JPH10144763A - Processor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To considerably improve throughput and to realize the processing of high variety, by providing plural processing sets where processing parts obtained by stacking plural processing units are disposed around transportation lines, and transporting bodies to be processed between the processing sets by means of an inter-set transportation mechanism. SOLUTION: A processing station 20 has two processing sets 20a and 20b. The processing sets 20a and 20b have the transportation lines 22a and 22b at respective center parts. Then, main wafer transportation mechanisms 21a and 21b are provided for the lines along the vertical directions. All the processing units are arranged around the wafer transportation lines 22a and 22b. The plural processing units are divided into plural processing parts, and the plural processing units are arranged in multiple stages along the vertical direction in the respective processing parts.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a processing apparatus for performing processing such as coating and development on a processing target such as a semiconductor wafer or an LCD substrate.

[0002]

2. Description of the Related Art In a semiconductor device manufacturing process,
A processing liquid, for example, a photoresist liquid is applied to a semiconductor wafer typified by a silicon substrate, a circuit pattern is reduced by using a photolithography technique, the photoresist film is exposed, and a series of processings for developing the same are performed. There is a step of applying.

A processing system for performing such coating / developing includes a cassette station for unloading a semiconductor wafer as an object to be processed from a cassette and loading the semiconductor wafer into the cassette, a cleaning unit for cleaning the wafer, and a process for making the surface of the wafer hydrophobic. Unit for cooling, a cooling unit for cooling the wafer to a predetermined temperature, a resist coating unit for coating the surface of the wafer with a resist solution, and baking for pre-baking or post-baking for heating the wafer before and after applying the resist solution. A unit, a peripheral exposure unit for removing the resist on the peripheral portion of the wafer, a wafer delivery table for delivering the wafer between adjacent exposure apparatuses, and exposing the exposed wafer to a developing solution. A developing unit for selectively dissolving the exposed or unexposed portions of the resist in a developing solution; Has a consolidation with the structures in the body,
This is intended to improve work.

[0004] As such a processing system, conventionally,
A wafer transfer path is provided in the center of the system along the longitudinal direction, and the plurality of units are disposed on both sides of the transfer path with their fronts facing each other, for transferring a wafer to each unit. Is generally used so that the wafer transfer body moves on the wafer transfer path. Therefore, since a horizontally long system configuration in which various processing units are arranged along the wafer transfer path extending in the horizontal direction, the occupied space of the entire system is increased,
There is a problem that a clean room cost is high. In particular, when the cleanliness of the entire system or each part is increased by a vertical laminar flow system effective for this type of processing system, the initial cost and maintenance cost of an air conditioner or a filter are very high because the space is large.

Therefore, a processing system has been proposed in which a wafer carrier is movable in a vertical direction and rotatable around a vertical axis, and each processing unit is arranged in multiple stages around the wafer carrier (Japanese Patent Laid-Open No. Hei 4 (1994) -104). -85812). According to such a processing system, the space occupied by the system is reduced, so that the clean room cost is reduced, the transport speed and the access speed can be increased, and the throughput can be improved.

[0006]

However, in such a processing system, the number of layers is limited due to the limitation of the height of the clean room and the like, and further improvement in throughput is required at present. It is considered difficult to fully satisfy the requirements. Further, a variety of processing is also required. The present invention has been made in view of such circumstances, and it is an object of the present invention to provide a processing apparatus having extremely high throughput and capable of performing highly diversified processing.

[0007]

In order to solve the above-mentioned problems, the present invention provides a processing apparatus for performing a process comprising a plurality of steps on an object to be processed, the processing apparatus extending in a vertical direction. Transport path,
A plurality of processing units arranged around the transport path and configured by vertically stacking a plurality of processing units each performing a predetermined process on an object to be processed, and moving the transport path, A main transport mechanism for loading and unloading the object to and from each processing unit of a plurality of processing units, and a set for transporting the object between adjacent processing sets. Provided is a processing apparatus having an inter-conveying mechanism. According to the processing apparatus having such a configuration, the number of processing units can be dramatically increased, so that the throughput can be significantly improved and the variety of processing can be increased.

In this case, each of the adjacent processing sets has at least one processing unit having a transport unit, and the processing units having these transport units are arranged so as to be adjacent to each other. It is preferable that the substrate is transported via each transport unit of these adjacent processing units. As a result, the object to be processed is quickly transported between the processing sets, and the throughput is further improved. Further, it is preferable that the transport units of the adjacent processing units are arranged at the same height. Thus, the transfer of the object to be processed between the adjacent processing sets is further facilitated.

