JP2000137784A - Ic card and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent an IC chip module M from being broken owing to the concentrated load of the flexure of an IC card substrate on the joint fixation part between the support base material of the IC chip module and an IC card substrate and to prevent an adhesive for joint fixation from oozing out to the top surface of the card substrate at the time of the manufacture. SOLUTION: The IC card is constituted by joining and fixing the IC chip module M fitted in a recessed part 20 bored in one surface of the card substrate 10, composed of the support substrate 1, the IC chip, and a resin sealing part 2, with the adhesive 4. The outside surface 2a of the resin sealing part 2 of the IC chip module M fitted in the recessed part of the card substrate 10 and the inside surface 20a of the recessed part are not joined together and the bottom surface 2b of the resin sealing part 2 and the inside bottom surface 20b of the recessed part are joined and fixed together with the adhesive.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an IC card in which an IC chip module is bonded and fixed to a recess formed in one surface of a card substrate via an adhesive, and a method of manufacturing the IC card.

[0002]

2. Description of the Related Art In an IC card, an IC chip module is fitted and fixed in a recess formed in one side of a plastic card substrate, and is bonded and fixed to the card substrate via an adhesive. ing.

As an IC chip module used for an IC card, for example, an IC chip alone or a C chip having an IC chip mounted on one surface of an IC chip supporting substrate is used.
OB (Chip on Board) type and COF (Ch
ip on Flexible module) type or C
There is an IC chip module such as an OT (Chip on Tape) type.

FIG. 5A is a side view showing an example of an IC chip module M, and FIG. 5B is a top view thereof.
The C chip module M is provided on one side of a support substrate 1 (glass-epoxy resin material, polyimide resin material, metal material, or the like).
A thin IC chip having an area smaller than that of the substrate 1 is mounted, and the IC chip is sealed by a resin sealing portion 2. For example, in a contact type IC chip, the resin sealing portion of the IC chip is used. 2 on the surface of the substrate 1 side.
A plurality of external contact terminals 3 (provided that the terminal positions and shapes conform to JIS standards) of the C chip are provided.
It is exposed on the outer surface side from a.

Conventionally, such an IC chip module M
When an IC card is manufactured by using an IC chip (not a single IC chip), the support substrate 1 extending over the IC chip resin sealing portion 2 of the IC chip module M shown in FIG. As shown in FIG. 6 (a), the liquid adhesive 4 is discontinuously attached to the square corner of the IC chip mounting surface in the portion corresponding to the back surface of the protruding portion A, or FIG. 6 (b). As shown in (1), a liquid adhesive 4 is continuously attached and supplied along the periphery of the back surface of the overhang portion A of the support substrate 1. In some cases, a double-sided adhesive tape (double-sided pressure-sensitive adhesive tape, double-sided heat-sensitive adhesive tape) may be used instead of the liquid adhesive 4.

Thereafter, as shown in FIG. 7, the IC chip module M is fitted into a concave portion 20 having an inner side surface 20a and an inner bottom surface 20b formed in a plastic card substrate 10.

Subsequently, a pressing operation is performed from the upper side of the support substrate 1 of the IC chip module M so that the upper surfaces of the support substrate 1 and the card substrate 10 are at the same height, as shown in FIG.
The overhang portion A of the support substrate 1 of the IC chip module M
The adhesive 4 is expanded between the adhesive and the flat stepped portion 20c formed at the upper end of the inner surface 20a of the concave portion 20. In the case of a solvent-evaporating adhesive, the adhesive is dried and solidified, or a chemically-curable adhesive (cyano In the case of an acrylate-based adhesive or a two-component reaction-curable adhesive), the card substrate 10 is solidified by reaction.
The IC chip module M is joined and fixed in the concave portion 20 of FIG.

[0008]

However, as shown in FIG. 8, the IC chip module M according to the conventional bonding and fixing method has a
Is merely fixed at the overhanging portion A of the support substrate 1 so that the card substrate 10 is curved so as to project toward the IC chip module M or to the opposite side during use of the IC card. If it is deformed due to bending or bending, the load of the strain stress caused by the deformation is intensive.
Since the IC chip module M is hung on the projecting portion A of the chip module M, the IC chip module M may be broken.

