JP3228698B2 - Processing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to the application of a resist to a substrate to be processed such as a semiconductor wafer or an LCD substrate.
The present invention relates to a processing device that performs processing such as development.

[0002]

2. Description of the Related Art For example, in a photolithography process in a semiconductor device manufacturing process, a resist coating process for forming a resist film on the surface of a semiconductor wafer (hereinafter, referred to as a "wafer") and an exposure of the wafer after the resist coating are performed. After the processing, a development processing of performing a development processing on the wafer is performed.

Conventionally, the resist coating process and the developing process are, as is well known, for example, from Japanese Patent Publication No. 2-30194, a composite type coating and developing system in which various processing units are provided in one system. At the inner,
The exposure is performed according to a predetermined sequence with an exposure process in an exposure apparatus connected to the processing system. In recent years, an object to be processed between such a coating and developing processing system and an exposure apparatus is provided by an interface device having a mechanism for automatically transferring an object to be processed in a space closed from the outside air. This realizes the transport of the object without requiring the cream room.

In a coating and developing system and an exposure apparatus, for the purpose of preventing foreign substances such as dust from entering and discharging, etc., the internal atmosphere pressure is reduced by introducing purified air into each unit in a downflow manner. Is higher than the atmospheric pressure. However, between the coating and developing processing system and the exposure apparatus, in many cases, the exposure apparatus side has a positive pressure with respect to the coating and developing processing system side. In the connected state, movement of dust and the like from the positive pressure side exposure apparatus to the negative pressure side coating and developing processing system occurs,
For this reason, in the coating and developing processing system, there is a possibility that the yield may be reduced due to the adhesion of foreign matter to the surface of the substrate to be processed. In particular, when foreign matter adheres during or immediately before or after resist coating or development on the substrate to be processed, the probability that the substrate to be processed is transported to the exposure apparatus while the foreign matter remains on the surface increases, and defects in the exposure pattern are reduced. Occurs.

In such a coating and developing system, a cassette station, an interface unit for an exposure apparatus, and other wafer transfer mechanisms can also be said to be sources of dust and the like. There is also a problem that the particles float and adhere to the surface of the substrate to be processed.

[0006]

As described above, in a processing apparatus that performs resist coating and development on a substrate to be processed, the pressure difference between the internal atmosphere of the processing apparatus and an external apparatus such as an exposure apparatus connected through an interface unit is increased. Foreign matter such as dust may intrude from an external device such as the exposure apparatus, and dust may be generated in a cassette station in the system, an interface unit for the exposure apparatus, and other wafer transfer mechanisms, and these may be generated on the surface of the substrate to be processed. There is a problem that the adhesion causes a decrease in yield.

The present invention has been made to solve such a problem, and prevents foreign substances such as dust from entering the liquid processing system area from other areas, whereby foreign substances adhere to the surface of the substrate to be processed. It is an object of the present invention to provide a processing apparatus capable of suppressing a decrease in yield due to the above.

Another object of the present invention is to provide a processing apparatus capable of realizing a small size and low cost air filter required for the entire system.

[0009]

[0010]

[MEANS FOR SOLVING THE PROBLEMS] To achieve the above object
In addition, the processing apparatus of the present invention is as described in claim 1.
A plurality of first processing units for performing predetermined processing including heat treatment on the substrate to be processed , a second processing unit for processing the substrate to be processed using a processing liquid, and each of the first processing units First, the substrate to be processed is taken in and out of
Of the first processing unit and a part of each of the first processing units and the second processing unit. And a means for applying a positive pressure to the inside of the second transfer unit with respect to the inside of the first transfer unit.

[0011]

[0012] The processing apparatus of the present invention, as described in claim 2, a plurality of first processing unit that performs predetermined processing including heat treatment on the target substrate, processing the substrate to be processed A second processing unit that processes using a liquid, an external delivery unit that delivers the substrate to and from the outside, delivery of the substrate to and from the external delivery unit, and the first processing unit A first transport unit for loading and unloading the substrate to be processed with respect to the external transfer unit, and a position opposed to the first transport unit with the first processing unit interposed therebetween. A second transfer unit that is provided to move the substrate into and out of a part of each of the first processing units and the second processing unit; In one transport unit Characterized by comprising a means for positive pressure with.

[0013] That is, in the invention of claim 2 to claim 1, by a positive pressure to the second conveyor in the unit with respect to the first transport unit, transfer of the substrate between the transport unit The flow direction of the air in the processing unit used in the second transfer unit is always the direction from the second transfer unit to the first transfer unit, and foreign matter such as dust enters the second transfer unit through the transfer processing unit. Can be prevented. Therefore, when a processing unit using a processing liquid such as resist coating or developing is employed as the second processing unit, a reduction in yield due to foreign matter such as dust adhering to the surface of the substrate to be processed is suppressed. You can do it.

Further, the second transfer unit is hermetically sealed with respect to an external transfer section, for example, an interface section for a cassette station or an exposure apparatus, so that a liquid processing apparatus comprising the second transfer unit and the second processing unit is provided. The hermeticity in the region is further improved, and the situation where dust or the like adheres to the surface of the substrate to be processed can be more effectively prevented.

