JP3283789B2 - Processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the application of a resist to a substrate to be processed such as a semiconductor wafer or an LCD substrate.
The present invention relates to a processing device that performs processing such as development.

[0002]

2. Description of the Related Art For example, in a photolithography process in a semiconductor device manufacturing process, a resist coating process for forming a resist film on the surface of a semiconductor wafer (hereinafter, referred to as a "wafer") and an exposure of the wafer after the resist coating are performed. After the processing, a development processing of performing a development processing on the wafer is performed.

Conventionally, the resist coating process and the developing process are, as is well known, for example, from Japanese Patent Publication No. 2-30194, a composite type coating and developing system in which various processing units are provided in one system. At the inner,
The exposure is performed according to a predetermined sequence with an exposure process in an exposure apparatus connected to the processing system. In recent years, the transfer of a substrate to be processed between such a coating and developing processing system and an exposure apparatus has been performed through an interface device that realizes automatic transfer of the substrate to be processed in a space closed from the outside air. Thus, the substrate to be processed can be transported without requiring a cream room.

In a coating and developing system and an exposure apparatus, for the purpose of preventing foreign substances such as dust from entering and discharging, etc., the internal atmosphere pressure is reduced by introducing purified air into each unit in a downflow manner. Is higher than the atmospheric pressure. However, between the coating and developing processing system and the exposure apparatus, in many cases, the exposure apparatus side has a positive pressure with respect to the coating and developing processing system side. In the connected state, movement of dust and the like from the positive pressure side exposure apparatus to the negative pressure side coating and developing processing system occurs,
For this reason, in the coating and developing processing system, there is a possibility that the yield may be reduced due to the adhesion of foreign matter to the surface of the substrate to be processed. In particular, when foreign matter adheres during or immediately before or after resist coating or development on the substrate to be processed, the probability that the substrate to be processed is transported to the exposure apparatus while the foreign matter remains on the surface increases, and defects in the exposure pattern are reduced. Occurs.

In such a coating and developing system, a cassette station, an interface unit for an exposure apparatus, and other wafer transfer mechanisms can also be said to be sources of dust and the like. There is also a problem that the particles float and adhere to the surface of the substrate to be processed.

[0006]

As described above, in a processing apparatus that performs resist coating and development on a substrate to be processed, the pressure difference between the internal atmosphere of the processing apparatus and an external apparatus such as an exposure apparatus connected through an interface unit is increased. Foreign matter such as dust may intrude from an external device such as the exposure apparatus, and dust may be generated in a cassette station in the system, an interface unit for the exposure apparatus, and other wafer transfer mechanisms, and these may be generated on the surface of the substrate to be processed. There is a problem that the adhesion causes a decrease in yield.

SUMMARY OF THE INVENTION The present invention has been made to solve such a problem, and reduces or prevents intrusion of foreign matter such as dust from another area into the liquid processing system area by improving the sealing property of the liquid processing system area. Accordingly, it is an object of the present invention to provide a processing apparatus capable of suppressing a decrease in yield due to foreign substances adhering to the surface of a substrate to be processed.

[0008]

[0009]

[0010]

[0011]

[0012]

[0013]

Processing apparatus of the present invention SUMMARY OF], as described in claim 1, a cassette station for performing loading and unloading of the substrate to be processed to and from a cassette for storing a substrate to be processed, an exposure device An interface unit for transferring a substrate to be processed, and a plurality of first units for processing the substrate to be processed.
A processing unit, a second processing unit for processing a substrate to be processed, the cassette station and the interface.
A first transfer unit for transferring the substrate to be processed to and from the face unit, and for taking in and out the substrate to and from each of the first processing units, and sealing to the cassette station and the interface unit And each of the first processing units is provided at a position facing the first transport unit with the first processing unit interposed therebetween. A second transport unit for loading and unloading the substrate, and a plurality of first transport units provided in the plurality of first processing units.
Between the first transport unit and the second transport unit
And a delivery unit for delivering the substrate to be processed .

[0014]

Furthermore, the processing apparatus of the present invention, as described in claim 2, a cassette station for performing loading and unloading of the substrate to be processed to and from a cassette for storing a substrate to be processed, an exposure apparatus and the substrate to be processed an interface unit for delivering a plurality of first processing unit that performs predetermined processing including heat treatment on the target substrate, a second processing unit for processing with a processing solution to be treated substrate, the hank
Between the communication station and the interface unit
A first transfer unit that transfers the substrate to be processed, and takes in and out the substrate to and from each of the first processing units, and is sealed with respect to the cassette station and the interface unit; The substrate to be processed is provided at a position opposed to the first transport unit with one processing unit interposed therebetween, and the substrate to be processed is taken in and out of a part of each of the first processing units and each of the second processing units. a second conveying unit for the plurality of first
1 processing unit and the first transfer unit.
Between the target and the second transfer unit.
And a delivery unit for delivery .

