repeated.

A heat transfer block 46 made of copper is provided on the upper surface of the processor 24, and the operating heat generated by the processor 24 is transmitted to the heat transfer block 46 by heat conduction. Further, the evaporation side end 38a of the heat pipe 38 is attached to the upper surface of the heat transfer block 46 in contact with the heat transfer block 46, so that the heat of the heat transfer block 46 is also condensed by the heat conduction.
It is transmitted to. In the illustrated embodiment, the condensing side end 38b of the heat pipe 38 extends to the outside through a circular hole 48 formed in the peripheral wall 18 of the CPU side housing 12, and is formed in the hinge member 52. It is pivotally supported by a cylindrical insertion portion 50. This hinge member 52 is
It is fixed to the inner surface of the display-side housing 14 by an appropriate means, and is capable of conducting heat with the display-side housing 14.

In the illustrated example, the hinge member 52 is made of copper, and the display housing 14 is made of plastic (along with the CPU housing 12). However, the display-side housing 14 may be made of metal. In this case, the hinge member 52 may be formed integrally with the metal display-side housing.

As shown in FIG. 3B, the hinge member 5
2 has a base portion 54 having a circular cross-sectional shape with a part thereof being cut off, and the above-described cylindrical insertion portion 50 is formed through the base portion 54. Further, the hinge member 52 is formed with a radial slit 56 extending upward from the lower side of the base portion 54 and reaching the through portion 50 as viewed in FIG. The hinge member 52 further includes an upwardly projecting portion 58 having a circular cross-sectional shape with a part thereof being omitted. A cylindrical insertion portion 60 is formed through the upper protruding portion 58, and the insertion portion 60 extends in parallel with the above-described insertion portion 50.

As described above, the hinge mechanism 36 has a unique structure in which a part thereof is formed by the condensing side end 38a of the heat pipe 38.
The mechanism as a whole allows the display-side housing 14 to rotate relative to the CPU-side housing 12 and allows the user to adjust the angular position of the display screen 32 with respect to the CPU-side housing 12 when using the computer. And can be fixed. Thus, hinge mechanism 36 is a friction hinge mechanism with adjustable frictional force, ie, a rotating "clutch".
Also, its “threshold” torque is
8 is maintained by the frictional force acting between the condensing side end 38 b and the hinge member 52. When changing the angular position of the display-side housing 14 with respect to the CPU-side housing member 12 of the computer 10, the user needs to apply a force large enough to overcome the threshold torque. In other words, the threshold torque prevents the display-side housing 14 from easily falling back and forth from the set use angle position, and is rotated when an external force is applied. In this way, the display side housing 14 is supported.

Copper is used as a material of the hinge member 52 and a material of the outer tube 40 of the thermosiphon heat pipe 38 because copper has a large thermal conductivity. It is preferable to improve friction and wear characteristics of a sliding surface of the pivot clutch mechanism between the condensing side end 38b of the heat pipe 38 and the hinge member 52.
A thin layer 62 of a friction material is provided on the outer peripheral surface of the agglomerated side end 38b of the heat pipe 38, and the inner circumferential surface of the insertion portion 50 of the hinge member 52 that pivotally supports the agglomerated side end 38b of the heat pipe 38 is also provided. Preferably, a thin layer 64 of material is provided. This friction material is preferably a metal material having a higher hardness than copper. Specifically, for example, the outer peripheral surface of the condensing side end 38 b of the heat pipe 38 and the insertion portion 50 of the hinge member 52 are inserted.
A chromium film may be applied by electroplating to the inner peripheral surface of the
A thin steel band may be press-fitted into the outer peripheral surface of the condensation side end 38b of the heat pipe 38 in a ring shape. Since the above-described radial slit 56 is formed in the hinge member 52, the aggregation end 38 b of the heat pipe 38 is formed.
When the is inserted into the insertion portion 50, the base 54 of the hinge member 52 is slightly "elastically" expanded in the lateral direction as viewed in FIG. The friction clutch force acting between 62 and 64 is maintained at an appropriate level.

During the operation of the computer 10, the operating heat generated by the processor 24 is transmitted to the evaporation side end 38 a of the heat pipe 38 via the heat transfer block 46. The operating heat transferred to the evaporating end 38a of the heat pipe 38 is transferred to the heat pipe 38 and transferred to the condensing side end 38b of the heat pipe 38, which is the hinge member end. Further, the light is transmitted to the display-side housing 14 via the hinge member 52, and is radiated from the display-side housing 14 to the surrounding environment by radiation and natural convection. Therefore, the heat is CPU
It is suitably “dispensed” to the side housing 12 and the display side housing 14. Therefore, CPU side housing 1
The temperature you feel when you touch 2 is much lower,
Further, the temperature of the components housed in the CPU side housing 12 that are easily affected by heat during operation can be suppressed lower.