[0015]

According to a third aspect of the present invention, there is provided a processing apparatus comprising: a plurality of first processing units for performing a predetermined process including a heat treatment on a substrate to be processed; a second processing unit for processing with the
Loading and unloading of the substrate to be processed with respect to each first processing unit
A first transport unit for performing the transfer, and a first transport unit provided at a position opposed to the first transport unit with the first processing unit interposed therebetween, and a part of the first processing units and the second transport unit. A second transfer unit for loading and unloading the substrate to and from the processing unit, and clean air introducing means for introducing clean air to each unit, wherein the first processing unit and the first It is characterized by comprising a clean air introducing means using different types of filters in the transfer unit and the second processing unit and the second transfer unit.

[0017]

According to a fourth aspect of the present invention, there is provided a processing apparatus comprising: a plurality of first processing units for performing predetermined processing including heat treatment on a substrate to be processed; A second processing unit that performs processing using the first and second processing units, an external transfer unit that transfers a substrate to and from the outside, a transfer of the substrate to and from the external transfer unit, and the first processing unit A first transport unit for loading and unloading the substrate to and from the processing unit; a first transport unit that is sealed with respect to the external transfer unit and faces the first transport unit with the first processing unit interposed therebetween; A second transport unit that is provided at a position and moves the substrate into and out of a part of each of the first processing units and the second processing unit; and introduces clean air into each of the units. Clean sky to do Introducing means comprising clean air introducing means using different types of filters in the first processing unit and the first transport unit and the second processing unit and the second transport unit. It is characterized by.

[0019] That is, the invention of claim 3 of claim 4, as a filter used in clean air introduction means for introducing the clean air into the unit, the first processing unit and the first conveying unit and the second And different types of processing units and second transport units. For example, a processing unit (more specifically, a developing unit, a resist coating unit, or the like) for processing a substrate to be processed using a processing liquid is defined as a second processing unit. A type of filter having a high ability to adsorb and remove chemical substances, for example, a chemical HEPA filter (U
LPA filter), and a smaller and less expensive filter, for example, a HEPA filter, is used as a filter in other areas. In this way, by using an appropriate type of filter that does not waste performance in consideration of the necessity of each unit, it is possible to reduce the size and cost of the entire system.

Furthermore processing apparatus of the present invention, as described in claim 5, a plurality of first processing units for processing a target substrate, and a plurality of second processing unit for processing a substrate to be processed A first transfer unit for loading and unloading the substrate to be processed with respect to each first processing unit, and each of the first transfer units sandwiching each of the first processing units at a position opposed to the first transfer unit. A plurality of second processing units are provided corresponding to the second processing units, and each of the plurality of second processing units is configured to take the substrate to be processed in and out of a part of the first processing units and the corresponding second processing unit. A transport unit and clean air introducing means for introducing clean air to each unit, wherein the first processing unit, the first transport unit, and a part of the second processing unit and a corresponding part thereof Do Characterized by comprising a clean air introducing means comprising using different types of filters and the second conveying unit parts.

According to a sixth aspect of the present invention, there is provided a processing apparatus comprising: a plurality of first processing units for performing predetermined processing including heat treatment on a substrate to be processed; A plurality of second processing units for processing using a liquid, a first transport unit for loading and unloading the substrate to and from each of the first processing units, and a plurality of second processing units sandwiching each of the first processing units. A first processing unit is provided at a position facing the first transport unit so as to correspond to each of the second processing units, and a part of each of the first processing units and the corresponding second processing unit are provided. A plurality of second transfer units each for taking in and out the substrate to be processed, and clean air introduction means for introducing clean air into each of the units, wherein the first processing unit and the first transfer unit And some Serial characterized by comprising a second processing unit and clean air introducing means comprising using different types of filters and a portion of the second conveying unit corresponding thereto.

Furthermore, the processing apparatus of the present invention, as described in claim 7, a plurality of first processing units for processing a substrate to be processed, a plurality of processing a substrate to be processed second processing unit And an external transfer unit that transfers the substrate to and from the outside; a transfer of the substrate to and from the external transfer unit; and the transfer of the substrate to each of the first processing units. A first transport unit for loading and unloading,
Each of the second processing units is provided at a position that is sealed with respect to the external transfer unit and that faces the first transport unit with the first processing unit interposed therebetween, corresponding to each of the second processing units. A plurality of second transfer units that respectively carry in and take out the substrate to be processed into and out of a part of one of the processing units and the corresponding second processing unit, and for introducing clean air into each of the units. Clean air introduction means, wherein the first processing unit and the first transport unit and a part of the second processing unit and a part of the second transport unit corresponding thereto are of different types. And a clean air introducing means using a filter.

Furthermore, the processing apparatus of the present invention, as described in claim 8, a plurality of first processing unit that performs predetermined processing including heat treatment on the target substrate, processing the substrate to be processed A plurality of second processing units that perform processing using the liquid, an external delivery unit that delivers the substrate to and from the outside, and delivery of the substrate to and from the external delivery unit; A first transport unit for loading and unloading the substrate to and from the first processing unit; and a first transport unit sealed with respect to the external transfer unit and sandwiching each of the first processing units. The substrate to be processed is provided at a position opposite to the second processing unit so as to correspond to each of the second processing units, and the substrate to be processed is taken in and out of a part of the first processing units and the corresponding second processing unit. Do a plurality of second A transport unit and clean air introducing means for introducing clean air to each unit, wherein the first processing unit, the first transport unit, and a part of the second processing unit and a corresponding part thereof And clean air introducing means using a different type of filter for some of the second transport units.