(2) The present invention also relates to a processing apparatus for performing resist coating and developing processing on an object to be processed, comprising a transport path extending in a vertical direction and a periphery of the transport path. At least one first unit configured by vertically stacking a plurality of processing units including a processing unit including a resist coating unit that applies a resist to a processing target and / or a developing unit that develops a pattern of the resist. A plurality of processing units including a processing unit, a heating unit for heating the object to be processed, a cooling unit for cooling the object to be processed, and a transport unit for transporting the object to be processed are vertically stacked. A plurality of processing sets, each of which includes: a first processing unit; and a main transport mechanism that moves along the transport path and loads and unloads the object to and from each processing unit of the plurality of processing units. Further comprising an inter-set transport mechanism for transporting an object to be processed between adjacent processing sets, wherein each of the adjacent processing sets is disposed such that a second processing unit is adjacent to the set, and the inter-set transport is provided. The mechanism provides a processing apparatus that transports an object to be processed via each transport unit of the adjacent second processing unit.

(3) Further, the present invention is a processing apparatus for performing a resist coating and developing process on an object to be processed, and a processing station for performing a series of processes including a resist coating and a developing process on the object to be processed. A transfer station for transferring the object to and from another apparatus and to and from the processing station; and an interface unit for transferring the object to and from the processing station and between the processing apparatus and the exposure apparatus. The processing station comprises: a transport path extending along the vertical direction; and a resist coating unit and / or a resist pattern disposed around the transport path and configured to apply a resist to a workpiece. At least one first processing unit configured by vertically stacking a plurality of processing units including a processing unit including a developing unit for developing A second processing unit configured by vertically stacking a plurality of processing units including a heating unit that heats the object, a cooling unit that cools the object, and a transport unit that transports the object. And a main transport mechanism that moves along the transport path and loads and unloads the object to and from each processing unit of the plurality of processing units.
Has a plurality of processing sets, and further has an inter-set transport mechanism for transporting an object to be processed between adjacent processing sets, wherein each of the adjacent processing sets is such that the second processing units are adjacent to each other. , And the inter-set transport mechanism transports an object to be processed via each transport unit of the adjacent second processing unit.

The processing apparatus according to the inventions (2) and (3) is a more specific example of applying the processing apparatus according to the invention (1) to a resist coating / developing processing apparatus. With this configuration, a resist coating / developing process with extremely high throughput is realized. In the inventions of (2) and (3), at least one of the second processing units of each of the processing sets includes a heating unit, a cooling unit, and a transport unit. In this case, the transport unit It is preferable that a heating unit is arranged at an upper position and a cooling unit is arranged at a lower position. With such a configuration, thermal mutual interference can be further reduced.

Further, in the inventions of (2) and (3), at least one of the second processing units of each of the processing sets includes a heating unit, a cooling unit, and a transporting unit, as well as a processing target. An adhesion processing unit that performs a hydrophobic treatment on the body, in this case, a heating unit and a cooling unit are arranged from above at an upper position across the transport unit, and an adhesion processing unit is arranged at a lower position, It is preferable to provide a downflow forming means for forming a downflow. With such a configuration, the HMDS of the adhesion processing unit is discharged by the downflow without reaching another processing unit while suppressing thermal mutual interference as much as possible.
The adverse effects of DS gas can be eliminated.

In the invention of (3), the transfer station is provided on one side of the processing station, and is connected from one processing set adjacent to the transfer station to another processing set adjacent thereto by the inter-set transfer mechanism. After being conveyed and after the processing is completed, it is preferable that the other processing set is returned to the one processing set by the inter-set transfer mechanism, and further returned to the transfer station. With such a configuration, the object to be processed can be loaded and unloaded by one transfer station as in the related art, while realizing high throughput and highly diversified processing.

In the inventions of (2) and (3), it is preferable that the transport units of the adjacent second processing units are arranged at the same height. This facilitates the transfer of the object between the processing sets.

In the inventions (1), (2) and (3),
It is preferable that the transport unit has two transport ports, and different transport ports are used for loading and unloading the object to be processed. In this case, it can be transported regardless of the loading / unloading timing,
Throughput is further improved.

The inter-set transport mechanism may have a transport arm for transporting the workpiece between one transport unit and the other transport unit. It may have a moving means for moving the stage and thereby transferring the object to be processed between one transfer unit and the other transfer unit. In any case, the object can be quickly conveyed.

Further, in the above (1), (2), and (3), each of the processing sets further includes downflow forming means for forming a downflow in the transport path. A gas intake port provided at an upper end of the transport path, an exhaust port provided at a lower end of the transport path, and a filter mechanism provided at the gas intake port for purifying the introduced gas. Preferably, there is. Thus, since the processing is always performed while the purified gas is being rectified, there is very little risk of generation and adhesion of particles, and extremely clean processing can be performed.

