JPH10206246A - 物体温度の非接触測定装置及び方法 - Google Patents
物体温度の非接触測定装置及び方法Info
- Publication number
- JPH10206246A JPH10206246A JP9346525A JP34652597A JPH10206246A JP H10206246 A JPH10206246 A JP H10206246A JP 9346525 A JP9346525 A JP 9346525A JP 34652597 A JP34652597 A JP 34652597A JP H10206246 A JPH10206246 A JP H10206246A
- Authority
- JP
- Japan
- Prior art keywords
- temperature
- conductive element
- adjusting
- zero
- heat flux
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 20
- 230000004907 flux Effects 0.000 claims abstract description 24
- 230000001105 regulatory effect Effects 0.000 claims abstract 4
- 238000009529 body temperature measurement Methods 0.000 claims description 31
- 239000002826 coolant Substances 0.000 claims description 24
- 239000000110 cooling liquid Substances 0.000 claims description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000001276 controlling effect Effects 0.000 claims 3
- 238000001816 cooling Methods 0.000 claims 3
- 239000007788 liquid Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 abstract description 14
- 235000012431 wafers Nutrition 0.000 description 31
- 238000004616 Pyrometry Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000004065 semiconductor Substances 0.000 description 5
- 238000012545 processing Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000005350 fused silica glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000003213 activating effect Effects 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/0003—Radiation pyrometry, e.g. infrared or optical thermometry for sensing the radiant heat transfer of samples, e.g. emittance meter
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K1/00—Details of thermometers not specially adapted for particular types of thermometer
- G01K1/16—Special arrangements for conducting heat from the object to the sensitive element
- G01K1/165—Special arrangements for conducting heat from the object to the sensitive element for application in zero heat flux sensors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/768915 | 1996-12-17 | ||
| US08/768,915 US5884235A (en) | 1996-12-17 | 1996-12-17 | Non-contact, zero-flux temperature sensor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10206246A true JPH10206246A (ja) | 1998-08-07 |
| JPH10206246A5 JPH10206246A5 (enExample) | 2005-07-28 |
Family
ID=25083864
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9346525A Pending JPH10206246A (ja) | 1996-12-17 | 1997-12-16 | 物体温度の非接触測定装置及び方法 |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US5884235A (enExample) |
| JP (1) | JPH10206246A (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012504750A (ja) * | 2008-07-31 | 2012-02-23 | ジーイー・インフラストラクチャー・センシング・インコーポレイテッド | 温度平衡を用いる温度センサ用のシステム及び方法 |
| US20240035894A1 (en) * | 2020-12-08 | 2024-02-01 | U Electronics Co., Ltd. | Apparatus, Method, and Computer-Readable Recording Medium for Correcting Temperature of Object Using Shutter |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB0103886D0 (en) * | 2001-02-16 | 2001-04-04 | Baumbach Per L | Temperature measuring device |
| US6641301B2 (en) * | 2001-04-09 | 2003-11-04 | Exergen Corporation | Radiation detector with passive air purge and reduced noise |
| JP3812884B2 (ja) * | 2001-06-27 | 2006-08-23 | 日本電信電話株式会社 | 温度検出方法および温度検出器 |
| US6907364B2 (en) * | 2002-09-16 | 2005-06-14 | Onwafer Technologies, Inc. | Methods and apparatus for deriving thermal flux data for processing a workpiece |
| US9068895B2 (en) * | 2009-04-15 | 2015-06-30 | 3M Innovative Properties Company | Deep tissue temperature probe constructions |
| CN102458232A (zh) * | 2009-04-15 | 2012-05-16 | 亚利桑特保健公司 | 深部组织温度探测器结构 |
| US8226294B2 (en) * | 2009-08-31 | 2012-07-24 | Arizant Healthcare Inc. | Flexible deep tissue temperature measurement devices |
| US8292495B2 (en) | 2010-04-07 | 2012-10-23 | Arizant Healthcare Inc. | Zero-heat-flux, deep tissue temperature measurement devices with thermal sensor calibration |
| US8292502B2 (en) | 2010-04-07 | 2012-10-23 | Arizant Healthcare Inc. | Constructions for zero-heat-flux, deep tissue temperature measurement devices |
| US9134186B2 (en) | 2011-02-03 | 2015-09-15 | Kla-Tencor Corporation | Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces |
| US9354122B2 (en) | 2011-05-10 | 2016-05-31 | 3M Innovative Properties Company | Zero-heat-flux, deep tissue temperature measurement system |
| US20230287556A1 (en) * | 2020-06-30 | 2023-09-14 | MAX-PLANCK-Gesellschaft zur Förderung der Wissenschaften e.V. | Method for controlling a flux distribution of evaporated source material, detector for measuring electromagnetic radiation reflected on a source surface and system for thermal evaporation with electromagnetic radiation |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| ATE109274T1 (de) * | 1986-06-20 | 1994-08-15 | Lehmann Martin | Verfahren zum berührungslosen messen einer temperatur von einem körper sowie anordnung hierfür. |
| US5294200A (en) * | 1989-11-01 | 1994-03-15 | Luxtron Corporation | Autocalibrating dual sensor non-contact temperature measuring device |
| US5054936A (en) * | 1989-11-16 | 1991-10-08 | Jacob Fraden | Sensor for active thermal detection |
| US5106200A (en) * | 1990-12-20 | 1992-04-21 | Applied Materials, Inc. | Apparatus for measuring temperature of wafer |
| JP3451107B2 (ja) * | 1992-10-05 | 2003-09-29 | 株式会社エコ・トゥエンティーワン | 電子冷却装置 |
| US5645349A (en) * | 1994-01-10 | 1997-07-08 | Thermoscan Inc. | Noncontact active temperature sensor |
| US5464284A (en) * | 1994-04-06 | 1995-11-07 | Luxtron Corporation | Autocalibrating non-contact temperature measuring technique employing dual recessed heat flow sensors |
| US5730528A (en) * | 1996-08-28 | 1998-03-24 | Lockheed Martin Energy Systems, Inc. | High temperature thermometric phosphors for use in a temperature sensor |
-
1996
- 1996-12-17 US US08/768,915 patent/US5884235A/en not_active Expired - Fee Related
-
1997
- 1997-12-16 JP JP9346525A patent/JPH10206246A/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012504750A (ja) * | 2008-07-31 | 2012-02-23 | ジーイー・インフラストラクチャー・センシング・インコーポレイテッド | 温度平衡を用いる温度センサ用のシステム及び方法 |
| US20240035894A1 (en) * | 2020-12-08 | 2024-02-01 | U Electronics Co., Ltd. | Apparatus, Method, and Computer-Readable Recording Medium for Correcting Temperature of Object Using Shutter |
Also Published As
| Publication number | Publication date |
|---|---|
| US5884235A (en) | 1999-03-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6798036B2 (en) | Temperature measuring method and apparatus in semiconductor processing apparatus, and semiconductor processing method and apparatus | |
| US6191399B1 (en) | System of controlling the temperature of a processing chamber | |
| JPH10206246A (ja) | 物体温度の非接触測定装置及び方法 | |
| US6064799A (en) | Method and apparatus for controlling the radial temperature gradient of a wafer while ramping the wafer temperature | |
| JP4034344B2 (ja) | ウエハの温度制御方法及び装置 | |
| US20050178335A1 (en) | Method and apparatus for active temperature control of susceptors | |
| US4956043A (en) | Dry etching apparatus | |
| KR101648082B1 (ko) | 화학 증착 챔버 내부의 베이스 가열 제어 장치 및 방법 | |
| KR20110088409A (ko) | 기판 재치 장치의 평가 장치 및 그 평가 방법, 그리고 이에 이용되는 평가용 기판 | |
| JP3911071B2 (ja) | 高速ランプ加熱処理装置及び高速ランプ加熱処理方法 | |
| JP4829833B2 (ja) | 温度推定方法および温度推定装置 | |
| JP3931357B2 (ja) | 半導体装置の製造方法 | |
| JPH03145121A (ja) | 半導体熱処理用温度制御装置 | |
| JPH06117938A (ja) | 基準黒体の温度制御装置 | |
| JP2982026B2 (ja) | 温度測定装置とこれを用いた被加熱体の温度測定装置 | |
| JPH0476618B2 (enExample) | ||
| KR100331023B1 (ko) | 냉각수단을 구비한 히터 조립체 | |
| JPH11145235A (ja) | 半導体ウェーハの温度調節プレート | |
| JPH10104147A (ja) | 熱重量測定装置 | |
| CN220306221U (zh) | 制冷载盘装置及半导体设备 | |
| TW202514083A (zh) | 用於製造焊接或燒結結點的構件之溫度調節之方法及焊接或燒結裝置 | |
| KR101002939B1 (ko) | 히터의 다중 온도 제어시스템 | |
| KR100858529B1 (ko) | 반도체 제조장비의 온도제어장치 | |
| JPH0783864A (ja) | 熱伝導率の測定方法及び測定装置 | |
| Vandenabeele et al. | The Influence of Facility Conditions on A±0.25° C Repeatability Lamp Voltage Controlled RTP System |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20041216 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20041216 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060828 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060904 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20061204 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20061207 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20070611 |