JPH098440A - Electronic component connecting device and manufacture thereof - Google Patents

Abstract

PURPOSE: To reduce the coating thickness of an anisotropic conductive film and also to contrive to improve a sealing of the package of an electronic component. CONSTITUTION: Electrode patterns 13a and 13b of a wiring board 11 are arranged on the rear of the board 11. A first aperture 14, which is larger than a pixel area of a CCD element 15 and is smaller than the external shape of the element 15, is formed in an insulating base material 12. Second apertures 17a and 17b are formed in parts, which oppose to electrodes 16a and 16b of the element 15, on the base meterial 12. An optical glass 18 is positioned under the aperture 14 and is attached to the surface on one side of the surfaces of the base material 12. The light-receiving surface of the element 15 is positioned on the aperture 14 and the element 15 is arranged on the other surface of the base material 12. Connection bumps (projections) 19 are respectively formed on the electrodes of the element 15 and these bumps 19 are inserted in the apertures 17a and 17b and come into contact with the patterns 13a and 13b of the board 11, whereby the element 15 can be electrically connected with the board 11.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connecting device for electronic parts housed in a small package and a method for manufacturing the same.

[0002]

2. Description of the Related Art Electronic components in which electric elements are housed in a small package are widely used for industrial purposes. Above all, a photoelectric conversion element using a CCD element (solid-state image pickup element) has a wide range of applications such as a camera. Such a CCD device is particularly required to be miniaturized for industrial use, and each company is trying to surpass the development of a light, thin, short and miniaturized device. Regarding the mounting of this photoelectric conversion element, Japanese Patent Application No. 6-
No. 111534, which will be described below with reference to FIGS.
This will be described with reference to FIG.

FIG. 8 is an exploded perspective view of a package, which comprises a CCD element 1, a flexible substrate 2 and an optical glass 3. When these are connected by the process described later, the package of FIG. 9 is completed.

Next, the manufacturing process of the package will be described with reference to FIGS. First, FIG. 10 (a),
In (b), the optical glass 3 and the wiring board 2 are bonded.
The wiring board 2 includes a flexible insulating base material 2a and a plurality of electrode patterns 2b fixed to the flexible insulating base material 2a.
An opening 2c is formed in the center of the. An adhesive agent for adhering the optical glass 3 and the flexible substrate 2 is applied to the back surface of the insulating base material 2a using, for example, an ultraviolet curable adhesive agent.

Next, in FIG. 10C, an anisotropic conductive film 4 is formed around the electrode pattern 2b. In FIG. 10D, the CCD element 1 is electrically connected to the electrode pattern 2b from above the anisotropic conductive film 4 by thermocompression bonding.

FIG. 11 is a sectional view showing the manufacturing process of FIG. At this time, the inside of the package corresponding to the pixel of the CCD element 1 is the opening 2c, and the CCD
The structure is such that the condensing effect of the microlens 5 formed on the element 1 is utilized.

FIG. 12 (a) is a plan view of the completed package, FIG. 12 (b) is a sectional view taken along line AA 'of FIG. 12 (a), and FIG. 12 (c) is a line of FIG. 12 (a). 3 is a cross-sectional view taken along the line BB ′.

FIG. 12 (b) is a cross section having a hollow portion 6,
(C) shows the cross-sectional direction in which the electrode patterns b2 are arranged. In (c) of FIG. 12, the anisotropic conductive film 4 is completely filled between the CCD element 1 and the insulating base material 2a, and the entire outer periphery of the CCD element 1 is shielded from the outside air, that is, the sealing structure is formed. Has been planned.

With the structure described above, a microminiature CCD
The package can be obtained by a simple manufacturing process. However, the conventional method has a problem to be solved. It is a method of applying the anisotropic conductive film 4 and a method of sealing. That is, as shown in FIG. 11C, when the anisotropic conductive film 4 is dispensed and thermocompression bonded, the anisotropic conductive film 4 is C
It enters the pixel area of the CD element 1 or the electrode pattern b
There is a problem that it flows out through 2. As shown in FIG. 11C, if it enters the pixel area of the CCD element 1, pixel failure occurs, and if it flows out of the package along the electrode pattern b2, the package sealing structure cannot be obtained.

