JPH10157357A - Ic card - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an IC card wherein an IC module does not separat from a substrate even at comparatively higher temperature, the card substrate is not deformed by heat when the IC module is bonded, bonding operation is simple, and an apparatus for bond operation can be simplified. SOLUTION: A recessed part 2 is provided on one side of a card substrate 1, and an IC module 3 is fixed by bonding via a reactive hot melt adhesive being an adhesion layer 15 in the recessed part 2. As the reactive hot melt adhesive, a moisture curing type urethane hot melt adhesive is concretely used. A stopper 13 for controlling a height position of the IC module 3 in a thickness direction of the card substrate 1 is protruded on a bottom wall 12 in the recessed part 2 bonded to the IC module 3 via the adhesion layer 15. The stopper 13 has a function wherein a thickness of the adhesion layer 15 formed between the card substrate 1 and the IC module 3 is controlled.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of an IC card having an IC module.

[0002]

2. Description of the Related Art An IC card is a card-like medium containing an IC chip and has advantages such as a larger storage capacity and less influence of magnetism than a magnetic card. It is being used as a storage medium in various fields.

FIG. 8 shows the structure of a conventional IC card. As shown in this figure, in general, an IC card has a stepped concave portion 2 formed in a thin plastic card substrate 1 serving as a base material, and in this concave portion 2, is called a chip-on-board (COB). In this configuration, the IC module 3 is fitted and bonded and fixed via the adhesive layer 15. Here, the IC module 3 includes an IC chip 6 on an IC substrate (external terminal plate) 4 on which a pattern (not shown) is provided.
Are connected by a bonding wire 7, and the connection portion and the IC chip 6 are sealed with a resin.

Conventionally, in such an IC card,
As the adhesive layer 15, for example, a thermal adhesive film containing a thermoplastic polyurethane resin as a main component was used, and the bonding operation was performed as follows. First, an upper surface (a bottom wall 1 of the first concave portion 2a) in the drawing in which the concave portion 2 of the card substrate 1 is formed.
2), a thermal adhesive film formed in a predetermined shape in advance is mounted. Next, the IC is placed on the heat-adhesive film.
The IC module 3 is set so that the pattern-side surface of the substrate 4 is positioned. In this state, the thermal head 20 is applied to the surface on the opposite side of the IC substrate 4 (the upper surface in the figure where the IC chip is not provided) and heated and pressed by a predetermined amount to soften the thermal adhesive film to a predetermined state. Then, the IC module 3 is bonded to the card substrate 1 via the bonding layer 15 formed by the curing.

[0005]

However, in a conventional IC card using a thermal adhesive film containing a thermoplastic polyurethane as a main component as described above, the characteristics of the thermoplastic polyurethane constituting the thermal adhesive film are limited. At a high temperature (for example, 80 to 120 ° C.) exceeding the card storage temperature range (for example, -5 to 50 ° C.), the IC module 3 may be peeled off from the card substrate 1. When bonding the IC module 3, it is necessary to apply heat equal to or higher than the softening temperature of the card substrate 1 to the IC module 3 and the card substrate 1 for several seconds, and the heat may deform the card substrate 1. Furthermore, according to the above-described conventional IC card using a thermal adhesive film, when the IC module 3 is bonded and fixed in the concave portion 2 of the card substrate 1, heat is applied so as to correspond to the bonding portion in the concave portion 2. The adhesive film must be stamped into a predetermined shape in advance.
Also, attach the punched thermal adhesive film in place,
It is necessary to perform a relatively complicated operation of setting the IC module 3 thereon and performing heating and pressure bonding, and thus requires a complicated device.

Conventionally, an instantaneous adhesive such as cyanoacrylate or an epoxy two-liquid mixed type adhesive such as araltite (trade name) may be used. Although excellent in strength and heat resistance, the flexibility or elasticity after curing is relatively small, so that when a bending force or the like is applied to the IC card, there is a problem that the resulting stress directly acts on the IC module.

An object of the present invention is to provide a high temperature (for example, 80 to 12) exceeding the card storage temperature range (for example, -5 to 50 ° C).
0 ° C), the IC module does not peel off from the card substrate,
An object of the present invention is to provide an IC card in which a card substrate is not deformed by heat during bonding of an IC module, does not require a preparatory operation such as punching a heat bonding film, and can simplify equipment for bonding.

[0008]

In order to achieve the above object, according to the present invention, a concave portion 2 is provided on one surface of a card substrate 1, and an IC module 3 is bonded and fixed in the concave portion 2 via an adhesive layer 15. The IC card according to claim 1, wherein the adhesive layer 15 is formed of a reactive hot melt adhesive.

