JP4822009B2 - Electronic device heat dissipation structure and electronic device - Google Patents

Description

  The present invention provides heat dissipation of electronic devices including portable information communication terminals such as portable telephones, PHS (Personal Handy-phone System), and portable information processing devices such as PDAs (Personal Data Assistant) and notebook personal computers. The present invention relates to a structure body and an electronic device.

  As a conventional portable phone, an operation side housing having operation buttons such as numeric keys and a display side housing having a display unit such as a liquid crystal display panel are rotatably connected via a hinge mechanism. A foldable structure is known.

  Usually, this type of portable phone has a hinge mechanism in a folded state in which the operation-side housing and the display-side housing are overlapped and an open state in which the display-side housing is opened with respect to the operation-side housing. It has a set of hinge members that can rotate relative to each other. The pair of hinge members are respectively disposed on the rotation axis of the operation side casing and the display side casing, and each has a rotation mechanism that restricts the rotation between the folded state and the open state. .

  In recent years, for the purpose of improving the durability performance of the hinge member and reducing the manufacturing cost, one of the pair of hinge members is omitted and only one hinge member is used. In the mobile phone having this configuration, instead of one hinge member, a cylindrical support cylinder (support hinge) that rotatably supports the operation-side casing and the display-side casing at a position on the rotation axis. Is arranged. The support cylinder is made of a metal material such as stainless steel (SUS), and is also used as a cable for electrically connecting the operation-side casing and the display-side casing or a flexible wiring board.

  In recent years, with the increase in functionality and performance of mobile phones, the amount of heat generated by electronic components inside the mobile phone has increased, while the mobile phone tends to be smaller and thinner. is there. For this reason, in a mobile phone, the outer peripheral surface of the housing is always in contact with the user during a call with a heavy load on the mobile phone, for example, when browsing e-mail or the web. Therefore, there is a problem that heat is transmitted to the user through the housing. Such heat of the casing has a great influence on the user.

  In general, in a conventional mobile phone, an electronic component mounted on a circuit board disposed inside an operation-side casing is a heat source. As shown in FIG. 6, in the conventional mobile phone, the area of the operation-side casing corresponding to the electronic component serving as a heat source is a relatively high temperature of 46.3 ° C. or higher. The temperature is distributed concentrically. That is, in the conventional mobile phone, a local high temperature region exists in the operation side casing.

  For this reason, in the conventional mobile phone, the surface temperature of the casing needs to satisfy a predetermined standard, and various measures are taken.

  In general, in the case of suppressing heat generation of an electronic component in a conventional mobile phone, measures such as reducing the supply current when the temperature exceeds a set temperature by performing temperature control using a thermistor may be taken. is there. However, when the supply current is reduced in order to suppress heat generation, there are not a few cases where sufficient performance of the mobile phone is not exhibited, and there is a disadvantage that the performance is temporarily lowered.

  In addition, electronic components that generate a relatively large amount of heat are often mounted on a circuit board disposed inside the operation-side casing. Therefore, a heat dissipation structure that dissipates heat generated inside the operation-side housing to the inside of the display-side housing is disclosed (for example, see Patent Document 1).

The conventional mobile phone disclosed in Patent Document 1 includes a first heat pipe disposed inside the operation-side casing and a second heat pipe disposed inside the display-side casing. These first and second heat pipes are connected to each other. According to this configuration, the temperature distribution of the housing can be made uniform.
Japanese Patent Laying-Open No. 2006-253171 (FIG. 1)

  However, in the configuration disclosed in Patent Document 1 described above, the first and second heat pipes are arranged inside the operation-side housing and the display-side housing, respectively, which makes the configuration complicated. There is. In addition, this configuration requires a heat block for moving heat from the electronic components inside the display-side housing in order to achieve a uniform temperature distribution in the housing. Will be further complicated.

  Accordingly, the present invention provides a heat dissipation structure for an electronic device that can suppress the occurrence of a local high-temperature region in the housing and make the temperature distribution of the housing uniform, and the electronic device with a relatively simple configuration. The purpose is to provide.

