JP2007027319A - Mesh material and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mesh material for exhaust that can reduce a pressure loss around an exhaust outlet in a limited small space to improve exhaust heat efficiency, and also to provide an electronic apparatus to which the mesh material is mounted. <P>SOLUTION: An air flow discharged from a jet stream generator 30 passes through a heat sink 20. Since the air flow from the heat sink 20 tends to spread three-dimensionally, it passes through the mesh material 50 in a manner that it may become vertical as much as possible to a curved plane forming the mesh surface of the mesh material 50. The mesh surface of the mesh material 50 is away from the exhaust outlet toward the outside of an enclosure 101. A pressure loss when the air flow passes through the mesh material 50 is thereby reduced so as to increase a flow rate of air, and to improve discharge efficiency of air as well as exhaust heat efficiency. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a mesh material installed at an exhaust port or the like for discharging heat from a heat generation source, and an electronic device equipped with the mesh material.

  Conventionally, an increase in the amount of heat generated from a heating element such as an IC (Integrated Circuit) associated with high performance of a PC (Personal Computer) has been a problem, and various heat radiation technologies have been proposed or commercialized. Yes. As a heat dissipation method, for example, there is a method in which a heat dissipation fin (heat sink) made of a metal such as aluminum is brought into contact with the IC, and heat from the IC is conducted to the heat sink to dissipate heat. Also, there is a method of dissipating heat by forcibly removing, for example, warm air in a PC housing by using a fan and introducing ambient low-temperature air around the heating element. Further, there is a method of forcibly removing the warm air around the heat sink by the fan while using the heat sink and the fan together to increase the contact area between the heating element and the air with the heat sink. Thus, the warm air around the heat sink is discharged to the outside of the casing through the exhaust port of the PC casing.

By the way, the technique which improved the exhaust heat efficiency by devising the shape of the exhaust port of a housing | casing is disclosed (for example, refer patent document 1). In Patent Document 1, one of the plurality of exhaust ports is provided with a pair of upper and lower members (front bulge portion (9a) and rear bulge portion (9b)) provided as a pair. It is formed by projecting to the inside and outside of the body. Thereby, an opening area becomes large and exhaust heat efficiency improves.
JP 2004-259916 A (paragraphs [0010] to [0013], FIG. 2)

  However, in order to prevent the device from being damaged due to the entry of foreign matter into the housing through the exhaust port, the size of the opening of the exhaust port needs to satisfy a predetermined standard, which is very restrictive. Further, due to such restrictions, the pressure loss at the exhaust port portion increases, that is, the exhaust efficiency is lowered, and thus the heat radiation efficiency is inevitably lowered.

  In particular, when an electronic device is downsized, the opening area cannot be increased, and it is difficult for the technique described in Patent Document 1 to cope with the problem of reduced exhaust efficiency. The technique of Patent Document 1 has a problem that the manufacturing process is complicated and the manufacturing cost is high.

  In addition, despite the increase in the amount of heat generated by ICs and the like, there is a strong demand for miniaturization of electronic device bodies, and it is necessary to reduce the pressure loss at the exhaust port in a limited space.

  In view of the circumstances as described above, an object of the present invention is to provide an exhaust mesh material capable of reducing pressure loss in the vicinity of an exhaust port and improving exhaust heat efficiency in a limited space and mounting the same. Is to provide an electronic device.

  It is a further object of the present invention to provide a mesh material capable of suppressing the manufacturing cost and an electronic apparatus equipped with the mesh material.

  In order to achieve the above object, the mesh material according to the present invention is capable of exhausting heat of the heat source through the exhaust port by a heat source, a housing having the heat source and having an exhaust port, and a gas. A mesh material provided in the exhaust port of an electronic device having a heat dissipation mechanism, wherein both end portions attached to the exhaust port and at least a part between the both end portions are outside the casing. And a first mesh surface curved so as to protrude.

