JP4671930B2 - Electronics - Google Patents

Description

The present invention relates to an electronic device such as a foldable mobile phone, in particular, an electronic apparatus capable of efficiently dissipating heat generated from the mounted heating element on the substrate to the outside.

  In recent years, mobile phones equipped with various functions such as a mail transmission / reception function, a TV phone function, an image photographing function, an Internet connection function in addition to a voice call function have been widely used. For this reason, the processing capacity has been improved to realize these functions, and the power consumption of the electronic components mounted inside the mobile phone has increased with the higher functionality and higher performance of the mobile phone. Have been doing.

  Here, it is known that an electronic device in which an electronic component is mounted, for example, a portable computer, performs heat dissipation by attaching a heat pipe or a fan for heat dissipation to the electronic component that generates a large amount of heat.

  For example, the following Patent Document 1 (Japanese Patent Application Laid-Open No. 11-102235) has a first portion and a second portion, and the opening / closing connecting means includes a first portion for opening and closing the second portion with respect to the first portion. An electronic device that mechanically connects one part and a second part and transfers heat from a heat generation source disposed in the first part to the second part is disclosed.

  That is, when the central processing unit of the portable computer is driven to generate heat, the heat generating plate receives the heat of the central processing unit, this heat is transmitted to the hinge through the heat pipe and the connector, and then this heat is transmitted to the case side, As a result, the transmitted heat is dissipated or diffused from the case.

  Further, Patent Document 2 (Japanese Patent Laid-Open No. 2000-20171) includes a main body portion in which a heating element is incorporated and a lid portion in which a liquid crystal display panel is provided on an inner surface, and the outside of the lid portion. There is disclosed a portable information processing device provided with a heat radiating plate that is exposed on the surface of the heat generating member and releases heat generated by the heating element to the outside.

That is, the heat generated by the CPU of the portable information processing apparatus is transmitted to the heat pipe through the heat conduction block, and is transmitted to the heat radiating plate by two-layer flow heat transport.
JP-A-11-102235 (paragraph [0014], FIG. 3) JP 2000-20171 (paragraph [0007], FIG. 3)

  In the electronic device described in Patent Document 1, heat is accumulated in the main body of the computer, which is an electronic device, by transferring heat from the main body side having a relatively large heat generation rate to the display portion side having a relatively small heat generation amount. It is possible to easily diffuse or disperse heat to the display portion side. Further, in the portable information processing apparatus described in Patent Document 2, since the heat radiating plate is provided so as to be exposed on the outer surface of the lid portion, the entire area of the heat radiating plate is effectively used and is generated in the heating element. Heat can be effectively released to the outside.

  However, since recent mobile phones are required to be further reduced in size and thickness, it is difficult to adopt a heat dissipation structure using a heat pipe or the like like the above-mentioned electronic devices due to space limitations. Also, there was a problem that it was difficult to install a fan because it prevented weight reduction. Further, along with the demand for miniaturization and thinning, the control board of the mobile phone is further integrated, and a heating element such as a power amplifier or a charging IC chip among various electronic components in the control board. Since it is small and integrated, the generated heat cannot be sufficiently dissipated outside by itself. From the above, there is a problem that the surface temperature rise cannot satisfy the standard value due to the heating element inside the housing.

  The inventor of the present application has conducted various studies to solve the above problems, and as a result, heat generated by a heating element such as a power amplifier mounted on the substrate passes through a metal portion having high thermal conductivity to the inside of the mobile phone. The present invention has been completed by conceiving that the above-mentioned problems can be solved if the heat is transmitted to the parts one after another and the entire internal parts made of metal are efficiently radiated. It is.

  That is, an object of the present invention is to provide a foldable mobile phone that can efficiently dissipate heat generated from a heating element mounted on a substrate to the outside.

The above object of the present invention can be achieved by the following configurations. That is, the invention of the electronic device according to claim 1, consisting of an upper body having a display unit, and a lower body having an operating portion, and a hinge mechanism for connecting the upper body and lower body rotatably, electronic The lower body includes at least a shield case made of a metal material, an IC card holder made of a metal material and capable of connecting an IC card therein, and a control board having a heating element, and the hinge mechanism Comprises a frame made of a metal material, the shield case and the IC card holder are brought into contact with each other via the frame of the hinge mechanism, and the heating element of the control board is arranged so as to contact the shield case. It is characterized by.

According to a second aspect of the present invention, in the electronic device according to the first aspect , a convex surface portion is provided at a position corresponding to the surface of the heating element so that the shield case contacts the surface of the heating element. It is characterized by.