As described above, when the adhesive 4 is supplied to the back surface of the overhang portion A of the IC chip module M or the surface of the step portion 20c of the concave portion 20 to which the overhang portion A is joined, When the adhesive 4 is supplied more than necessary, the adhesive 4 protrudes from the gap between the end of the overhang portion A and the concave portion 20 to the surface of the card substrate 10 to form an adhesive protrusion 4a, thereby forming an external contact. There is a risk of causing a contact failure between the terminal 3 and the IC card reader, and the supply of the adhesive requires strict control of the supply amount. An object of the present invention is to solve the above problem.

[0010]

According to a first aspect of the present invention, there is provided an IC card in which an IC chip module fitted into a recess formed in one side of a card substrate is fixedly bonded via an adhesive. The outer surface of the IC chip module fitted into the recess of the card substrate and the inner surface of the recess are not joined to each other, and the bottom surface of the IC chip module and the inner bottom surface of the recess are bonded to each other via an adhesive. An IC card characterized in that the IC card is fixed by bonding.

According to a second aspect of the present invention, an IC chip module is fitted into a recess formed in one surface of a card substrate, and the IC chip module is bonded and fixed to the inner surface of the recess via an adhesive. In the method for manufacturing an IC card, the liquid adhesive is supplied only to the inner surface of the concave portion, which is opposed to the bottom surface of the IC chip module facing each other, and then the IC chip module is pressed against the inner bottom surface of the concave portion. Then, the liquid adhesive is expanded on the opposing inner surface between the outer surface of the IC chip module and the inner surface of the recess so as not to adhere to both the outer surface of the IC chip module and the inner surface of the recess. While holding the outer surface of the IC chip and the inner surface of the concave in a non-bonded state, the opposing inner surfaces of the bottom surface of the IC chip module and the inner bottom surface of the concave portion are connected to each other via an adhesive. Is a manufacturing method of IC card, characterized in that the fixing.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS I of the present invention according to claim 1 of the present invention.
An embodiment of the C card will be described below in detail with reference to FIGS.

FIG. 1 is a side sectional view of an IC card according to the present invention, in which an IC chip module M is fitted in a recess 20 of a card substrate 10.

This IC chip module M has an IC chip mounted on one surface of an IC chip supporting substrate 1, and the IC chip is appropriately molded by a resin molding (packaging) using a synthetic resin. Resin sealing.

If the IC chip of the IC chip module M is a contact IC chip, a plurality of external contact terminals 3 are provided on the surface of the IC chip.
Is exposed on the outer surface side from the terminal window hole 1a penetrating through the support substrate 1, and the terminal window hole 1a is not necessarily required in the support substrate 1 as long as it is a non-contact type IC chip.

The IC chip module M fitted in the concave portion 20 of the card substrate 10 includes the bottom surface 2 b of the IC chip resin sealing portion 2 and the bottom surface 20 in the concave portion 20 of the card substrate 10.
The adhesive 4 is entirely interposed on the inner surface opposite to the bottom surface 2b of the IC chip resin sealing portion 2 and the card substrate 10
And the inner bottom surface 20b of the recess 20 is fixedly attached to each other by the adhesive 4.

An adhesive 4 is provided on the inner surface of the IC chip module M fitted in the recess 20 of the card substrate 10 so as to oppose the outer surface 2a of the IC chip resin sealing portion 2 and the inner surface 20a of the recess 20 of the card substrate 10. Is not entirely interposed between the IC chip resin sealing portion 2 and the card substrate 10.
Is in a non-joined state with the inner side surface 20a of the recess 20. Further, the IC chip supporting substrate 1 and the card substrate 10 of the IC chip module M are not joined to each other.

The IC card of the present invention has a bottom surface 2b of an IC chip resin sealing portion 2 and a concave portion 2 of a card substrate 10 as shown in a side sectional view showing another embodiment of the IC card in FIG.
Adhesive 4 interposed on the inner surface facing the inner bottom surface 20b
From the bottom surface 2b of the IC chip resin sealing portion 2 to the outer surface 2
a and over the back surface of the support substrate 1. The so-called IC chip resin sealing portion 2 of the so-called IC chip module M may be partially or completely buried in the adhesive 4. In addition, IC chip module M
The adhesive 4 may reach the back surface of the overhang portion A of the support substrate 1 of FIG.

The card substrate 10 used in the IC card of the present invention may be a single plastic sheet, a laminated sheet obtained by laminating a plurality of plastic sheets or films in multiple layers (for example, a relatively thick core sheet and a relatively thick core sheet). Or a laminated sheet with a thin oversheet).

