JPH10125925A5 - - Google Patents

Info

Publication number
JPH10125925A5
JPH10125925A5 JP1996282507A JP28250796A JPH10125925A5 JP H10125925 A5 JPH10125925 A5 JP H10125925A5 JP 1996282507 A JP1996282507 A JP 1996282507A JP 28250796 A JP28250796 A JP 28250796A JP H10125925 A5 JPH10125925 A5 JP H10125925A5
Authority
JP
Japan
Prior art keywords
substrate
semiconductor integrated
integrated circuit
insulating film
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
JP1996282507A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10125925A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP28250796A priority Critical patent/JPH10125925A/ja
Priority claimed from JP28250796A external-priority patent/JPH10125925A/ja
Publication of JPH10125925A publication Critical patent/JPH10125925A/ja
Publication of JPH10125925A5 publication Critical patent/JPH10125925A5/ja
Abandoned legal-status Critical Current

Links

JP28250796A 1996-10-24 1996-10-24 半導体集積回路 Abandoned JPH10125925A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP28250796A JPH10125925A (ja) 1996-10-24 1996-10-24 半導体集積回路

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP28250796A JPH10125925A (ja) 1996-10-24 1996-10-24 半導体集積回路

Publications (2)

Publication Number Publication Date
JPH10125925A JPH10125925A (ja) 1998-05-15
JPH10125925A5 true JPH10125925A5 (OSRAM) 2004-10-21

Family

ID=17653350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP28250796A Abandoned JPH10125925A (ja) 1996-10-24 1996-10-24 半導体集積回路

Country Status (1)

Country Link
JP (1) JPH10125925A (OSRAM)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3437132B2 (ja) 1999-09-14 2003-08-18 シャープ株式会社 半導体装置
US7829971B2 (en) 2007-12-14 2010-11-09 Denso Corporation Semiconductor apparatus
US7999320B2 (en) * 2008-12-23 2011-08-16 International Business Machines Corporation SOI radio frequency switch with enhanced signal fidelity and electrical isolation
JP4894910B2 (ja) 2009-01-15 2012-03-14 株式会社デンソー 半導体装置の製造方法及び半導体装置並びにその半導体装置を内蔵する多層基板

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