In order to achieve the above-described object, a heat dissipation structure for an electronic device according to the present invention includes a first case and a second case that are rotatably connected via a hinge mechanism. Is the body. The hinge mechanism is a hinge that can rotate between a folded state in which the first housing and the second housing are overlapped and an open state in which the second housing is opened with respect to the first housing. A member, and a first support case and a metal support cylinder that rotatably support the second case, which are disposed on the rotation axis of the hinge member. The heat dissipating structure of the electronic device is in contact with the electronic component and the support cylinder disposed inside the first casing, and includes a heat conduction member that conducts heat from the electronic component to the support cylinder. Prepare. The space in the inner periphery of the support cylinder is in communication with the space outside the first housing.

According to the heat dissipation structure for an electronic device according to the present invention configured as described above, the heat conduction member conducts part of the heat generated in the electronic component to the support cylinder, thereby generating heat from the electronic component. Generation of a high temperature region locally in the first housing is suppressed, and the temperature distribution of the first housing is made uniform.
Moreover, the space of the inner peripheral part of the support cylinder with which the heat dissipation structure of the electronic device according to the present invention is provided communicates with the outer space of the first casing, so that the inner peripheral part of the support cylinder is provided. Since the conducted heat is dissipated to the space outside the casing, the temperature distribution of the first casing can be made even better.

Further, in the first casing provided in the heat dissipation structure for the electronic device according to the present invention, a heat dissipation hole for radiating heat from the support cylinder to the outside of the first casing communicates with the outer peripheral surface of the support cylinder. May be provided. This arrangement, heat conducted to the outer peripheral surface of the support cylinder since heat is radiated to the outside of the housing, the temperature distribution of the first housing is better homogenized.

  In addition, the heat conducting member provided in the heat dissipation structure of the electronic mechanism according to the present invention has one end abutting on the electronic component inside the first casing and the other end via the support cylinder. It may be extended to the inside. With this configuration, the heat conducted to the support cylinder is radiated to the inside of the second casing, so that the temperature distribution of the first casing can be made even better.

  Moreover, the electronic device which concerns on this invention is equipped with the thermal radiation structure of the electronic device of this invention mentioned above.

  As described above, according to the present invention, it is possible to provide a housing with a relatively simple configuration by including the heat conducting members that are in contact with the electronic component and the support cylinder disposed inside the first housing. A local high temperature region can be prevented from being generated in the body, and the temperature distribution of the housing can be made uniform.

  Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.

(First embodiment)
As shown in FIG. 1, the mobile phone 1 according to the first embodiment includes an operation unit 6 on which operation buttons such as numeric keys for performing various operations are arranged, and various operations such as operation contents by the operation unit 6. A display unit 7 provided with a display plate made of a liquid crystal or an organic EL (electroluminescence) element for displaying information, and a communication circuit unit (not shown) as a communication means for performing information communication or a telephone call are provided. .

  The mobile phone 1 includes an operation side case 11 (first case) provided with an operation unit 6, a display side case 12 (second case) provided with a display unit 7, and these operations. A hinge mechanism 13 that connects the side housing 11 and the display side housing 12 so as to be rotatable with each other and a heat conducting member 14 that conducts heat generated in the operation side housing 11 to the hinge mechanism 13 are provided.

  The operation-side casing 11 and the display-side casing 12 are made of, for example, a resin material, and connecting portions 15 and 16 that are engaged and connected to each other are formed at one end portion. In addition, a circuit board 17 on which an electronic component 18 serving as a heat source is mounted is disposed inside the operation-side casing 11. Examples of this type of electronic component 18 include a PA (power amplifier), a charging FET (field effect transistor), and the like.

  The hinge mechanism 13 can be rotated between a folded state in which the operation side case 11 and the display side case 12 are overlapped and an open state in which the display side case 12 is opened with respect to the operation side case 11. A hinge member 21 is provided. The hinge mechanism 13 includes a metal support cylinder 22 that rotatably supports the operation-side casing 11 and the display-side casing 12.

  The hinge member 21 of the hinge mechanism 13 is located on one end side on the rotation axis on which the operation side casing 11 and the display side casing 12 rotate relative to each other. Arranged inside. The hinge member 21 has a rotation mechanism (not shown) that restricts the rotation operation between the folded state and the opened state.