The recess 20 formed in the card substrate 10 used in the IC card of the present invention is formed by forming a single plastic sheet into the support substrate 1 and the IC chip resin sealing portion 2.
Inner surface 20 by cutting or embossing to the size of, or by plastic molding using a mold.
a and an inner bottom surface 20b, or a relatively thick core sheet of a laminated sheet formed by laminating the supporting substrate 1 and the IC chip resin sealing portion 2 to form a hole, An inner side surface 20a and an inner bottom surface 20b are formed by laminating a relatively thin oversheet on one side of the core sheet.

Next, the IC according to the second aspect of the present invention will be described.
An embodiment of the card manufacturing method will be described in detail below with reference to FIG.

FIG. 3A is a side sectional view of an IC chip module M used in the method of manufacturing an IC card according to the present invention, FIG. 3B is a top view of the IC chip module M, and FIG. Is a bottom view of the IC chip module M. The IC chip module M includes an IC chip support substrate 1 and an IC chip mounted on one surface thereof.

This IC chip module M has an IC chip mounted on one surface of an IC chip supporting substrate 1, and the outer surface of the IC chip is appropriately sealed with a resin by resin molding (packaging). It is sealed at the stop 2.

If the IC chip constituting the IC chip module M is a contact type IC chip, a plurality of external contact terminals 3 are provided on the surface of the IC chip. The terminal window hole 1a is not necessarily required in the support substrate 1 as long as it is exposed to the outer surface side from the terminal window hole 1a thus formed and is a non-contact type IC chip.

The method of manufacturing an IC card according to the present invention comprises:
A liquid adhesive 4 (for example, an acrylic-based, urethane-based, or epoxy-based solvent-evaporating adhesive) is provided at one location substantially at the center of the inner bottom surface 20b of the recess 20 formed in the card substrate 10 shown in FIG. , A two-component reaction-curable adhesive, a heat-curable adhesive, an ultraviolet-light-curable adhesive, etc.). Alternatively, as shown in FIGS. 3 (a) and 3 (c), the adhesive 4 is formed in a point-like manner at a substantially central portion of the bottom surface 2b of the main body of the IC chip resin sealing portion 2 of the IC chip module M. Supply adhere.

Subsequently, the IC chip module M supplied with the adhesive 4 is fitted and pushed into the recess 20 of the card substrate 10 shown in FIG. 1 with the IC chip resin sealing portion 2 on the lower side. The adhesive 4 adhering to the bottom surface 2b of the IC chip resin sealing portion 2 is applied to the entire inner surface of the opposing inner surface of the bottom surface 2b of the IC chip resin sealing portion 2 and the inner bottom surface 20b of the recess 20 as shown in FIG. The height of the upper surface of the support substrate 1 of the IC chip module M and the height of the upper surface of the card substrate 10 fall within predetermined IC card standards. For example, the height is set to have a predetermined height difference or to be the same height.

Subsequently, the adhesive 4 is solidified by heat drying curing, heat reaction curing, two-component reaction curing, humidity curing, etc., and the IC chip module M is joined and fixed in the concave portion 20 of the card substrate 10 to fix the IC. Manufacture cards.

FIG. 4 is a bottom view of an IC chip module M for explaining another embodiment of the method of manufacturing the IC card. This is a case in which the adhesive 4 is supplied.

The adhesive 4 is applied to at least the bottom surface 2b of the IC chip resin sealing portion 2 in the IC chip module M, and to the inner bottom surface 20b of the concave portion 20 in the card substrate 10. However , the number of the attachment supply points may be two or more. Further, the adhesive supply amount of the adhesive 4 per one place may be the same, or the supply amount may be appropriately adjusted according to the supply point, and the adhesive supply may be performed.

[0030]

According to the IC card and the method of manufacturing the same of the present invention, in the IC chip module M, the adhesive is supplied to the bottom surface 2b of the resin sealing portion 2 of the IC chip in the IC chip module M. On the other hand, in the card substrate 10, since the process is performed on the inner bottom surface 20 b of the concave portion 20, it is possible to prevent the adhesive for joining and fixing from leaking out to the surface of the card substrate.

Therefore, it is difficult to form a protrusion of the adhesive around the upper surface of the IC chip module supporting substrate,
There is an effect that it is possible to avoid the occurrence of poor connection or the like due to the protrusion of the adhesive between the external contact terminal of the IC chip module and the contact terminal of the IC card reader.