According to a third aspect of the present invention, in the electronic device according to the first or second aspect, the heating element is at least one of a power amplifier and a charging IC chip.

According to a fourth aspect of the present invention, in the electronic device according to the first aspect , the hinge mechanism includes a first frame fixed to the shield case and the IC card holder, and a first frame fixed to the upper body. A biaxial hinge mechanism comprising two frames and a third frame rotatably connected to the first and second frames, respectively, the first frame being in contact with the shield case and the IC card holder A part thereof is arranged in contact with the shield case and the IC card holder so that the area of the part becomes large.

By providing the above configuration, the present invention has the following excellent effects. That is, according to the invention according to claim 1 of the present application, the hinge mechanism, the shield case, and the IC card holder are formed of a metal material having high thermal conductivity, are connected to each other, and the shield case is further heated by the heating element of the control board. Since the heat generated in the heating element is transmitted to these members and diffused throughout the electronic device and radiated to the outside, the heat generated in the heating element can be effectively radiated. Further, since heat generated by the heating element is dispersed and dissipated without attaching a large heat pipe or fan, it is possible to obtain a good heat dissipating effect without increasing the size of the electronic device itself.

  According to the second aspect of the present invention, the shield case and the heating element can be brought into contact with each other with a simple structure by providing the shielding case with the convex portion so as to contact the surface of the heating element. .

  According to the invention of claim 3, since the heating element is a power amplifier and / or a charging IC chip, it generates a large amount of heat, but with the configuration of claim 1, the generated heat Can be efficiently transmitted to the outside and can be released to the outside.

  Furthermore, according to the invention which concerns on Claim 4, the biaxial hinge mechanism which consists of a 1st-3rd frame as a hinge mechanism is employ | adopted, and the contact area of a 1st frame, a shield case, and an IC card holder becomes large. Since it comprised, the heat conduction between these members becomes favorable.

Hereinafter, specific examples of the present invention will be described in detail with reference to examples and drawings. However, the embodiments described below exemplify an electronic device (for example, a foldable mobile phone) for embodying the technical idea of the present invention, and are intended to specify the present invention as the electronic device. However, the present invention is equally applicable to other embodiments within the scope of the claims.

  FIG. 1 is a front perspective view of a foldable mobile phone according to an embodiment of the present invention, and FIG. 2 is a rear view showing a state of a lower body and a hinge mechanism from which various covers and the like of the foldable mobile phone according to an embodiment of the present invention are removed. FIG. 3 is an exploded perspective view in which the folding cellular phone shown in FIG. 2 is disassembled into parts, FIG. 4 is a view showing a shield case, FIG. 4 (a) is a rear view, and FIG. FIG. 5 is a diagram showing an IC card holder, FIG. 5A is a rear view, FIG. 5B is a front view, FIG. 6 is a diagram showing a control board, and FIG. FIG. 6B is a front view, FIG. 7 shows a state in which the hinge mechanism is opened, FIG. 7A is a front view, FIG. 7B is a right side view, and FIG. 8 (a) is a front view, FIG. 8 (b) is a right side view, and FIG. 8 (c) is a view seen from the X direction of FIG. 8 (a). That.

  As shown in FIG. 1, the foldable mobile phone 10 according to the present embodiment includes an upper body 20 including a display unit 21 including a liquid crystal display module that displays various function setting screens, a standby screen, and the like, an EL light emitting element, and the like. And a lower body 30 including a key operation unit 31 in which a plurality of keys such as numeric keys, direction keys, and special function keys are arranged, and a hinge mechanism 50 that connects these upper and lower bodies 20 and 30. The upper and lower bodies 20 and 30 and the hinge mechanism 50 are covered with an upper cover 22, a lower cover 32, and a hinge cover 51 made of synthetic resin or the like, respectively.

  A display unit holder, a speaker, and the like for fixing the display unit 21 are disposed in the upper main body 20, but are not shown here because they have a known configuration.

  In the lower main body 30, a shield case 35 made of a thin plate metal material, for example, stainless steel, and an IC card slot 41 for inserting an IC card are provided so as to cover the upper part of the back surface of the shield case 35. An IC card holder 40 and a control board 45 that is disposed on the front side of the shield case and performs various controls of the foldable mobile phone 10 are provided.

  Among them, the shield case 35 provided in the lower main body 30 is a thin plate made of a metal material mainly as shown in FIG. 4, and the control board 45 and the IC are provided at a plurality of locations on the outer edge and the front and back surfaces. A cut and raised piece for fixing a device such as the card holder 40 is provided. The shield case 35 is provided for the purpose of blocking electromagnetic waves generated from electronic components such as a control board 40, a secondary battery (not shown) or an IC card (not shown), and for the purpose of increasing mechanical strength. .

