WO2007007491A1

WO2007007491A1 - Mesh material and electronic apparatus

Info

Publication number: WO2007007491A1
Application number: PCT/JP2006/311383
Authority: WO
Inventors: Yumi Yamashita
Original assignee: Sony Corporation
Priority date: 2005-07-14
Filing date: 2006-06-07
Publication date: 2007-01-18
Also published as: TW200719812A; JP2007027319A

Abstract

Provided are a mesh material for exhausting air, capable of, in a limited reduced space, reducing pressure loss near an air exhaust opening of a housing to improve heat exhaust efficiency, and an electronic apparatus having the mesh material mounted on it. Airflow exhausted from a jet flow generation device (30) passes through a heatsink (20). The airflow exiting from the heatsink (20) tends to spread three-dimentionally, and this causes the airflow to pass through a mesh material (50) such that the airflow is perpendicular as much as possible to a curved surface that forms a mesh surface of the mesh material (50). The mesh surface of the mesh material (50) is away toward the outside of a housing (101) from an air exhaust opening. This reduces pressure loss occurring when the airflow passes through the mesh material (50), and as a result, the flow rate of air increases, air exhaust efficiency is enhanced, and heat exhaust efficiency is improved.

Description

Specification

Mesh material and electronic equipment

Technical field

TECHNICAL FIELD [0001] The present invention relates to a mesh material installed at an exhaust port or the like for discharging heat from a heat source, and an electronic device equipped with the mesh material.

Background art

[0002] Conventionally, an increase in the amount of heat generated from a heating element such as an IC (Integrated Circuit) due to high performance of a PC (Personal Computer) has been a problem, and various heat dissipation techniques have been proposed. Has been commercialized. As a heat dissipation method, for example, there is a method in which a heat sink fin (heat sink) made of a metal such as aluminum is brought into contact with the IC, and the heat from the IC is conducted to the heat sink to release the heat. In addition, there is also a method of using a fan to forcibly remove the warm air in the PC housing and for example releasing heat by introducing ambient low-temperature air around the heating element. Furthermore, by using a heat sink and a fan together, there is a method of forcibly removing the warm air around the heat sink by the fan while increasing the contact area between the heating element and the air with the heat sink. In this way, the warm air around the heat sink is discharged to the outside of the housing through the exhaust port of the PC housing.

[0003] By the way, a technique that improves the exhaust heat efficiency by devising the shape of the exhaust port of the housing is disclosed (for example, paragraphs [0010] to [0013] and FIG. See 2 ”;). In this “Japanese Patent Laid-Open No. 2004-259916”, one of the plurality of exhaust ports is provided with a pair of upper and lower ridge-like members (front bulge portion (9a) and rear bulge portion). (9b) is formed by projecting to the inside and outside of the casing. This increases the opening area and improves the exhaust heat efficiency.

Disclosure of the invention

[0004] In order to prevent foreign matter from entering the housing through the exhaust port while damaging the device, the size of the exhaust port opening and the like must satisfy a predetermined standard. About big. In addition, due to such restrictions, the pressure loss at the exhaust port portion increases, that is, the exhaust efficiency decreases, so that the heat dissipation efficiency is unavoidably reduced. [0005] In particular, when an electronic device is downsized, the opening area cannot be increased, and the technique described in “Japanese Patent Laid-Open No. 2004-259916” addresses the problem of reduced exhaust efficiency. It is difficult. The technique disclosed in Japanese Patent Laid-Open No. 2004-259916 has a problem that the manufacturing process is complicated and the manufacturing cost is high.

[0006] In addition, despite the increase in the amount of heat generated by ICs and the like, there is a strong demand for miniaturization of electronic device bodies, and it is necessary to reduce the pressure loss at the exhaust port in a limited space. is there

[0007] In view of the circumstances as described above, the object of the present invention is to provide a mesh material for exhaust that can improve the exhaust heat efficiency by reducing the pressure loss near the exhaust port in a limited space. It is to provide an electronic device equipped with this.

[0008] A further object of the present invention is to provide a mesh material capable of suppressing the manufacturing cost and an electronic apparatus equipped with the mesh material.

