JP4753811B2 - Electronics - Google Patents

Description

The present invention relates to an electronic device such as a foldable mobile phone, in particular, an electronic apparatus capable of efficiently dissipating heat generated from the mounted heating element on the substrate to the outside.

  In recent years, mobile phones equipped with various functions such as a mail transmission / reception function, a TV phone function, an image photographing function, an Internet connection function in addition to a voice call function have been widely used. For this reason, the processing capacity has been improved to realize these functions, and the power consumption of the electronic components mounted inside the mobile phone has increased with the higher functionality and higher performance of the mobile phone. Have been doing.

  Here, it is known that an electronic device in which an electronic component is mounted, for example, a portable computer, performs heat dissipation by attaching a heat pipe or a fan for heat dissipation to the electronic component that generates a large amount of heat.

  For example, the following Patent Document 1 (Japanese Patent Application Laid-Open No. 11-102235) has a first portion and a second portion, and the opening / closing connecting means includes a first portion for opening and closing the second portion with respect to the first portion. An electronic device that mechanically connects one part and a second part and transfers heat from a heat generation source disposed in the first part to the second part is disclosed.

  That is, when the central processing unit of the portable computer is driven to generate heat, the heat generating plate receives the heat of the central processing unit, this heat is transmitted to the hinge through the heat pipe and the connector, and then this heat is transmitted to the case side, As a result, the transmitted heat is dissipated or diffused from the case.

  Further, Patent Document 2 (Japanese Patent Laid-Open No. 2000-20171) includes a main body portion in which a heating element is incorporated and a lid portion in which a liquid crystal display panel is provided on an inner surface, and the outside of the lid portion. There is disclosed a portable information processing device provided with a heat radiating plate that is exposed on the surface of the heat generating member and releases heat generated by the heating element to the outside.

That is, the heat generated by the CPU of the portable information processing apparatus is transmitted to the heat pipe through the heat conduction block, and is transmitted to the heat radiating plate by two-layer flow heat transport.
Japanese Patent Laid-Open No. 11-102235 (paragraph [0014], FIG. 3) JP 2000-20171 (paragraph [0007], FIG. 3)

  In the electronic device described in Patent Document 1, heat is accumulated in the main body of the computer, which is an electronic device, by transferring heat from the main body side having a relatively large heat generation rate to the display portion side having a relatively small heat generation amount. It is possible to easily diffuse or disperse heat to the display portion side. Further, in the portable information processing apparatus described in Patent Document 2, since the heat radiating plate is provided so as to be exposed on the outer surface of the lid portion, the entire area of the heat radiating plate is effectively used and is generated in the heating element. Heat can be effectively released to the outside.

However, since recent mobile phones are required to be further reduced in size and thickness, it is difficult to adopt a heat dissipation structure using a heat pipe or the like like the above-mentioned electronic devices due to space limitations. Also, there was a problem that it was difficult to install a fan because it prevented weight reduction. Further, along with the demand for miniaturization and thinning, the control board of the mobile phone is further integrated, and a heating element such as a power amplifier or a charging IC chip among various electronic components in the control board Since it is small and integrated, the generated heat cannot be sufficiently dissipated outside by itself. From the above, a problem has arisen that the surface temperature rise cannot satisfy the standard value due to the heating element inside the housing.

  The inventor of the present application has conducted various studies to solve the above problems, and as a result, heat generated by the heating element mounted on the substrate is successively transmitted through the metal portion having high thermal conductivity, and The inventors have conceived that the above-mentioned problems can be solved if heat is efficiently dissipated by the entire internal parts, and the present invention has been completed.

  That is, an object of the present invention is to provide a foldable mobile phone that can efficiently dissipate heat generated from a heating element mounted on a substrate to the outside.

The above object of the present invention can be achieved by the following configurations. That is, the invention of the electronic device according to claim 1 includes an upper body having a display unit, a lower body having an operation unit, and a hinge mechanism that rotatably connects the upper body and the lower body . The upper body includes a display holder made of at least a metal material, the lower body includes a control board having a shield case and a heating element made of at least a metal material, the hinge mechanism includes a frame made of a metal material, and the display An electronic device in which a heating element of the control board is in contact with the shield case, wherein the shield case A T-shaped press process is applied to the connecting portion with the frame in accordance with the shape of the frame, and a protrusion for fixing the frame is provided. It is characterized in.

According to a second aspect of the present invention, in the electronic device according to the first aspect , a convex surface portion is provided at a position corresponding to the surface of the heating element so that the shield case contacts the surface of the heating element. It is characterized by.