Furthermore, the processing apparatus of the present invention, as described in claim 3, wherein the second transport unit, a plurality of
It is characterized by being constituted by a transport mechanism. further,
According to a fourth aspect of the present invention, there is provided a processing apparatus comprising:
Note that the atmosphere between the transport mechanisms is shut off.
Sign. Further, the processing apparatus of the present invention is described in claim 5.
As described above, the first processing is performed for each of the plurality of transport mechanisms.
The delivery unit is provided in the management unit
It is characterized by the following. Furthermore, the processing apparatus of the present invention
As described in item 6, the second processing unit is provided
Each of the first processing units sandwiches the second transport unit.
It is characterized in that it is arranged at a position opposing the port.

[0017] That is, in processing apparatus of the present invention, the second conveyor for loading and unloading a substrate to be processed with respect to the resist coating unit and the developing unit or the like for processing using a second processing unit for example a substrate to be processed treatment liquid The unit is sealed with respect to the cassette station and the interface unit for the exposure apparatus, or the substrate to be processed is not directly transferred to and from the cassette station and the interface unit for the exposure apparatus. It is possible to reduce or prevent intrusion of dust and the like from the outside into the second transport unit through the interface unit for the device, and it is possible to improve the yield.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings.

FIGS. 1 to 3 show the overall structure of a coating and developing system 1 for a semiconductor wafer (hereinafter, referred to as "wafer") to which an embodiment of the present invention is applied.
2 is a plan view, FIG. 2 is a front side view, and FIG. 3 is a partial cross-sectional side view on the back side. As shown in these figures, the coating and developing processing system 1 of the present embodiment carries in / out a wafer cassette CR containing a plurality of wafers W to / from the outside, and takes in / out a wafer W from / to the wafer cassette CR. Station 10 for carrying out wafer W
A processing station 11 configured by arranging various types of single-wafer processing units that perform predetermined processing one by one on the
An interface unit 12 for transferring a wafer W to and from an external exposure apparatus is integrally combined.

In the cassette station 10, as shown in FIG. 1, a plurality of, for example, up to five wafer cassettes CR are mounted on a cassette mounting table 20 in a line with their respective wafer entrances facing the processing station 11 side. With respect to these wafer cassettes CR, a wafer carrier 21 movably provided in the X direction and the Z direction (the direction of arranging wafers in the wafer cassette CR; the vertical direction) performs the operation of taking in and out of the wafer W. I have. This wafer carrier 21 is
The wafer W is rotatable in the θ direction, and can transfer the wafer W to and from the first wafer carrier 22 on the processing station 11 side.

In the processing station 11, a first transport unit 31 which is two independent transport units is provided.
And a second transport unit 32 and various processing unit groups.

The processing unit sets the wafer W in the cup CP.
A spinner type (a resist coating unit (COT) and a developing unit (DEV)) that performs a predetermined process using a processing liquid while rotating on a spin chuck and a wafer W placed on a mounting table SP for a predetermined time. Oven type (processing unit group 33 including a heat treatment system) which performs the above-mentioned processing. These spinner type processing units (resist coating unit (COT) and developing unit (DEV)) and oven type processing unit (The processing unit group 33 including the heat treatment system) is divided into two parts on both sides of the second transport unit 32. Then, the first transport unit 31 and the second transport unit 3 are operated by an oven-type processing unit (a processing unit group 33 including a heat treatment system).
2 are separated from each other.

The arrangement of these processing units will be described in more detail. As shown in FIGS. 1 and 2, a resist coating unit (CO) which is a spinner type processing unit is used.
T) and the developing unit (DEV) are arranged side by side in a row facing the second transport unit 32. The oven-type processing unit (the processing unit group 33 including the heat treatment system) is the same as FIG.
As shown in FIG. 3 and a plurality of rows (in this example, 4 rows and 5 columns) are arranged side by side. FIG. 3 is a partial cross-sectional and side view showing an arrangement configuration of an oven-type processing unit (a processing unit group 33 including a heat treatment system) from the first transfer unit 31 side.