[0009] In order to achieve the above object, a mesh material according to the present invention includes a heat generation source, a housing having the heat generation source and having an exhaust port, and heat of the heat generation source by gas through the exhaust port. An electronic device having a heat dissipation mechanism that can be discharged in a vacuum is a mesh material provided at the exhaust port, and at least a part between the both end portions attached to the exhaust port and the both end portions is the housing. And a first mesh surface curved so as to protrude outward from the body.

[0010] In the present invention, for example, even if the outlet of the gas flow of the heat dissipation mechanism in the casing is near the exhaust port, the curved first mesh surface is provided so that the exhaust port force is also separated. Therefore, the heat dissipation mechanism can reduce the pressure loss when the exhaust heat gas flows from the inside of the housing to the outside through the exhaust port, and the exhaust heat efficiency can be increased. In other words, in the present invention, both ends of the mesh material are attached to the exhaust port, and the first mesh surface that is curved is provided, so that the exhaust gas is exhausted as much as possible within a narrow housing or a limited space of the exhaust port. It is possible to efficiently exhaust heat by increasing the area or volume of the part.

[0011] Further, since only the mesh material needs to be provided at the exhaust port, for example, the manufacturing cost can be suppressed as compared with a structure such as "JP-A-2004-259916".

[0012] Both end portions of the mesh material are, for example, both end portions in the vertical direction (vertical direction) of the electronic device, both end portions in the horizontal direction, or both end portions in the oblique direction. It is.

[0013] Examples of the heat source include electronic components such as an IC, a coil, and a resistor, or a power source such as a motor.

[0014] The heat dissipation mechanism includes, for example, a gas delivery mechanism that delivers at least gas as described later. In addition to the blower device, the heat dissipation mechanism may include a heat sink or a heat transport device using a heat pipe principle, or the like that has a heat dissipation function and a heat transfer function.

[0015] Electronic devices include computers (in the case of personal computers, laptops or desktops), PDAs (Personal Digital Assistance), electronic dictionaries, cameras, display devices, audio Z Examples include visual equipment, projectors, mobile phones, game equipment, car navigation equipment, robot equipment, and other electrical appliances.

The gas is, for example, a force including air, but is not limited thereto, and may be nitrogen, helium gas, argon gas, or other gas.

In the present invention, the mesh material further includes a flat second mesh surface provided continuously with the first mesh surface. Among the mesh materials, in particular, if the pressure loss is lowered, only the portion is set as the first and second mesh surfaces as appropriate.

[0018] In the present invention, the heat dissipation mechanism includes a heat sink having a first width disposed in the vicinity of the exhaust port and thermally connected to the heat generation source, and the mesh material includes: In the first width direction, the second width is 105% to 150% of the first width. Heat sink force is also applied to the mesh material Gas flows so that the heat sink force spreads. Therefore, according to the configuration of the present invention, the exhaust heat efficiency can be increased.

[0019] A mesh material according to another aspect of the present invention is capable of exhausting heat of the heat source through the exhaust port by a heat source, a housing with the heat source built in and having an exhaust port, and a gas. A mesh material provided at the exhaust port of an electronic device having a heat dissipation mechanism, and a first end portion mounted on the exhaust port and a second end opposite to the first end portion And a mesh surface formed along a plurality of planes at different angles from the first end to the second end.

In the present invention, for example, the outlet of the air flow of the heat dissipation mechanism in the housing is near the exhaust port. In addition, the mesh surface is formed along a plurality of planes at different angles, and a part of the mesh surface is provided so that the exhaust port force is also separated. Therefore, the heat dissipation mechanism can reduce the pressure loss when the exhaust heat gas flows from the inside of the housing to the outside through the exhaust port, and the exhaust heat efficiency can be increased.

In the present invention, the mesh surface has a first length in a first direction from the first end toward the second end, and is substantially orthogonal to the first direction. The second direction has a second length longer than the first length. Alternatively, in the present invention, the mesh surface has a first length in a first direction directed from the first end portion toward the second end portion, and the first direction and A second length shorter than the first length is provided in a second direction that is substantially orthogonal.