Further, in the inventions of (1), (2) and (3), it is preferable that each of the processing sets further has an atmosphere control means for controlling an atmosphere of the transport path. Thereby, the processing can always be performed in a desired atmosphere,
As a result, stable processing is realized. In this case, it is preferable that the atmosphere control unit individually controls the atmosphere of the transport path of each processing set. This makes it possible to control the processing atmosphere for each processing set, thereby realizing highly diversified processing.

[0019]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the processing apparatus of the present invention is applied to a system for applying and developing a resist on a semiconductor wafer will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic plan view showing a resist coating and developing system according to the present embodiment, FIG. 2 is a front view of FIG. 1, and FIG. 3 is a rear view of FIG.

This processing system includes a cassette station 10 as a transfer station, a processing station 20 having a plurality of processing units, and a processing station 2.
And an interface unit 30 for transferring a wafer W between an exposure apparatus (not shown) and an exposure apparatus (not shown).

The cassette station 10 loads a plurality of semiconductor wafers W as objects to be processed, for example, in units of 25 wafers, into the wafer cassette 1 and loads the semiconductor wafers W from another system into this system or from this system to another system. This is for unloading and carrying the wafer W between the wafer cassette 1 and the processing station 20.

In the cassette station 10, as shown in FIG. 1, a plurality of (four in the figure) projections 3 are formed on the cassette mounting table 2 along the X direction in the figure. The wafer cassettes 1 can be placed at a position in a line with the respective wafer entrances facing the processing station 20 side. In the wafer cassette 1, the wafers W are arranged in a vertical direction (Z direction). Also,
The cassette station 10 includes the wafer cassette mounting table 2
And a wafer transfer mechanism 4 located between the processing station 20. The wafer transfer mechanism 4 includes a wafer transfer arm 4a movable in a cassette arrangement direction (X direction) and a wafer arrangement direction (Z direction) of wafers W therein.
The arm 4a allows any one of the wafer cassettes 1 to be selectively accessed. The wafer transfer arm 4a is configured to be rotatable in the θ direction, and can transfer the wafer W to and from a transfer unit (TR) 46 belonging to a group G3 on the processing station 20 side described later.

The processing station 20 is provided with a plurality of processing units for performing a series of steps for performing a coating / phenomenon on the semiconductor wafer W, and these are arranged at predetermined positions in multiple stages. The semiconductor wafer W
Are processed one by one. This processing station 20
As shown in FIG. 1, there are two processing sets 20a and 20b. The processing sets 20a and 20b have transfer paths 22a and 22b at the center, respectively, and the main wafer transfer mechanisms 21a and 2 that can move in the vertical direction in the inside.
1b is provided, and all the processing units are arranged around the wafer transfer paths 22a and 22b. The plurality of processing units are divided into a plurality of processing units, and each processing unit includes a plurality of processing units arranged in multiple stages along a vertical direction. In this embodiment, the processing set 20
a represents five processing units G1, G2, G3, G4 and G5.
Are arranged around the wafer transfer path 22a, and
The processing set 20b also includes five processing units G6, G7, G8,
G9 and G10 are arranged around the wafer transfer path 22b, and the wafer transfer paths 22a and 22b are substantially closed spaces.

Of these, the processing units G1, G2, G6
G7 is arranged in parallel on the front side of the system (in FIG. 1), the processing section G3 is arranged adjacent to the cassette station 10, and the processing section G9 is arranged on the interface section 30.
, And the processing units G4 and G9 are disposed so as to be adjacent to the center of the processing station 20, and the processing units G
5, G10 is arranged on the back side.

In this case, as shown in FIG. 2, in the processing section G1 of the processing set 20a, two spinners for mounting a wafer W on a spin chuck (not shown) in the cup 23 and performing predetermined processing. Mold processing units are arranged vertically,
In this embodiment, a resist coating unit (COT) for coating the resist on the wafer W and a developing unit (DEV) for developing the resist pattern are stacked in two stages from the bottom. Similarly, the processing section G2 also includes a resist coating unit (CO) as two spinner-type processing units.
T) and the developing unit (DEV) are stacked in two stages from the bottom. Further, the processing units G6 and G6 of the processing set 20b
G7 has the same arrangement.

As described above, the resist coating unit (CO
The reason for disposing T) on the lower side is that the waste liquid of the resist solution is inherently more complicated than the waste liquid of the developer both mechanically and in terms of maintenance, and thus the coating unit (COT) is disposed on the lower stage. This reduces the complexity. However, if necessary, a resist coating unit (COT) can be arranged in the upper stage.

In the processing section G3 of the processing set 20a, as shown in FIG. 3, an oven-type processing unit and a transfer unit for mounting the wafer W on the mounting table 24 (see FIG. 1) and performing predetermined processing are provided. It is arranged in seven layers. Specifically, the adhesion processing units (A
D) 47a, transport unit (TR) 46a, two chill plate units (CP) 44a, 45a, and three hot plate units (HP) 43a, 42a, 4
1a is arranged.