As an oven type processing unit, a cooling unit (COL) for performing a cooling process of the wafer W,
Alignment unit (A for aligning wafer W)
LIM), an adhesion unit (AD) for performing a hydrophobic treatment for improving the fixability of a resist solution applied to the surface of the wafer W, and a prebaking unit (PREBAKE) for performing a heating process on the wafer W before the exposure process. ), A post-baking unit (POBAKE) for performing a heating process on the wafer W after the exposure process,
A cooling unit (EXTCOL) and an extension unit (EX) for transferring the wafer W between the first transfer unit 31 and the second transfer unit 32
T).

Here, the cooling unit (COL), the extension / cooling unit (EXTCOL) and the extension unit (EXT) each having a relatively low processing temperature are arranged, for example, at the lowest stage, and the pre-baking unit having a relatively high processing temperature. (PREBAKE) and post-baking unit (POBAKE) and adhesion unit (AD) are cooling units (CO
L) and the extension unit (EXT). By arranging units having a high processing temperature in the upper stage, thermal mutual interference between the units is reduced.

In the first transport unit 31, the Y transfer between the cassette station 10 and the interface unit 12 is performed.
The first is configured to be movable in the Z direction (vertical direction) and to be rotatable in the θ direction.
Of the wafer W between the cassette station 10 and the interface unit 12 by the first wafer carrier 22.
Then, the wafer W is taken in and out of the individual oven-type processing units in the processing unit group 33 including the heat treatment system.

On the other hand, in the second transfer unit 32, for example, two wafer transfer units of a fixed position type, for example, two transfer units configured to be vertically movable in the Z direction (vertical direction) and rotatable in the θ direction. (A second wafer carrier 23 and a third wafer carrier 24) are provided. This second
As shown in FIGS. 1 and 4, the transfer of the wafer W to and from the extension unit (EXT), the transfer of the wafer W to and from the resist coating unit (COT), and the transfer of the third transfer It is assumed that the transfer of the wafer W between them is performed. Further, the third transfer member 24 transfers the wafer W to and from the second transfer member 23 and transfers the wafer W to and from the developing unit (DEV).

As shown in FIG. 4, each processing unit is provided with an opening 41 for loading / unloading the wafer W, and these openings 41 are individually formed by a shutter 42 driven by driving means (not shown). It is opened and closed. Therefore, the first transport unit 31 and the second transport unit 3
The extension units (EXT) used to transfer the wafer W to and from the transfer unit 31 include
An opening 41 and a shutter 42 for opening and closing the opening 41 are provided on both surfaces opposite to 32.

The interface section 12 includes a portable pickup cassette CR and a stationary buffer cassette B.
R, a peripheral exposure device (not shown), a wafer carrier 25 and the like are provided. The wafer transfer body 25 moves in the X direction and the Z direction.
To transfer the wafer W to the cassettes CR and BR. Further, the wafer carrier 25 is also rotatable in the θ direction, and the wafer W between the first wafer carrier 22 on the processing station 11 side and a wafer transfer table (not shown) on the external exposure apparatus side. Is configured to be delivered.

As shown in FIGS. 3, 4, and 5, above the cassette station 10, the processing station 11, and the interface section 12, an air supply chamber 10a is provided.
11a1, 11a2, and 12a are provided, and dustproof filters 10b, 11b1, 11b2, and 12b are mounted below the air supply chambers 10a, 11a1, 11a2, and 12a. Air conditioner 3 outside this system
The air is supplied from the air conditioner 37 through a pipe 39 to each of the air supply chambers 10a, 11a1, 11a2.
, 12a and the filter 10 of each air supply chamber.
By b, 11b1, 11b2, and 12b, clean air is supplied to each section 10, 11, and 12. This down-flow air passes through a plurality of vents 40 provided at appropriate places at the bottom of the system, and exhaust air 42 at the bottom is provided.
And is collected by the air conditioner 37 from the exhaust port 42 through the pipe 45.

Next, the flow of processing by the coating and developing system will be described.

First, at the cassette station 10,
The wafer carrier 21 accesses the cassette CR containing the unprocessed wafers W on the cassette mounting table 20, and takes out one wafer W from the cassette CR. After that, the wafer carrier 21 transfers the wafer W to the first wafer carrier 22 in the first carrier unit 31 of the processing station 11. The first wafer transfer body 22 moves in the Y and Z directions (vertical direction) to the position of the alignment unit (ALIM), and further rotates in the θ direction to transfer the wafer W into the alignment unit (ALIM). I do.