That is, according to the invention of claims 5 to 8 , the filter used in the clean air introducing means for introducing clean air into each unit is a part of the first processing unit and the first transport unit. The second processing unit and a part of the second transport unit corresponding thereto use different types of filters. For example,
The developing unit and the like of the resist coating unit and the developing unit are used as a second processing unit, and the second processing unit and the second transport unit for loading and unloading the substrate to be processed into and out of the second processing unit have high chemical substance adsorption / removal ability. Types of filters such as chemical HEPA filters (ULPA filters)
Is used, and a smaller and less expensive filter, for example, a HEPA filter is used as a filter in other areas.
In this way, by using an appropriate type of filter that does not waste performance in consideration of the necessity of each unit, it is possible to reduce the size and cost of the entire system. Ma
The processing apparatus according to the present invention is as described in claim 9.
The processing apparatus according to any one of claims 2, 4, 7, and 8
In the above, the external delivery unit is configured to
Cassette station and / or dew for transferring plates
It is an interface unit for optical devices.
You. Further, the processing apparatus of the present invention is described in claim 10.
10. A processing apparatus according to claim 1, wherein
In the plurality of the first processing units, the first processing unit
Between the second transport unit and the second transport unit.
Includes an extension unit for transferring the substrate
It is characterized by the following.

[0025]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described based on the drawings.

FIGS. 1 to 3 show the overall configuration of a coating and developing system 1 for a semiconductor wafer (hereinafter, referred to as "wafer") to which an embodiment of the present invention is applied.
2 is a plan view, FIG. 2 is a front side view, and FIG. 3 is a partial cross-sectional side view on the back side. As shown in these figures, the coating and developing processing system 1 of the present embodiment carries in / out a wafer cassette CR containing a plurality of wafers W to / from the outside, and takes in / out a wafer W from / to the wafer cassette CR. Station 10 for carrying out wafer W
A processing station 11 configured by arranging various types of single-wafer processing units that perform predetermined processing one by one on the
An interface unit 12 for transferring a wafer W to and from an external exposure apparatus is integrally combined.

In the cassette station 10, as shown in FIG. 1, a plurality of wafer cassettes CR, for example, up to five wafer cassettes CR are mounted on a cassette mounting table 20 in a line with their respective wafer entrances facing the processing station 11. With respect to these wafer cassettes CR, a wafer carrier 21 movably provided in the X direction and the Z direction (the direction of arranging wafers in the wafer cassette CR; the vertical direction) performs the operation of taking in and out of the wafer W. I have. This wafer carrier 21 is
The wafer W is rotatable in the θ direction, and can transfer the wafer W to and from the first wafer carrier 22 on the processing station 11 side.

In the processing station 11, a first transport unit 31 which is two independent transport units is provided.
And a second transport unit 32 and various processing unit groups.

The processing unit sets the wafer W in the cup CP.
A spinner type (a resist coating unit (COT) and a developing unit (DEV)) that performs a predetermined process using a processing liquid while rotating on a spin chuck and a wafer W placed on a mounting table SP for a predetermined time. Oven type (processing unit group 33 including a heat treatment system) which performs the above-mentioned processing. These spinner type processing units (resist coating unit (COT) and developing unit (DEV)) and oven type processing unit (The processing unit group 33 including the heat treatment system) is divided into two parts on both sides of the second transport unit 32. Then, the first transport unit 31 and the second transport unit 3 are operated by an oven-type processing unit (a processing unit group 33 including a heat treatment system).
2 are separated from each other.

The arrangement of these processing units will be described in more detail. As shown in FIGS. 1 and 2, a resist coating unit (CO) which is a spinner type processing unit is used.
T) and the developing unit (DEV) are arranged side by side in a row facing the second transport unit 32. The oven-type processing unit (the processing unit group 33 including the heat treatment system) is the same as FIG.
As shown in FIG. 3 and a plurality of rows (in this example, 4 rows and 5 columns) are arranged side by side. FIG. 3 is a partial cross-sectional and side view showing an arrangement configuration of an oven-type processing unit (a processing unit group 33 including a heat treatment system) from the first transfer unit 31 side.

As an oven type processing unit, a cooling unit (COL) for performing a cooling process of the wafer W,
Alignment unit (A for aligning wafer W)
LIM), an adhesion unit (AD) for performing a hydrophobic treatment for improving the fixability of a resist solution applied to the surface of the wafer W, and a prebaking unit (PREBAKE) for performing a heating process on the wafer W before the exposure process. ), A post-baking unit (POBAKE) for performing a heating process on the wafer W after the exposure process,
A cooling unit (EXTCOL) and an extension unit (EX) for transferring the wafer W between the first transfer unit 31 and the second transfer unit 32
T).