Of these, the hot plate units (HP) 41a, 42a and 43a are for subjecting the semiconductor wafer W to a heating process such as a pre-bake process or a post-bake process.
P) 44a and 45a are for cooling the semiconductor wafer W heated by the processing, and include a transfer unit (TR) 46.
a is for transferring the semiconductor wafer W between the cassette station and the processing set 20a. The adhesion processing unit (AD) 47a performs a hydrophobic treatment on the semiconductor wafer W.

Similarly, the processing unit G4, as shown in FIG.
An oven type processing unit and a transport unit are arranged in seven stages. Specifically, in order from the bottom, a chill plate unit (CP) 54a and a transport unit (TR) 53
a and five hot plate units (HP) 52
a, 51a, 50a, 49a, and 48a are arranged.

The processing section G8 of the processing set 20b has the same configuration as the processing section G3, and includes an adhesion processing unit (AD) 47b and a transport unit (T
R) 46b, two chill plate units (CP) 44
b, 45b, and three hot plate units (H
P) 43b, 42b, 41b are arranged.

The processing section G9 has the same configuration as that of the processing section G4, and the chill plate unit (C
P) 54b, a transport unit (TR) 53b, and five hot plate units (HP) 52b, 51b, 5
0b, 49b and 48b are arranged. The transfer unit 53a of the processing unit G4 and the transfer unit 53b of the processing unit G9 include a chill plate, and can cool the semiconductor wafer W.

As described above, the processing unit G4 of the processing set 20a and the processing unit G8 of the processing set 20b are adjacent to each other, and the transport unit 53a and the processing unit G of the processing unit G4 are adjacent to each other.
The semiconductor wafer W can be transferred between the processing set 20 and the processing set 20b by an inter-set transfer mechanism described later via the transfer unit 46b of No.8. In this case, both transport units 53a and 46
b are arranged at the same height, so that the transfer of the semiconductor wafer W between these processing sets is extremely easily and smoothly performed.

The processing units G5, G10 located on the back side of the main wafer transfer mechanism 21 are also basically processing units G3, G4, G
8, G9 has a structure in which open processing units are stacked in multiple stages. The processing units G5 and G10
Can move laterally along the guide rail 25 when viewed from the main wafer transfer mechanism 21. Therefore,
Since a space is secured by sliding the processing units G5 and G10, maintenance work can be easily performed from behind the main wafer transfer mechanisms 21a and 21b.

The interface section 30 has the same length in the X direction as the processing station 20. As shown in FIGS. 1 and 2, a portable pickup cassette 3 is provided at the front of the interface section 30.
1 and stationary buffer cassettes 32 are arranged in two stages,
A peripheral exposure device 33 is provided on the back, and a central
A wafer transfer arm 34 is provided. The wafer transfer arm 34 moves in the X and Z directions to move both cassettes 3.
The wafers can be transported to the peripheral exposure devices 33. Further, the wafer transfer arm 34 is rotatable in the θ direction, and is also connected to a transfer unit 53b belonging to the processing unit G9 of the processing set 20b of the processing station 20 and a wafer transfer table (not shown) on the adjacent exposure apparatus side. The wafer W can be transferred.

As described above, the transfer between the processing set 20a and the processing set 20b is performed via the transfer unit 53a of the processing unit G4 and the transfer unit 46b of the processing unit G8. The inter-conveying mechanism will be described. As shown in FIG. 4, the transport unit 53a of the processing unit G4 has two transport ports, and has two stages 61 and 62 corresponding thereto. The transfer unit 46b of the processing unit G8 also has two transfer ports, and two stages 63,
64. In addition, the symbol P in the figure is a pin for transporting a semiconductor wafer.

The inter-set transfer mechanism includes two transfer arms 6
The transfer arm 65 transfers the semiconductor wafer W from the stage 62 of the transfer unit 53a to the stage 64 of the transfer unit 46b.
Transports the semiconductor wafer from the stage 63 of the transport unit 46b to the stage 61 of the transport unit 53a.

As described above, since each transport unit has two transport ports and corresponding stages, the transport route can be divided for loading and unloading, and transport can be performed regardless of the timing of loading and unloading. As a result, it can be conveyed quickly, and the throughput can be further improved. If a chill plate is used for the stage 62, for example, the semiconductor wafer W can be cooled at the same time.

The configuration shown in FIG. 5 is not limited to the configuration shown in FIG. Here, the transport units 53a and 46b have the same configuration as that of FIG. 4 having two transport ports, but differ in that these transport units have common stages 67 and 68.