When orientation alignment and centering of the wafer W are completed in the alignment unit (ALIM), the first wafer carrier 2 in the first carrier unit 31 is completed.
2 receives the aligned wafer W, and subsequently moves the wafer W to the position of the adhesion unit (AD) in the Y direction and the Z direction (vertical direction) to move the wafer W into the adhesion unit (AD). Put on. Here, the wafer W
Is performed.

The wafer W that has been subjected to the hydrophobizing process is subsequently subjected to a predetermined pre-baking unit (PREBAKE) by the first wafer carrier 22 in the first carrier unit 31.
And baked, and then carried into a predetermined cooling unit (COL). In the cooling unit (COL), the wafer W is cooled to a set temperature before the resist coating processing, for example, 23 ° C.

When the cooling process of the wafer W is completed, the first wafer carrier 22 in the first carrier unit 31 takes out the wafer W from the cooling unit (COL), and then moves the position of the extension unit (EXT). The wafer W is carried into the extension unit (EXT), and the wafer W is mounted on the mounting table SP therein.

Thereafter, the extension unit (EX)
The wafer W is transferred into the second transfer unit 32 through T). That is, the extension unit (EX
T) The shutter 42 for opening and closing the opening 41 facing the second transfer unit 32 is opened, and the wafer W mounted on the mounting table SP in the extension unit (EXT) is opened.
Is carried out of the extension unit (EXT) by the second carrier 23 in the second carrier unit 32, and the shutter 42 is closed.

The extension unit (EX)
Each shutter 42 that opens and closes both openings 41 of the first transport unit 31, for example, sets the atmospheric pressure in the second transport unit 32 higher than that in the first transport unit 31. By using other means capable of preventing foreign substances such as particles from entering the second transport unit 32 from the second transport unit 32, the second transport unit 32 can be eliminated.

Thereafter, the extension unit (EX)
The wafer W transferred from the inside of the second transfer unit 32 into the second transfer unit 32 is carried into the resist coating unit (COT) by the second transfer body 23, and is transferred to the surface of the wafer W in the resist coating unit (COT). Is applied.

When the resist coating process is completed, the second wafer carrier 23 in the second carrier unit 32
Is taken out of the resist coating unit (COT), and is again carried into the extension unit (EXT). Thereafter, the first wafer transfer body 2 in the first transfer unit 31
2, the wafer W is carried out of the extension unit (EXT), and then the first wafer carrier 22 moves through the first carrier unit 31 in the Y direction and the Z direction (pre-baked unit) to the position of the predetermined prebaking unit (PREBAKE). The wafer W is moved in the pre-bake unit (PR)
EBAKE). Here, the wafer W is heated at a predetermined temperature, for example, 100 ° C. for a predetermined time, so that the remaining solvent is evaporated and removed from the coating film on the wafer W.

Thereafter, the wafer W is transferred to the first wafer carrier 2
2 interface section 12 extension
The wafer W is carried into a cooling unit (@TCOL), where the wafer W is cooled to a temperature suitable for the next step, that is, 24 ° C. suitable for a peripheral exposure process by a peripheral exposure apparatus (not shown) provided in the interface unit 12.

Subsequently, the first wafer carrier 22 in the first carrier unit 31 takes out the wafer W from the extension cooling unit (@TCOL) and delivers it to the wafer carrier 25 of the interface unit 12.
The wafer carrier 25 of the interface unit 12 carries the wafer W into a peripheral exposure device (not shown) in the interface unit 12. Here, the wafer W is subjected to an exposure process on its peripheral portion.

When the peripheral exposure processing is completed, the wafer carrier 25 of the interface section 12 carries out the wafer W from the peripheral exposure apparatus and transfers it to a wafer receiving table (not shown) of the adjacent exposure apparatus. In this case, before the wafer W is transferred to the exposure apparatus, the wafer W
It may be temporarily stored in R.

When the entire surface pattern exposure processing in the exposure apparatus is completed and the wafer W is returned to the wafer receiving table on the exposure apparatus side, the wafer carrier 25 of the interface section 12 moves the wafer after the exposure processing from the wafer receiving table to the wafer receiving table. W, and transfers the wafer W to the first wafer carrier 22 in the first carrier unit 31 of the processing station 11 again.
In this case, the wafer W may be temporarily stored in the buffer cassette BR in the interface unit 12 as necessary before being transferred to the processing station 11 side.