According to a third aspect of the present invention, in the electronic device according to the first or second aspect, the heating element is at least one of a power amplifier and a charging IC chip.

According to a fourth aspect of the present invention, in the electronic device according to the first aspect , the hinge mechanism includes a first frame fixed to the shield case, a second frame fixed to the display unit holder, A biaxial hinge mechanism comprising a third frame pivotally connected to the first and second frames, respectively, wherein the first frame and the second frame include the shield case or the display unit holder A part of the contact portion is arranged in contact with the shield case or the display unit holder so that the area of the contact portion becomes larger.

By providing the above configuration, the present invention has the following excellent effects. That is, according to the first aspect of the present invention, the display unit holder, the hinge mechanism, and the shield case are formed of a metal material having high thermal conductivity, are connected, and the shield case is further heated by the heating element of the control board. Since the heat generated in the heating element is transmitted to these members and diffused throughout the electronic device and radiated to the outside, the heat generated in the heating element can be effectively radiated. Further, since heat generated by the heating element is dispersed and dissipated without attaching a large heat pipe or fan, it is possible to obtain a good heat dissipating effect without increasing the size of the electronic device itself. Furthermore, since the pressing process is performed in a T shape so that the contact area between the upper part of the shield case and the hinge mechanism is increased and the protrusion for fixing the frame is provided, the heat conduction between these members is improved.

  According to the second aspect of the present invention, the shield case and the heating element can be brought into contact with each other with a simple structure by providing the shielding case with the convex portion so as to contact the surface of the heating element. .

  According to the invention of claim 3, since the heating element is a power amplifier and / or a charging IC chip, it generates a large amount of heat, but with the configuration of claim 1, the generated heat Can be efficiently transmitted to the outside and can be released to the outside.

  Furthermore, according to the invention which concerns on Claim 4, the biaxial hinge mechanism which consists of a 1st-3rd frame as a hinge mechanism is employ | adopted, and the contact area of a 1st, 2nd frame, a shield case, and a display part holder is large. Since it comprised so that thermal conductivity between these members may become favorable.

Hereinafter, specific examples of the present invention will be described in detail with reference to examples and drawings. However, the embodiments described below exemplify an electronic device (for example, a foldable mobile phone) for embodying the technical idea of the present invention, and are intended to specify the present invention as the electronic device. However, the present invention is equally applicable to electronic devices of other embodiments included in the scope of claims.

  FIG. 1 is a front perspective view of a foldable mobile phone according to an embodiment of the present invention, FIG. 2 is a rear perspective view showing a state in which various covers of the foldable mobile phone according to an embodiment of the present invention are removed, and FIG. 2 is an exploded perspective view in which the foldable mobile phone shown in FIG. 2 is disassembled for each part, FIG. 4 is a view showing a display unit holder, FIG. 4 (a) is a rear view, FIG. 4 (b) is a front view, FIG. FIG. 5 (a) is a rear view, FIG. 5 (b) is a front view, FIG. 6 is a view showing a control board, FIG. 6 (a) is a rear view, and FIG. b) is a front view, FIG. 7 shows a state in which the hinge mechanism is opened, FIG. 7 (a) is a front view, FIG. 7 (b) is a right side view, and FIG. 8 shows a state in which the hinge mechanism is closed. 8 (a) is a front view, FIG. 8 (b) is a right side view, and FIG. 8 (c) is a view seen from the X direction of FIG. 8 (a).

  As shown in FIG. 1, the foldable mobile phone 10 according to the present embodiment includes an upper body 20 including a display unit 21 including a liquid crystal display module that displays various function setting screens, a standby screen, and the like, an EL light emitting element, and the like. And a lower body 30 including a key operation unit 31 in which a plurality of keys such as numeric keys, direction keys, and special function keys are arranged, and a hinge mechanism 50 that connects these upper and lower bodies 20 and 30. The upper and lower bodies 20 and 30 and the hinge mechanism 50 are covered with an upper cover 22, a lower cover 32, and a hinge cover 51 made of synthetic resin or the like, respectively.

  As shown in FIGS. 2 and 3, a display unit holder 25 made of a thin plate metal material, for example, a magnesium alloy, is provided in the upper body 20. In the lower main body 30, a shield case 35 made of a thin metal material, for example, stainless steel, and a control board 40 for performing various controls of the foldable mobile phone 10 are provided.