  Further, in the vicinity of the upper part of the shield case 35, that is, in the vicinity of the short side on the side connected to the hinge mechanism 50, the front side is substantially T-shaped in accordance with the shape of the first frame 55 of the hinge mechanism 50 described later. There are provided frame-fixing protrusions 36 that are pressed toward the surface, and one or a plurality of the protrusions 36 (for example, two in the vicinity of the ends of the protrusions 36 extending in the lateral direction). A through-hole 37a for fixing the screw to the first frame 55 of the hinge mechanism 50 is provided. Further, at one or a plurality of positions on the back surface of the protruding portion 36 (for example, one position on a portion extending in the vertical direction of the protruding portion 36), the engaging mechanism 57 engages with an engaging hole 57b provided in the first frame 55 of the hinge mechanism 50. A protrusion 37b is provided. In addition, a through hole for engaging with a notch 57c provided in the first frame 55 of the hinge mechanism 50 and fixing with a screw at the center thereof is provided in an intermediate portion of the protruding portion 36 of the shield case 35 shown in FIG. The fixing projection 37c provided with the is provided. In the vicinity of the lower portion of the shield case 35, the power amplifier 47 is pressed from the back to the front in the same manner as the protrusion 36 described above at a position facing power amplifiers 47 and 47 of the control board 45 described later. , 47 are provided with convex surface portions 38, 38 for contact.

  An IC card holder 40 is disposed at the upper part of the back surface of the shield case 35. As shown in FIG. 5, the IC card holder 40 has a rectangular shield case 35 with a length in the longitudinal direction that is shorter than that of the shield case 35, and an IC card is inserted therein. A box-shaped IC card slot 41, a thin plate-like base 42 to which the IC card slot 41 is fixed, and an IC card inserted into the IC card slot 41 and the control board 45 are electrically connected. And a connector 43. And IC card holder 40 provided with these structures is formed with the metal material except circuit parts, such as connector 43. FIG.

  In addition, an upper portion of the base 42 of the IC card holder 40, that is, in the vicinity of the short side connected to the hinge mechanism 50, is provided on the shield case 35 when disposed on the back surface of the shield case 35. Through-holes 44a, 44a communicating with the through-holes 37a, 37a are provided, and further, a through-hole provided in the fixing projection 37c of the shield case 35 is provided at an intermediate portion connecting the two through-holes 44a, 44a. A through-hole 44b communicating with is provided.

  The control board 45 provided in the lower main body 30 is mainly composed of a semiconductor substrate 46 having a multilayer structure and various electronic circuits as shown in FIG. And it arrange | positions so that a part of the back surface may be covered with the shield case 35. FIG. Most of the various electronic circuits formed on the semiconductor substrate 46 are attached to the back surface of the semiconductor substrate 46, and power amplifiers 47 and 47, which are one of these electronic circuits, are arranged below the semiconductor substrate 46. It is installed. Further, a charging IC chip 48 is disposed near the center of the semiconductor substrate 46. Above the charging IC chip 48, a connector 43 of the IC card holder 40 is connected to a flexible printed circuit (flexible printed circuit, illustrated). A connector 49 to be connected via a) is attached.

  The upper main body 20 and the lower main body 30, specifically, a display unit holder (not shown) for fixing the display unit 21 and the shield case 35 are connected by a hinge mechanism 50. As shown in FIGS. 7 and 8, the hinge mechanism 50 includes first to third frames 55, 60, 65 made of metal (for example, stainless steel) each made of a horizontally long plate, and the first frame 55 is a lower portion. Fixed to the shield case 35 of the main body 30, the second frame 60 is fixed to the display unit holder of the upper main body 20, and the third frame 65 fixes the first and second frames 55, 60 to be rotatable. .