In this case, the inter-set transport mechanism includes a moving mechanism (not shown) for independently moving the stages 67 and 68, and a rail 69 for guiding these stages. Then, the semiconductor wafer W carried into the transfer unit 53a is placed on the stage 68,
8 is guided by the rail 69 and transported to the transport unit 46b. The semiconductor wafer W carried into the transfer unit 46b is placed on the stage 67,
7 is guided by the rail 69 and transported to the transport unit 53a.

The processing system configured as described above includes:
Although it is installed in a clean room and thereby increases the cleanliness, the cleanliness of each part is further enhanced by efficiently supplying a vertical laminar flow in the system.
6 and 7 show the flow of clean air in the system,
And an atmosphere control mechanism.

As shown in FIG. 6, the processing sets 20a, 20a of the cassette station 10 and the processing station 20 are provided.
Air supply chambers 18, 28a, 28b, and 38 are provided above the interface b and the interface section 30, and a filter with a dustproof function, for example, a ULPA filter 70 is provided on the lower surface of the air supply chambers 18, 28a, 28b, and 38. Installed. Air is introduced into the air supply chambers 18 and 38 through piping described later, and clean air is supplied to the cassette station 10 and the interface unit 30 by the ULPA filter 70 in a downflow manner. Further, as described later, the air supply chambers 28a and 28b
Similarly, air is also introduced, and clean air is supplied to the processing unit 20 in a down flow by the filter.

As shown in FIG. 7, each processing set 20a,
Air supply ports 71a and 71b for supplying air to the wafer transfer paths 22a and 22b, respectively, are provided above the wafer transfer paths 22a and 22b.
Are provided below the wafer transfer paths 22a and 22b.
Outlets 72a, 72 for exhausting the air supplied to the
b is provided. The aforementioned air supply chambers 28a, 28b
Are provided at the connection between the air supply port 71a and the air supply pipe 73a and at the connection between the air supply port 71b and the air supply pipe 73b, respectively, and the ULPA filter 70 is attached to the lower surface thereof. A chemical filter 74 having a function of removing organic contaminants such as amines is attached above these components.

Exhaust ports 72a, 72b and exhaust pipe 73
a and 73b are connected to the exhaust chambers 75a and 75b, respectively.
5b, and a perforated plate 76a, in which exhaust ports 72a, 72b are formed on the upper surfaces of the exhaust chambers 75a, 75b,
76b is attached, and exhaust fans 77a and 77b are arranged in the exhaust chambers 75a and 75b. Further, a pressure adjusting means such as a slit damper 78a, 78 is provided at a connection portion between the exhaust chambers 75a, 75bb and the exhaust pipes 73a, 73b.
b is provided.

The slit dampers 78a and 78b are provided with a fixed perforated plate having a large number of ventilation holes, and a plurality of adjustment holes which are disposed on the lower surface of the fixed perforated plate so as to be reciprocally movable in the horizontal direction and can match the ventilation holes. The movable porous plate has a movable perforated plate having a suitable reciprocating drive means, such as a cylinder mechanism and a timing belt mechanism, by reciprocating in the horizontal direction, to adjust the opening area and adjust the ventilation amount, Thus, the pressure in the wafer transfer spaces 22a and 22b is adjusted. For example, the pressure in the wafer transfer space can be set to a positive pressure with respect to the pressure in the clean room. Here, the case where a slit damper is used as the pressure adjusting means has been described, but the pressure adjusting means does not necessarily need to be a slit damper, and the conveying paths 22a, 22
Any material other than the slit damper may be used as long as it can adjust the passage area of the air exhausted from the inside b.

The pipes 73a and 73b form a circulation path, and blower fans 81a and 81b are provided in the middle of the circulation path, whereby a downflow is formed in the conveyance paths 22a and 22b. In these pipes 73a and 73b, between the blower fan 81a and the slit damper 78a, and between the blower fan 81b and the slit damper 78b,
Outside air introduction pipes 79a and 79 for introducing outside air, respectively.
b, and these outside air introduction pipes 79a, 79b
Are provided with dampers 80a and 80b, respectively, as air volume adjusting mechanisms. And the blowing fan 81
a and 81b are driven, and the dampers 80a and 80b are opened at a predetermined opening, so that the outside air introduction pipes 79a and 79b are opened.
b, the outside air, that is, the clean air in the clean room, is transferred via the pipes 73a and 73b to the transport paths 22a and 22b, respectively.
2b. Therefore, the transport paths 22a, 22
b, even if the clean air supplied to each processing unit flows and is lost, the air flow is supplied from the outside air inlets 79a and 79b to constantly maintain the air flow of the clean air flowing in the transport path spaces 22a and 22b. Can be maintained. In addition, as the air volume adjusting mechanism, another device such as a flow rate adjusting valve may be used instead of the damper.