Thereafter, the first transport unit 31
Carries the wafer W into a predetermined post-baking unit (POBAKE). In this post-baking unit (POBAKE), the wafer W
Is baked for a predetermined time. Subsequently, the baked wafer W is transferred to one of the cooling units (CO) by the wafer transfer body 22 in the first transfer unit 31.
L), and the wafer W is returned to normal temperature in the cooling unit (COL).

Subsequently, after the wafer W is carried into the extension unit (EXT), the wafer W is taken out of the extension unit (EXT) by the second carrier 23 in the second carrier unit 32 in the same manner as described above. Then, it is transferred to the third transfer body 24 in the second transfer unit 32. Then, the wafer W is carried into the developing unit (DEV) by the third carrier 24.

In the developing unit (DEV), the wafer W is placed on a spin chuck, and a developing solution is uniformly applied to a resist on the surface of the wafer W by, for example, a spray method to perform development. After the development, a rinsing liquid is applied to the wafer surface in the developing unit (DEV),
The developer is washed off.

After that, the third transport unit 32 in the second transport unit 32
Wafer transfer body 24 transfers wafer W to developing unit (DE).
After being carried out from V), it is delivered to the adjacent second carrier 23. The second carrier 23 transfers the wafer W delivered from the third wafer carrier 24 to the extension unit (EX).
Carry in T). Thereafter, the wafer W is carried out of the extension unit (EXT) by the first wafer carrier 22 in the first carrier unit 31, and then the first wafer carrier 22 is moved to a predetermined post-baking unit (POBAK @). ) Is carried in. In this post-baking unit (POBAKE), the wafer W is heated, for example, at 100 ° C. for a predetermined time, whereby the resist swollen by development is hardened, and the chemical resistance is improved.

When the post-baking is completed, the wafer carrier 22 in the first carrier unit 31 carries out the wafer W from the post-baking unit (POBAKE), and then carries the wafer W into a predetermined cooling unit (COL). The cooling process is performed. Here, after the temperature of the wafer W has returned to normal temperature, the first wafer carrier 22 transfers the wafer W to the wafer carrier 21 on the cassette station 10 side.
Then, the wafer carrier 21 transfers the received wafer W to the cassette C for storing the processed wafer on the cassette mounting table 20.
R is inserted into a predetermined wafer accommodating groove.

As described above, in the present embodiment, the transfer of the wafer W between the cassette station 10 and the interface unit 12 for the exposure apparatus, and the transfer of the wafer W to and from the oven-type processing unit group 33 including the heat treatment system are performed. A first transfer unit 31 and a second transfer unit 32 for transferring a wafer W in and out of the resist coating unit (COT) and the developing unit (DEV) are arranged separately from each other. 31st and 2nd
The transfer of the wafer W to / from the transfer unit 32 is performed through an extension unit (EXT) in the oven type processing unit group 33 of the heat treatment system.

Therefore, the hermeticity of the second transport unit 32 is improved, and the second transport unit 3 is moved from the cassette station 10 and the interface unit 12 for the exposure apparatus.
2 can reduce or prevent intrusion of foreign matter such as dust into the inside of the wafer 2 and effectively suppress a decrease in yield due to foreign matter adhering to the surface of the wafer W during or immediately before or after resist coating and development. It becomes possible to do.

The arrangement of each component in the coating and developing system described above is merely an example, and various modifications are possible.

For example, as shown in FIG. 6, the space in the second transport unit 32 is separated from the space 32a on the resist coating unit (COT) side by the partition wall 35 and the developing unit (DE).
V) side space 32b, and the individual spaces 32a, 3b
2b, the first and second transfer units 31 and 32 are provided integrally with each other.
The lowermost two processing units of the oven-type processing unit group 33 including the heat treatment system disposed between them are used as wafer delivery extension units (EXT) corresponding to the individual wafer transfer bodies 23 and 24. It may be configured to be used.

In the above embodiment, the extension unit (EXT) is determined from the lowest processing unit of the oven type processing unit group 33 including the heat treatment system. The second or third stage processing unit may be used as the extension unit.

Further, in the above embodiment, the cassette station 10 and the interface unit 12 are arranged on both sides of the processing station 11 with the processing station 11 interposed therebetween. However, as shown in FIG. The interface units 12 may be provided side by side at positions opposing the oven type processing unit group 33 including the heat treatment system with the interposition 31 interposed therebetween. In this configuration, the interface unit 12 includes:
For example, a plurality of (two in this example) wafer carriers 125,
A plurality of wafer carriers 125 and 126 can be used as buffers for transferring wafers W between the exposure apparatus and the processing station 11. Reference numeral 28 denotes a peripheral exposure device that exposes the peripheral portion of the wafer W before the entire surface of the wafer W is exposed by the exposure device.