[0022] An electronic apparatus according to the present invention includes a heat generation source, a housing having the heat generation source therein and having an exhaust port, and a heat dissipation mechanism capable of discharging heat of the heat generation source through the exhaust port by gas. And a mesh material having a first mesh surface that is provided at the exhaust port and that is curved so that at least a part protrudes to the outside of the housing.

[0023] For example, in the present invention, in the case where the mesh material has a planar second mesh surface provided continuously with the first mesh surface, the first mesh surface is the second mesh surface. It is placed above the mesh surface. The exhausted hot gas tends to flow upward. By disposing the first mesh surface above the second mesh surface, the first mesh surface is disposed so as to be as perpendicular as possible to the gas flow, so that the heat exhaust efficiency is improved.

In the present invention, the heat dissipation mechanism is disposed in the vicinity of the exhaust port and thermally connected to the heat generation source, and is directed to the heat sink in order to cool the heat sink. And a gas delivery mechanism for delivering gas. Examples of the gas delivery mechanism include a rotary fan or a jet generating device that discharges gas as a pulsating flow.

[0025] An electronic device according to another aspect of the present invention is capable of exhausting heat of the heat source through the exhaust port by a heat source, a housing having the heat source built therein and having an exhaust port, and gas. And a mesh material provided along a plurality of planes at different angles, provided at the exhaust port. [0026] An electronic device according to still another aspect of the present invention includes a heat generation source, a predetermined surface, an exhaust port opened in the surface, a housing containing the heat generation source, a gas Thus, a heat dissipation mechanism capable of discharging the heat of the heat source through the exhaust port and a planar mesh material provided at the exhaust port so as to face an angle different from the angle of the surface.

[0027] Even with such a configuration, for example, even if the outlet of the air flow of the heat dissipation mechanism in the housing is close to the exhaust port, a part of the mesh material is provided so that the exhaust port force is also separated. The heat dissipation mechanism can reduce pressure loss when the exhaust heat gas flows from the inside of the housing to the outside through the exhaust port.

Brief Description of Drawings

FIG. 1 is a partially cutaway perspective view showing an electronic device according to an embodiment of the present invention.

FIG. 2 is a diagram showing a back side of the electronic device shown in FIG.

3 is a cross-sectional view of the back side of the electronic device shown in FIG.

FIG. 4 is a perspective view showing a mesh material according to an embodiment of the present invention.

FIG. 5 is a cross-sectional view showing a jet flow generating device.

FIG. 6 is a perspective view showing a heat sink.

FIG. 7 is a perspective view showing a mesh material according to another embodiment of the present invention.

FIG. 8 is a cross-sectional view of the mesh material shown in FIG.

FIG. 9 is a perspective view showing a mesh material according to still another embodiment of the present invention.

FIG. 10 is a perspective view showing a mesh material according to still another embodiment of the present invention.

FIG. 11 is a cross-sectional view of the back side of a PC provided with a mesh material according to still another embodiment of the present invention.

FIG. 12 is a cross-sectional view of the back side of a PC provided with a mesh material according to still another embodiment of the present invention.

FIG. 13 is a graph showing the relationship between the distance between the heat sink and the mesh material and the pressure near the air flow outlet of the heat sink.

[Figure 14] Figure 14 shows the relationship between the size of the exhaust port and the pressure near the airflow outlet of the heat sink. It is a graph which shows.

FIG. 15 is a graph showing the pressure in the vicinity of the airflow outlet of the heat sink for each mesh material according to each embodiment.

FIG. 16 is a graph showing the pressure in the vicinity of the airflow outlet of the heat sink for each mesh material according to each embodiment.

BEST MODE FOR CARRYING OUT THE INVENTION

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

FIG. 1 is a partially cutaway perspective view showing an electronic apparatus according to an embodiment of the present invention. FIG. 2 is a diagram illustrating a back side of the electronic device illustrated in FIG. FIG. 3 is a cross-sectional view of the electronic device shown in FIG.