  Among these, the display unit holder 25 provided in the upper main body 20 is composed of a substantially rectangular thin plate that matches the shape of the upper main body 20, as mainly shown in FIG. Extension portions 26a and 26b are provided in the longitudinal direction of the display unit holder 25 at the lower ends of the rectangular display unit holder 25, that is, at both ends of the short side connected to the hinge mechanism 50, respectively. The extension portions 26a and 26b are provided with through holes 27a and 27b for fixing screws to a second frame 60 of the hinge mechanism 50 described later.

  Further, on the front and back surfaces of the display unit holder 25, there are provided substantially rectangular panel storage portions 28a and 28b for storing display panels of different sizes. Specifically, a two-screen liquid crystal display panel or the like is fixed to the panel storage portions 28a and 28b, and the panel storage portion 28a provided on the front side of the display portion holder 25 has a main portion. A relatively large liquid crystal display panel is fixed as a display panel, and a relatively small liquid crystal display panel is fixed as a sub liquid crystal display panel in the panel housing portion 28b provided on the back side. These two display panels are electrically connected by a flexible printed wiring board (FPC, not shown), and the flexible printed wiring board is a horizontally long opening provided in the vicinity of the upper short side of the display unit holder 25. 29 is disposed through. The horizontally long opening 29 is also used as a space for storing a speaker.

  As shown in FIG. 5, the shield case 35 provided in the lower main body 30 is a thin plate made of a metal material. The control board 40 and IC card slots ( A cut-and-raised piece for fixing a device such as (not shown) is provided. The shield case 35 is provided for the purpose of blocking electromagnetic waves generated from electronic components such as a control board 40, a secondary battery (not shown) or an IC card (not shown), and for the purpose of increasing mechanical strength. .

  Further, in the vicinity of the upper part of the shield case 35, that is, in the vicinity of the short side on the side connected to the hinge mechanism 50, the front side is substantially T-shaped in accordance with the shape of the first frame 55 of the hinge mechanism 50 described later. There are provided frame-fixing protrusions 36 that are pressed toward the surface, and one or a plurality of the protrusions 36 (for example, two in the vicinity of the ends of the protrusions 36 extending in the lateral direction). A through-hole 37a for fixing the screw to the first frame 55 of the hinge mechanism 50 is provided. Further, at one or a plurality of positions on the back surface of the protruding portion 36 (for example, one position on a portion extending in the vertical direction of the protruding portion 36), the engaging mechanism 57 engages with an engaging hole 57b provided in the first frame 55 of the hinge mechanism 50. A protrusion 37b is provided. In addition, a through hole for engaging with a notch 57c provided in the first frame 55 of the hinge mechanism 50 and fixing with a screw at the center thereof is provided at an intermediate portion of the protruding portion 36 of the shield case 35 shown in FIG. The fixing projection 37c provided with the is provided. In the vicinity of the lower portion of the shield case 35, the power amplifier 42 is pressed from the back to the front in the same manner as the protrusion 36 described above at a position facing a power amplifier 42, 42 of the control board 40 described later. , 42 are provided with convex surface portions 38, 38 for contact.

  The control board 40 provided in the lower main body 30 is mainly composed of a semiconductor substrate 41 having a multilayer structure and various electronic circuits as shown in FIG. And it arrange | positions so that a part of the back surface may be covered with the shield case 35. FIG. Most of the various electronic circuits formed on the semiconductor substrate 41 are attached to the back surface of the semiconductor substrate 41, and power amplifiers 42 and 42, which are one of these electronic circuits, are arranged below the semiconductor substrate 41. It is installed. A charging IC chip 43 is disposed near the center of the semiconductor substrate 41.

  The upper main body 20 and the lower main body 30, specifically the display unit holder 25 and the shield case 35, are connected by a hinge mechanism 50. As shown in FIGS. 7 and 8, the hinge mechanism 50 includes first to third frames 55, 60, 65 made of metal (for example, stainless steel) each made of a horizontally long plate, and the first frame 55 is a lower portion. Fixed to the shield case 35 of the main body 30, the second frame 60 is fixed to the display unit holder 25 of the upper main body 20, and the third frame 65 fixes the first and second frames 55 and 60 so as to be rotatable. Yes.