  The support cylinder 22 of the hinge mechanism 13 is formed in a cylindrical shape by a metal material having a relatively large specific heat capacity, for example, and the end portion of the heat conducting member 14 is in contact therewith. The support cylinder 22 is located on the other end side on the rotation axis of the hinge member 21 and is disposed inside the connecting portion 15 of the operation side casing 11. Note that the specific heat capacity of the metal material forming the support cylinder 22 is preferably 400 J / kg · K or more, and heat from the electronic component 18 is conducted well. Therefore, the support cylinder 22 functions to assist the rotation operation by the hinge member 21 and acts to absorb heat conducted from the electronic component 18 by the heat conduction member 14 described later. That is, the support cylinder 22 suppresses the occurrence of a local high-temperature region that is about 46 ° C. or higher in the operation-side casing 11, and the temperature distribution of the operation-side casing 11 is made uniform.

  The connecting portion 14 of the operation side housing 11 is provided with a plurality of heat radiation holes 23 for radiating heat from the support cylinder 22 disposed inside to the outside of the operation side housing 11. The heat radiating holes 23 are arranged at predetermined intervals along the circumferential direction of the end portion of the support cylinder 22 and the circumferential direction of the outer peripheral surface. These heat radiating holes 23 lower the temperature of the support cylinder 22, and the temperature distribution of the operation-side casing 11 is made smooth and uniform.

  Similarly, as shown in FIG. 2, the connection portion 15 of the display-side housing 12 radiates heat from the connection portion 15 of the operation-side housing 11 when the display-side housing 12 is open with respect to the operation-side housing 11. A plurality of heat radiation holes 25 are provided at positions corresponding to the holes 23, respectively. Therefore, in the open state of the display-side housing 12 with respect to the operation-side housing 11, the heat-dissipating hole 23 of the connecting portion 15 of the operation-side housing 11 and the heat-dissipating hole 25 of the display-side housing 12 are communicated with each other. The heat conducted from the electronic component 18 to the support cylinder 22 by the heat conducting member 14 is radiated from the heat radiating hole 23 to the outside of the operation side housing 11 and also into the display side housing 12 through the heat radiating hole 25. It is possible to dissipate heat. Therefore, the temperature distribution of the operation-side casing 11 can be made even more smooth by the heat radiation holes 25.

  Further, the inner peripheral portion of the support cylinder 22 arranged in the connecting portion 15 is exposed to the outside of the operation-side casing 11, and the heat dissipation to the outside is enhanced.

  Further, although not shown, the hinge mechanism 13 is arranged through a cable or a flexible wiring board (FPC) that electrically connects the display unit 6 and the operation unit 7.

  The heat conductive member 14 has a relatively large heat conductivity and is formed into a sheet shape from a flexible material. One end of the heat conducting member 14 is in contact with the electronic component 18 inside the operation-side casing 11, and the other end is in contact with the outer peripheral surface of the support cylinder 22 of the hinge mechanism 13. . In addition, as a heat conductivity of the material which forms the heat conductive member 14, 500 W / m * K or more is preferable, and the heat | fever generate | occur | produced in the electronic component 18 is favorably conducted to the support cylinder 22.

  Regarding the mobile phone 1 configured as described above, the temperature distribution of the operation-side casing 11 will be described with reference to the drawings.

  In the conventional mobile phone described above, as shown in FIG. 6, the region of the operation-side housing corresponding to the electronic component serving as the heat source is a relatively high temperature of 46.3 ° C. or higher. The temperature was distributed concentrically from this high temperature region. That is, in the conventional mobile phone, a local high temperature region exists in the operation side casing.

  On the other hand, in the mobile phone 1 of the present embodiment, as shown in FIG. 4, a part of the heat generated in the electronic component 18 inside the operation side housing 11 is conducted to the support cylinder 22 by the heat conducting member 14. As a result, the temperature is made uniform between the high temperature region of the operation-side casing 11 corresponding to the electronic component 18 and the relatively low temperature region corresponding to the support cylinder 22. For this reason, the operation side housing 11 does not have a local high temperature region of 46.3 ° C. or higher, and the region of 43.6 ° C. is greatly expanded. That is, the operation-side housing 11 has a uniform temperature distribution.

  As described above, the mobile phone 1 according to this embodiment includes the heat conducting members 14 that are in contact with the support cylinder 22 of the hinge mechanism 13 and the electronic component 18 inside the operation-side casing 11. Thus, it is possible to suppress the occurrence of a local high temperature region in the operation-side casing 11 and to make the temperature distribution of the operation-side casing 11 uniform.