The coating thickness of the anisotropic conductive film 4 is shown in FIG.
Since the sealing structure is assumed as shown in (c), a coating thickness of about 60 μm to 90 μm was required to absorb the maximum gap G1 (about 55 μm) between the insulating base material 2a and the CCD element 1. Further, in order to narrow the gap, dummy leads 7 are formed with an electrode pattern. Even so, it is difficult to control the coating thickness of the anisotropic conductive film 4, and defective bleeding or defective sealing occurs, resulting in a decrease in yield. Therefore, CCD
A means for narrowing the gap between the element 1 and the electrode pattern 2b and reducing the coating thickness of the anisotropic conductive film 4 is required.

Further, a means for forming a dam on the CCD element 1 or the wiring board 2 for stopping the flow of the anisotropic conductive film 4 is also applied by the applicant of the present invention to Japanese Patent Application No. 6-11153.
Although a No. 4 type is also conceivable, it has a drawback that it is difficult to realize due to the fine dam structure, and the manufacturing process is complicated because it is formed in a separate step.

[0012]

In the above-mentioned conventional connecting device for electronic parts and the manufacturing method thereof, a means for reducing the coating thickness of the anisotropic conductive film has been proposed, but in reality, it is a fine dam structure. Therefore, there is a problem that the feasibility is difficult, and the manufacturing process is complicated because it is formed in another step. The present invention reduces the coating thickness of the anisotropic conductive film and improves the sealing of the package.

[0013]

In order to solve the above problems, the present invention provides an electronic device including an element forming portion and an electrode formed around a package of the element forming portion and electrically connected to the element forming portion. A component, an insulating member, and one opening bonded to the insulating member at a position facing the element forming portion of the electronic component, and a second opening at a position facing the electrode of the electronic component. It is characterized by comprising a wiring board formed by fixing an electrode pattern on the formed insulating base material, and a connecting means for electrically connecting the electrode of the electronic component and the electrode pattern of the wiring board.

In advance, a first opening is provided at a position facing the element forming portion of the electronic component, and a second opening is provided at a position facing the electrode of the electronic component on the insulating base material.
A first step of forming a wiring board by fixing an electrode pattern to the insulating base material, a second step of adhering the wiring board to an insulating member, and connecting the electronic component and the wiring board And a third step.

[0015]

By the above means, the electrode pattern and the electronic component are connected to each other through the second opening portion by using the bump or the anisotropic conductive film. Therefore, the bump and the anisotropic conductive film have a thickness corresponding to the thickness of the wiring substrate having the second opening formed therein, so that the dimensional variation due to the product can be suppressed and the gap between the first and second openings is not provided. Since the insulating base material is located at the position, it is possible to prevent the bumps and the anisotropic conductive film from flowing out to the element forming portion of the electronic component.

[0016]

Embodiments of the present invention will now be described in detail with reference to the drawings. FIG. 1 is a perspective view showing a mounting structure for explaining an embodiment of the present invention. In FIG. 1, first, as the wiring board 11, polyimide having a thickness of about 75 μm is used as the insulating base material 12, and the width is 2
Electrode pattern 13a having a thickness of about 00 μm and a thickness of about 25 μm,
13b formed TAB tape (Tape Automated Bonding)
It was used. In this case, the wiring board 11 is a flexible board, but may be a rigid board such as an inflexible glass epoxy board. The electrode pattern 13a of the wiring board 11,
13b is arranged on the back surface of the wiring board 11. Also,
The insulating substrate 12 has a first opening 1 that is larger than the pixel area of the CCD element and smaller than the outer shape of the CCD element.
4 is formed. The first opening 14 is the CCD element 1.
It is optimal in terms of preventing bleeding if it is provided on the outer side of the portion formed of an organic resin such as the microlens and the color filter of 5.

Further, on the insulating base material 12, other than the first opening portion 14, a portion opposed to each of the electrodes 16a and 16b of the CCD element 15 in which a plurality of electrodes are linearly arranged so as to be dually arranged is provided. , The second opening 1 having a hole diameter of about 150 μm
7a and 17b are formed. An optical glass 18 having a thickness of 2 mm and an outer size of about 6 mm square is attached to one surface of the insulating base material 12 at the first opening portion 14. On the other surface of the insulating base material 12, the light receiving surface of the CCD element 15 is arranged so as to be located in the first opening portion 14. Bumps (projections) 19 for connection having a diameter of 100 μm and a height of about 70 μm are formed on the electrodes of the CCD element 15, and the bumps 19 are inserted into the second openings 17a and 17b to form wiring. By making contact with the electrode patterns 13a and 13b of the substrate 11, electrical connection is achieved. The bumps 19 can be formed using a gold wire by a modification of the wire bonding method. The height of the bump 19 needs to be higher than the height of the second openings 17a and 17b, that is, the thickness of the insulating base material 12. The tip shape of the bump 19 may be a flat shape or a protruding shape which is a wire tear-off type in order to increase the height of the bump 19. The diameter of the second openings 17a and 17b needs to be larger than the outermost shape of the bump 19.