  The first frame 55 is made of a horizontally long metal plate, and extends from both ends in the longitudinal direction so that left and right arm pieces 56a and 56b having the same shape having through holes at the tip end portions thereof stand upright. The through holes provided at the front ends of 56a and 56b are through holes provided in the lower arms 67a and 67b (see FIG. 8C) of the left and right arm pieces 66a and 66b of the third frame 65 disposed on the inner surface side thereof. The first rotating shaft 70 is formed by communicating with the hole. In addition, communication holes 57 a and 57 a communicating with the through holes 37 a of the shield case 35 are provided at positions close to the left and right arm pieces 56 a and 56 b of the first frame 55. Further, from the lower side wall of the central portion in the longitudinal direction of the first frame 55, that is, from the side wall located on the lower main body 30 side when attached to the lower main body 30, it is predetermined in a direction orthogonal to the longitudinal direction of the first frame 55. An extension portion 58 extending in length is provided, and a locking hole 57 b that fits into the locking projection 37 b of the shield frame 35 is formed at the distal end portion of the extension portion 58. Furthermore, the upper side wall at the center in the longitudinal direction of the first frame 55, that is, the side wall close to the third frame 65, has a notch whose width is substantially equal to or slightly larger than the outer diameter of the fixing projection 37c. 57c is provided.

  The second frame 60 is made of a horizontally long metal plate, and the width of the second frame 60 is widened in the vicinity of both end portions. , 61b extends so as to stand upright. The through-holes provided at the front ends of the left and right arm pieces 61a and 61b are formed in the upper arms 68a and 68b (see FIG. 8C) of the left and right arm pieces 66a and 66b of the third frame 65 disposed on the inner surface side. The second rotating shaft 71 is formed by communicating with the provided through hole. The widened portion of the second frame 60 is provided with communication holes 62a and 62b that communicate with through holes (not shown) provided in the display unit holder.

  The third frame 65 is made of a horizontally long metal plate, and is formed so that left and right arm pieces 66a, 66b with its tip branching up and down from both ends thereof are erected, of which the left arm piece 66a is The right arm piece 66b includes an upper arm 67b and a lower arm 67b that are vertically branched and have a through hole at the tip.

  The hinge mechanism 50 formed by connecting the first to third frames 55, 60, and 65 having the above-described configuration is a biaxial hinge having first and second rotation shafts 70.71. Further, in a state where the first to third frames 55, 60, 65 are connected, the connection between the left arm pieces 56 a, 61 a of the first and second frames 55, 60 and the left arm piece 66 a of the third frame 65 is performed. A driving mechanism 73 and a linkage mechanism 75 are provided, and a stopper mechanism 76 is provided at a connecting portion between the right arm pieces 56b and 61b of the first and second frames 55 and 60 and the right arm piece 66b of the third frame 65. Is provided.

  The drive mechanism 73 opens and closes (rotates) the upper and lower bodies 20 and 30 and maintains this state when the upper and lower bodies 20 and 30 are stopped at a predetermined position, and obtains an appropriate snap action when the upper and lower bodies 20 and 30 are opened and closed. The cam piece provided inside the left arm pieces 56a and 61a of the first and second frames 55 and 60 and the left arm piece 66a of the third frame 65 are provided. This engagement state is achieved by the biasing mechanism 74 made of a spring body or the like disposed outside the left arm pieces 56a, 61a of the first and second frames 55, 60 in a state where the cam pieces provided on the outside are engaged. It is comprised by energizing. The linkage mechanism 74 is provided for interlocking the rotation of the first frame 55 with respect to the third frame 65 and the rotation of the second frame 60 with respect to the third frame 65, and is constituted by a gear, for example. Has been. Further, the stopper mechanism 76 sets the maximum opening angle (for example, 160 °) of the upper and lower bodies 20 and 30, and restricts the rotation of the upper and lower bodies 20 and 30 in the state where the maximum opening angle is reached. It is supposed to be. Note that each of the components constituting the drive mechanism 73, the linkage mechanism 75, and the stopper mechanism 76 is formed of a material having high thermal conductivity, such as stainless steel.

  When assembling each of the above-described components, as shown in FIGS. 2 and 3, a control board is disposed on the front surface of the shield case 35, and a protrusion provided above the shield case 35 is provided on the back surface thereof. The first frame 55 is disposed in the portion 36, and the IC card holder 40 is disposed so as to cover the upper portion of the first frame 55. The through holes 37a and 37a of the shield case 35 and the through holes of the fixing protrusion 37c The communication holes 57 a and 57 a and the notch 57 c of the first frame 55 and the through hole 44 a of the IC card holder 40. 44a and 44b are fixed by screws so that the respective members come into contact with each other.

