JP2008131501A - Portable terminal equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a structure for advantageously diffusing heat from an electronic component inside portable terminal equipment. <P>SOLUTION: The portable terminal equipment comprises: a case body 1; a circuit board 7 disposed inside the case body 1, for which the electronic component 12 is mounted on a surface on one side; a coating member 6 disposed inside the case body 1 facing the surface on one side of the circuit board 7 and the surface on the other opposite side; an endothermic member 5a disposed inside the case body 1 facing the electronic component 12; and a heat transmission member 5a for forming a heat conducting path between the endothermic member 6 and the coating member. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure in a mobile terminal device, particularly a mobile terminal device incorporating a heat-generating component.

While mobile terminal devices such as mobile phones and PDAs (Personal Digital Assistants) as typical examples are being improved in functionality, there is a demand for miniaturization and thickness reduction.
From such a background, there is a tendency for the number of parts to increase with the increase in functionality, and in particular, the number of heat generating parts to increase, and the case of the portable terminal device may be locally heated by the heat from the heat generating parts.
In particular, in a mobile terminal device that is downsized or thinned, heat from the heat-generating component tends to be trapped inside. Therefore, in order to advance the functionality of the mobile terminal device, it is necessary to efficiently dissipate the heat from the heat generating component to the outside.

  Conventionally, heat from heat-generating components inside the apparatus has been dissipated through, for example, a shield frame that supports a circuit board. However, the heat dissipation of the electronic component mounted on the circuit board surface facing the shield frame can be performed through the shield frame, but the heat from the electronic component mounted on the circuit board surface opposite to the shield frame can be performed. No measures have been taken against.

In this regard, Patent Document 1 proposes that heat is radiated to the outside of the housing from a hand strap attached via a pin to a heat radiating plate attached to the surface of the electronic component. However, since the heat transfer portion is small, the actual heat dissipation effect is poor, and there are many points to be improved, such as the necessity of a hand strap.
JP 2005-244493 A

  Accordingly, an object of the present invention is to propose a structure that advantageously dissipates heat from an electronic component inside a portable terminal device to the outside of the device.

  That is, in order to achieve the above object, a mobile communication terminal device according to the present invention includes a housing, a circuit board that is disposed in the housing and on which one of the first electronic components is mounted, A covering member disposed in the casing so as to face the other surface opposite to the one surface of the circuit board, and a heat absorbing member disposed in the casing so as to face the first electronic component. And a heat transfer member that forms a heat conduction path between the heat absorbing member and the covering member.

In addition, the mobile communication terminal device according to the present invention is disposed in the housing, the first electronic component is mounted on one surface, and the second electronic component is mounted on the other surface. A circuit board that is disposed in the housing so as to face the other surface of the circuit board, and that covers the second electronic component, and in the housing that faces the first electronic component. An endothermic member disposed on,
A heat transfer member that forms a heat conduction path between the heat absorbing member and the covering member is provided.

Furthermore, in the mobile communication terminal device according to the present invention,
The heat transfer member is a flexible substrate;
The covering member is a heat conductor;
The heat absorbing member is configured to include a third electronic component, and the heat transfer member is a flexible substrate connected to the third electronic component;
The third electronic component is a connector member configured to have a sheet metal connected to an external member;
The flexible substrate is configured to have an extending portion disposed on the outer surface of the casing of the covering member, and the extending portion is disposed only on a part of the surface of the covering member. Being
The circuit board is advantageously provided with a fixing member that is disposed around the first electronic component and supports the heat absorbing member.

  According to the present invention, heat generated from the electronic component mounted on one surface of the circuit board is absorbed by the heat absorbing member, transmitted to the covering member via the heat transferring member, and dissipated by the covering member. . Therefore, a heat dissipation path is also provided for an electronic component mounted on one surface of a circuit board, which has not been taken before, so that heat can be efficiently radiated from the electronic component inside the portable terminal device. it can.

The best mode for carrying out the present invention will be described below with reference to the drawings.
FIG. 1 is a perspective view of a key-side casing in a mobile phone as an example of a mobile terminal device according to an embodiment of the present invention.
As shown in FIG. 1, a key-side casing 1 of a mobile phone has a display-side casing (not shown) attached via a hinge portion 2 provided at one end of the key-side casing 1. A mobile phone having a folding structure is formed. The key-side casing 1 is configured by overlapping a key front case 3 and a key rear case 4. The key front case 3 includes a key switch having a metal dome, for example, for detecting the operation state of various operation keys. A key detection device (not shown) having a mounted key sheet and operation keys is mounted.