[0030] Electronic device 100 is, for example, a laptop PC that includes a main body 102 and a display 103. A housing 101 of the main body 102 includes a heat sink 20 and a jet flow generating device 30 that supplies a synthetic jet toward the heat sink 20. An IC such as a CPU (Central Processing Unit) is thermally connected to the heat sink 20 as a heat source (not shown). The term “thermally connected” means that both are in direct contact with each other, or that both are connected via a heat transfer device (not shown) such as a heat pipe or a heat conductive sheet.

An exhaust port 101 b is formed on the back surface 101 a of the housing 101. The exhaust port 101b has, for example, a rectangular shape. As shown in FIG. 3, the heat sink 20 is disposed in the vicinity of the exhaust port 101b, and the jet flow generating device 30 is disposed in the vicinity of the heat sink 20. A mesh member 50 according to an embodiment of the present invention is installed in the exhaust port 10 lb. The exhaust port 101 b may be a side surface or an upper surface of the force housing 101 configured to be provided on the back side of the housing 101.

FIG. 4 is a perspective view showing the mesh material 50. The mesh material 50 has, for example, a circular arc shape in cross section, and is formed by bending thin members vertically and horizontally. The mesh material 50 is made of, for example, resin, metal, or carbon having high thermal conductivity. In the case of metals, examples include aluminum, copper, and stainless steel. As shown in FIG. 3, the upper and lower ends 51 and 52 of the mesh material 50 are placed above and below the exhaust port 101b, for example, welding, pressure bonding, laser bonding, etc. It is installed by. Alternatively, the mesh material 50 may be integrally formed with the housing 101.

As shown in FIG. 2, the left and right end portions of the mesh material 50 installed at the exhaust port 101b are covered with a cover member 58, for example. However, the cover member 58 may also have a mesh structure. As the mesh material 50, for example, a UL (UNDERWRITERS LABORATORIE S INC.) Standard mesh is used. The cross section of the mesh material 50 is not necessarily an arc shape, but may be a quadratic function curve shape such as a hyperbola, a parabola, or an elliptic curve.

FIG. 5 is a cross-sectional view showing the jet flow generating device 30. The jet flow generating device 30 includes a housing 32 having a prism shape on one side and a cylindrical shape on the opposite side. The housing 32 is made of resin, metal, ceramics, or the like. The diaphragm 35 is provided inside the housing 32 so as to divide the interior into the chambers 32a and 32b. The diaphragm 35 is configured by attaching, for example, a planar coil (not shown) to a disk made of resin, metal, or other material. The housing 32 is provided with a mechanism for electromagnetically driving the diaphragm 35 such as a magnet yoke (not shown). A predetermined electric signal is applied to the planar coil by a control unit 36 having a driving IC or the like.

[0035] Two rows of upper and lower nozzles 33a and 33b are provided on the front surface of the housing 32. A plurality of nozzles 33a and 33b are provided in the direction perpendicular to the paper surface in FIG. The chamber 32a communicates with air outside the housing 32 through the nozzle group 33a. Similarly, the chamber 32b communicates with air outside the housing 32 through the nozzle group 33b.

[0036] The form of the jet flow generating device 30 is not limited to the above-described form, and there are various shapes and sizes of the diaphragm 35, such as the nozzle 32, the nozzle 32, the nozzle 33a, etc. The form is considered. The driving method of the diaphragm 35 is not limited to electromagnetic driving, and piezoelectric driving, electrostatic driving, or the like may be used.

[0037] The operation of the jet flow generating device 30 configured as described above will be described. For example, when a sinusoidal AC voltage is applied to the coil of the diaphragm 35, the diaphragm 35 performs sinusoidal vibration. As the diaphragm 35 vibrates up and down in FIG. 5, the volumes of the chambers 32a and 32b alternately increase and decrease, and as a result, air is alternately discharged in a reverse phase through the nozzles 33a and 33b. The When air is discharged from the nozzles 33a and 33b, the pressure around the nozzles 33a and 33b decreases due to the flow velocity of the air. As a result, the air around the housing 32 is entrained in the air flow discharged from the nozzles 33 a and 33 b, that is, becomes a synthetic jet, and this synthetic jet is supplied to the heat sink 20. On the other hand, sound waves are generated independently from each nozzle 33a and nozzle 33b. Possible causes of this sound wave are vibration of the diaphragm 35, vibration of the air in the housing 32, or turbulence in the air inside the housing 32, the nozzle 33a, etc. . However, since the sound waves generated by the nozzles 33a and the nozzles 33b are sound waves of opposite phases, they are weakened with each other. As a result, noise is suppressed, and noise reduction can be achieved.