  In the foldable mobile phone 10 assembled in this way, the surfaces of the power amplifiers 47 and 47 of the control board 45 disposed on the surface of the shield case 35 are brought into contact with the convex portions 38 and 38 of the shield case 35. As a result, the heat generated in the power amplifiers 47 and 47 is transmitted to the shield case 35 via the convex portions 38 and 38. Further, since the shield case 35 is in contact with the first frame 55 of the hinge mechanism 50 at the upper part thereof, the heat transmitted to the shield case 35 is further transmitted to the first frame 55 of the hinge mechanism 50. In addition, since the first frame 55 is also in contact with the IC card holder 40, the heat transmitted to the first frame 55 is further transmitted to the IC card holder 40. As described above, the heat generated from the power amplifiers 47 and 47 is conducted to the shield case 35, the first frame 55 of the hinge mechanism 50, and the IC card holder 40, whereby heat is radiated by all of these members. Thus, a good heat dissipation effect can be obtained. In addition, since the first hinge mechanism 50 is partially extended with respect to the shield case 35 and the IC card holder 40 so as to increase the contact area thereof, good heat conduction can be obtained. Yes.

  As described above in detail, according to the mobile phone 10 according to the present invention, the shield case 35, the first frame 55 of the hinge mechanism 50, and the IC card holder 40 are made of stainless steel, and the power amplifier 47 is a heating element. Since 47 is configured to be in direct contact with the shield case 35, the heat from the power amplifiers 47 and 47 can be efficiently radiated to the outside through the heat conduction path of the shield case 35, the hinge mechanism 50, and the IC card holder 40. it can.

  In the present embodiment, the power amplifiers 47 and 47 are applied as the heating elements. However, the present invention is not limited to this, and the present invention can also be applied to the charging IC chip 48 and other semiconductor elements.

  In the present embodiment, the description has been made using stainless steel as a material having good thermal conductivity for forming the shield case 35, the hinge mechanism 50, and the IC card holder 40. However, the present invention is not limited to this, and magnesium, aluminum A material having excellent thermal conductivity such as a metal such as copper or carbon can also be applied.

  Furthermore, in the present embodiment, the foldable mobile phone has been described as an example. However, the present invention is not limited to this, and any portable electronic device including at least a display unit and an operation unit may be used. For example, a PDA or the like The present invention can be similarly applied to small portable computers and portable game machines.

  According to the present invention, heat from the heating element can be efficiently radiated to the outside. In particular, since a CDMA mobile phone generates a large amount of heat from a power amplifier, it is useful as a heat dissipation structure with high heat dissipation efficiency.

FIG. 1 is a front perspective view of a foldable mobile phone according to an embodiment of the present invention. FIG. 2 is a rear perspective view showing the state of the lower body and the hinge mechanism from which various covers and the like of the folding cellular phone according to the embodiment of the present invention are removed. FIG. 3 is an exploded perspective view of the foldable mobile phone shown in FIG. 4A and 4B are diagrams showing a shield case. FIG. 4A is a rear view, and FIG. 4B is a front view. FIG. 5 is a view showing the IC card holder, FIG. 5 (a) is a rear view, and FIG. 5 (b) is a front view. 6A and 6B are diagrams showing the control board, in which FIG. 6A is a rear view and FIG. 6B is a front view. 7 shows a state in which the hinge mechanism is opened, FIG. 7A is a front view, and FIG. 7B is a right side view. 8 shows a state in which the hinge mechanism is closed, FIG. 8 (a) is a front view, FIG. 8 (b) is a right side view, and FIG. 8 (c) is a view seen from the X direction of FIG. 8 (a). is there.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Folding type mobile phone 20 Upper body 21 Display part 30 Lower body 31 Key operation part 35 Shield case 38 Convex part 40 IC card holder 41 IC card slot 45 Control board 47 Power amplifier 50 Hinge mechanism 55 1st frame 60 2nd frame 65 3rd frame

Claims (4)

An electronic device comprising an upper body having a display unit, a lower body having an operation unit, and a hinge mechanism for rotatably connecting the upper body and the lower body,
The lower main body includes at least a shield case made of a metal material, an IC card holder made of a metal material to which an IC card can be connected, and a control board having a heating element,
The hinge mechanism includes a frame made of a metal material,
An electronic apparatus, wherein the shield case and the IC card holder are brought into contact with each other via a frame of the hinge mechanism, and a heating element of the control board is disposed so as to contact the shield case. The electronic device according to claim 1, wherein the shield case is provided with a convex surface portion at a position corresponding to the surface of the heating element so as to contact the surface of the heating element. The electronic device according to claim 1, wherein the heating element is at least one of a power amplifier and a charging IC chip. The hinge mechanism includes a first frame fixed to the shield case and the IC card holder, a second frame fixed to the upper body, and a first frame rotatably connected to the first and second frames. The first frame includes a part of the shield case and the IC card holder so that an area of a contact portion between the first case and the shield case and the IC card holder is increased. The electronic device according to claim 1, wherein the electronic device is disposed in contact with the electronic device .

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