Here, a cooling unit (COL), an extension cooling unit (EXTCOL), and an extension unit (EXT) each having a relatively low processing temperature are disposed, for example, at the lowest stage, and a prebaking unit having a relatively high processing temperature. (PREBAKE) and post-baking unit (POBAKE) and adhesion unit (AD) are cooling units (CO
L) and the extension unit (EXT). By arranging units having a high processing temperature in the upper stage, thermal mutual interference between the units is reduced.

In the first transport unit 31, the Y transfer between the cassette station 10 and the interface unit 12 is performed.
The first is configured to be movable in the Z direction (vertical direction) and to be rotatable in the θ direction.
Of the wafer W between the cassette station 10 and the interface unit 12 by the first wafer carrier 22.
Then, the wafer W is taken in and out of the individual oven-type processing units in the processing unit group 33 including the heat treatment system.

On the other hand, in the second transfer unit 32, for example, two wafer transfer units of a fixed position type, for example, two transfer units configured to be vertically movable in the Z direction (vertical direction) and rotatable in the θ direction. (A second wafer carrier 23 and a third wafer carrier 24) are provided. This second
As shown in FIGS. 1 and 4, the wafer W is moved in and out of the extension unit (EXT), the wafer W is moved in and out of the resist coating unit (COT) as shown in FIGS. The transfer of the wafer W is performed. Further, the third wafer carrier 24 transfers the wafer W to and from the second wafer carrier 23, and takes the wafer W in and out of the developing unit (DEV).

As shown in FIG. 4, each processing unit is provided with an opening 41 for loading / unloading the wafer W, and these openings 41 are individually formed by a shutter 42 driven by driving means (not shown). It is opened and closed. Therefore, the first transport unit 31 and the second transport unit 3
The extension units (EXT) used to transfer the wafer W to and from the transfer unit 31 include
An opening 41 and a shutter 42 for opening and closing the opening 41 are provided on both surfaces opposite to 32.

The interface section 12 includes a portable pickup cassette CR and a stationary buffer cassette B.
R, a peripheral exposure device (not shown), a wafer carrier 25 and the like are provided. The wafer transfer body 25 moves in the X direction and the Z direction.
To transfer the wafer W to the cassettes CR and BR. Further, the wafer carrier 25 is also rotatable in the θ direction, and the wafer W between the first wafer carrier 22 on the processing station 11 side and a wafer transfer table (not shown) on the external exposure apparatus side. Is configured to be delivered.

As shown in FIGS. 3, 4, and 5, an air supply chamber 10a is provided above the cassette station 10, the processing station 11, and the interface unit 12.
11a1, 11a2 and 12a are provided, and filters 10b, 11b1 and 11b2 with dustproof functions are provided below the air supply chambers 10a, 11a1 and 11a2 and 12a.
12b is attached. Air conditioners 36 and 37 are installed outside the system.
Air is introduced into each of the air supply chambers 10a, 11a1, 11a2, and 12a from pipes 37 through pipes 38 and 39, and the filters 10b, 11b1, 11b2, and 1 of each air supply chamber are provided.
2b allows clean air to be supplied to the respective parts 10, 11, 12. The gas is collected at an exhaust port 42 at the bottom through a plurality of ventilation holes provided at appropriate locations below the downflow system.
The air is passed through the air conditioners 36 and 37 and collected by the air conditioners 36 and 37.

In the coating and developing system of this embodiment, the second transport unit 32, the resist coating unit (COT) and the developing unit (D
The amount of air supply per unit time to the air supply chamber 11a2 above the EV) is measured from the air conditioner 36 to the first transfer unit 31 and the oven type processing unit group 33 including the heat treatment system.
Is set higher than the air supply amount per unit time to the air supply chamber 11a1 above, so that the pressure in the former region is higher than the pressure in the latter region. Thereby, the direction of the air flow in the extension unit (EXT) for transferring the wafer W between the transfer units 31 and 32 is always from the second transfer unit 32 to the first transfer unit 31. Therefore, it is possible to prevent foreign matter such as dust from entering the liquid processing system through the extension unit (EXT).

In the liquid processing, particularly the developing processing, of the wafer, it is important to prevent a defect caused by the adsorption of a chemical substance contained in the atmosphere, for example, an alkaline substance such as an ammonia gas or an amine gas on the surface of the wafer W. It has been. In view of such circumstances, as shown in FIGS. 4 and 5, the coating and developing processing system 1 of the present embodiment includes the second transport unit 32 and each processing unit (COT) (DEV) of the liquid processing system. As the filter 11b2 for purifying the introduced air, a type of filter having a high ability to adsorb and remove chemical substances, for example, a chemical HEPA filter (ULPA filter) is used. Such a type of filter having a better ability to adsorb and remove chemical substances can of course be used as a filter in other areas, but the filter size is relatively large and expensive, and the system can be reduced in size and cost. It can be a factor that prevents cost reduction.

Therefore, in the coating and developing system of this embodiment, only a filter 11b2 in the region of the liquid processing system including the second transport unit 32 has a type of filter having a high ability to adsorb and remove chemical substances, for example, a chemical HEPA filter ( ULPA filter), and as the filters 10b, 11b1 and 12b in other areas, smaller and less expensive filters, for example, HEPA filters are used.
This contributes to downsizing of the system and cost reduction.