  In the present invention, for example, even when the outlet of the gas flow of the heat dissipation mechanism in the housing is near the exhaust port, the curved first mesh surface is provided so as to be separated from the exhaust port. Therefore, it is possible to reduce the pressure loss when the exhaust heat gas flows from the inside of the housing to the outside through the exhaust port by the heat dissipation mechanism, and the exhaust heat efficiency can be increased. In other words, in the present invention, both ends of the mesh material are attached to the exhaust port, and the curved first mesh surface is provided, so that the exhaust part can be exhausted as much as possible in a narrow housing or a limited space of the exhaust port. It is possible to efficiently exhaust heat by increasing the area or volume.

  Moreover, since it is only necessary to provide a mesh material at the exhaust port, for example, the manufacturing cost can be suppressed as compared with the structure of Patent Document 1 or the like.

  The both ends of the mesh material are, for example, both ends in the vertical direction (vertical direction) of the electronic device, both ends in the horizontal direction, or both ends in the oblique direction, and various modes are conceivable.

  Examples of the heat source include electronic parts such as an IC, a coil, and a resistor, or a power source such as a motor.

  The heat dissipation mechanism includes, for example, a gas delivery mechanism that sends at least gas as described later. In addition to the blower device, the heat dissipating mechanism may include a heat sink or a heat transport device using a heat pipe principle or the like that has a heat dissipating effect and a heat transfer effect.

  Electronic devices include computers (in the case of personal computers, laptop computers or desktop computers), PDAs (Personal Digital Assistance), electronic dictionaries, cameras, display devices, audio / visual devices, A projector, a mobile phone, a game device, a car navigation device, a robot device, other electric appliances, and the like can be given.

  Examples of the gas include air, but are not limited thereto, and may be nitrogen, helium gas, argon gas, or other gases.

  In the present invention, the mesh material further includes a planar second mesh surface provided continuously with the first mesh surface. Of the mesh material, in particular, only the portion where the pressure loss is desired to be lowered may be set as the first and second mesh surfaces as appropriate.

  In the present invention, the heat dissipation mechanism includes a heat sink having a first width that is disposed in the vicinity of the exhaust port and is thermally connected to the heat generation source, and the mesh member has the first width. In the direction, it has a second width that is between 105% and 150% of the first width. The gas from the heat sink toward the mesh material flows so as to spread from the heat sink. Therefore, according to the configuration of the present invention, the exhaust heat efficiency can be increased.

  A mesh material according to another aspect of the present invention includes a heat generation source, a housing that includes the heat generation source and has an exhaust port, and a heat dissipation mechanism that can discharge heat of the heat generation source through the exhaust port by gas. A mesh material provided in the exhaust port of the electronic device having a first end and a second end opposite to the first end that are attached to the exhaust port; And a mesh surface formed along a plurality of planes having different angles from the first end portion to the second end portion.

  In the present invention, for example, even if the outlet of the air flow of the heat dissipation mechanism in the housing is near the exhaust port, the mesh surface is formed along a plurality of planes with different angles, and a part of the mesh surface is exhausted. It is provided away from the mouth. Therefore, it is possible to reduce the pressure loss when the exhaust heat gas flows from the inside of the housing to the outside through the exhaust port by the heat dissipation mechanism, and the exhaust heat efficiency can be increased.

  In the present invention, the mesh surface has a first length in a first direction from the first end portion toward the second end portion, and a second length substantially orthogonal to the first direction. The direction has a second length longer than the first length. Alternatively, in the present invention, the mesh surface has a first length in a first direction from the first end portion toward the second end portion, and is substantially perpendicular to the first direction. A second length shorter than the first length in the direction of 2;

  An electronic apparatus according to the present invention includes a heat source, a housing having the heat source built therein and having an exhaust port, a heat dissipation mechanism capable of discharging the heat of the heat source by gas through the exhaust port, and the exhaust And a mesh material having a first mesh surface that is provided at the mouth and is curved so as to protrude outward from the housing.

