JP2000067201A - Adhering method for ic module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an adhering method for IC module with which the surface of the module and the surface of a card substrate are pressed while kept parallel by improving a press head and a step between a card and the module is suppressed to a minimum by regulating the amount of push-in. SOLUTION: Concerning this adhering method, an embedding hole (m) for loading an IC module 18 is formed at the prescribed position of a card substrate 15 and after an adhesive agent is applied to the base of this embedding hole, the IC module is fitted into this embedding hole and pressed from the upside by a press head 10. In this case, a frame-shaped projecting part 12 is provided at the central part of this press head and a card press part 11 located at the same height as the frame-shaped projecting part is provided around that projecting part. Then, the IC module 18 is held by the frame-shaped projecting part 12 and pressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pressing step of bonding an IC module to a card substrate, by pressing the module and the card while keeping the module parallel, and by controlling the amount of pressing, the card and the module can be connected to each other. The present invention relates to an IC module bonding method for minimizing a step.

[0002]

2. Description of the Related Art A conventional IC card manufacturing process includes, for example, receiving a card (appearance inspection), counterboring (module burial hole), applying adhesive, mounting a module, and the like.
The process of final bonding (heating / pressing) -final bonding (cooling) -function / appearance inspection is performed, and an IC card is manufactured. That is, assembling of an IC card is mainly performed by forming a buried hole of an IC module by counterboring at a predetermined position of a card base material such as PVC, applying an adhesive to the buried hole, inserting the module, and pressing from above. By doing so, the module and the card base material are permanently bonded to form an IC card.

As the adhesive, a hot-melt adhesive or a cold-setting adhesive is used, and in any case, it is necessary to press the module and the card base in order to improve the adhesive strength.

[0004] On the other hand, an IC card has a card base surface and an IC card.
The level difference from the module surface is determined by the standard, and the value is ± 0.1 mm.

In manufacturing an IC module, an IC
Since the resin shrinks when the resin for sealing the chip is cured, the module has a problem that warpage of about 0.05 mm usually occurs.

[0006]

However, in the above-described conventional module bonding process, although a pressing process for improving the bonding strength between the card base material and the module is performed, the pressure is required to destroy the module. It is limited to a range that does not, and has not yet been forced to warp the module. That is, the card base and the module must be bonded in a state where the shape of the module cannot be made uniform, and it is difficult to make the module horizontal to the surface of the card base because the shape of the module is not uniform. Further, it is difficult to uniformly apply the adhesive to be applied to the bottom surface of the buried hole, which causes uneven thickness of the adhesive. Therefore, if the module is warped and the adhesive cannot be applied uniformly, the pressed module is unlikely to be parallel to the card surface, and may be adhered to the card base while tilted. It has been difficult to eliminate the step between the card surface and the module surface due to uneven adhesive application.

Accordingly, the present invention is to improve the press head to minimize the step between the card and the module by controlling the amount of pressing and pushing while keeping the module surface and the card base surface parallel. It is an object of the present invention to provide a method of bonding an IC module which suppresses the temperature.

[0008]

In order to achieve the above object, according to the first aspect of the present invention, a buried hole for mounting an IC module is formed at a predetermined position on a card base material. After applying adhesive to the bottom, I
In the IC module bonding method in which the C module is fitted and pressed by a press head from above, the press head is located at the same height as the frame-shaped protrusion at the center and at the periphery of the frame-shaped protrusion. A card press section is provided,
This is a method for bonding an IC module, wherein the C module is held by a frame-shaped convex portion and pressed.

According to a second aspect of the present invention, the frame-shaped projection of the press head is located at the center of the IC module, and the size of the frame-shaped projection is 2/100 of the module size. An IC module bonding method using a press head, wherein the IC module is formed as described above.

According to a third aspect of the present invention, there is provided a press head wherein the card press portion of the press head is substantially the same size as the buried hole and is formed in a frame shape around the hole. This is a bonding method of the used IC module.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION According to the method of bonding an IC module to a card substrate according to the present invention, a buried hole for mounting an IC module is formed at a predetermined position on a card substrate, and an adhesive is applied to the bottom of the buried hole. After the application, the IC module is fitted into the burial hole and pressed by a press head from above. In the IC module bonding method, a frame-shaped protrusion is formed at the center of the press head, and a frame-shaped protrusion is formed around the center. Providing a card press unit located at the same height as the unit, and holding and pressing the IC module with a frame-shaped protrusion.
This is a bonding method of the C module.

Further, the frame-shaped convex portion of the press head is
It is located at the center of the IC module, and the size of the frame-shaped convex portion is formed to be 2/1 of the module size, and the card press portion is approximately the same size as the buried hole.
Also, this is an IC module bonding method using a press head formed in a frame shape around the IC module.