For example, when a plastic card substrate having relatively flexibility is bent by an external force,
Even when the outer surface of the relatively rigid IC chip module (or IC chip main body) bonded and fixed thereto and the inner surface of the concave portion of the card substrate are separated from each other, the bottom surface of the IC chip module and the inner surface of the concave portion of the card substrate are separated. Since the inner surface of the overlap is securely bonded and the bonding strength is improved, the danger of extremely lowering the bonding and fixing strength of the IC chip module to the inner surface of the concave portion of the card substrate can be avoided, and the IC chip module falls off the card substrate. Can be prevented.

Adhesive supply for bonding and fixing can be performed more quickly and uniformly by attaching and supplying the adhesive to the bottom surface of the IC chip body of the IC chip module in the form of a point using an adhesive supply nozzle or the like. The adhesive can be supplied in a small amount, the required supply amount of the adhesive can be reduced as compared with the conventional case, and the economic effect is enormous.

Further, the IC card of the present invention is a conventional IC card.
During use of the IC card, the card substrate is placed on the IC chip module side or on the opposite side as compared to a case where the IC chip module is bonded and fixed to the card substrate only by the projecting portion of the module support substrate like a card. In the case where the IC chip module is deformed by being curved or bent so as to protrude, the risk of strain stress being applied to the projecting portion of the IC chip module intensively and damaging the IC chip module can be avoided. This has the effect of improving the strength and durability of the IC card.

[Brief description of the drawings]

FIG. 1 is a side sectional view illustrating an embodiment of an IC card of the present invention.

FIG. 2 is a side cross-sectional view illustrating another embodiment of the IC card of the present invention.

FIG. 3A shows an IC used for the IC card of the present invention.
Side sectional view of the chip module, (b) is a top view thereof,
(C) is the bottom view.

FIG. 4 is a bottom view of an IC chip module used for the IC card of the present invention.

FIG. 5A shows an IC used for a general IC card.
FIG. 3B is a side sectional view of the chip module, and FIG.

FIG. 6A shows an IC in a method of manufacturing an IC card.
FIG. 4B is a bottom view of the IC chip module, illustrating an example of a conventional adhesive adhesion supply method for the chip module, FIG.
Describes another example of a conventional adhesive adhesion supply method
The bottom view of a chip module.

FIG. 7 is a side sectional view for explaining a method of manufacturing an IC card by a conventional adhesive adhesion supply method.

FIG. 8 shows an I manufactured by a conventional adhesive adhesion supply method.
The sectional side view of a C card.

[Description of References] M: IC chip module A: Overhanging part 1: IC chip support substrate 1a: Terminal window hole 2: IC chip resin sealing part 2a: Sealing part outer surface 2b: Sealing part bottom surface 3: IC Chip external connection terminal 4 ... Adhesive 4a ... Protrusion 10 ... Card board 20 ... Recess 20a ... Recess inner surface 20b ... Recess inner bottom 20c ... Recess recess step

[Procedure amendment]

[Submission Date] November 30, 1998 (1998.11.
30)

[Procedure amendment 1]

[Document name to be amended] Drawing

[Correction target item name] Fig. 1

[Correction method] Change

[Correction contents]

FIG.

[Procedure amendment 2]

[Document name to be amended] Drawing

[Correction target item name] Figure 3

[Correction method] Change

[Correction contents]

FIG. 3

Claims (2)

[Claims] 1. An IC card in which an IC chip module fitted in a recess formed in one side of a card substrate is bonded and fixed via an adhesive, wherein the IC chip module fitted in the recess of the card substrate is provided. An IC card wherein the outer side surface and the inner side surface of the recess are not bonded to each other, and the bottom surface of the IC chip module and the inner bottom surface of the recess are bonded and fixed to each other via an adhesive. 2. The method according to claim 1, further comprising the step of:
In a method of manufacturing an IC card in which a C chip module is fitted and an IC chip module is bonded and fixed to an inner surface of the recess through an adhesive, when the fitting is performed, the bottom surface of the IC chip module and the inner bottom surface of the recess are opposed to each other. After supplying the liquid adhesive only to the opposing inner surface of the IC chip module, the IC chip module is pressed against the inner bottom surface of the concave portion so that the liquid adhesive does not adhere to both the outer surface of the IC chip module and the inner surface of the concave portion. By expanding the inner surface of the IC chip module opposite to the outer surface and the inner surface of the recess, the outer surface of the IC chip module and the inner surface of the recess are held in a non-joined state while the bottom surface of the IC chip module and the recess are held. A method for manufacturing an IC card, wherein inner surfaces facing the inner bottom surface are bonded and fixed to each other via an adhesive.