Specifically, a moisture-curable urethane-based hot melt adhesive is used as the adhesive for bonding the IC modules. Such a moisture-curable urethane-based hot melt adhesive is, for example, an isocyanate group-terminated urethane prepolymer that is cured by causing a crosslinking reaction due to moisture in the air, various thermoplastic polymers for improving strength,
It can be obtained by blending a tackifying resin, a plasticizer, a catalyst and the like.

A stopper 13 for regulating the height position of the IC module 3 in the thickness direction of the card substrate 1 is projected on the bottom wall 12 in the concave portion 2 joined to the IC module 3 via the adhesive layer 15. Set up. This stopper 13
The tip of the IC module 3 contacts the IC module 3 when the adhesive is applied, thereby regulating the height position of the IC module 3. That is, the stopper 13 has a function of controlling the thickness of the adhesive layer 15 formed between the card substrate 1 and the IC module 3.

[0011]

In the IC card of the present invention, the reactive hot-melt adhesive such as the moisture-curable urethane-based hot-melt adhesive forming the adhesive layer 15 exhibits plasticity at a relatively low temperature before being cured. Excellent handling because it can be easily processed. Then, once cured, an adhesive layer having relatively high heat resistance, which is a property common to reactive adhesives, is formed. Therefore, the card storage temperature range (for example, -5 to 5)
Since the adhesive layer 15 does not deteriorate even at a high temperature exceeding 0 ° C. (for example, 80 to 120 ° C.), the IC module 3 does not peel off from the card substrate 1.

The reactive hot-melt adhesive used in the present invention is originally composed of a highly elastic urethane resin, and therefore has excellent impact resistance even after being cured. Therefore, since the adhesive layer 15 itself has elasticity, even if the card is bent or deformed, the stress caused by the bending can be absorbed to a certain extent by the adhesive layer 15, so that the stress acting on the IC module 3 is correspondingly increased. Can be reduced.

When the IC module 3 is bonded, the reactive hot melt adhesive liquidized at, for example, about 120 ° C. is applied to the concave portion 2 of the card substrate 1. Since it cools, the card substrate 1 is not deformed by heat. In addition, since the adhesive can be applied by a dispenser, there is no need to perform a punching process on a film which was necessary when a heat-bonding film was used, and a complicated device for setting such a film material at a predetermined position is also available. Since it is not required, the facility can be simplified accordingly.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) As shown in FIG. 1, an IC according to the first embodiment
The card has a card substrate 1 made of, for example, polyvinyl chloride formed in a thin rectangular shape, and has an IC on one side thereof.
A recess 2 for mounting a module is formed, and
In this configuration, a C module (COB) 3 is mounted. IC
The module 3 itself is the same as the above-mentioned conventional one, and as shown in FIG. 2, has an IC board 4 made of, for example, a glass epoxy resin, and a predetermined pattern (not shown) is formed on the IC board 4. An IC chip 6 is bonded to a provided surface (a lower surface in the figure, hereinafter referred to as a lower surface) 5 and connected by a bonding wire 7, and the connection portion and the IC chip 6 are sealed with a synthetic resin 9. .

The IC module 3 is fitted into the terrace-shaped concave portion 2 and is fixed by an adhesive layer 15. Specifically, the concave portion 2 of the card substrate 1 is
First concave portion 2a having a rectangular shape slightly larger than the plane of the C substrate 4
And a second recess 2b, which is recessed in the bottom wall 12 of the first recess 2a and is slightly larger than the first recess 2a, is formed in an inverted convex cross section. Wall 12
The lower surface 5 of the peripheral portion of the IC substrate 4 projecting outward from the IC chip 6 is bonded and fixed via an adhesive layer 15, and the IC chip 6 is disposed in the second recess 2b in this state.
In this case, the adhesive layer 15 in this case is formed of a moisture-curable urethane-based hot melt adhesive.

The moisture-curable urethane-based hot-melt adhesive comprises an isocyanate group-terminated urethane prepolymer, which is cured by causing a crosslinking reaction due to moisture in the air, and various thermoplastic polymers for improving strength, a tackifying resin,
It is obtained by blending a plasticizer, a catalyst, and the like, and has excellent workability and handleability before curing, and has excellent heat resistance and elasticity after curing. That is, a relatively low temperature (120 ° C.) before curing.
It is easy to process because it shows plasticity and is easy to handle, and once cured, it forms an adhesive layer with high heat resistance, and because it is mainly composed of urethane resin, which is originally rich in elasticity It has the property of exhibiting excellent impact resistance. Here, as a composition of the moisture-curable urethane-based hot melt adhesive used in the present example, a trade name: Hibon 4830 manufactured by Hitachi Chemical Co., Ltd. was used.