FIG. 2 is a perspective view showing the internal structure of the key-side casing of FIG. FIG. 2 shows a state in which the key rear case 4 is removed and the inner surface side of the key front case 3 is exposed.
As shown in FIG. 2, the inside of the key-side housing 1, that is, the inner surface side of the key front case 3 constituting the key-side housing 1, faces the key rear case 4 that is superimposed on the key front case 3. That is, in the figure, the operation keys in the key detection device (not shown), the flexible substrate 5 as the key sheet, the shield case 6 and the circuit substrate 7 are stacked in order from the lower side.

  In the illustrated example, the circuit board 7 is disposed inside the housing so as to occupy a substantially half area of the key front case 3 on the hinge 2 side, and a battery (not shown) is provided in the remaining area of the key front case 3. Is stored in the battery storage chamber 8. Further, the circuit board 7 has a battery connector 9 that is electrically connected to a battery stored in the battery storage chamber 8. Furthermore, on the circuit board 7, on the mounting surface 7a facing the key rear case 4, there are various electronic components such as converters, power amplifiers, card connectors 10 and the like as the first electronic components. Implemented. These electronic parts include many heat generating parts. In FIG. 1, reference numeral 11 denotes a lid that closes the card mounting opening of the card connector 10.

  Here, since the electronic components mounted on the circuit board 7 generate a considerable amount of heat, it is necessary to dissipate this heat outside the apparatus. The heat dissipation path for this will be described in detail below, taking as an example the case where a heat-generating electronic component is mounted on the mounting surface 7a between the card connector 10 and the circuit board 7.

  3 is a plan view showing the circuit board 7 in the key-side casing 1 shown in FIG. 1, and FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. As shown in FIGS. 3 and 4, the first electronic component 12 is mounted on the left end portion of the circuit board 7 on the mounting surface 7 a in the drawing, and the first electronic component 12 is opposed to the key rear case 4. Is arranged with the card connector 10 facing each other. The card connector 10 is mounted on a flexible substrate 5a disposed between the card connector 10 and the first electronic component 20, and heat from the first electronic component 20 serves as a heat absorbing member disposed to face the card connector 10. Absorbed by the flexible substrate 5a. The flexible substrate 5a is bent from one surface of the circuit board 7 on which the first electronic component 12 is mounted to the other surface on the opposite side, and is disposed so as to face the other surface. Is connected to the flexible substrate 5 through the shield case 6 as described above, the flexible substrate 5a and the card connector 10 function as a heat absorbing member, and the flexible substrate 5b connected between the flexible substrate 5a and the flexible substrate 5 transfers heat. It functions as a member. In FIG. 5, the flexible substrate 5a is connected to a side portion of the flexible substrate 5 as a key sheet having a key switch S for operation so that the flexible substrate 5a is developed on the flexible substrate 5 side. 5 is integrated.

  That is, in the flexible substrate 5a, the contact area with the first electronic component 12 functions as a heat absorbing member, and the bent area functions as a heat transfer member. As described above, the card connector 10 is electrically connected to the circuit board 7 via the flexible boards 5a, 5b, 5 and the first electronic component 12 is provided via the flexible board 5a that also serves as a heat absorbing member and a heat transfer member. Heat is absorbed and conducted, and is guided to the flexible substrate 5. Since the flexible substrate 5 is in close contact with the shield case 6 that is a covering member, the heat from the first electronic component 12 is transmitted from the flexible substrates 5 a, 5 b, 5 to the shield case 6 and is dissipated from the shield case 6. .

  In the illustrated example, the heat absorption member and the heat transfer member are configured to serve as the flexible substrate 5a. The heat absorbing member and the heat transfer member can be made of a sheet metal material instead of a flexible substrate. In other words, any configuration may be used as long as the heat absorbed by the heat absorbing member disposed opposite to the first electronic component 12 is transmitted to the shield case 6 as the covering member via the heat transfer member and radiated.

  Further, as shown in FIG. 6, the mounting state of the first electronic component 12 on the circuit board 7 is a fixing member for fixing the flexible board 5 a to a predetermined position on the circuit board 7. It arrange | positions in the notch provided in the base 13. FIG. The pedestal 13 is fixed to the circuit board 7 via pins 14 raised from the circuit board 7, and the card connector mounted on the flexible board 5 a by engaging the pedestal 13 with the flexible board 5 a. 10 can be positioned in the board plane direction and the casing thickness direction, and the card connector 10 is finally fixed at a predetermined position. On the other hand, by arranging the first electronic component 12 in the notch provided in the pedestal 13, the heat of the first electronic component 12 can be efficiently absorbed by the flexible substrate 5 a via the pedestal 13.

On the other hand, a card connector (third electronic component) 10 having a sheet metal member is disposed opposite to the surface of the flexible substrate 5a mounted on the first electronic component 12 opposite to the first electronic component 12. The heat absorbed from the first electronic component 12 to the flexible substrate 5a can be dissipated through the card connector 10 as well.
The card connector 10 is disposed as the third electronic component mounted on the flexible substrate 5a. However, instead of the card connector 10, other connectors configured to have a sheet metal connected to an external member. It may be a member (such as an earphone connector or a charging terminal) or another electronic component.