  In addition, the portable telephone 1 functions as a member for moving the heat conducted to the heat conducting member 14 by using the support cylinder 22 that assists the pivoting operation by the hinge member 21, thereby Without requiring such parts separately, the temperature distribution of the operation-side casing 11 can be made uniform with a relatively simple configuration.

(Second Embodiment)
In 1st Embodiment mentioned above, although the structure by which the heat conductive member 14 was arrange | positioned ranging over the electronic component 18 inside the operation side housing | casing 11 and the support cylinder 22 was taken, a part of heat conductive member is taken. However, it may be extended inside the display-side housing 12. Since the basic configuration of the second embodiment is the same as that of the first embodiment except for the configuration of the arrangement state of the heat conducting member, the same reference numerals are used for the same members as those of the first embodiment. A description thereof will be omitted.

  As shown in FIG. 5, the heat conducting member 24 included in the mobile phone 2 of the second embodiment has one end abutting against the electronic component 18 on the circuit board 17 and the other end side supporting the support cylinder 22. Then, it is extended into the inside of the display-side housing 12 and is in contact with, for example, a support frame (not shown) made of a metal material having a relatively large specific heat capacity.

  According to the mobile phone 2 of the present embodiment, the heat conducting member 24 is brought into contact with the inside of the display-side housing 12 via the support cylinder 22, so that the electronic component of the operation-side housing 11. Since the heat generated by 18 can be conducted to the support cylinder 22 and conducted to the display-side housing 12 side, the temperature distribution of the operation-side housing 11 can be made even better.

  In the above-described embodiment, the heat conducting members 14 and 24 are configured to conduct heat by the electronic component 18 mounted on the circuit board 17, but the heat conducting member is provided on the operation side housing 11. It may be configured to conduct heat from the heat sources at a plurality of internal locations to the support cylinder 22 respectively.

It is a front view which shows the portable telephone of 1st Embodiment. It is sectional drawing which shows a hinge mechanism from the front side. It is sectional drawing which shows a hinge mechanism from the side surface side. It is a figure which shows the temperature distribution of the operation side housing | casing with which the mobile telephone of the 1st implementation mobile phone is provided. It is sectional drawing which shows the principal part of the 2nd implementation mobile telephone. It is a figure which shows the temperature distribution of the operation side housing | casing with which the conventional portable telephone is equipped.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Portable telephone 6 Operation part 7 Display part 11 Operation side housing | casing 12 Display side housing | casing 13 Hinge mechanism 14 Thermal conduction member 21 Hinge member 22 Supporting cylinder 23 Heat radiation hole

Claims (7)

A heat dissipation structure for an electronic device including a first housing and a second housing that are rotatably connected via a hinge mechanism,
The hinge mechanism is rotated between a folded state in which the first casing and the second casing are overlapped and an open state in which the second casing is opened with respect to the first casing. A hinge member that is movable, and a metal support cylinder that is disposed on a pivot axis of the hinge member and rotatably supports the first housing and the second housing;
It said first housing being abut respectively disposed inside an electronic component and said support tube body comprises a heat conducting member for conducting heat from the electronic component to the support cylinder,
The space of the inner peripheral portion of the support cylinder is that have communicated with the outside space of the first casing, the heat radiating structure of an electronic device. The heat radiation hole for radiating heat from the support cylinder to the outside of the first housing is provided in the first casing so as to communicate with the outer peripheral surface of the support cylinder. The heat dissipation structure of the electronic device as described. One end of the heat conducting member is in contact with the electronic component inside the first casing, and the other end is extended into the second casing through the support cylinder. The heat dissipation structure for an electronic device according to claim 1 or 2 . The heat dissipation structure for an electronic device according to any one of claims 1 to 3 , wherein the heat conducting member has flexibility. The first casing is provided with an operation unit in which operation buttons are arranged,
Wherein the second housing, a display unit having a display panel is provided, the heat radiating structure of an electronic device according to any one of claims 1 to 4. An electronic device comprising the heat dissipation structure for an electronic device according to any one of claims 1 to 5 . The electronic device according to claim 6 , which is an information communication terminal including a communication unit for information communication.

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