Temperature controllers 82a, 82b for controlling the temperature of the clean air supplied into the conveying paths 22a, 22b are provided between the blowing fans 81a, 81b and the air supply chamber 20a in the circulation pipes 73a, 73b, respectively. 82b is interposed. Although not shown, the piping 73
By arranging appropriate humidity adjusting means in a and 73b, the humidity in the transport paths 22a and 22b can also be controlled.

The slit damper 7 configured as described above
8a, 78b, dampers 80a, 80b and temperature controllers 82a, 82b are controlled by control signals from a central processing unit (CPU) 90 as control means. That is, a signal detected by a pressure / air volume sensor (not shown) disposed on the air supply port side of each of the transport paths 22a and 22b is transmitted to the CPU 90, and the detected signal and information stored in the CPU 90 in advance are transmitted. By performing a comparison operation and transmitting the control signal to the slit dampers 78a and 78b and the dampers 80a and 80b, the pressure in the transport paths 22a and 22b and the flow rate of the supplied clean air are controlled to predetermined values. .

Further, a temperature signal detected by a temperature sensor (not shown) disposed at the lower side of each of the transport paths 22a and 22b is transmitted to the CPU 90, and the temperature signal and information stored in the CPU 90 in advance are transmitted. By performing a comparison operation and transmitting the control signal to the temperature controllers 82a and 82b, the clean air flowing through the pipes 73a and 73b is controlled to a predetermined temperature, for example, 23 ° C., and the clean air at that temperature is supplied to the conveying paths 22a and 22b. Supplied to Therefore, the atmosphere in the transport paths 22a and 22b, that is, the pressure, the air volume, and the temperature can always be controlled to predetermined values, and each processing in the processing system can be suitably performed.

Further, in such an atmosphere control system, the atmosphere of the transport paths 22a and 22b can be individually controlled. Therefore, the transport paths 22a and 22b
Thus, the atmosphere can be made different, and extremely diverse processing can be realized. For example, the pressure is different between the transport paths 22a and 22b, and a processing unit requiring higher cleanliness can be arranged on the side of the processing set with a higher pressure. The processing unit can also be arranged. Further, an application unit may be arranged on one processing set side and a developing unit may be arranged on the other processing set side, so that an appropriate atmosphere can be set. In this case, a chemical filter may be provided only on the developing unit side in addition to the ULPA filter.

Further, since the clean air is circulated and supplied into the transfer paths 22a and 22b, the air outside the processing system, that is, inside the clean room does not flow out.
Particles and organic contaminants generated in the processing system do not leak to the clean room.

In the cassette station 10, as shown in FIG. 6, the space above the cassette mounting table 2 and the space for moving the wafer transfer arm 4a are separated from each other by a vertical partition plate 5, and the space is lowered. The flow space flows separately in both spaces.

In the processing station 20, as shown in FIG. 6, a resist coating unit (COT) disposed at a lower stage in the processing units G1, G2, G6 and G7.
A ULPA filter 85 is provided on the ceiling surface of the printer, and air supplied from the circulation pipes 73a and 73b into the transport paths 22a and 22b flows through the ULPA filter 85 into the resist coating unit (COT).

As shown in FIG. 6, the main wafer transfer mechanism 2 of each spinner type processing unit (COT), (DEV)
An opening 29 through which the wafer W and the transfer arm enter and exit is provided on the side wall facing 1a and 21b.
Each opening 29 is provided with a shutter (not shown) for preventing particles or organic contaminants from each unit from entering the main wafer transfer mechanism.

The processing unit G3 of the processing set 20a
In the processing section G8 of the processing set 20b, adhesion processing units 47a and 47b for performing a hydrophobic treatment on the semiconductor wafer W are provided. These adhesion processing units 47a and 47b use HMDS gas. However, since this processing is performed in a semi-open unit instead of a completely closed unit, the HMDS gas may leak out of the unit. When such a gas enters another open type processing unit, the semiconductor wafer W to be processed is
Adversely affect

However, as shown in FIG. 3, the adhesion processing units 47a and 47b are provided below the heating unit, the cooling unit, and the transport unit, and the transport paths 22a and 22b have the downflow of the purified air. Is formed, the adhesion processing unit 4
The HMDS gas leaked from 7a and 47b flows downward due to the downflow and is quickly discharged, and there is almost no risk of entering another processing unit. Therefore, HM
The DS gas can be prevented from adversely affecting the semiconductor wafer W of another processing unit. The cooling units 45a and 45b and the adhesion processing unit 47
Since the transport units 46a and 46b are interposed between the transfer units 46a and 47b, thermal mutual interference can be suppressed.