FIG. 6 is a perspective view showing the heat sink 20. The heat sink 20 is configured by arranging a plurality of radiating fins 25, and is not limited to the form shown in FIG. 6, for example, if a known heat sink is used. A plurality of air circulation holes 26 are formed between the heat radiating fins 25. As shown in FIGS. 1 and 3, the jet generating device 30 and the heat sink 20 are positioned so that the nozzles 33a and 33b of the jet generating device 30 face each flow hole 26.

[0039] The operation of the heat dissipation system configured as described above will be described. When a composite jet is generated by the jet generator 30, the air flow generated by the composite jet passes through the flow hole 26 of the heat sink 20. The air flow through the heat sink 20 proceeds while destroying the temperature boundary layer staying on the surface of each radiating fin 25, and thus becomes an air flow including heat. The air flow passing through the heat sink 20 is discharged together with heat to the outside of the housing 101 through the exhaust port 101b and the mesh material 50.

[0040] As shown in FIG. 3, since the air flow exiting the heat sink 20 tends to spread three-dimensionally, the air flow is as perpendicular as possible to the curved surface constituting the mesh surface of the mesh material 50. Pass through the mesh material 50 so that it is close. This reduces the pressure loss as it passes through the airflow cache 50, thus increasing the air flow rate. As a result, the efficiency of exhausting air is increased and the efficiency of exhaust heat is improved.

[0041] Further, even when the airflow outlet side of the heat sink 20 is near the exhaust port 101b, the curved mesh member 50 is provided so as to be separated from the exhaust port 101b. This also means that The pressure loss of the air flow passing through the tote sink 20 can be reduced. That is, the exhaust heat efficiency can be increased by increasing the area or volume around the exhaust port 101b as much as possible within the limited narrow space in the housing 101.

[0042] Further, by providing the mesh member 50, the dustproof effect can be enhanced as compared with an exhaust port formed of a plurality of small holes, a lattice-shaped hole, an exhaust port, or the like.

Furthermore, since only the mesh material 50 needs to be provided at the exhaust port 101b, the manufacturing cost can be reduced as compared with, for example, the structure of “Japanese Patent Laid-Open No. 2004-259916”.

FIG. 7 is a perspective view showing a mesh material according to another embodiment of the present invention. FIG. 8 is a cross-sectional view thereof. This mesh material 60 has mesh surfaces 60a and 60b formed along, for example, two different angle planes from one end 61 (first end) to the other end 62 (second end). . The both ends 61 and 62 of the mesh material 60 thus configured are mounted on the upper and lower sides of the exhaust port 101b in the same manner as in FIG. 3, so that the mesh material 60 is installed in the exhaust port 101b. As a result, even if the heat sink 20 is close to the exhaust port 101b, the mesh surfaces 60a and 60b are separated from the exhaust port 101b, so that the pressure loss of the air flow from the heat sink 20 can be reduced and the exhaust heat efficiency can be improved. Can do. Further, almost in the same way as the curved mesh material 50 described above, the pressure loss can be reduced because the air flow cache surfaces 60a and 60b that flow out from the heat sink 20 and spread as close as possible.

FIG. 9 and FIG. 10 are perspective views showing a mesh material according to still another embodiment of the present invention. The mesh member 70 shown in FIG. 9 has a plurality of mesh surfaces 70a, 70b, 70c, 70d, 70e and 70f at different angles from one end 73 to the other end 74 in the longitudinal direction, that is, the left-right direction. Even with such a configuration, the pressure loss of the air flow from the heat sink 20 can be reduced. The mesh material 80 shown in FIG. 10 has a form in which the number of mesh surfaces of the mesh material 70 is increased.