In use, the notebook computer 10 is often placed on a horizontal support surface, such as the top of a desk or the top of an aircraft seat back tray.
Therefore, the bottom wall portion 16 of the CPU side housing 12 is opposed to the horizontal support surface in close proximity, and
Radiation from the bottom surface, which is the widest surface of the CPU-side housing 12, and heat radiation due to natural convection are significantly inhibited. On the other hand, the display side housing 14
Is suitable for dissipating heat into the surrounding air by radiation and convection because it is in a standing position when the computer is in use and is entirely exposed to the surrounding air. Therefore, since the large surface area of the display-side housing 14 is used as the heat radiation surface, the heat radiation path of the computer is greatly reinforced.

In the notebook computer 10, an auxiliary heat source is provided to enhance the heat transfer function of transferring the operating heat generated by the components housed in the CPU side housing 12 from the hinge member 52 to the display side housing 14. This is a preferable configuration in which a second heat pipe 66, which is a pipe, is disposed in the display-side housing 14 and used. The heat pipe 66 has the same configuration as the heat pipe 38 described above, and has an evaporation-side end 66a and a condensation-side end 66b. The evaporation-side end 66a is inserted into the insertion portion 60 of the hinge member 52, and the insertion portion 60 is inserted into the insertion portion 5 of the hinge member 52 into which the condensation-side end 38b of the heat pipe 38 is inserted.
It is formed close to zero. On the other hand, heat pipe 66
Is condensed with the display-side housing 14 at a position away from the evaporation-side end 66a.

The heat transmitted from the condensing side end 38 b of the heat pipe 38 to the hinge member 52 is further transferred to the heat pipe 66.
Of the display side housing 1 through the heat pipe 66 and from there through the heat pipe 66.
4 to a position away from the hinge member 52. Thus, the heat generated by the components housed in the CPU side housing 12 is efficiently “spread” along the display side housing 14.

FIG. 4 is a perspective view showing a second conventional example (see, for example, JP-A-09-006481). In the portable information processing apparatus shown in FIG. 4, a heat receiving plate 203 is attached to a heating element 206 built in the main body 200. The heat receiving plate 203 is configured to enter the inside of the main body side hinge portion 204. A heat sink 202 is attached to the display unit, and a heat pipe 201 is further attached to the heat sink 202. The heat pipe 201 passes through the display side hinge portion 205 and penetrates into the main body side hinge portion 204. Further, the heat pipe 201 is wound around the heat receiving plate 203 inside the main body side hinge portion 204 leaving a certain gap. The display unit rotates about an axis that coincides with the center of the heat pipe penetrating the hinge unit. Heat pipe 2
Thermal grease 8 having good thermal conductivity is injected into a gap between the heat receiving plate 01 and the heat receiving plate 203 to seal the end.

FIGS. 5A to 5C are a perspective view, a side view and a plan view showing a third conventional example. (See, for example, Japanese Patent Application Laid-Open No. 10-039955) In the notebook personal computer shown in FIGS. 5A to 5C, one end of a heat pipe A is thermally connected to a heating element 318 in a main body 310, and One end of the heat pipe B is thermally connected to the keyboard 311 or the noise shielding plates 315 and 316 of the liquid crystal display 312 rotatably attached to the rotation shafts 313 and 314 provided on the main body 310, and the heat pipe A , B are thermally connected to each other via a heat conductive sheet 317 having flexibility, so that the heat of the heat generating element 318 can be reduced.
15,316.

[0030]

The above-mentioned prior art has a problem that in a device such as a portable computer which is expected to be used for applications other than tabletop installation, the heat pipe does not operate properly depending on the installation state. Unless the heat radiating plate is positioned above the heat generating portion of the heat pipe, the heat transfer effect cannot be expected. In particular, as in the third conventional example, the heat generating portion and the heat radiating portion are housed in the main body of the portable computer, If the heat pipe is configured to be nearly horizontal, there is a high risk that the heat pipe will be used in a state where the heat radiating plate is located below the heat generating portion.

A temperature sensor is attached to the CPU chip or the like, which is a heat source, so that an alarm can be issued when the temperature of the CPU chip rises because the portable computer is not used properly. There is also a problem that it is not easy to determine whether the cause is the usage posture of the portable computer or another cause.