Furthermore, in the IC card of the present embodiment, a stopper 13 for regulating the position of the card substrate 1 in the thickness direction when the IC module 3 is mounted is projected from the bottom wall 12 of the first recess 2a. . The stopper 13 has a height (the first height) equivalent to the required thickness of the adhesive layer 15.
(Dimension in the depth direction of the recess 2a). And
After applying the adhesive to form the adhesive layer 15 on the bottom wall 12 of the first concave portion 2a, the IC module 3 is fitted and the upper surface side in the figure is pressed with a predetermined force, and the opposite side is applied. The bottom surface 5 located in the first recess 2a contacts the tip of the stopper 13 so that the bottom wall 12 in the first recess 2a and the IC module 3
A layer having a certain thickness or a clearance serving as an adhesive layer is secured between them.

In the illustrated example, the stopper 13 is formed in an annular shape in plan view so as to surround the periphery of the second recess 2b on the bottom wall 12 of the first recess 2a. However, this type of stopper only needs to ensure an adhesive layer or clearance of a certain thickness between the bottom wall in the recess 2 including the first recess 2a and the IC module 3, and thus surrounds the periphery of the second recess 2b. Needless to say, they may be provided in a discrete state at a predetermined interval from each other as described above.

The above IC card is manufactured, for example, as follows. That is, as shown in FIG. 3, first, a predetermined portion of the material for the card substrate is cut (counterbore),
On one surface thereof, a concave portion 2 having an inverted convex cross section for mounting an IC module (hereinafter, reference numerals of respective portions are shown in FIG. 2) is formed. However, when a material for a card substrate in which a concave portion 2 for mounting an IC module is previously formed on one side by injection molding or the like is used, this cutting process can be omitted. Then
A liquid moisture-curable urethane-based hot melt adhesive is applied to the bottom wall 12 of the first recess 2a in the recess 2.

Next, the IC is placed in the recess 2 on which the adhesive has been applied.
After setting the module 3, the IC substrate 4 shown in FIG.
Is pressed by a predetermined amount with a predetermined force. By doing so, the lower surface 5 of the IC substrate 4 comes into contact with the stopper 13 in the first recess 2a, and the IC module 3 does not move in the pressing direction any further. In this state, an adhesive layer 15 of a predetermined thickness made of the above adhesive is formed between the lower surface 5 of the IC module 3 and the wall surface of the bottom wall 2a of the first concave portion 2a. 3 is joined to the bottom wall 2a of the first recess 2a. Thus,
The IC module 3 is bonded and fixed to a predetermined position in the recess 2 of the card substrate 1.

According to the above-mentioned IC card, since the moisture-curable urethane hot-melt adhesive is used as the bonding means for bonding and fixing the IC module 3, the bonding layer 15 formed by the curing is It has heat resistance enough to withstand relatively high temperatures. This prevents the IC module 3 from peeling off from the card substrate 1 even at a high temperature (for example, 80 to 120 ° C.) exceeding the card storage temperature range (for example, -5 to 50 ° C.). Furthermore, since the moisture-curable urethane-based hot-melt adhesive originally contains a highly elastic urethane resin as a main component, the cured adhesive layer 15 also has relatively high elasticity and excellent impact resistance. . As a result, even when, for example, bending deformation occurs in the IC card due to an external force, the stress caused by the bending deformation is absorbed to some extent by the adhesive layer 15, so that the stress on the IC module 3 is reduced.

When bonding the IC module 3, 1
The adhesive, which is liquid at about 20 ° C., is applied. Since the adhesive cools in a short time, there is a problem that has occurred when a conventional thermal adhesive film is used, that is, the card is heated by the heat applied during bonding. The problem that the substrate is deformed can be solved. In addition, since the adhesive can be applied by a dispenser, there is no need to perform a punching process on the film which was necessary when using a thermal adhesive film, and a complicated device for setting such a film material in a predetermined position. Since it is not necessary, the equipment can be simplified accordingly.

(Second Embodiment to Fifth Embodiment) FIGS. 4 to 7
Next, another embodiment of the present invention will be described. Among them, FIG.
A second embodiment in which a stopper 13 is formed in the C card near the outer peripheral portion of the bottom wall 12 of the first recess 2a is shown. According to this, when the adhesive layer 15 is formed using the moisture-curable hot melt adhesive, it is possible to prevent or suppress the adhesive from protruding outside the stopper 13. In this case, if a space a is provided between the inner peripheral wall of the first concave portion 2a and the stopper 13 as shown in the figure, even if the adhesive protrudes outward, the protruded adhesive will remain in the space a. Therefore, it is possible to reliably prevent the adhesive from protruding outside the concave portion 2.

