JPH0997808A - Die bonding device - Google Patents
Die bonding deviceInfo
- Publication number
- JPH0997808A JPH0997808A JP7277001A JP27700195A JPH0997808A JP H0997808 A JPH0997808 A JP H0997808A JP 7277001 A JP7277001 A JP 7277001A JP 27700195 A JP27700195 A JP 27700195A JP H0997808 A JPH0997808 A JP H0997808A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- heat block
- island portion
- die bonding
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
- H01L2224/27011—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature
- H01L2224/27013—Involving a permanent auxiliary member, i.e. a member which is left at least partly in the finished device, e.g. coating, dummy feature for holding or confining the layer connector, e.g. solder flow barrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、ＩＣペレットをリ
ードフレームのアイランド部に熱硬化性接着剤を用いて
固定するダイボンディング装置に係り、特に、前記接着
剤を硬化させるべく前記リードフレームをヒートブロッ
ク上に置いて加熱するようにしてなるものに関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die bonding apparatus for fixing an IC pellet to an island portion of a lead frame by using a thermosetting adhesive, and more particularly, to heat the lead frame to cure the adhesive. The present invention relates to something which is placed on a block and heated.
【０００２】[0002]
【従来の技術】ＩＣ製造ラインには、ＩＣペレットをリ
ードフレームのアイランド部に固定するためのダイボン
ディング装置が備えられる。ＩＣペレットをリードフレ
ームのアイランド部に固定するにあたっては、通常、銀
ペーストと呼ばれる銀入りエポキシ系接着剤等の熱硬化
性接着剤が用意され、これをリードフレームのアイラン
ド部に塗布して加熱硬化させることによりＩＣペレット
をアイランド部に接着固定する。加熱硬化手段として
は、オーブン加熱によるものとヒートブロックを用いた
ものとがある。2. Description of the Related Art An IC manufacturing line is equipped with a die bonding apparatus for fixing IC pellets to an island portion of a lead frame. When fixing the IC pellets to the island portion of the lead frame, a thermosetting adhesive such as an epoxy adhesive containing silver called silver paste is usually prepared, and this is applied to the island portion of the lead frame and cured by heating. By doing so, the IC pellet is adhesively fixed to the island portion. As the heating and curing means, there are a method using oven heating and a method using a heat block.
【０００３】ヒートブロックを用いたものは、図３に示
される如くに、リードフレーム２を直接ヒートブロック
４上に置いて加熱しながら連続的に搭載工程へ搬送する
ようにしたもので、オーブン加熱によるものに比して生
産性が高い。As shown in FIG. 3, the one using a heat block is one in which the lead frame 2 is directly placed on the heat block 4 and is continuously conveyed to the mounting process while being heated. Productivity is higher than that of
【０００４】[0004]
【発明が解決しようとする課題】ところが、リードフレ
ーム２をヒートブロック４上に直接置いて加熱するよう
にしたものでは、ヒートブロック４の反り、凹凸、変
形、あるいは、リードフレーム２の反り，凹凸、変形等
により、ヒートブロック４に対してリードフレーム２が
ガタついたり傾いたりして、ヒートブロック４とリード
フレーム２との接触面積及び接触部位が変化し、リード
フレーム２のうちの、ヒートブロック４に接触している
部分と接触していない部分とに大きな温度差が生じ、そ
の結果、リードフレーム２内（の特に熱硬化性接着剤が
塗布されるアイランド部２ａ）の温度分布が不均一とな
り、接着剤の硬化速度等に差が生じ、ダイシェア強度が
ばらついて不安定となり、その後に行われるワイヤボン
ディング等に不具合が生じて製品品質や歩留りが低下す
るといった問題が発生していた。However, in the case where the lead frame 2 is directly placed on the heat block 4 for heating, the heat block 4 is warped, uneven or deformed, or the lead frame 2 is warped or uneven. The lead frame 2 rattles or tilts with respect to the heat block 4 due to deformation, etc., and the contact area and contact portion between the heat block 4 and the lead frame 2 change, so that the heat block of the lead frame 2 There is a large temperature difference between the part that is in contact with 4 and the part that is not in contact, and as a result, the temperature distribution in the lead frame 2 (in particular, the island part 2a to which the thermosetting adhesive is applied) is uneven. The difference in the curing speed of the adhesive causes the die shear strength to fluctuate and become unstable, causing problems with subsequent wire bonding, etc. Cause problems such as product quality and yield decreases in has occurred.
【０００５】本発明は、上述した如くの問題を解消する
ためになされたもので、その目的とするところは、リー
ドフレームのアイランド部の温度分布を均一にして、接
着剤の硬化速度等に差を生じ難くし、ダイシェア強度を
均一にして安定させ、その後に行われるワイヤボンディ
ング等に不具合が生じないようにして製品品質や歩留り
を向上させることのできるダイボンディング装置を提供
することにある。The present invention has been made in order to solve the above-mentioned problems, and its purpose is to make the temperature distribution of the island portion of the lead frame uniform so that the curing speed of the adhesive may be different. It is an object of the present invention to provide a die bonding apparatus capable of improving the product quality and the yield by making the die shear strength uniform and stable, and causing no problems in wire bonding and the like performed thereafter.