In the processing units G4 and G9, a hot plate unit serving as a heating unit and a chill plate unit serving as a cooling unit are arranged above the transport units 53a3 and 53b. Also, thermal mutual interference can be suppressed.

Next, the processing operation of the entire system will be described. First, at the cassette station 10,
The wafer transfer arm 4a of the wafer transfer mechanism 4 accesses the cassette 1 containing the unprocessed wafers W on the cassette mounting table 2 so that one wafer W
Take out. After the alignment of the wafer W, the main wafer transport mechanism 2 of the processing set 20a in the processing unit 20
The arm 1a carries the semiconductor wafer W into the adhesion processing unit 47a belonging to the processing section G3.

The semiconductor wafer having been subjected to the adhesion process is cooled in one of the chill plate units (CP) and then coated with a resist by spin coating in a coating unit (COT). After that, prebaking is performed in any of the hot plate units (HP), and is cooled by the cooling unit.

In this case, at any timing, the semiconductor wafer W is transferred from the processing set 20a to the processing set 20b by the above-described transfer mechanism between sets via the transfer units 53a and 46b.
The semiconductor wafer W is transferred to the interface unit 30 by the arm of the main transfer mechanism 21b. In the interface unit 30, peripheral exposure is performed by a peripheral exposure device, and thereafter, the semiconductor wafer W is transferred to an adjacent exposure device, and overall exposure is performed.

When the exposure processing is completed, the wafer transfer arm 34 of the interface section 30 receives the wafer W, and carries the received wafer W into the transfer unit 54b belonging to the processing section G9 of the processing set 20b in the processing station 20. The wafer W is cooled by the cooling plate therein. Then, the main wafer transfer mechanism 21b receives the wafer W, loads it into one of the developing units (DEV), and performs a developing process. When the development process is completed, post baking is performed by one of the hot plate units (HP). After that, one of the tilt-pate units (C
P).

At any time, the transport units 46b and 53a are transferred from the processing set 20b to the processing set 20a by the above-described transport mechanism between sets.
The semiconductor wafer W is transferred via the semiconductor wafer W, and after a predetermined process is completed, the semiconductor wafer W is mounted on the mounting table of the transfer unit 46a by the arm of the main transfer mechanism 21a. Then, the arm 4a of the cassette station 10 receives the wafer W and puts the wafer W into a predetermined wafer accommodating groove of the cassette 1 for accommodating the processed wafer on the cassette mounting table 2. Thus, a series of processing is completed.

As described above, two processing sets are provided, and the semiconductor wafer is transported by the transport mechanism between sets via the transport units of the adjacent processing units G4 and G8. Thus, throughput can be remarkably improved, and highly diversified processing can be performed. In addition, the processing object can be loaded and unloaded by one transfer station as in the related art while realizing high throughput and highly diversified processing.

The present invention can be variously modified without being limited to the above embodiment. For example, in the above embodiment, the case where two processing sets are provided has been described, but the number of processing sets is not limited to two. Also, the object to be processed is not limited to a semiconductor wafer, and various objects such as an LCD substrate, a glass substrate, a CD substrate, a photomask, and a printed substrate can be applied.

[0064]

As described above, according to the present invention,
A plurality of processing sets in which processing units each formed by stacking a plurality of processing units are arranged around the transport path are provided, and the processing target is transported between the processing sets by the transport mechanism between sets, so that the throughput is extremely high. Can be
In addition, highly diverse processing can be realized.

[Brief description of the drawings]

FIG. 1 is a plan view showing a resist liquid application / development processing system according to an embodiment of a processing apparatus of the present invention.

FIG. 2 is a side view showing the resist liquid application / development processing system of FIG. 1;

FIG. 3 is a rear view showing the resist liquid application / development processing system of FIG. 1;

FIG. 4 is a diagram showing an example of a mechanism used in the apparatus of FIG. 1 for transporting an object to be processed between processing sets.

FIG. 5 is a view showing another example of a mechanism used for the apparatus shown in FIG. 1 for transporting an object to be processed between processing sets.

FIG. 6 is a schematic diagram showing a flow of clean air in the resist liquid application / development processing system of FIG. 1;

FIG. 7 is a schematic diagram showing an atmosphere control system in the resist liquid application / development processing system of FIG. 1;

[Explanation of symbols]

10 Cassette station 20 Processing station 20a, 20b Processing set 21a, 21b Main substrate transport mechanism 22a, 22b Transport path 46a, 53b Transport unit G1, G2, G3, G4, G57, G6, G7, G8,
G9, G10 Processing unit

Claims (16)