In short, in the coating and developing treatment system 1 of the present embodiment, since the respective regions of the liquid treatment system and the heat treatment system are separated from each other, different types having the minimum necessary capacity are required for each region. A filter can be applied, whereby the system can be reduced in size and cost. Therefore, in the present invention, the types of filters applied to each area are not limited to those described above.

In the above-described embodiment, a type of filter having a high ability to adsorb and remove chemical substances is used only for the filter 11b2 in the region of the liquid processing system including the second transport unit 32. As shown in FIG. 5, the space in the second transport unit 32 is separated from the space 32a on the resist coating unit (COT) side by the partition wall 35 and the developing unit (DE).
V) side space 32b, and the individual spaces 32a, 3b
2b, the first and second transfer units 31 and 32 are provided integrally with each other.
The lowermost two processing units of the oven type processing unit group 33 of the heat treatment system disposed between the wafer processing units 33 and 24 are used as wafer delivery extension units (EXT) corresponding to the individual wafer transfer bodies 23 and 24. In the case of the configured coating and developing system, only the space 32b on the developing unit (DEV) side in the second transport unit 32 and the filter 11b3 above the developing unit (DEV) are provided.
A type of filter that is more excellent in the ability to adsorb and remove chemical substances may be used.

Next, the flow of processing by the coating and developing system will be described.

First, at the cassette station 10,
The wafer carrier 21 accesses the cassette CR on the cassette mounting table 20 that contains the unprocessed wafers W, and takes out one wafer W from the cassette CR. After that, the wafer carrier 21 transfers the wafer W to the first wafer carrier 22 in the first carrier unit 31 of the processing station 11. The first wafer transfer body 22 moves in the Y and Z directions (vertical direction) to the position of the alignment unit (ALIM), and further rotates in the θ direction to transfer the wafer W into the alignment unit (ALIM). I do.

When the orientation alignment and centering of the wafer W are completed in the alignment unit (ALIM), the first wafer transfer body 2 in the first transfer unit 31 is completed.
2 receives the aligned wafer W, and subsequently moves the wafer W to the position of the adhesion unit (AD) in the Y direction and the Z direction (vertical direction) to move the wafer W into the adhesion unit (AD). Put on. Here, the wafer W
Is performed.

The wafer W that has been subjected to the hydrophobizing process is subsequently subjected to a predetermined pre-baking unit (PREBAKE) by the first wafer carrier 22 in the first carrier unit 31.
And baked, and then carried into a predetermined cooling unit (COL). In the cooling unit (COL), the wafer W is cooled to a set temperature before the resist coating processing, for example, 23 ° C.

When the cooling process of the wafer W is completed, the first wafer carrier 22 in the first carrier unit 31 takes out the wafer W from the cooling unit (COL), and then moves the position of the extension unit (EXT). The wafer W is carried into the extension unit (EXT), and the wafer W is mounted on the mounting table SP therein.

Thereafter, the extension unit (EX)
The wafer W is transferred into the second transfer unit 32 through T). That is, the extension unit (EX
T) The shutter 42 for opening and closing the opening 41 facing the second transfer unit 32 is opened, and the wafer W mounted on the mounting table SP in the extension unit (EXT) is opened.
Is carried out of the extension unit (EXT) by the second carrier 23 in the second carrier unit 32, and the shutter 42 is closed.

The extension unit (EX
Each shutter 42 that opens and closes both openings 41 of the first transport unit 31, for example, sets the atmospheric pressure in the second transport unit 32 higher than that in the first transport unit 31. By using other means capable of preventing foreign substances such as particles from entering the second transport unit 32 from the second transport unit 32, the second transport unit 32 can be eliminated.

Thereafter, the extension unit (EX)
The wafer W transferred from the inside of the second transfer unit 32 into the second transfer unit 32 is carried into the resist coating unit (COT) by the second transfer body 23, and is transferred to the surface of the wafer W in the resist coating unit (COT). Is applied.

When the resist coating process is completed, the second wafer carrier 23 in the second carrier unit 32
Is taken out of the resist coating unit (COT), and is again carried into the extension unit (EXT). Thereafter, the first wafer transfer body 2 in the first transfer unit 31
2, the wafer W is carried out of the extension unit (EXT), and then the first wafer carrier 22 moves through the first carrier unit 31 in the Y direction and the Z direction (pre-baked unit) to the position of the predetermined prebaking unit (PREBAKE). The wafer W is moved in the pre-bake unit (PR)
EBAKE). Here, the wafer W is heated at a predetermined temperature, for example, 100 ° C. for a predetermined time, so that the remaining solvent is evaporated and removed from the coating film on the wafer W.

Thereafter, the wafer W is transferred to the first wafer carrier 2
2 interface section 12 extension
The wafer W is carried into a cooling unit (@TCOL), where the wafer W is cooled to a temperature suitable for the next step, that is, 24 ° C. suitable for a peripheral exposure process by a peripheral exposure apparatus (not shown) provided in the interface unit 12.