  For example, in the present invention, when the mesh material has a flat second mesh surface provided continuously with the first mesh surface, the first mesh surface is higher than the second mesh surface. Is arranged. The exhausted hot gas tends to flow upward. By disposing the first mesh surface above the second mesh surface, the first mesh surface is disposed so as to be as perpendicular as possible to the gas flow, so that the heat exhaust efficiency is improved.

  In the present invention, the heat dissipation mechanism is disposed in the vicinity of the exhaust port and is thermally connected to the heat generation source, and a gas delivery device that sends gas toward the heat sink to cool the heat sink. Mechanism. Examples of the gas delivery mechanism include a rotary fan or a jet generating device that discharges gas as a pulsating flow.

  An electronic apparatus according to another aspect of the present invention includes a heat generation source, a housing including the heat generation source and having an exhaust port, and a heat dissipation mechanism capable of discharging heat of the heat generation source through the exhaust port by gas. And a mesh material provided at the exhaust port and formed along a plurality of planes at different angles.

  An electronic device according to still another aspect of the present invention includes a heat generation source, a predetermined surface, an exhaust port opened in the surface, a housing containing the heat generation source, and the heat generation source by gas. A heat dissipating mechanism capable of discharging the heat through the exhaust port, and a planar mesh material provided at the exhaust port so as to face an angle different from the angle of the surface.

  Even with such a configuration, for example, even if the airflow outlet of the heat dissipation mechanism in the housing is near the exhaust port, a part of the mesh material is provided so as to be separated from the exhaust port. It is possible to reduce the pressure loss when the exhaust heat gas flows from the inside of the housing to the outside through the exhaust port.

  As described above, according to the present invention, the heat loss efficiency can be improved by reducing the pressure loss at the exhaust port in a limited space.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a partially broken perspective view showing an electronic apparatus according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a back side of the electronic device illustrated in FIG. 1. 3 is a cross-sectional view of the back side of the electronic apparatus shown in FIG.

  The electronic device 100 is, for example, a laptop PC that includes a main body 102 and a display 103. A housing 101 of the main body 102 includes a heat sink 20 and a jet flow generating device 30 that supplies a synthetic jet toward the heat sink 20. An IC such as a CPU (Central Processing Unit) is thermally connected to the heat sink 20 as a heat source (not shown). The term “thermally connected” means that both are in direct contact, or that both are connected via a heat transfer device (not shown) such as a heat pipe or a heat conductive sheet.

  An exhaust port 101 b is formed on the back surface 101 a of the housing 101. The exhaust port 101b has a rectangular shape, for example. As shown in FIG. 3, the heat sink 20 is disposed in the vicinity of the exhaust port 101 b, and the jet flow generating device 30 is disposed in the vicinity of the heat sink 20. A mesh member 50 according to an embodiment of the present invention is installed in the exhaust port 101b. The exhaust port 101b is configured to be provided on the back side of the housing 101, but may be a side surface or an upper surface of the housing 101.

  FIG. 4 is a perspective view showing the mesh material 50. The mesh material 50 has, for example, an arc-shaped cross section, and is formed by curving thin members vertically and horizontally. The mesh material 50 is made of, for example, resin, metal, or carbon having high thermal conductivity. In the case of a metal, aluminum, copper, stainless steel, etc. are mentioned. As shown in FIG. 3, the upper and lower ends 51 and 52 of the mesh material 50 are mounted on the upper and lower sides of the exhaust port 101b by, for example, welding, pressure bonding, laser bonding, or the like. Alternatively, the mesh material 50 may be integrally formed with the housing 101.

  As shown in FIG. 2, the left and right ends of the mesh material 50 installed in the exhaust port 101 b are covered with, for example, a cover member 58. However, the cover member 58 may also have a mesh structure. The mesh material 50 is, for example, a UL (UNDERWRITERS LABORATORIES INC.) Standard mesh. The cross section of the mesh material 50 does not necessarily have an arc shape, and may be a quadratic function curve shape such as a hyperbola, a parabola, or an elliptic curve.

  FIG. 5 is a cross-sectional view showing the jet flow generating device 30. The jet flow generator 30 includes a housing 32 having a prismatic shape on one side and a cylindrical shape on the opposite side. The housing 32 is made of resin, metal, ceramics, or the like. A vibration plate 35 is provided inside the housing 32 so as to form the chambers 32a and 32b by dividing the inside. The diaphragm 35 is configured by attaching, for example, a planar coil (not shown) to a disk made of resin, metal, or other material. The housing 32 is provided with a mechanism for electromagnetically driving the diaphragm 35 such as a magnet and a yoke (not shown). A predetermined electrical signal is applied to the planar coil by a control unit 36 having a driving IC or the like.

  Two rows of upper and lower nozzles 33 a and 33 b are provided on the front surface of the housing 32. A plurality of nozzles 33a and 33b are provided in the direction perpendicular to the paper surface in FIG. The chamber 32a communicates with air outside the housing 32 through the nozzle group 33a. Similarly, the chamber 32b communicates with air outside the housing 32 via the nozzle group 33b.

  The form of the jet flow generating device 30 is not limited to the above-described form, and various forms are conceivable for the shape and size of the diaphragm 35 such as the housing 32 and the nozzle 33a, the driving method of the diaphragm 35, and the like. The driving method of the diaphragm 35 is not limited to electromagnetic driving, and piezoelectric driving, electrostatic driving, or the like may be used.

  The operation of the jet flow generating device 30 configured as described above will be described. For example, when a sinusoidal AC voltage is applied to the coil of the diaphragm 35, the diaphragm 3 performs sinusoidal vibration. As the diaphragm 35 vibrates up and down in FIG. 5, the volumes of the chambers 32a and 32b alternately increase and decrease, and as a result, air is alternately discharged in a reverse phase through the nozzles 33a and 33b. . When air is discharged from the nozzles 33a and 33b, a pressure is generated around the nozzles 33a and 33b due to a flow velocity generated in the air. As a result, the air around the housing 32 is entrained in the air flow discharged from the nozzles 33 a and 33 b, that is, becomes a synthetic jet, and this synthetic jet is supplied to the heat sink 20. On the other hand, a sound wave is generated independently from each nozzle 33a and nozzle 33b. The cause of the generation of the sound wave may be that the vibration in the vibration plate 35 causes the air in the housing 32 to vibrate, or that the air is turbulent in the housing 32 or the nozzle 33a. However, since each sound wave generated by each nozzle 33a and nozzle 33b is a sound wave having an opposite phase, it is weakened. As a result, noise is suppressed, and noise reduction can be achieved.

  FIG. 6 is a perspective view showing the heat sink 20. The heat sink 20 is configured by arranging a plurality of heat radiation fins 25. For example, a known heat sink may be used, and the heat sink 20 is not limited to the form shown in FIG. A plurality of air circulation holes 26 are formed between the heat radiating fins 25. As shown in FIGS. 1 and 3, the jet generating device 30 and the heat sink 20 are positioned so that the nozzles 33 a and 33 b of the jet generating device 30 face each flow hole 26.

  The operation of the heat dissipation system configured as described above will be described. When a combined jet is generated by the jet generating device 30, an air flow generated by the combined jet passes through the flow hole 26 of the heat sink 20. The air flow passing through the heat sink 20 proceeds while destroying the temperature boundary layer staying on the surface of each radiating fin 25, so that the air flow includes heat. The air flow passing through the heat sink 20 is discharged together with heat to the outside of the housing 101 through the exhaust port 101b and the mesh material 50.

  As shown in FIG. 3, the air flow exiting the heat sink 20 tends to spread three-dimensionally, so that the air flow is as close as possible to the curved surface constituting the mesh surface of the mesh material 50. Then, the mesh material 50 is passed through. Thereby, since the pressure loss when an air flow passes through the mesh material 50 is reduced, the flow rate of air increases. As a result, the air discharge efficiency is increased and the heat exhaust efficiency is improved.

  Further, even when the outlet side of the airflow of the heat sink 20 is near the exhaust port 101b, the curved mesh material 50 is provided so as to be separated from the exhaust port 101b. Also by this, the pressure loss of the airflow that has passed through the heat sink 20 can be reduced. That is, the exhaust heat efficiency can be increased by increasing the area or volume around the exhaust port 101b as much as possible within the limited narrow space in the housing 101.

  Further, by providing the mesh member 50, the dustproof effect can be enhanced as compared with an exhaust port formed of a plurality of small holes, an exhaust port having a lattice-like hole, or the like.

  Furthermore, since only the mesh material 50 needs to be provided at the exhaust port 101b, for example, the manufacturing cost can be suppressed as compared with the structure of Patent Document 1 or the like.

  FIG. 7 is a perspective view showing a mesh material according to another embodiment of the present invention. FIG. 8 is a sectional view thereof. The mesh material 60 has mesh surfaces 60a and 60b formed along, for example, two different angle planes from one end 61 (first end) to the other end 62 (second end). . The both ends 61 and 62 of the mesh material 60 thus configured are mounted on the upper and lower sides of the exhaust port 101b in the same manner as in FIG. 3, so that the mesh material 60 is installed in the exhaust port 101b. Thereby, even if the heat sink 20 is near the exhaust port 101b, the mesh surfaces 60a and 60b are separated from the exhaust port 101b, so that the pressure loss of the air flow from the heat sink 20 can be reduced, and the exhaust heat efficiency can be improved. it can. Further, almost the same as the curved mesh material 50, the air flow that flows out from the heat sink 20 and spreads as close as possible to the mesh surfaces 60a and 60b as much as possible, so that the pressure loss can be reduced.

  9 and 10 are perspective views showing a mesh material according to still another embodiment of the present invention. The mesh material 70 shown in FIG. 9 has a plurality of mesh surfaces 70a, 70b, 70c, 70d, 70e and 70f at different angles from one end 73 to the other end 74 in the longitudinal direction, that is, the left-right direction. Even with such a configuration, the pressure loss of the airflow from the heat sink 20 can be reduced. The mesh material 80 shown in FIG. 10 has a form in which the number of mesh surfaces of the mesh material 70 is increased.

  11 and 12 are cross-sectional views of the back side of a PC provided with a mesh material according to still another embodiment of the present invention. The exhaust port 201b of the PC housing 201 shown in FIG. 11 is provided obliquely with respect to the vertical back surface 201a. The upper and lower ends 90a and 90b of the mesh material 90 having one plane are mounted on the upper and lower sides of the exhaust port 201b that is opened obliquely in this way. With such a configuration, the lower part of the mesh material 90 has a greater distance from the airflow outlet of the heat sink 20 than the upper part. Thereby, the pressure loss of an airflow can be reduced.

  The exhaust port 201b is provided obliquely so that the opening surface faces upward toward the outside of the housing 201. However, conversely, it may be provided obliquely so that the opening surface faces downward. In this case, the mesh material 90 is also installed obliquely so as to face downward toward the outside of the housing 201.

  The exhaust port 301b of the PC housing 301 shown in FIG. 12 is also opened obliquely in the same manner as the exhaust port 201b shown in FIG. The mesh material 110 has a curved upper surface 110a. On the other hand, the lower part is planar. Since the exhausted high-temperature air tends to flow upward, the mesh surface 110b is disposed so that the upper mesh surface 110a is located above the lower mesh surface 110b so as to be as close as possible to the air flow. This improves the exhaust heat efficiency.

  FIG. 13 is a graph showing the relationship between the distance between the heat sink 20 and the mesh material 50 shown in FIG. 4 and the pressure near the airflow outlet of the heat sink 20. As shown in FIG. 4, the size of the mesh material 50 used in this experiment was set such that the horizontal width a = 100 mm, the vertical width b = 15 mm, and the height c = 3 mm. As shown in FIG. 3, the distance between the heat sink 20 and the mesh material 50 is a distance s between the end of the heat sink 20 on the air flow outlet side and both ends 51 or 52 of the mesh material 50. That is, the distance s is a distance from the heat sink 20 to a part of the mesh material 50 closest to the heat sink 20. From this graph, it can be seen that when the distance is 2 mm or more, the pressure in the vicinity of the end portion on the outlet side of the heat sink 20 can be reduced, and when the distance is 2 mm or more, the change is small. Therefore, in this case, the distance is preferably 2 mm or more.

  FIG. 14 is a graph showing the relationship between the size of the exhaust port and the pressure near the air flow outlet of the heat sink 20. The size of the exhaust port refers to the width d as shown in FIG. In the experiment according to this graph, the present inventor conducted an experiment by appropriately changing the width a of the mesh material in accordance with the size of the exhaust port. From this graph, the size of the exhaust port is preferably 110 mm because the pressure decreases from around 110 mm and becomes almost constant. Moreover, as shown in FIG. 6, the lateral width e of the heat sink used in this experiment is 100 mm.

  As a result, it is preferable to use an exhaust port or a mesh material having a width of about 105% to 150%, preferably about 110% of the width e of the heat sink. The upper limit is set to 150% because the exhaust heat efficiency does not change even if the width of the exhaust port is larger than this, and conversely, the dustproof effect may be reduced.

FIG. 15 is a graph showing the pressure near the airflow outlet of the heat sink 20 for each mesh material according to the above embodiment. In the graph, A is a state in which there is no mesh material at the exhaust port 101b, and B is a general planar mesh material. Reference numerals 50, 70 and 80 correspond to the mesh material 50 shown in FIG. 4, the mesh material 70 shown in FIG. 9, and the mesh material 80 shown in FIG. From this graph, it can be seen that the mesh material 50 shown in FIG. 4 has the best exhaust efficiency. Also,
FIG. 16 is a graph with the same purpose as FIG. In the figure, reference numerals 60, 90 and 110 respectively correspond to the mesh material 60 shown in FIG. 7, the mesh material 90 shown in FIG. 11, and the mesh material 110 shown in FIG. Although the mesh material 90 has a planar shape, the inventor conducted an experiment in a state where the mesh material 90 was installed obliquely. From this graph, it can be seen that the example shown in FIG. 12 has the best exhaust efficiency.

  The present invention is not limited to the embodiment described above, and various modifications are possible.

  As the gas delivery mechanism, the jet flow generating device 30 is used in the above embodiment. However, a rotary vane fan may be used. In this case, for example, an axial fan or a centrifugal fan is used.

  For example, the mesh material 110 shown in FIG. 12 is installed in the exhaust port 301b having an oblique opening surface. However, the mesh material 110 may be installed in a normal exhaust port 101b as shown in FIG. In addition to the mesh material 110, various forms of the above-described mesh materials 50, 60, 70, etc. may be mounted on the exhaust ports.

  Each of the mesh members 50, 60, 70, 80, 90, 110 and the shape of the exhaust port are all long, but are not limited thereto. In addition, although a laptop PC is used as the electronic device, a desktop type or an electronic device other than the PC may be used.

  It is also possible to configure one mesh material by combining at least one of the characteristic portions of the mesh materials 50, 60, 70, 80, 90, and 110 according to the above embodiments.

1 is a partially broken perspective view showing an electronic apparatus according to an embodiment of the present invention. It is a figure which shows the back side of the electronic device shown in FIG. It is sectional drawing of the back side of the electronic device shown in FIG. It is a perspective view which shows the mesh material which concerns on one embodiment of this invention. It is sectional drawing which shows a jet flow generator. It is a perspective view which shows a heat sink. It is a perspective view which shows the mesh material which concerns on other embodiment of this invention. It is sectional drawing of the mesh material shown in FIG. It is a perspective view which shows the mesh material which concerns on another embodiment of this invention. It is a perspective view which shows the mesh material which concerns on another embodiment of this invention. It is sectional drawing of the back side of PC provided with the mesh material which concerns on another embodiment of this invention. It is sectional drawing of the back side of PC provided with the mesh material which concerns on another embodiment of this invention. It is a graph which shows the relationship between the distance between a heat sink and a mesh material, and the pressure near the exit of the airflow of a heat sink. It is a graph which shows the relationship between the size of an exhaust port, and the pressure near the exit of the airflow of a heat sink. It is a graph which shows the pressure of the vicinity of the exit of the airflow of a heat sink for every mesh material which concerns on each embodiment. It is a graph which shows the pressure of the vicinity of the exit of the airflow of a heat sink for every mesh material which concerns on each embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 20 ... Heat sink 30 ... Jet generator 50, 60, 70, 80, 90, 110 ... Mesh material 51, 52, 61, 62, 71, 72, 73, 74, 90a, 90b ... End part 60a, 60b, 70a- 70f, 110a, 110b ... mesh surface 100 ... electronic device 101, 201, 301 ... casing 101a ... back surface 101b, 201b, 301b ... exhaust port

Claims (13)

Provided at the exhaust port of an electronic device having a heat generation source, a housing having the heat generation source therein and having an exhaust port, and a heat dissipation mechanism capable of discharging heat of the heat generation source through the exhaust port by gas. Mesh material,
Both ends mounted on the exhaust port;
A mesh material comprising: a first mesh surface that curves so that at least a part between the both end portions protrudes to the outside of the housing. The mesh material according to claim 1,
The mesh material further comprising a planar second mesh surface provided continuously with the first mesh surface. The mesh material according to claim 1,
The heat dissipation mechanism is
A heat sink having a first width disposed near the exhaust port and thermally connected to the heat source;
The mesh material has a second width that is 105% to 200% of the first width in the direction of the first width. Provided at the exhaust port of an electronic device having a heat generation source, a housing having the heat generation source therein and having an exhaust port, and a heat dissipation mechanism capable of discharging heat of the heat generation source through the exhaust port by gas. Mesh material,
A first end and a second end opposite to the first end attached to the exhaust;
And a mesh surface formed along a plurality of planes having different angles from the first end portion to the second end portion. The mesh material according to claim 4,
The mesh surface has a first length in a first direction from the first end portion to the second end portion, and the second mesh surface in a second direction substantially orthogonal to the first direction. A mesh material characterized by having a second length longer than one. The mesh material according to claim 4,
The mesh surface has a first length in a first direction from the first end portion to the second end portion, and the second mesh surface in a second direction substantially orthogonal to the first direction. A mesh material having a second length shorter than the length of one. A heat source,
A housing containing the heat source and having an exhaust port;
A heat dissipating mechanism capable of exhausting heat of the heat source through the exhaust port by gas;
An electronic apparatus comprising: a mesh material having a first mesh surface which is provided at the exhaust port and is curved so that at least a part protrudes to the outside of the housing. The electronic device according to claim 7,
The said mesh material has the planar 2nd mesh surface provided continuously with the 1st mesh surface, The electronic device characterized by the above-mentioned. The electronic device according to claim 8,
The electronic apparatus according to claim 1, wherein the first mesh surface is disposed above the second mesh surface. The electronic device according to claim 7,
The heat dissipation mechanism is
A heat sink having a first width disposed near the exhaust port and thermally connected to the heat source;
The electronic device according to claim 1, wherein the mesh material has a second width that is 105% to 150% of the first width in the first width direction. The electronic device according to claim 7,
The heat dissipation mechanism is
A heat sink disposed near the exhaust port and thermally connected to the heat source;
An electronic device comprising: a gas delivery mechanism for delivering a gas toward the heat sink to cool the heat sink. A heat source,
A housing containing the heat source and having an exhaust port;
A heat dissipating mechanism capable of exhausting heat of the heat source through gas through the exhaust port;
An electronic device comprising: a mesh material provided at the exhaust port and formed along a plurality of planes having different angles. A heat source,
A housing having a predetermined surface and an exhaust port opened in the surface, and including the heat source;
A heat dissipating mechanism capable of exhausting heat of the heat source through the exhaust port by gas;
An electronic device comprising: a planar mesh material provided at the exhaust port so as to face an angle different from the angle of the surface.