Also, when the bumps 19 are deformed under pressure during thermocompression bonding of the CCD element 15 and the surface of the CCD element 15 is pressed against the surface of the insulating base material 12 while making the entire height of the bumps 19 uniform, the CCD element 15 The gap between 15 and the wiring board 11 is minimized, and the sealing effect is enhanced. Further, the connectivity of the bumps 19 themselves can be improved by deforming the shape of the bumps 19 themselves in the second openings 17a, 17b and filling the second openings 17a, 17b during thermocompression bonding. As the material of the bumps 19, it is suitable to use a general-purpose gold wire, a solder bump having low hardness and easy deformation, or the like.

Next, the manufacturing process of the embodiment shown in FIG. 1 will be described with reference to FIG. First, the optical glass 18 is bonded to the wiring board 11 in the steps of (a) and (b) of FIG. The wiring board 11 includes an insulating base material 12, electrode patterns 13a and 13b having a width of 200 μm, a first opening 14 of 4 × 4 mm and a second opening 17 having a hole diameter of 150 μm.
It consists of a and 17b. The adhesive is applied to the back surface of the insulating substrate 12 by using, for example, an ultraviolet curable adhesive.

At this time, in order to increase the adhesive force, a method of etching the wiring board 11 and the electrode patterns 13a and 13b to roughen the surface is effective. In addition, adhesive or insulating base material 1
2 and the electrode patterns 13a and 13b may be blackened to prevent reflection.

Next, in FIG. 2C, an anisotropic conductive film 20 is formed around the electrode patterns 13a and 13b. 2D, the bumps 19 formed on the electrodes of the CCD element 15 are inserted into the second openings 17a and 17b from above the anisotropic conductive film 20 and are formed on the back surface side of the wiring board 11. The electrode patterns 13a and 13b which are formed have, for example, 15
It is electrically connected by thermocompression bonding at 0 ° C. for about 60 to 200 seconds.

At this time, in the lower part of the first opening 14,
The electrode patterns 13a and 13b are provided with receivers, and the lower holes are closed. As the anisotropic conductive film 20, for example, gold particles having a particle size of about 5 μm dispersed in an epoxy resin may be used. Although the electrodes of the CCD element 15 are in two directions, they may be arranged on one side in one direction.

3 and 4 are sectional views showing the manufacturing process of FIG. FIG. 3 is a front view of FIG.
As shown in (b) showing the AA ′ cross section of (a) of
A microlens 32 is formed in the CCD element 15 facing the hollow portion 31 formed between the pixel of the CCD element 15 and the optical glass 18, and has a structure in which a condensing effect is utilized. FIG. 3C shows the BB ′ cross section direction in which the electrode patterns 13a and 13b are arranged. In FIG. 3C, the anisotropic conductive film 20 is completely filled between the CCD element 15 and the wiring board 11, and the outer periphery of the CCD element 15 is completely shielded from the outside air, that is, a sealing structure is achieved. ing. At this time,
The anisotropic conductive film 20 is applied on the premise of a sealing structure.
The gap G2 between the insulating substrate 12 and the CCD 15 is 5 to 1
It can be reduced to about 0 μm, which is about 1/5 of the conventional value.

Therefore, a coating amount of about 30 to 50 μm is sufficient. In FIG. 4, the anisotropic conductive film 20
After being applied to the second openings 17a and 17b (see FIG.
(B)) can be easily flowed and filled in the second openings 17a, 17b as the viscosity of the wiring board 11 is reduced during heating. In addition, the electrode patterns 13a, 1 having high thermal conductivity
3b can receive the anisotropic conductive film 20 below the holes of the second openings 17a and 17b, and can prevent the anisotropic conductive film 20 from flowing out of the package. Further, since the absolute amount of coating is small, the possibility that the anisotropic conductive film 20 will exude into the pixel area of the CCD element 15 is reduced. Therefore, it is possible to easily realize the microminiature CCD package which does not exude and has a good sealing property.