Subsequently, the first wafer transfer body 22 in the first transfer unit 31 takes out the wafer W from the extension cooling unit (@TCOL) and transfers it to the wafer transfer body 25 of the interface unit 12.
The wafer carrier 25 of the interface unit 12 carries the wafer W into a peripheral exposure device (not shown) in the interface unit 12. Here, the wafer W is subjected to an exposure process on its peripheral portion.

When the peripheral exposure processing is completed, the wafer carrier 25 of the interface section 12 carries out the wafer W from the peripheral exposure apparatus and transfers it to the adjacent wafer receiving table (not shown) of the exposure apparatus. In this case, before the wafer W is transferred to the exposure apparatus, the wafer W
It may be temporarily stored in R.

When the entire surface pattern exposure processing in the exposure apparatus is completed and the wafer W is returned to the wafer receiving table on the exposure apparatus side, the wafer transfer body 25 of the interface section 12 moves the wafer after the exposure processing from the wafer receiving table to the wafer receiving table. W, and transfers the wafer W to the first wafer carrier 22 in the first carrier unit 31 of the processing station 11 again.
In this case, the wafer W may be temporarily stored in the buffer cassette BR in the interface unit 12 as necessary before being transferred to the processing station 11 side.

Thereafter, the first transport unit 31
Carries the wafer W into a predetermined post-baking unit (POBAKE). In this post-baking unit (POBAKE), the wafer W
Is baked for a predetermined time. Subsequently, the baked wafer W is transferred to one of the cooling units (CO) by the wafer transfer body 22 in the first transfer unit 31.
L), and the wafer W is returned to normal temperature in the cooling unit (COL).

Subsequently, after the wafer W is carried into the extension unit (EXT), the wafer W is taken out of the extension unit (EXT) by the second carrier 23 in the second carrier unit 32 in the same manner as described above. Then, it is transferred to the third transfer body 24 in the second transfer unit 32. Then, the wafer W is carried into the developing unit (DEV) by the third carrier 24.

In the developing unit (DEV), the wafer W is placed on a spin chuck, and a developing solution is uniformly applied to a resist on the surface of the wafer W by, for example, a spray method to perform development. After the development, a rinsing liquid is applied to the wafer surface in the developing unit (DEV),
The developer is washed off.

Thereafter, the third transport unit 32
Wafer transfer body 24 transfers wafer W to developing unit (DE).
After being carried out from V), it is delivered to the adjacent second carrier 23. The second carrier 23 transfers the wafer W delivered from the third wafer carrier 24 to the extension unit (EX).
Carry in T). Thereafter, the wafer W is carried out of the extension unit (EXT) by the first wafer carrier 22 in the first carrier unit 31, and then the first wafer carrier 22 is moved to a predetermined post-baking unit (POBAK @). ) Is carried in. In this post-baking unit (POBAKE), the wafer W is heated, for example, at 100 ° C. for a predetermined time, whereby the resist swollen by development is hardened, and the chemical resistance is improved.

When the post-baking is completed, the wafer carrier 22 in the first carrier unit 31 carries out the wafer W from the post-baking unit (POBAKE), and then carries the wafer W into a predetermined cooling unit (COL). The cooling process is performed. Here, after the temperature of the wafer W has returned to normal temperature, the first wafer carrier 22 transfers the wafer W to the wafer carrier 21 on the cassette station 10 side.
Then, the wafer carrier 21 transfers the received wafer W to the cassette C for storing the processed wafer on the cassette mounting table 20.
R is inserted into a predetermined wafer accommodating groove.

As described above, in the present embodiment, the transfer of the wafer W between the cassette station 10 and the interface unit 12 for the exposure apparatus, and the transfer of the wafer W to and from the oven-type processing unit group 33 including the heat treatment system are performed. A first transfer unit 31 and a second transfer unit 32 for transferring a wafer W in and out of the resist coating unit (COT) and the developing unit (DEV) are arranged separately from each other. 31st and 2nd
In the coating and developing processing system 1 configured to transfer the wafer W to and from the transfer unit 32 through an extension unit (EXT) in the oven type processing unit group 33 of the heat treatment system, the second transfer is performed. The pressure on the unit 32 side is higher than the pressure on the first transport unit 31 side. Thereby, the extension unit (EXT) between the transport units 31 and 32 is provided.
The flow direction of the air in the second transport unit 32 is always
To the first transport unit 31, and as a result, it is possible to prevent foreign matter such as dust from entering the liquid processing system through the extension unit (EXT).

In the coating and developing system 1 of this embodiment, the chemical substance is applied only to the filter 11b2 in the area of the liquid processing system including the second transport unit 32 or only to the filter 11b3 in the area of the developing system. A type of filter having a high adsorption / removal capability, for example, a chemical HEPA filter (ULPA filter) is used, and as a filter for other areas, a smaller and less expensive filter, for example, HEP filter
By using the A filter, the size and cost of the system can be reduced.

The arrangement of each part in the coating and developing system described above is merely an example, and various modifications are possible.

For example, in the above-described embodiment, the extension unit (EXT) is determined from the lowermost processing unit of the oven type processing unit group 33 including the heat treatment system. The second or third stage processing unit may be used as the extension unit.