[0032]

According to a first aspect of the present invention, there is provided a heat pipe installation status monitoring apparatus comprising: a heating element (4) provided on a substrate (407);
02), a heat receiving plate (401) is mounted on the heat receiving plate.
The tilt angle sensor (405) is placed on (401).
One end of the heat pipe (403) is connected to the heat receiving plate (401).
And the other end of the heat pipe (403) is a heat sink
(404) and adjusts the inclination angle of the inclination angle sensor.
When the heat radiator is at a lower position than the heat generator based on
An alarm is generated when

[0033]

A heat pipe installation status monitoring apparatus according to a second invention is the heat pipe installation state monitoring apparatus according to the first invention, wherein the substrate (407) is used for a portable computer.

According to a third aspect of the present invention, there is provided the heat pipe installation status monitoring apparatus according to the first aspect, wherein the heating element (402) is a CP.
It is a U chip.

According to a fourth aspect of the present invention, in the heat pipe installation status monitoring apparatus according to the first aspect, the heat pipe (403) is provided.
, Via thermal hinge mechanism part from the main body of the portable computer is connected to the radiator plate provided in Table radical 113.

According to a fifth aspect of the present invention, in the heat pipe installation status monitoring apparatus according to the first aspect, the heat pipe (403)
Is directly from the heating element (402) at one corner of the main body to the heat sink (404) at the other corner of the main body.

[0038]

Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a flowchart showing one embodiment of the present invention. The installation status monitoring method of the heat pipe shown in FIG.
(A) A first procedure of arranging an inclination angle sensor on a line parallel to a straight line connecting the one end and the other end of a heat pipe having a heating element attached to one end and a heat sink attached to the other end (S1) And (b) a second procedure (S2) of determining whether the other end is at a position lower than the one end based on an output signal of the tilt angle sensor, and (c) the second step. A third procedure for issuing a warning when it is determined that the other end is at a position lower than the one end in the procedure (S3).
And is comprised.

FIGS. 2A and 2B are schematic side views showing one embodiment of the present invention. A heat receiving plate 401 is mounted on a heating element 402 of a substrate 407, and an inclination angle sensor 405 is mounted on the heat receiving plate 401.

One end of the heat pipe 403 is connected to a heat receiving plate 401.
The other end of the heat pipe 403 is
Has been inserted.

The substrate 407 is used, for example, in a portable computer.

The heating element 402 is, for example, a CPU chip.

The heat pipe 403 is, for example, connected to the main body of a portable computer via a thermal hinge mechanism.
Te is connected to the radiator plate provided in Table radical 113.

The heat pipe 403 may extend directly from the heating element at one corner of the main body to the heat sink 404 at the other corner of the main body.

FIG. 2A shows a heat receiving plate 401 and a heat radiating plate 404.
Indicates the same height, and no warning is issued in this case.

FIG. 2B shows that the heat radiating plate 4 is more than the heat receiving plate 401.
04 indicates a lower position, in which case a warning is issued.

[0048]

According to the method and apparatus for monitoring the installation state of a heat pipe of the present invention, a tilt angle sensor is added, so that a warning can be issued if the installation state is inappropriate. The effect is that the installation state can be corrected so that it can be demonstrated.

[Brief description of the drawings]

FIG. 1 is a flowchart illustrating an embodiment of the present invention.

FIGS. 2A and 2B are schematic side views showing an embodiment of the present invention.

FIGS. 3A and 3B are a perspective view and a partial sectional view showing a first conventional example.

FIG. 4 is a perspective view showing a second conventional example.

5 (a) to 5 (c) are perspective views showing a third conventional example,
It is a side view and a top view.

[Explanation of symbols]

 401 Heat receiving plate 402 Heating element 403 Heat pipe 404 Heat sink 405 Inclination angle sensor 407 Substrate

Claims (5)

(57) [Claims] 1. A heating element (402) on a substrate (407).
A heat receiving plate (401) is attached to the heat receiving plate (401).
A tilt angle sensor (405) is placed on the
One end of the IP (403) is inserted into the heat receiving plate (401),
The other end of the heat pipe (403) is inserted into the heat sink (404).
And generates heat based on the tilt angle of the tilt angle sensor.
Generates an alarm when the radiator is lower than the body
Heat pipe installation status monitoring device
Place . 2. A substrate (407) is a portable installation state monitoring device of the heat pipe of claim 1, wherein it is intended to be used in the computer. 3. A heating element (402) is installed condition monitoring apparatus of the heat pipe of claim 1, wherein the CPU chip. 4. A heat pipe (403) is provided from a main body of the portable computer via a thermal hinge mechanism .
Installation conditions device of the heat pipe of claim 1, wherein connected to the radiator plate provided in Table radical 113. 5. A heat pipe (403), the heating element in the corner of the main body (402) from the radiator plate at the other corner of the main body portion (404) to the heat pipe according to claim 1, wherein one leading directly Installation status monitoring device.