With the structure described above, the anisotropic conductive film 2 is formed.
It is possible to obtain a microminiature CCD package that does not have pixel defects or sealing defects of the CCD element 15 due to bleeding or flowing of 0 by a simple manufacturing process.

In this embodiment, the anisotropic conductive film 20 is used as the means for connecting the CCD element 15 and the wiring substrate 11, but the invention is not limited to this, and an insulating adhesive may be used. At this time, the bumps 19 and the electrode patterns 13a and 13b are electrically connected by, for example, mechanical contact, and the adhesive serves as a reinforcing means. Further, the bumps and the electrode patterns 13a and 13b may be solid-phase diffusion-bonded to each other for a short time. At this time, the sealing material is applied to the outer peripheral portion of the CCD element 15 after connection, thereby achieving airtight sealing. In addition, a conductive adhesive such as a silver paste, which is composed of conductive particles and an adhesive, is selectively applied to the opening to obtain a desired connection, and after heating and curing, sealing and reinforcement are similarly performed with a sealing agent. May be.

Furthermore, the bonding surface between the wiring board 11 and the optical glass 18 has the electrode patterns 13a and 13b and the insulating base material 1
2 and the optical glass 18. It is desirable that the adhesive, the electrode patterns 13a and 13b, or the insulating base material 12 be blackened so that the adhesive surface does not have a problem such as reflection when the image is taken in.

The optical glass 18 facing the light receiving portion of the CCD element 15 has a convex structure so that the total thickness of the optical glass 18 can be reduced and characteristics such as a diffraction grating pattern can be added.

FIG. 5 is an exploded perspective view for explaining another embodiment of the present invention. In the embodiment of FIG. 1, the second opening for connection is formed for each electrode of the CCD element 15, but in this embodiment, the second opening communicating with the frame is formed.
The opening 51 is defined as. Accordingly, by applying the anisotropic conductive paste in the second opening 51, the application surface is flattened and the application is facilitated, and an additional effect such that the application amount is easily held in the opening is obtained. Can be expected.

FIGS. 6 and 7 are front views for explaining second and third other embodiments of the present invention, respectively.
A countermeasure against dew condensation is taken by providing a communicating portion in a part of the wiring board 11 or the anisotropic conductive film 20.

That is, as in the embodiment shown in FIG. 6, a part of the insulating base material 12 of the wiring board 11 is connected to a communicating portion 61, and as in the embodiment shown in FIG. 7, electrode patterns 13a, 13 essential for connection are formed.
The anisotropic conductive films 20a and 20b are formed only on the b portion.

In each of these embodiments, the wiring board 11 and the CCD
The environment between the elements 15 is the same as the outside air, and dew condensation does not occur in high humidity. Further, in order to prevent the entry of dust and the like, the open portion can be sealed with a resin such as silicon which allows moisture to flow in and out quickly.

The present invention is not limited to the above-mentioned embodiment, and for example, the optical glass 18 is used, but the invention is not limited to the ultraviolet erasable memory in which the light transmitting property is essential on the element portion formed in the package. This invention is also effective. Further, the electric element can be applied to other elements requiring a hollow structure, for example, a SAW device which is a surface acoustic wave element or a crystal oscillator, and further, a special package such as an LED or an optical pickup.

[0034]

As described above, according to the connecting device for electronic parts and the method for manufacturing the same of the present invention, it is possible to improve the characteristics and the hermetic sealing of a microminiature electronic parts package having a hollow structure. It can be obtained by a simple manufacturing process.

[Brief description of drawings]

FIG. 1 is a perspective view for explaining an embodiment of the present invention.

FIG. 2 is an exploded view showing the manufacturing process of the present invention.

3 (a) is a front view of FIG. 1, and FIGS. 3 (b) and 3 (c) are views for explaining the structure of FIG.
It is a sectional view of BB '.

FIG. 4 is an explanatory diagram for explaining a manufacturing process when an anisotropic conductive film is injected into the second opening of FIG. 1 and used as a connecting means.

FIG. 5 is a perspective view for explaining another embodiment of the present invention.

FIG. 6 is a front view for explaining a second another embodiment of the present invention.

FIG. 7 is a front view for explaining a third embodiment of the present invention.

FIG. 8 is an exploded perspective view for explaining connection of conventional electronic components.

9 is a perspective view showing a state where FIG. 8 is assembled.

FIG. 10 is an exploded view for explaining the manufacturing process in FIG.

11 is a sectional view showing the manufacturing process of FIG. 10 in a sectional structure.

12A is a plan view of a completed package for explaining the configuration of FIG. 9, and FIG. 12B is a line A- of FIG.
A'is a sectional view, and (c) is a sectional view taken along the line BB 'in (a).

[Explanation of symbols]

11 ... Wiring board, 12 ... Insulating base material, 13a, 13b ... Electrode pattern, 14 ... First opening, 15 ... CCD element,
16a, 16b ... Electrodes, 17a, 17b, 51 ... Second openings, 18 ... Optical glass, 19 ... Bumps, 20, 20
a, 20b ... Anisotropic conductive film, 31 ... Hollow part, 32 ... Microlens, 61 ... Communication part.

Claims (19)

[Claims] 1. An electronic component including an element forming portion and an electrode formed around a package of the element forming portion and electrically connected to the element forming portion, an insulating member, and an element forming portion of the electronic component. A wiring board in which an electrode pattern is fixed on an insulating base material in which a first opening portion is formed at a facing position and a second opening portion is formed at a position facing an electrode of the electronic component, and which is bonded to the insulating member. And a connecting means for electrically connecting the electrode of the electronic component and the electrode pattern of the wiring board. 2. The connection device for an electronic component according to claim 1, wherein the first opening of the wiring board is larger than an element forming portion of the electronic component and smaller than an outer shape of the electronic component. 3. The wiring board and the electronic component are electrically connected to each other through an electrode pattern of the wiring board or a conductive protrusion formed on an electrode of the electronic component. 1. An electronic component connecting device according to 1. 4. The electronic component connecting device according to claim 1, wherein the wiring board and the electronic component are connected by an anisotropic conductive film. 5. The electronic component connecting device according to claim 4, wherein the anisotropic conductive film is formed so as to surround the element formation surface of the electronic component in a ring shape. 6. The electronic component connecting device according to claim 5, wherein one of the wiring board and the anisotropic conductive film is provided with an opening portion. 7. The electronic component connecting device according to claim 1, wherein the wiring substrate is a flexible substrate. 8. The electronic component connecting device according to claim 1, wherein the wiring board is formed by mounting a plurality of electronic components. 9. The electronic component connecting device according to claim 1, wherein the wiring board has a bent portion, and the insulating base material of the bent portion is removed. 10. The connection device for an electronic component according to claim 1, wherein the wiring board and the electronic component are connected by a conductive adhesive. 11. The electronic component connecting device according to claim 1, wherein the wiring board and the electronic component are connected by mechanical contact using a conductive protrusion formed on an electrode of the electronic component. 12. The electronic component connecting device according to claim 1, wherein the electronic component is a photoelectric conversion element. 13. The reinforcing resin is formed on the outer side of the electrode of the electronic component.
The electronic device connection device according to any one of 0 and 11. 14. An insulating base material is provided with a first opening at a position facing an element forming portion of an electronic component and a second opening at a position facing an electrode of the electronic component. A first step of forming a wiring board by fixing an electrode pattern to a base material, a second step of adhering the wiring board to an insulating member, and a third step of connecting the electronic component and the wiring board A method of manufacturing an electronic component, comprising: 15. The method according to claim 15, further comprising a step of forming a conductive protrusion on either the electrode pad of the electronic component or the electrode pattern of the wiring board before the third step. Item 15. A method of manufacturing an electronic component according to Item 14. 16. The conductive projection is formed at least as a third pre-step, being smaller than a second opening of the wiring board and higher than a base material thickness of the wiring board. The method for manufacturing an electronic component according to claim 15. 17. A step of forming an anisotropic conductive film on one of an electrode pad of an electronic component or an electrode pattern of the wiring board is added after the second step. The method for manufacturing an electronic component according to claim 14. 18. The method of manufacturing an electronic component according to claim 17, wherein the anisotropic conductive film is in the form of a paste, and a step of applying it on the electrode pattern of the wiring board is added at least. 19. The method of manufacturing an electronic component according to claim 14, further comprising a fourth step of forming a reinforcing resin on the outer side of the electrode of the electronic component after the third step.