The details will be described below with reference to the drawings. FIG.
FIG. 4 is an explanatory view showing a method of bonding an IC module by a press head. FIG. 4A is a cross-sectional view showing a state in which an IC module is mounted in a buried hole of a card base material and is bonded to the card base material from above by a press head. (B) is an explanatory diagram represented by a plane showing a pressed state. 10 is a press head, 11 is a card press part of a press head, 12 is a frame-shaped convex part of a press head,
Reference numeral 15 denotes a card base, 18 denotes an IC module, f denotes a sealing resin of the module, and m denotes an embedded hole of the card base.

According to the present invention, as shown in FIG. 1, a buried hole m for mounting the IC module 18 is formed at a predetermined position on the card base material 15, and an adhesive is applied to the bottom of the buried hole m. (Not shown), the IC module 1
8 is a method of bonding an IC module, which is pressed by a press head 10 from above. The press head 10 has a frame-shaped protrusion 12 in the center and a surface of the frame-shaped protrusion 12 around the periphery. Card press unit 1 located at the same height as
The IC module 18 is bonded and fixed to the buried hole m of the card base material 15 using this press head. That is, as described in the background art, when the sealing resin f for sealing the IC chip is cured, the resin shrinks.
Warpage often occurs, and the card base and the module must be bonded in a state where the module shape cannot be made uniform.Because the module shape is not uniform, the module must be level with the card base surface. Although it is difficult to perform the warping, the warped IC module 18 is held by the frame-shaped convex portion 12 and pressed to correct the warpage of the IC module, and when bonding, the IC module surface And an IC module using a press head formed with a frame-shaped convex portion for minimizing a step on the surface of a card base material and a card press portion.

As shown in FIG. 1B, the frame-shaped projection 12 of the press head 10 is
And a frame-shaped projection 1
2 is formed to be 2/1 of the size of the IC module 18. That is, an IC chip (not shown) is protected by a sealing resin f at a central portion of the IC module, so that the pressing of the press head is not directly applied to this portion, and the IC module is formed by a frame-shaped convex portion. Can be held horizontally.

Further, the card press section 11 has a buried hole m
And is formed in a frame shape around the buried hole m. Therefore, this press head 10
With the use of the IC module, the surface of the IC module and the surface of the card substrate can be kept horizontal, and the amount of the IC module to be embedded can be properly adjusted by the card press section, so that the IC module and the card can be mounted without breaking the module. This is an IC module bonding method capable of minimizing a step with a substrate surface.

[0017]

As described above, the present invention has the following effects. That is, by providing the press head with a frame-shaped convex portion, even if the IC module has a warp, the warp is absorbed by the convex portion of the press head, and when the IC module is bonded, the press head holds the module horizontally, And it can be stably held. Also, the center of the warpage in the thickness direction of the IC module is held by the press head by setting the frame size of the frame-shaped projection to half the size of the IC module and matching the center of the frame with the center of the IC module. . Furthermore, when pressing the IC module, the height of the center of the warp and the height of the surface of the card base material are made equal by making the height of the card press part and the height of the frame-shaped convex part the same, and the module is positioned with respect to the card base material. The unevenness can be kept uniform. In other words, the warped IC module can be bonded horizontally and in a state where the unevenness of the module is even with respect to the surface of the card base material,
Various effects such as the step between the card base material and the module can be minimized.

[Brief description of the drawings]

FIG. 1 shows a method of bonding an IC module by a press head according to an embodiment of the present invention. FIG. 1 (A) shows a method of mounting an IC module in a buried hole of a card base material and pressing the head from above to the card base material with a press head. It is explanatory drawing represented by the cross section which shows the state which adhere | attached, (B) is explanatory drawing represented by the plane which shows a pressed state.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 ... Press head 11 ... Card press part 12 ... Frame-shaped convex part 15 ... Card base material 18 ... IC module f ... Encapsulation resin m ... Buried hole

Claims (3)

[Claims] A buried hole for mounting an IC module is formed at a predetermined position on a card base material, an adhesive is applied to the bottom of the buried hole, the IC module is fitted into the buried hole, and a pressing is performed from above. In a method for bonding an IC module by pressing with a head, a frame-shaped convex portion is provided at a central portion of the press head, and a card press portion located at the same height as the frame-shaped convex portion around the central portion, A method of bonding an IC module, wherein the module is held by a frame-shaped convex portion and pressed. 2. The press head according to claim 1, wherein the frame-shaped projection is located at the center of the IC module, and the size of the frame-shaped projection is 2/1 of the module size. The method for bonding an IC module according to claim 1. 3. The IC module bonding method according to claim 1, wherein the card press portion of the press head has substantially the same size as the buried hole and is formed in a frame shape around the hole.