[Claims] 1. A processing apparatus for performing a process consisting of a plurality of processes on an object to be processed, comprising a transport path extending along a vertical direction, and disposed around the transport path. A plurality of processing units configured to vertically stack a plurality of processing units for performing predetermined processing on the processing path; A processing apparatus comprising: a plurality of processing sets each including: a main transport mechanism for carrying in / out a body; and an inter-set transport mechanism for transporting an object to be processed between adjacent processing sets. 2. Each of the adjacent processing sets has at least one processing unit having a transport unit, and the processing units having these transport units are arranged so as to be adjacent to each other. The processing apparatus according to claim 1, wherein the substrate is transported via each transport unit of a matching processing unit. 3. The processing apparatus according to claim 2, wherein the transport units of the adjacent processing units are arranged at the same height. 4. A processing apparatus for applying and developing a resist on an object to be processed, comprising: a transport path extending along a vertical direction; At least one first processing unit configured by vertically stacking a plurality of processing units including a processing unit including a resist coating unit that applies a resist and / or a developing unit that develops a resist pattern; A second processing unit configured by vertically stacking a plurality of processing units including a heating unit that heats the object, a cooling unit that cools the object, and a transport unit that transports the object, A main transport mechanism for moving the transport path and loading / unloading the object to / from each of the processing units of the plurality of processing units; and a plurality of processing sets comprising: An inter-set transport mechanism for transporting an object to be processed between adjacent processing sets, wherein each of the adjacent processing sets is disposed such that a second processing unit is adjacent to the other processing set, and the inter-set transport mechanism is adjacent to the second processing unit. A processing apparatus that transports an object to be processed via each transport unit of a second processing unit. 5. A processing apparatus for performing a resist coating and developing process on an object to be processed, comprising: a processing station for performing a series of processes including a resist coating and developing process on the object to be processed; And a transfer station that transfers the object between the processing station and the processing station; and an interface unit that transfers the object between the processing station and the exposure apparatus. The processing station includes a transport path extending in the vertical direction, a resist coating unit that is disposed around the transport path, and applies a resist to a workpiece and / or a developing unit that develops a pattern of the resist. Heating at least one first processing unit configured by stacking a plurality of processing units including units in the vertical direction; A second processing unit configured by vertically stacking a plurality of processing units including a heating unit, a cooling unit for cooling an object to be processed, and a transport unit for transporting the object, and the transport path And a main transport mechanism for carrying the object in and out of each of the processing units of the plurality of processing units, and a plurality of processing sets comprising: An inter-set transport mechanism for transporting the processing objects, wherein each of the adjacent processing sets is arranged such that a second processing unit is adjacent to the processing unit; A processing apparatus for transporting an object to be processed via each transport unit. 6. The processing apparatus according to claim 4, wherein the transport units of the adjacent second processing units are arranged at the same height. 7. The transport unit according to claim 2, wherein the transport unit has two transport ports, and uses different transport ports for loading and unloading the object to be processed. The processing device according to claim 1. 8. The set-to-set transfer mechanism has a transfer arm for transferring an object to be processed between one transfer unit and the other transfer unit. The processing device according to claim 1. 9. The inter-set transport mechanism includes a moving unit that moves a workpiece stage in the transport unit, and thereby transports a workpiece between one transport unit and the other transport unit. The processing device according to any one of claims 2 to 7, wherein: 10. The processing apparatus according to claim 1, wherein each of the processing sets further includes a downflow forming unit that forms a downflow in the transport path. 11. The downflow forming means is provided at a gas intake port provided at an upper end of the transport path, an exhaust port provided at a lower end of the transport path, and provided at the gas intake port. The processing apparatus according to claim 10, further comprising a filter mechanism for purifying gas. 12. The processing apparatus according to claim 1, wherein each of the processing sets further includes an atmosphere control unit that controls an atmosphere of the transport path. 13. The processing apparatus according to claim 12, wherein said atmosphere control means individually controls the atmosphere of the transport path of each processing set. 14. At least one of the second processing units of each of the processing sets includes a heating unit, a cooling unit, and a transport unit. The processing apparatus according to claim 4, wherein a cooling unit is disposed in the processing unit. 15. An adhesion processing unit for performing a hydrophobic treatment on an object to be processed, in addition to a heating unit, a cooling unit, and a transport unit, at least one of the second processing units in each of the processing sets. Including a heating unit and a cooling unit from above at a position above the transfer unit, an adhesion processing unit disposed at a position below, and a downflow forming means for forming a downflow in the transfer path. The processing device according to claim 4 or 5, wherein 16. The transfer station is provided on one side of the processing station, and is transferred from one processing set adjacent to the transfer station to another adjacent processing set by the inter-set transfer mechanism, and the processing is terminated. 6. The processing apparatus according to claim 5, wherein the processing set is returned from the other processing set to the one processing set by an inter-set transfer mechanism, and further returned to the transfer station.