Further, in the above-described embodiment, the cassette station 10 and the interface unit 12 are arranged on both sides of the processing station 11 with the processing station 11 interposed therebetween. However, as shown in FIG. The interface units 12 may be provided side by side at positions opposing the oven type processing unit group 33 including the heat treatment system with the interposition 31 interposed therebetween. In this configuration, the interface unit 12 includes:
For example, a plurality of (two in this example) wafer carriers 125,
A plurality of wafer carriers 125 and 126 can be used as buffers for transferring wafers W between the exposure apparatus and the processing station 11. Reference numeral 28 denotes a peripheral exposure device that exposes the peripheral portion of the wafer W before the entire surface of the wafer W is exposed by the exposure device.

In the above-described embodiment, a fixed-position type wafer carrier is adopted as the wafer carrier in the second carrier unit 32. Instead, for example, as shown in FIG. The coating and developing system according to the present invention may be configured by employing a structure similar to the wafer transfer body 22 in the transfer unit 31, that is, a wafer transfer body 223 movable in the Y direction.

The apparatus for applying and developing a resist solution on the surface of a semiconductor wafer has been described above.
Needless to say, the present invention can be applied to an apparatus for applying and developing a resist solution on the surface of a CD substrate or the like.

[0068]

As described above, according to the present invention, according to the present onset Akira,
By setting the inside of the second transfer unit to a positive pressure with respect to the inside of the first transfer unit, the flow direction of air in the processing unit used for delivery of the substrate to be processed between the transfer units is always set to the second direction. From the transfer unit to the first transfer unit, and the second through the transfer processing unit.
It is possible to prevent foreign matter such as dust from entering the transport unit side. Therefore, when a processing unit using a processing liquid such as resist coating or developing is employed as the second processing unit, a reduction in yield due to foreign matter such as dust adhering to the surface of the substrate to be processed is suppressed. You can do it. In addition, since the second transfer unit is hermetically sealed with respect to an external transfer unit, for example, an interface unit for a cassette station or an exposure apparatus, the liquid transfer area in the liquid processing area including the second transfer unit and the second processing unit is formed. The hermeticity is further improved, and the situation where dust and the like adhere to the surface of the substrate to be processed can be more effectively prevented.

Further, according to the present invention, for example, a chemical unit is adsorbed on a processing unit such as a developing unit and a resist coating unit for processing a substrate to be processed using a processing liquid and a transport unit for taking the substrate into and out of the processing unit.・ It is necessary to use each type of processing unit and transport unit for loading and unloading the substrate to be processed. By selecting an appropriate type of filter that does not waste performance in consideration of performance,
The size and cost of the entire system can be reduced.

Further, according to the present invention, for example, a processing unit such as a developing unit of the resist coating unit and the developing unit, and a transfer unit for taking a substrate to be processed into and out of the processing unit, the ability to adsorb and remove chemical substances. The need for each individual processing unit and the transport unit for loading and unloading the substrate to be processed into and out of the processing unit, as described above, using a higher type of filter and using a smaller and less expensive filter as the filter in other areas. By selecting an appropriate type of filter that does not waste performance in consideration of the above, it is possible to reduce the size and cost of the entire system.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of a semiconductor wafer coating and developing processing system according to an embodiment of the present invention.

FIG. 2 is a front side view of the coating and developing system shown in FIG. 1;

FIG. 3 is a partial cross-sectional and side view of the back side of the coating and developing system shown in FIG. 1;

FIG. 4 is a sectional view of the coating and developing system shown in FIG. 1;

FIG. 5 is a plan view showing the arrangement of filters on the ceiling in the coating and developing system shown in FIG. 1;

FIG. 6 is a plan view showing the overall configuration of a semiconductor wafer coating and developing system according to another embodiment of the present invention;

FIG. 7 is a plan view showing the overall configuration of a semiconductor wafer coating and developing system according to still another embodiment of the present invention.

FIG. 8 is a plan view showing the overall configuration of a semiconductor wafer coating and developing processing system according to still another embodiment of the present invention.

[Explanation of symbols]

W semiconductor wafer 10 cassette station 11 processing station 11a1, 11a2 air supply chamber 11b1 HEPA filter 11b2 chemical HEPA filter (ULPA filter) 12 interface unit 31 first transport Unit 32 Second transport unit 33 Processing unit group including heat treatment system 36, 37 Air conditioner COT Resist coating unit DEV Developing unit EXT Extension unit for wafer delivery

Claims (10)