【０００６】[0006]
【課題を解決するための手段】上述の目的を達成すべ
く、本発明に係るダイボンディング装置は、基本的に
は、ＩＣペレットをリードフレームのアイランド部に熱
硬化性接着剤を用いて固定すべく、前記リードフレーム
をヒートブロック上に置いて加熱するようにしてなり、
前記リードフレームを前記ヒートブロックから浮かせた
ことを特徴としている。To achieve the above object, a die bonding apparatus according to the present invention basically fixes an IC pellet to an island portion of a lead frame using a thermosetting adhesive. Therefore, put the lead frame on a heat block to heat it,
It is characterized in that the lead frame is floated from the heat block.
【０００７】上記のように、リードフレームをヒートブ
ロックから浮かせたことにより、ヒートブロックに対し
てアイランド部全体が無接触となり、必然的に、従来の
もののようにヒートブロックに対してアイランド部の接
触面積や接触部位は変化しないので、リードフレームや
ヒートブロックに反り、凹凸、変形等が生じていても、
ヒートブロックによりアイランド部全体が空気を介して
略均等に加熱され、アイランド部の各部に温度差はほと
んど生じない。As described above, by floating the lead frame from the heat block, the entire island portion does not come into contact with the heat block, and inevitably the island portion comes into contact with the heat block as in the conventional case. Since the area and contact area do not change, even if the lead frame or heat block is warped, uneven, or deformed,
The heat block heats the entire island portion substantially evenly through the air, and there is almost no temperature difference between the island portions.
【０００８】その結果、アイランド部の温度分布が均一
化され、接着剤の硬化速度等に差が生じ難くなり、ダイ
シェア強度が均一となって安定し、その後に行われるワ
イヤボンディング等に不具合が生じず、製品品質や歩留
りを向上させることができる。As a result, the temperature distribution in the island portion is made uniform, the difference in the curing speed of the adhesive is less likely to occur, the die shear strength becomes uniform and stable, and problems occur in the wire bonding and the like performed thereafter. Therefore, product quality and yield can be improved.
【０００９】[0009]
【発明の実施の形態】以下、本発明の実施例を図面を参
照しつつ説明する。本発明のダイボンディング装置の一
実施例においては、図１に示される如くに、リードフレ
ーム２をヒートブロック４上に置いて加熱しながら連続
的に搭載工程へ搬送するのは前述した図３に示される従
来のものと同じであるが、搬送時には、前記リードフレ
ーム２を凸状治具５，５で前記ヒートブロック４から若
干浮かせるようにしている。BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings. In one embodiment of the die bonding apparatus of the present invention, as shown in FIG. 1, the lead frame 2 is placed on the heat block 4 and continuously conveyed to the mounting step while being heated. Although the same as the conventional one shown, the lead frame 2 is slightly lifted from the heat block 4 by the convex jigs 5 and 5 at the time of transportation.
【００１０】すなわち、前記ヒートブロック４の上面
に、例えばリードフレーム２の四隅及び中央両側に対応
する部位にそれぞれ円柱状の凸状治具５，５を立設もし
くは突設し、図２に示される如くに、リードフレーム２
を前記６個の凸状治具５，５で支承するようになし、も
って、リードフレーム２全体をヒートブロック４から所
定距離Ｇ、例えば０．２ないし０．３ｍｍ程度だけ離隔
させている。That is, on the upper surface of the heat block 4, for example, columnar convex jigs 5 and 5 are erected or protruded at the four corners and the central side of the lead frame 2, respectively, as shown in FIG. The lead frame 2
Is supported by the six convex jigs 5 and 5, so that the entire lead frame 2 is separated from the heat block 4 by a predetermined distance G, for example, about 0.2 to 0.3 mm.
【００１１】なお、凸状治具５，５の形状、個数、位置
等は任意に設定でき、その材料も金属、合成樹脂、セラ
ミック等から適宜選定すればよい。The shape, the number, the position, etc. of the convex jigs 5, 5 can be arbitrarily set, and the material thereof may be appropriately selected from metals, synthetic resins, ceramics and the like.
【００１２】このように、リードフレーム２を凸状治具
５，５でヒートブロック４から若干浮かせるようにした
ことにより、ヒートブロック４に対してアイランド部２
ａ全体が無接触となり、必然的に、従来のもののように
ヒートブロック４に対してリードフレーム２の接触面積
や接触部位は変化しないので、リードフレーム２やヒー
トブロック４に反り、凹凸、変形等が生じていても、ヒ
ートブロック４によりアイランド部２ａ全体が空気を介
して略均等に加熱され、リードフレーム２の各部に温度
差はほとんど生じない。In this way, the lead frame 2 is slightly floated from the heat block 4 by the convex jigs 5 and 5, so that the island portion 2 is formed with respect to the heat block 4.