In the above-described embodiment, a fixed-position type wafer carrier is adopted as the wafer carrier in the second carrier unit 32. Instead, for example, as shown in FIG. The coating and developing system according to the present invention may be configured by employing a structure similar to the wafer transfer body 22 in the transfer unit 31, that is, a wafer transfer body 223 movable in the Y direction.

The apparatus for applying and developing a resist solution on the surface of a semiconductor wafer has been described above.
Needless to say, the present invention can be applied to an apparatus for applying and developing a resist solution on the surface of a CD substrate or the like.

[0057]

[0058]

As described above , according to the processing apparatus of the present invention , the second processing unit, for example, a resist coating unit or a developing unit for processing a substrate to be processed by using a processing liquid, or a developing unit is used. The second transfer unit for taking in and out is sealed with respect to the cassette station and the interface unit for the exposure apparatus, or the substrate to be processed is directly transferred to and from the interface unit for the cassette station and the exposure apparatus. Therefore, it is possible to reduce or prevent intrusion of dust and the like from the outside into the second transport unit through the cassette station or the interface unit for the exposure apparatus, and to improve the yield.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of a semiconductor wafer coating and developing processing system according to an embodiment of the present invention.

FIG. 2 is a front side view of the coating and developing system shown in FIG. 1;

FIG. 3 is a partial cross-sectional and side view of the back side of the coating and developing system shown in FIG. 1;

FIG. 4 is a sectional view of the coating and developing system shown in FIG. 1;

FIG. 5 is a plan view showing the arrangement of filters on the ceiling in the coating and developing system shown in FIG. 1;

FIG. 6 is a plan view showing the overall configuration of a semiconductor wafer coating and developing system according to another embodiment of the present invention;

FIG. 7 is a plan view showing the overall configuration of a semiconductor wafer coating and developing system according to still another embodiment of the present invention.

FIG. 8 is a plan view showing the overall configuration of a semiconductor wafer coating and developing processing system according to still another embodiment of the present invention.

[Explanation of symbols]

 W: semiconductor wafer 10: cassette station 11: processing station 12: interface unit 31: first transport unit 32: second transport unit 33: processing unit group including a heat treatment system COT: resist Coating unit DEV: Developing unit EXT: Extension unit for wafer delivery

Claims (6)

(57) [Claims] 1. A cassette station for loading and unloading a substrate to be processed into and out of a cassette for storing a substrate to be processed, an interface unit for transferring an exposure apparatus and the substrate to be processed, and a plurality of first processing units for processing the substrate to be processed. A processing unit for processing a substrate to be processed, the cassette station and the interface unit
And a first transport unit for transferring the substrate to be processed between the first processing unit and the first processing unit, and for taking in and out the substrate to and from the first processing unit; The first processing unit is provided at a position facing the first transport unit with the first processing unit interposed therebetween, and a part of each of the first processing units and the second processing unit are covered with the first processing unit. a second conveying unit for loading and unloading of the substrate, provided in said plurality of first processing units, said first
Between the transfer unit and the second transfer unit
A processing apparatus, comprising: a delivery unit for delivering a substrate to be processed . A cassette station for loading and unloading the substrate to and from a cassette accommodating the substrate to be processed; an interface unit for transferring the exposure substrate to and from the exposure apparatus; A plurality of first processing units, a second processing unit for processing a substrate to be processed using a processing liquid, the cassette station and the interface unit
And a first transport unit for transferring the substrate to be processed between the first processing unit and the first processing unit, and for taking in and out the substrate to and from the first processing unit; The first processing unit is provided at a position facing the first transport unit with the first processing unit interposed therebetween, and a part of each of the first processing units and the second processing unit are covered with the first processing unit. a second conveying unit for loading and unloading of the substrate, provided in said plurality of first processing units, said first
Between the transfer unit and the second transfer unit
A processing apparatus, comprising: a delivery unit for delivering a substrate to be processed . 3. The processing apparatus according to claim 1, wherein said second transport unit is constituted by a plurality of transport mechanisms. 4. The apparatus according to claim 3, characterized in that between said plurality of transport mechanisms that are blocked atmosphere. 5. The apparatus of claim 4, wherein the plurality of the transport mechanism of the first processing unit each time, characterized in that the delivery unit is provided. In any of the processing apparatus 6. The method of claim 1 to 5, wherein is disposed at a position where the second processing unit is opposed to each first processing unit across the second conveying unit A processing device.