  The first frame 55 is made of a horizontally long metal plate, and extends from both ends in the longitudinal direction so that left and right arm pieces 56a and 56b having the same shape having through holes at the tip end portions thereof stand upright. The through holes provided at the front ends of 56a and 56b are through holes provided in the lower arms 67a and 67b (see FIG. 8C) of the left and right arm pieces 66a and 66b of the third frame 65 disposed on the inner surface side thereof. The first rotating shaft 70 is formed by communicating with the hole. In addition, communication holes 57 a and 57 a communicating with the through holes 37 a of the shield case 35 are provided at positions close to the left and right arm pieces 56 a and 56 b of the first frame 55. Further, from the lower side wall of the central portion in the longitudinal direction of the first frame 55, that is, from the side wall located on the lower main body 30 side when attached to the lower main body 30, it is predetermined in a direction orthogonal to the longitudinal direction of the first frame 55. An extension portion 58 extending in length is provided, and a locking hole 57 b that fits into the locking projection 37 b of the shield frame 35 is formed at the distal end portion of the extension portion 58. Furthermore, the upper side wall at the center in the longitudinal direction of the first frame 55, that is, the side wall close to the third frame 65, has a notch whose width is substantially equal to or slightly larger than the outer diameter of the fixing projection 37c. 57c is provided.

  The second frame 60 is made of a horizontally long metal plate, and the width of the second frame 60 is widened in the vicinity of both end portions, and the left and right arm pieces 61a having the same shape and having through holes at the tip portions from the tip portions of the widened both end portions. , 61b extends so as to stand upright. The through-holes provided at the distal ends of the left and right arm pieces 61a and 61b are formed in the upper arms 68a and 68b (see FIG. 8C) of the left and right arm pieces 66a and 66b of the third frame 65 disposed on the inner surface side. The second rotating shaft 71 is formed by communicating with the provided through hole. In addition, communication holes 62 a and 62 b communicating with the through holes 27 a and 27 b of the display unit holder 25 are provided in the widened portion of the second frame 60.

  The third frame 65 is made of a horizontally long metal plate, and is formed so that left and right arm pieces 66a, 66b with its tip branching up and down from both ends thereof are erected, of which the left arm piece 66a is The right arm piece 66b includes an upper arm 67b and a lower arm 67b that are vertically branched and have a through hole at the tip.

  The hinge mechanism 50 formed by connecting the first to third frames 55, 60, and 65 having the above-described configuration is a biaxial hinge having first and second rotation shafts 70.71. Further, in a state where the first to third frames 55, 60, 65 are connected, the connection between the left arm pieces 56 a, 61 a of the first and second frames 55, 60 and the left arm piece 66 a of the third frame 65 is performed. A driving mechanism 73 and a linkage mechanism 75 are provided, and a stopper mechanism 76 is provided at a connecting portion between the right arm pieces 56b and 61b of the first and second frames 55 and 60 and the right arm piece 66b of the third frame 65. Is provided.

  The drive mechanism 73 opens and closes (rotates) the upper and lower bodies 20 and 30 and maintains this state when the upper and lower bodies 20 and 30 are stopped at a predetermined position, and obtains an appropriate snap action when the upper and lower bodies 20 and 30 are opened and closed. The cam piece provided inside the left arm pieces 56a and 61a of the first and second frames 55 and 60 and the left arm piece 66a of the third frame 65 are provided. This engagement state is achieved by the biasing mechanism 74 made of a spring body or the like disposed outside the left arm pieces 56a, 61a of the first and second frames 55, 60 in a state where the cam pieces provided on the outside are engaged. It is comprised by energizing. The linkage mechanism 74 is provided for interlocking the rotation of the first frame 55 with respect to the third frame 65 and the rotation of the second frame 60 with respect to the third frame 65, and is constituted by a gear, for example. Has been. Further, the stopper mechanism 76 sets the maximum opening angle (for example, 160 °) of the upper and lower bodies 20 and 30, and restricts the rotation of the upper and lower bodies 20 and 30 in the state where the maximum opening angle is reached. It is supposed to be. Note that each of the components constituting the drive mechanism 73, the linkage mechanism 75, and the stopper mechanism 76 is formed of a material having high thermal conductivity, such as stainless steel.

  When the above-described components are assembled, as shown in FIGS. 2 and 3, the surfaces of the power amplifiers 42, 42 of the control board 40 disposed on the surface of the shield case 35 are the convex portions 38, 38 of the shield case. The heat generated by the power amplifiers 42 and 42 is transmitted to the shield case 35 via the convex surface portions 38 and 38. Further, since the shield case 35 is in contact with the first frame 55 of the hinge mechanism 50 at the upper part thereof, the heat transmitted to the shield case 35 is further transmitted to the first frame 55 of the hinge mechanism 50. In addition, since the hinge mechanism 50 is entirely formed of a metal material made of stainless steel, the heat transmitted to the first frame 55 is transmitted to the third frame 65 and the second frame 60, and further the second frame. It is transmitted to the display unit holder 25 that is fixed in contact with 60. As described above, the heat generated from the power amplifier 42 is conducted to the shield case 35, the hinge mechanism 50, and the display unit holder 25, so that the heat is radiated by all of these members. Obtainable. In addition, the first and second frames 55 and 60 of the hinge mechanism 50 may be partially extended or widened so that the contact area with the shield case 35 and the display unit holder 25 is increased. Therefore, good heat conduction can be obtained.