  As shown in FIG. 7, the second side (upper side in FIG. 7) of the circuit board 7 on which the first electronic component 12 is mounted on the first side (lower side in FIG. 7) An electronic component 12a may be mounted. In this case, the heat from the second electronic component 12a is transmitted to the shield case 6 which is a covering member, and is dissipated from the shield case 6.

  Incidentally, the shield case 6 that is a covering member ultimately serves as the end of the heat dissipation path, so that the role as a heat sink is important, and it is also necessary to have the role of holding the circuit board 7 and the flexible board 5. It is desirable to use a lightweight and hard sheet metal part made of aluminum alloy or magnesium alloy, but stainless steel or plain steel can also be used.

Next, FIG. 8 shows a state in which the flexible substrate 5a is developed on the flexible substrate 5 side in the same manner as in FIG. 5 for another form of the flexible substrate 5 and the flexible substrate 5a. That is, the flexible substrate 5 is arranged so as to extend from the flexible substrate 5a to the surface of the shield case 6 on the key front case 3 side.
In the example shown in FIG. 8, the copper foil 5b is interposed in the hatched region in the figure, and the heat conductivity in this region is increased as compared with other regions, so that the heat from the flexible substrate 5a (see arrow) ) In the flexible substrate 5 is limited to the area of the copper foil 5b.

  That is, in a mobile phone that is a typical example of a mobile terminal device, the operation surface on which the operation keys are arranged is relatively close to a part of the cheek when the user presses the ear against the hinge 2 side in FIG. Since there is a contact area, it is preferable that heat is not transmitted to the contact area. Therefore, as shown in FIG. 8, it is advantageous to give a high-quality feeling when the heat transfer area is controlled by the installation area of the copper foil 5b and the heat dissipation area is limited.

  Although the present invention has been described with reference to the above-described embodiment, it is not limited to this embodiment. Therefore, what is implemented as a change aspect without deviating from the meaning of the present invention is also included. For example, in the above-described embodiment, a foldable mobile phone has been described as the mobile terminal device. However, other mobile phones, information communication terminals such as a PDA (Personal Digital Assistant), and communication such as a PC (Personal Computer), etc. It can also be applied to equipment.

It is a perspective view of the portable terminal device which concerns on one embodiment of this invention. It is a perspective view which shows the internal structure of the key side housing | casing of FIG. It is a top view of a circuit board. It is sectional drawing which follows the IV-IV line in FIG. It is an expanded view of a flexible substrate. It is a figure which shows the mounting state of the 1st electronic component in a circuit board. It is sectional drawing which shows the portable terminal device of another form. It is a figure which shows another form of a flexible substrate.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Display side housing | casing 2 Hinge 3 Key front case 4 Key rear case 5 Flexible board 5a Flexible board 6 Shield case 7 Circuit board 8 Battery storage chamber 9 Battery connector 10 Card connector 12 Electronic component 12a Electronic component 13 Base

Claims (8)

A housing,
A circuit board disposed in the housing and mounted with a first electronic component on one of the surfaces;
A covering member disposed in the housing so as to face the surface on the other side opposite to the surface on the one side of the circuit board;
A heat absorbing member disposed in the housing opposite the first electronic component;
A portable terminal device comprising: a heat transfer member that forms a heat conduction path between the heat absorbing member and the covering member. A housing,
A circuit board disposed in the housing, on which a first electronic component is mounted on one of the surfaces, and a second electronic component is mounted on the other surface;
A covering member that is disposed in the casing so as to face the other surface of the circuit board and covers the second electronic component;
A heat absorbing member disposed in the housing opposite the first electronic component;
A portable terminal device comprising: a heat transfer member that forms a heat conduction path between the heat absorbing member and the covering member.   The portable terminal device according to claim 1, wherein the heat transfer member is a flexible substrate.   The portable terminal device according to claim 1, wherein the covering member is a heat conductor.   5. The heat sink according to claim 1, wherein the heat absorbing member includes a third electronic component, and the heat transfer member is a flexible substrate connected to the third electronic component. The portable terminal device according to item.   The portable terminal device according to claim 5, wherein the third electronic component is a connector member configured to have a sheet metal connected to an external member.   The flexible substrate is configured to have an extending portion disposed on the outer surface of the casing of the covering member, and the extending portion is disposed only on a part of the surface of the covering member. The mobile terminal device according to claim 5, wherein the mobile terminal device is a mobile terminal device.   The portable terminal device according to claim 1, wherein the circuit board includes a fixing member that is disposed around the first electronic component and supports the heat absorbing member.