FIG. 5 shows a third embodiment in which an adhesive layer 15 made of a moisture-curable hot melt adhesive is provided between the entire bottom wall of the recess 2 and the IC module 3. According to this, since the bonding area is larger than in the case of the first embodiment, the IC module 3 is more securely joined and fixed in the recess 2.

In the above embodiments, the first concave portion 2a
Although a predetermined stopper 13 is formed on the bottom wall 12 of this embodiment, such a stopper 13 is not always necessary. FIGS. 6 and 7 show an IC card according to a fourth embodiment and a fifth embodiment of the present invention without such a stopper 13. FIG.
FIG. 7 shows that an adhesive layer 15 made of a moisture-curable hot-melt adhesive is provided between the lower surface of the card and the bottom wall 12 of the first recess 2. FIG. 7 shows the entire bottom wall of the recess 2 and the IC module 3. This shows that an adhesive layer 15 made of a moisture-curable hot melt adhesive is provided between the two. These FIGS. 6 and 7
In the IC card shown in (1), the adjustment of the height position of the IC module 3 in the thickness direction of the card substrate 1, that is, the adjustment of the thickness of the adhesive layer 15 depends on the application amount and the IC substrate when the adhesive is applied to the recess 2. This is performed by adjusting the amount of pressurization with respect to 4. In addition, in FIGS. 4 to 7, since the configuration and operation other than the above-described parts are the same as those in the first embodiment, those parts are denoted by the same reference numerals as those in FIG. 2. The description is omitted.

[0026]

As described above, according to the present invention, the heat-resistant adhesive layer 15 made of a reactive hot melt adhesive such as a moisture-curable urethane hot melt adhesive is provided in the recess 2 of the card substrate 1. Since the IC module was joined and fixed via
Even under a high temperature (for example, 80 to 120 ° C.) exceeding the card storage temperature range (for example, -5 to 50 ° C.), the adhesive layer 15 does not deteriorate, and therefore the IC module 3 does not peel off from the card substrate 1.

Since the reactive hot-melt adhesive originally contains a highly elastic urethane resin as a main component, the adhesive layer 15 formed by itself is relatively elastic and has excellent impact resistance. . Therefore, even when bending deformation or the like occurs in the card, the stress caused by the bending deformation can be absorbed to some extent by the adhesive layer 15, so that the stress acting on the IC module 3 can be reduced correspondingly.

When bonding the IC module 3, a reactive hot melt adhesive which has been heated to a predetermined temperature and turned into a liquid state is applied to the recess 2 of the card substrate 1, but this kind of adhesive is short. Since it cools down in time, the card substrate 1 is not deformed by heat. In addition, since the adhesive can be applied by a dispenser, there is no need to perform a punching process on a film which was necessary when a heat-bonding film was used, and a complicated device for setting such a film material at a predetermined position is also available. Since it is not required, the facility can be simplified accordingly.

[Brief description of the drawings]

FIG. 1 is a perspective view showing an IC card according to a first embodiment.

FIG. 2 is a sectional view taken along line AA in FIG.

FIG. 3 is a process chart used for explaining a manufacturing process of the IC card according to the first embodiment.

FIG. 4 is a partial longitudinal sectional view of an IC card according to a second embodiment.

FIG. 5 is a longitudinal sectional view of a main part of an IC card according to a third embodiment.

FIG. 6 is a longitudinal sectional view of a main part of an IC card according to a fourth embodiment.

FIG. 7 is a longitudinal sectional view of a main part of an IC card according to a fifth embodiment.

FIG. 8 is a longitudinal sectional view used to explain the structure of a conventional IC card and the bonding operation of the IC module.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Card board 2 Depression 3 IC module 12 Bottom wall 13 Stopper 15 Adhesive layer

Claims (3)

[Claims] 1. An IC card in which a concave portion 2 is provided on one surface of a card substrate 1 and an IC module 3 is bonded and fixed in the concave portion 2 via an adhesive layer 15, wherein the adhesive layer 15 reacts. An IC card formed of a conductive hot melt adhesive. 2. An IC card in which a concave portion 2 is provided on one surface of a card substrate 1, and an IC module 3 is fixedly bonded to the concave portion 2 via an adhesive layer 15; An IC card formed of a curable urethane hot melt adhesive. 3. An IC card in which a concave portion 2 is provided on one surface of a card substrate 1 and an IC module 3 is fixedly bonded to the concave portion 2 via an adhesive layer 15; The bottom wall 12 in the concave portion 2 which is formed of a curable urethane-based hot melt adhesive and is bonded to the IC module 3 via the adhesive layer 15 has a structure between the card substrate 1 and the IC module 3. Adhesive layer 1 having a predetermined thickness
Stopper 13 that regulates the height position of IC module 3 in the thickness direction of card substrate 1 so that 5 is secured.
An IC card characterized by having a protrusion.