  As described above in detail, according to the mobile phone 10 of the present invention, the shield case 35 and the hinge mechanism 50 are made of stainless steel, the display unit holder 25 is made of magnesium, and the power amplifier 42 that is a heating element, 42 is configured to be in direct contact with the shield case 35, the heat from the power amplifiers 42, 42 can be efficiently radiated to the outside through the heat conduction paths of the shield case 35, the hinge mechanism 50, and the display unit holder 25. it can.

  In the present embodiment, the power amplifiers 42 and 42 are applied as the heating elements. However, the present invention is not limited to this and can be applied to the charging IC chip 43 and other semiconductor elements.

  Further, in the present embodiment, the description has been given using stainless steel or magnesium as a material having good thermal conductivity for forming the shield case 35, the hinge mechanism 50, and the display unit holder 25. However, the present invention is not limited to this. A material having excellent thermal conductivity such as a metal such as copper or carbon can also be applied.

  Furthermore, in the present embodiment, the foldable mobile phone has been described as an example. However, the present invention is not limited to this, and any portable electronic device including at least a display unit and an operation unit may be used. For example, a PDA or the like The present invention can be similarly applied to small portable computers and portable game machines.

  According to the present invention, heat from the heating element can be efficiently radiated to the outside through the housing. In particular, since a CDMA mobile phone generates a large amount of heat from a power amplifier, it is useful as a heat dissipation structure with high heat dissipation efficiency.

FIG. 1 is a front perspective view of a foldable mobile phone according to an embodiment of the present invention. FIG. 2 is a rear perspective view showing a state in which various covers and the like of the folding cellular phone according to the embodiment of the present invention are removed. FIG. 3 is an exploded perspective view of the foldable mobile phone shown in FIG. 4A and 4B are diagrams showing the display unit holder. FIG. 4A is a rear view, and FIG. 4B is a front view. FIG. 5 is a view showing a shield case, FIG. 5 (a) is a rear view, and FIG. 5 (b) is a front view. 6A and 6B are diagrams showing the control board, in which FIG. 6A is a rear view and FIG. 6B is a front view. 7 shows a state in which the hinge mechanism is opened, FIG. 7A is a front view, and FIG. 7B is a right side view. 8 shows a state in which the hinge mechanism is closed, FIG. 8 (a) is a front view, FIG. 8 (b) is a right side view, and FIG. 8 (c) is a view seen from the X direction of FIG. 8 (a). is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Folding type mobile phone 20 Upper body 21 Display part 25 Display part holder 30 Lower body 31 Key operation part 35 Shield case 38 Convex part 40 Control board 42 Power amplifier 50 Hinge mechanism 55 1st frame 60 2nd frame 65 3rd frame

Claims (4)

An upper body having a display unit, a lower body having an operation unit, and a hinge mechanism for rotatably connecting the upper body and the lower body ,
The upper body includes a display unit holder made of at least a metal material,
The lower body includes at least a shield case made of a metal material and a control board having a heating element,
The hinge mechanism includes a frame made of a metal material,
The display unit holder and the shield case are connected by a frame of the hinge mechanism, and the electronic device is disposed so that the heating element of the control board contacts the shield case, An electronic device, wherein a protruding portion for fixing a frame is provided by pressing a T-shape in accordance with the shape of the frame at a connection portion with the upper frame .   The electronic device according to claim 1, wherein the shield case is provided with a convex surface portion at a position corresponding to the surface of the heating element so as to contact the surface of the heating element.   The electronic device according to claim 1, wherein the heating element is at least one of a power amplifier and a charging IC chip.   The hinge mechanism includes a first frame fixed to the shield case, a second frame fixed to the display unit holder, a third frame rotatably connected to the first and second frames, The first frame and the second frame are partly in the shield case or the display so that the area of the contact portion with the shield case or the display unit holder is increased. The electronic apparatus according to claim 1, wherein the electronic apparatus is disposed in contact with the part holder.

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