(57) [Claims] A plurality of first processing units for performing a predetermined process including a heat treatment on a substrate to be processed; a second processing unit for processing a substrate to be processed using a processing liquid; A first transport unit for loading and unloading the substrate to and from the processing unit, and a first transport unit provided at a position opposed to the first transport unit with the first processing unit interposed therebetween; A second transport unit for loading and unloading the substrate to be processed with respect to a part of the processing units and the second processing unit; A processing unit for applying a positive pressure. A plurality of first processing units for performing predetermined processing including heat treatment on the substrate to be processed, a second processing unit for processing the substrate to be processed using a processing liquid, and an external unit. An external transfer unit that transfers the substrate to be processed, and a first transfer unit that transfers the substrate to and from the external transfer unit and that moves the substrate into and out of each of the first processing units. Is provided at a position that is sealed with respect to the external transfer unit and that faces the first transport unit with the first processing unit interposed therebetween, and a part of the first processing unit and the first processing unit. A second transfer unit for loading and unloading the substrate to and from the second processing unit; and a unit for applying a positive pressure to the inside of the second transfer unit with respect to the inside of the first transfer unit. A process characterized by Apparatus. 3. A plurality of first processing units for performing predetermined processing including heat treatment on a substrate to be processed, a second processing unit for processing the substrate to be processed using a processing liquid, and each of the first processing units . Of the substrate to be processed
A first conveyance unit that was put, the provided at a position facing the first conveying unit across the first processing unit, said portion and said one of the first processing unit A second transfer unit for loading and unloading the substrate to and from a second processing unit; and a clean air introducing unit for introducing clean air to each unit, wherein the first processing unit and the second A processing apparatus comprising: a first transport unit; a second processing unit; and a clean air introducing unit using different types of filters in the second transport unit. 4. A plurality of first processing units for performing predetermined processing including heat treatment on a substrate to be processed, a second processing unit for processing a substrate to be processed using a processing liquid, and an external unit. An external transfer unit that transfers the substrate to be processed in the first transfer unit; and a first process that transfers the substrate to be processed between the external transfer unit and the loading and unloading of the substrate to and from each of the first processing units. A transport unit, provided at a position sealed with respect to the external transfer unit and opposed to the first transport unit with each of the first processing units interposed therebetween; one of the first processing units; A second transport unit for loading and unloading the substrate to and from the unit and the second processing unit; and a clean air introducing unit for introducing clean air into each unit, wherein the first processing Unit and first Processing apparatus characterized by comprising a clean air introducing means comprising using different types of filters and the conveyance unit and the second processing unit and the second transport unit. 5. A plurality of first processing units for processing a substrate to be processed, a plurality of second processing units for processing a substrate to be processed, and a plurality of first processing units for processing the substrate to be processed. A first transfer unit for loading and unloading, and a first transfer unit that is provided corresponding to each of the second processing units at a position facing the first transfer unit with the first processing unit interposed therebetween; A plurality of second transport units for respectively carrying in and out the substrate to and from a part of the processing units and the corresponding second processing unit; and a cleaning unit for introducing clean air into each unit. Air introducing means, wherein the first processing unit and the first processing unit
And a part of the second processing unit and a corresponding part of the second transport unit, and a clean air introducing means using different types of filters. Processing equipment. 6. A plurality of first processing units for performing predetermined processing including heat treatment on a substrate to be processed, a plurality of second processing units for processing a substrate to be processed using a processing liquid, A first transfer unit for loading and unloading the substrate to and from the first processing unit; and a second transfer unit at a position facing the first transfer unit with the first processing unit interposed therebetween. A plurality of second transport units that are provided corresponding to the processing units and that respectively carry in and take out the substrate to be processed with respect to a part of the first processing units and the corresponding second processing units; A clean air introducing means for introducing clean air into each of the units, wherein the first processing unit and the first
And a part of the second processing unit and a corresponding part of the second transport unit, and a clean air introducing means using different types of filters. Processing equipment. 7. A plurality of first processing units for processing a substrate to be processed, a plurality of second processing units for processing a substrate to be processed, and an external delivery unit for transferring the substrate to and from the outside. And a first transport unit for transferring the substrate to be processed between the external transfer unit and the loading and unloading of the substrate to and from each of the first processing units. It is provided corresponding to each of the second processing units at a position opposed to the first transfer unit with the first processing units interposed therebetween, and the first processing unit is A plurality of second transport units for respectively carrying the substrate to be processed in and out of a part and the corresponding second processing unit; and a clean air introducing means for introducing clean air into each of the units. , The first Processing unit and the first
And a part of the second processing unit and a corresponding part of the second transport unit, and a clean air introducing means using different types of filters. Processing equipment. 8. A plurality of first processing units for performing predetermined processing including heat treatment on a substrate to be processed, a plurality of second processing units for processing a substrate to be processed using a processing liquid, An external transfer unit that transfers the substrate to be processed between the first and second processing units; and a transfer unit that transfers the substrate to be processed between the external transfer unit and the first processing unit. One transfer unit, and a position corresponding to each of the second processing units at a position that is sealed with respect to the external transfer unit and that faces the first transfer unit with each of the first processing units interposed therebetween. A plurality of second transport units that are provided and respectively carry out the loading and unloading of the substrate to be processed into and out of a part of each of the first processing units and the corresponding second processing unit; Introduce air A clean air introduction means fit, said first processing unit and the first
And a part of the second processing unit and a corresponding part of the second transport unit, and a clean air introducing means using different types of filters. Processing equipment. In any of the processing device 9. claim 2,4,7,8, wherein said external delivery unit, the cassette station and / or an exposure apparatus for transferring the substrate to be processed with respect to the cassette interface A processing device characterized by being a unit. 10. The processing apparatus according to claim 1, wherein a plurality of said first processing units are provided between said first transfer unit and said second transfer unit. A processing device comprising an extension unit that performs delivery.