FIG. 11 and FIG. 12 are cross-sectional views on the back side of a PC provided with a mesh material according to still another embodiment of the present invention. The exhaust port 201b of the PC housing 201 shown in FIG. 11 is provided obliquely with respect to the vertical back surface 201a. The upper and lower ends 90a and 90b of the mesh material 90 having one plane are mounted on the upper and lower sides of the exhaust port 201b that is opened obliquely in this way. With this configuration, the lower force of the mesh material 90 Great distance from 20 airflow outlets. Thereby, the pressure loss of the air flow can be reduced.

It should be noted that the exhaust port 201b is provided obliquely so that the opening surface faces upward toward the outside of the housing 201. However, conversely, it may be provided obliquely so that the opening surface faces downward. In this case, the mesh material 90 is also installed obliquely so as to face downward on the outside of the casing 201.

The exhaust port 301b of the PC housing 301 shown in FIG. 12 is also opened obliquely, similarly to the exhaust port 20 lb shown in FIG. In the mesh material 110, the upper mesh surface 110a is curved. On the other hand, the lower part is planar. Since the high-temperature exhausted air tends to flow upward, the mesh surface 110b is arranged so that the upper mesh surface 110a is positioned above the lower mesh surface 110b so that it is as perpendicular as possible to the air flow. As a result, exhaust heat efficiency is improved.

FIG. 13 is a graph showing the relationship between the distance between the heat sink 20 and the mesh material 50 shown in FIG. 4 and the pressure in the vicinity of the air flow outlet of the heat sink 20. As shown in FIG. 4, the mesh material 50 used in this experiment had a width a = 100 mm, a length b = 15 mm, and a height c = 3 mm. As shown in FIG. 3, the distance between the heat sink 20 and the mesh material 50 is a distance s from the end of the heat sink 20 on the air flow outlet side to both ends 51 or 52 of the mesh material 50. That is, the distance s is a distance from the heat sink 20 to a part of the mesh material 50 that is closest to the heat sink 20. From this graph, it can be seen that when the distance is 2 mm or more, the pressure near the end of the outlet side of the heat sink 20 can be reduced, and when the distance is 2 mm or more, the change is small. Therefore, in this case, the distance is preferably 2 mm or more.

FIG. 14 is a graph showing the relationship between the size of the exhaust port and the pressure in the vicinity of the airflow outlet of the heat sink 20. The size of the exhaust port refers to the width d as shown in Fig.2. In the experiment related to this graph, the present inventor conducted an experiment by appropriately changing the width a of the mesh material in accordance with the size of the exhaust port. From this graph, the size of the exhaust port should be 110mm because the pressure decreases from around 110mm and becomes almost constant. The horizontal width e of the heat sink used in this experiment in Fig. 6 is 100 mm.

[0050] As a result, the width e of the heat sink is about 105% to 150%, preferably about 110%. It is preferable to use an exhaust port or a mesh material having a lateral width. The upper limit is set to 150% because the exhaust heat efficiency does not change even if the width of the exhaust port is larger than this, and conversely the dust-proofing effect may be reduced.

FIG. 15 is a graph showing the pressure in the vicinity of the airflow outlet of the heat sink 20 for each mesh material according to the above embodiment. In the graph, A is a state where there is no mesh material at the exhaust port 101b, and B is a general planar shape mesh material. 50, 70 and 80 correspond to the mesh material 50 shown in FIG. 4, the mesh material 70 shown in FIG. 9, and the mesh material 80 shown in FIG. From this graph, it can be seen that the mesh material 50 shown in FIG. 4 has the best exhaust efficiency. FIG. 16 is a graph having the same purpose as FIG. In the figure, 60, 90, and 110 correspond to the mesh material 60 shown in FIG. 7, the mesh material 90 shown in FIG. 11, and the mesh material 110 shown in FIG. The mesh material 90 has a planar shape, but the present inventor conducted an experiment in a state of being installed obliquely. From this graph, it can be seen that the example shown in FIG. 12 has the best exhaust efficiency.

The present invention is not limited to the embodiment described above, and various modifications are possible.

As the gas delivery mechanism, the jet generator 30 is used in the above embodiment. However, a rotary vane fan may be used. In this case, for example, an axial fan or a centrifugal fan is used.