Since the contact area and contact area of the lead frame 2 do not change with respect to the heat block 4 as in the conventional case, the whole a does not contact, so that the lead frame 2 and the heat block 4 are warped, uneven, deformed, etc. Even if the heat generation occurs, the entire heat of the island portion 2a is substantially evenly heated by the heat block 4, and a temperature difference hardly occurs between the respective portions of the lead frame 2.
【００１３】その結果、アイランド部２ａの温度分布が
均一化され、リードフレーム２のアイランド部２ａに塗
布される銀ペーストと呼ばれる銀入りエポキシ系接着剤
等の熱硬化性接着剤の硬化速度等に差が生じ難くなり、
ダイシェア強度が均一となって安定し、その後に行われ
るワイヤボンディング等に不具合が生じず、製品品質や
歩留りを向上させることができる。As a result, the temperature distribution of the island portion 2a is made uniform, and the curing speed of a thermosetting adhesive such as a silver-containing epoxy adhesive called silver paste applied to the island portion 2a of the lead frame 2 is improved. The difference is less likely to occur,
The die shear strength becomes uniform and stable, and no problems occur in subsequent wire bonding and the like, and product quality and yield can be improved.
【００１４】[0014]
【発明の効果】以上の説明から理解されるように、本発
明に係るダイボンディング装置によれば、リードフレー
ムをヒートブロックから浮かせたので、ヒートブロック
に対してアイランド部全体が無接触となり、リードフレ
ームやヒートブロックに反り、凹凸、変形等が生じてい
ても、ヒートブロックによりアイランド部全体を空気を
介して略均等に加熱でき、そのため、アイランド部の各
部に温度差をほとんど生じないようにできる。As can be understood from the above description, according to the die bonding apparatus of the present invention, since the lead frame is floated from the heat block, the entire island portion is not in contact with the heat block, and the lead block is not contacted. Even if the frame or heat block is warped, uneven, deformed, etc., the heat block can heat the entire island part substantially evenly through the air, so that there can be almost no temperature difference between the parts of the island part. .
【００１５】その結果、アイランド部の温度分布が均一
化され、接着剤の硬化速度等に差が生じ難くなり、ダイ
シェア強度が均一となって安定し、その後に行われるワ
イヤボンディング等に不具合が生じず、製品品質や歩留
りを向上させることができる。As a result, the temperature distribution in the island portion is made uniform, the difference in the curing speed of the adhesive is unlikely to occur, the die shear strength becomes uniform and stable, and problems occur in the wire bonding and the like performed thereafter. Therefore, product quality and yield can be improved.
【図１】本発明に係るダイボンディング装置の一実施例
を示し、（Ａ）は概略平面図、（Ｂ）は概略側面図。FIG. 1 shows an embodiment of a die bonding apparatus according to the present invention, (A) is a schematic plan view, and (B) is a schematic side view.
【図２】図１のＡ部拡大図。FIG. 2 is an enlarged view of a portion A in FIG.
【図３】従来のダイボンディング装置の一例を示し、
（Ａ）は概略平面図、（Ｂ）は概略側面図。FIG. 3 shows an example of a conventional die bonding apparatus,
(A) is a schematic plan view, (B) is a schematic side view.
２ リードフレーム ２ａ アイランド部 ４ ヒートブロック ５ 凸状治具 2 lead frame 2a island part 4 heat block 5 convex jig
Claims (1)
ンド部に熱硬化性接着剤を用いて固定すべく、前記リー
ドフレームをヒートブロック上に置いて加熱するように
したダイボンディング装置において、 前記リードフレームを前記ヒートブロックから浮かせた
ことを特徴とするダイボンディング装置。1. A die bonding apparatus in which the lead frame is placed on a heat block and heated in order to fix the IC pellets to the island portion of the lead frame by using a thermosetting adhesive. A die bonding apparatus, which is floated from the heat block.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7277001A JPH0997808A (en) | 1995-09-29 | 1995-09-29 | Die bonding device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7277001A JPH0997808A (en) | 1995-09-29 | 1995-09-29 | Die bonding device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0997808A true JPH0997808A (en) | 1997-04-08 |
Family
ID=17577387
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7277001A Pending JPH0997808A (en) | 1995-09-29 | 1995-09-29 | Die bonding device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0997808A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7744886B2 (en) | 1996-12-23 | 2010-06-29 | Immunex Corporation | Methods for interfering with rank signaling |
-
1995
- 1995-09-29 JP JP7277001A patent/JPH0997808A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7744886B2 (en) | 1996-12-23 | 2010-06-29 | Immunex Corporation | Methods for interfering with rank signaling |
| US8377690B2 (en) | 1996-12-23 | 2013-02-19 | Immunex Corporation | Cells and methods for producing blocking antibodies to human RANKL |
| US8715683B2 (en) | 1996-12-23 | 2014-05-06 | Immunex Corporation | RANK ligand polypeptides |
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