[0053] For example, the mesh material 110 shown in FIG. 12 was installed in the exhaust port 301b having an oblique opening surface. However, the mesh material 110 may be installed in a normal exhaust port 101b as shown in FIG. 3, for example. In addition, various methods can be considered for mounting the mesh materials 50, 60, 70, etc., to the exhaust port, which is performed only by the mesh material 110.

[0054] Although the mesh members 50, 60, 70, 80, 90, 110 and the exhaust ports are all elongated, the present invention is not limited to this. In addition, although the laptop PC is used as the electronic device, it may be a desktop type or an electronic device other than the PC.

[0055] It is also possible to configure one mesh material by combining at least one of the characteristic portions of the mesh materials 50, 60, 70, 80, 90, and 110 according to the above embodiments.

[0056] As described above, according to the present invention, the pressure at the exhaust port is limited in a limited space. Reduces loss and improves exhaust heat efficiency

Claims

The scope of the claims

[1] The exhaust port of an electronic device having a heat source, a housing having the heat source built therein and having an exhaust port, and a heat dissipation mechanism capable of discharging heat of the heat source through the exhaust port by gas The mesh material provided in

Both ends mounted on the exhaust port;

A first mesh surface that curves so that at least a portion between the both end portions protrudes to the outside of the housing;

The mesh material characterized by comprising.

[2] The mesh material according to claim 1,

A mesh material further comprising a planar second mesh surface provided continuously with the first mesh surface.

[3] The mesh material according to claim 1,

The heat dissipation mechanism is

A heat sink having a first width disposed near the exhaust port and thermally connected to the heat source;

The mesh material has a second width that is 105% to 200% of the first width in the direction of the first width.

[4] The exhaust port of an electronic device comprising a heat source, a housing having the heat source built therein and having an exhaust port, and a heat dissipation mechanism capable of discharging heat of the heat source through the exhaust port by gas The mesh material provided in

A first end and a second end opposite to the first end, which are attached to the exhaust port, and a plurality of different angles from the first end to the second end. A mesh surface formed along a plane,

The mesh material characterized by comprising.

[5] The mesh material according to claim 4,

The mesh surface has a first length in a first direction toward the second end portion and a second direction substantially perpendicular to the first direction. The first length A mesh material characterized by having a second length.

[6] The mesh material according to claim 4,

The mesh surface has a first length in a first direction toward the second end portion and a second direction substantially perpendicular to the first direction. A mesh material having a second length shorter than the first length.

[7] a heat source;

A housing containing the heat source and having an exhaust port;

A heat dissipating mechanism capable of discharging heat of the heat generation source through the exhaust port by gas; and a first mesh surface provided at the exhaust port and curved so that at least a part protrudes to the outside of the housing. Mesh material having

An electronic apparatus comprising:

[8] The electronic device according to claim 7,

2. The electronic apparatus according to claim 1, wherein the mesh material has a planar second mesh surface provided continuously with the first mesh surface.

[9] The electronic device according to claim 8,

The electronic device according to claim 1, wherein the first mesh surface is disposed above the second mesh surface.

[10] The electronic device according to claim 7,

The heat dissipation mechanism is

The electronic apparatus according to claim 1, wherein the mesh material has a second width that is 105% to 150% of the first width in the first width direction.

[11] The electronic device according to claim 7,

The heat dissipation mechanism is

A heat sink disposed in the vicinity of the exhaust port and thermally connected to the heat generation source; and a gas delivery mechanism for sending gas toward the heat sink to cool the heat sink. An electronic device comprising:

[12] a heat source;

A housing containing the heat source and having an exhaust port;

A heat dissipating mechanism capable of discharging heat from the heat source through the exhaust port by gas; and a mesh material provided at the exhaust port and formed along a plurality of planes at different angles. Electronic equipment.

[13] A heat source,

A housing having a predetermined surface and an exhaust port opened in the surface, and including the heat generation source; a heat dissipating mechanism capable of exhausting heat of the heat generation source by gas through the exhaust port; A planar mesh material provided at the exhaust port so as to face an angle different from the angle of the surface;

An electronic apparatus comprising: