JPH0957600A - Sample thinning method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To simultaneously perform a sample thinning and recessing by replacing and taking over the dimpling tool to a working position by integrally turning the polishing tool and the dimpling tool after completing polishing work. SOLUTION: A batten 9 is formed by freely positioning for rotating by 180 deg. about an intermediate rotation vertical shaft 20 or the sliding and rotating vertical shaft 12 so that, in the case of polishing work, the center of a sample stuck jig holding hole 15 loaded with a sample stuck jig 4 is made to face to the axis of a rotary disc 2 and in dimpling work, the center of a polishing wheel 1 is made to face to the axis of the rotary disc 2. After the batten 9 is polished by a polishing film sheet 8, it is positioned by horizontally turning to 180 deg., the surface of a sample Si substrate transcribes the shape of an osculating circle of the polishing wheel 1, and both of them are rotated with each other so that the sample is formed into a spherical recessed face.

Description

Detailed Description of the Invention

[0001]

INDUSTRIAL APPLICABILITY The present invention makes it possible to make a thin piece sample of a transmission electron, and at the same time, to make the central part of the sample concave, and to cool and heat the thin piece sample. The present invention relates to a method and an apparatus for thinning a sample.

[0002]

2. Description of the Prior Art In order to observe the appearance of defects in a sample in a transmission electron microscope, a commercially available 200
In the case of a semiconductor material such as Si, it is 50
In order to observe an image at an atomic level of about 0 nm or less, more specifically, at a thickness of about 50 nm, which is 1/10 or less of this thickness, a clear image cannot be observed. Even with a special ultra-high voltage electron microscope (1000 KV), 1 μm
It is necessary to thin the sample to a certain thickness.

FIG. 1 shows a conventional process for heteroepitaxially growing a heterogeneous semiconductor on a Si substrate.
An explanation will be given based on 6. As shown in FIG. 16 (a),
First, the observation sample portion of the observation sample α is cut into a 5 mm square, and this is pasted with an adhesive β [FIG. 16 (b)]. Further, a reinforcing plate γ is attached [16 (c)], and then this is 600 μm. To a thickness of about 100 μm, and a thin film is cut into pieces with a polishing machine by sequentially using polishing liquids having different polishing abrasive grains, and the pieces are cut into mirror-like pieces [16].
(B)].

Then, punching is performed according to the shape of the sample holder of the electron microscope [16 (e)], and further, the center portion is depleted by the polishing wheel 1 of the rotary tool, and 20
This sample δ is made concave to about μm [16 (f)] A hole ε is made in the center by an ion milling device, and the thin section is used as an electron microscope observation sample δ [FIG.
(G)].

[0005]

As is clear from the above steps, the thinning process is divided into cutting, cutting, polishing, demping, ion milling, and thinning. In addition, when a soft material such as a living body is used, it is necessary to embed and fix the material at the same time as dyeing when using the above process. Therefore, the work is complicated due to multiple processes,
Prepare processing equipment for each work process and carefully sample α and δ.
Was required to be set or taken out and required extremely high skill. In particular, precision processing is required in the polishing step and the depressing step, and in the polishing processing, the scattering of the polishing liquid lowers the processing efficiency and the working environment is easily contaminated, and often causes the sample to be damaged during handling or processing.

Here, the main objects to be solved by the present invention are as follows. A first object of the present invention is to provide a sample thinning method and apparatus for performing thinning in a simple and quick manner, shortening the steps and cleaning.

A second object of the present invention is to provide a sample thinning method and apparatus in which a polishing step, which is a thinning step after cutting out a sample, and a demping step are performed by the same apparatus.

A third object of the present invention is to provide a sample thinning method and apparatus for carrying out the second object in the cooling and hardening state of the sample.

A fourth object of the present invention is to provide a sample thinning method and apparatus for carrying out the third object, which comprises polishing in a condition below freezing and polishing in an ice state.

A fifth object of the present invention is to provide a sample thinning method and apparatus for heating the sample in the polishing step to promote the reaction of the step and accelerate the step in carrying out the second object. It is what

[0011] Other objects of the present invention are as follows:
In particular, it will be obvious from the description of the appended claims.

[0012]

A first feature of the method of the present invention is that when a sample is sliced by cutting, processing, polishing, dempling and ion milling to thin the sample, a polishing tool and a dempling tool are provided. Is attached to one device at a position corresponding to 180 ° and one machining work position is provided.
After the polishing work is completed at the processing work position, the polishing work tool and the dempling work tool are integrally rotated by 180 ° to replace the dempling work tool with the working work position and bring the dempling work. By continuing, there is a sample thinning method in which the polishing process and the templating process are performed by one device.

A second feature of the method of the present invention resides in a sample thinning method in which the polishing process and the dempling process in the first feature of the method of the present invention are performed by cooling and hardening the sample.

The third feature of the method of the present invention resides in a method for thinning a sample, in which the polishing process according to the first or second feature of the method of the present invention is performed by ice-like polishing under a temperature below freezing point.

The fourth feature of the method of the present invention is that the polishing process according to the first, second or third feature of the method of the present invention heats the sample to accelerate the reaction of the sample. It is in.

A fifth characteristic of the method of the present invention is that the polishing and depressing processing in the first, second, third or fourth characteristic of the method of the present invention is performed at a temperature below -20 ° C to + 40 ° C. It is a method for thinning a sample by performing hot or warm working.

A sixth feature of the method of the present invention is that the polishing process in the first, second, third, fourth or fifth feature of the method of the present invention is performed while the sample is horizontally swinging and swinging. There is another method for thinning a sample.

The seventh feature of the method of the present invention is that the dempling process according to the first, second, third, fourth, fifth or sixth feature of the method of the present invention causes the sample to be rotated and horizontally rocked. This is a method for thinning a sample by performing amplitude.

An eighth feature of the method of the present invention is that the sample is fixed by the dempling process according to the first, second, third, fourth, fifth, sixth or seventh feature of the method of the present invention, It is a method for thinning a sample, which is performed by horizontally rotating and horizontally swinging a dempling tool.

The ninth feature of the method of the present invention resides in the method for thinning a sample in which the swing width of the sixth, seventh or eighth feature of the method of the present invention is variable and variable.

The first feature of the device of the present invention is that the drive torque transmission gear train mechanism, the thinning processing mechanism for polishing the sample and measuring the demp ring, and the torque of the drive torque transmission gear train mechanism for the thin piece. It consists of a transmission rotary shaft mechanism that transmits it to the chemical processing mechanism as a processing rotational force or rotational oscillating force.The transmission rotational shaft mechanism rotates a rotary disk for processing work that holds a polishing tool or a sample bonding jig to which a sample is bonded. A vertical axis of rotation of the disk, an intermediate vertical axis of rotation that oscillates the thinning processing mechanism while relaying the rotational force of the demping tool, and a vertical axis of rotation that oscillates the thinning processing mechanism. And a sample thinning device.

A second feature of the device of the present invention is that the thinning processing mechanism in the first feature of the device of the present invention is slidable by penetrating the upper part of the oscillating rotation vertical axis orthogonal to the intermediate part. The lever plate that is pivotally attached, the sample bonding jig holding hole that is provided at one end of the lever plate and faces the center axis of the rotating disc, and the screw rod that is erected near one side of the intermediate part of the lever plate. A dial that penetrates the tip of an arm that moves up and down as a result of rotation of the matching fastening nut, and presses the upper surface of the sample bonding jig loaded in the sample bonding jig holding hole with a plunger to display the pressing force. A sample thinning device is provided with a gauge and a depressing tool that is rotatably attached to the other end of the lever plate and is connected to an intermediate rotation axis and a pulley / belt transmission mechanism so that torque can be transmitted.

A third feature of the device of the present invention is that the vertical axis of the intermediate rotation in the first or second feature of the device of the present invention is such that the lower end driven eccentric cam is fixed to the upper end and a swing amplitude adjusting collar is fixed. This is a sample thinning device in which the axial center of the dynamic rotational axis is rotatably pierced through, the driving pulley and the swing amplitude adjusting collar are fixed to the upper end of the penetrating shaft, and the driven eccentric cam is fixed in the middle. .

A fourth feature of the device of the present invention is that the drive torque transmission gear train mechanism according to the first, second or third feature of the device of the present invention is a driven eccentric cam of which the torque output is a oscillating rotation vertical axis. The sample thinning device is provided with a clutch mechanism for selectively transmitting the change to any of the driven eccentric cams on the vertical axis of the intermediate rotation.

A fifth feature of the device of the present invention is that the drive torque transmitting gear train mechanism according to the first, second, third or fourth feature of the device of the present invention relays with the motor shaft and the disc rotation vertical axis. A disk rotary gear fixed to the interlocking shaft and the final interlocking shaft, respectively, is fixed to the disk rotation vertical axis, and is fixed to the motor gear fixed to the motor shaft. A relay gear that circumscribes externally with the rotating gear is fixed, and a switching gear that vertically slides the spline section by a clutch mechanism is attached.The final interlocking shaft has an external contact that corresponds to the driven eccentric cam on the vertical axis of the swing rotation. The output driving eccentric cam is fixedly attached, and the output driving eccentric cam corresponding to the driven eccentric cam on the longitudinal axis of the intermediate rotation is rotatably attached to the output eccentric cam, and one of a pair of selection gears which selectively engages the switching gear with the external contact at the lower portion. Stick to the other In the sample thinned device comprising mounted for idly to rotate said idle freely output driving the eccentric cam and integrally.

A sixth feature of the device of the present invention is that the lever in the second, third, fourth or fifth feature of the device of the present invention is
During polishing, the center of the sample bonding jig holding hole loaded with the sample bonding jig should face the center axis of the rotating disk, and during demping, the center of the depressing tool should face the center axis of the rotating disk. This is a sample thinning device which is formed so that it can be pivotally positioned by 180 ° around a rotation vertical axis or a swing rotation vertical axis.

A seventh feature of the device of the present invention is that the thinning processing mechanism in the second, third, fourth, fifth or sixth feature of the device of the present invention adheres the sample of the lever plate during the demping process. A sample thinning device in which a base plate having a recess for fitting a receiving block for receiving a ball of a rotary ball mounting jig loaded in a jig holding hole is provided on a housing containing a drive torque transmission gear train mechanism. It is in.

The eighth feature of the device of the present invention is that the sample bonding jig holding hole in the second, third, fourth, fifth or sixth feature of the device of the present invention is loaded with the sample bonding jig or It is a sample thinning device in which a ball bearing is internally fitted so that a rotating ball mounting jig can be held in rotation.

The ninth feature of the device of the present invention is the first, second, third, fourth, fifth, sixth, seventh or eighth of the device of the present invention.
The rotating disk in the above feature is a sample thinning device in which a sample bonding jig fitting hole is recessed in the center of the upper surface.

A tenth feature of the device of the present invention is that the rotating disk in the ninth feature of the device of the present invention has an annular groove for accumulating an aqueous solution of abrasive grains on the upper surface surrounding the outer periphery of the fitting hole of the sample bonding jig. This is a sample thinning device that is formed by digging and rimging ribs along the entire length of the outer peripheral edge of the upper surface.

An eleventh feature of the device of the present invention is that the polishing tool according to the first, second, third, fourth, fifth, sixth, seventh or eighth feature of the device of the present invention is a polishing circle. This is a sample thinning device in which an annular groove for accumulating an aqueous solution of abrasive grains is dug in an upper surface of a plate surrounding a central portion and ribs are trimmed along the entire length of the outer peripheral edge of the upper surface.

The twelfth feature of the device of the present invention is that the rotating disk in the ninth or tenth feature of the device of the present invention forms and surrounds the lower inner surface of the fitting hole of the sample bonding jig to form a Peltier effect element. While being buried and connected to the Peltier effect element by a lead wire with a sliding ring provided around the entire circumference of the rotating disk, a sliding brush that is always in slidable contact with the sliding ring is provided on the rotating disk. It is in a sample thinning device that is installed near one side.

The thirteenth feature of the device of the present invention resides in the second, third, fourth, fifth, sixth, seventh, ninth, tenth, eleventh or twelfth feature of the device of the present invention. The lever plate is a sample thinning device in which a Peltier effect element is embedded by surrounding and forming an intermediate inner surface of the sample bonding jig holding hole, and a lead wire is connected and drawn out to the Peltier effect element.

The fourteenth feature of the device of the present invention is that the first, second, third, fourth, fifth, sixth, seventh, eighth, ninth, tenth and eleventh parts of the device of the present invention. The 12th or 13th characteristic dempling tool is any one of a polishing wheel, a pen-type polishing tool, and a ball fixed to the flange end at the lower end of the rotary shaft.

A fifteenth feature of the device of the present invention is that the polishing wheel according to the fourteenth feature of the device of the present invention is rotatably penetrated by fixing a driven pulley at one end to a bifurcated bracket projecting at the other end of the lever plate. The sample thinning device is fixed to the wheel shaft between the forked brackets.

A sixteenth feature of the device of the present invention is that the pen type polishing tool according to the fourteenth feature of the device of the present invention has a pen shaft having a driven pulley fixed to the upper portion thereof rotatably supported at its tip end. A thin sample piece in which the base end side of the support plate is connected and connected to the notch on one side of the lever plate, and the belt is endlessly stretched between the driven pulley and the drive pulley of the intermediate rotation vertical axis to transmit torque. It is in the computerization device.

The seventeenth feature of the device of the present invention is that the ball fixed to the flange end at the lower end of the rotary shaft in the fourteenth feature of the device of the present invention stands upright at one end of the lever plate and extends through the vertical guide groove. The existing movable guide plate and the protractor-type fixed guide arc plate which is upright on the housing so as to be capable of overlapping sliding contact therewith and extends through the semi-arc guide groove. Through the rear end, and the rear end of the bearing block fixed to the front end of the slide rod that elastically biases the projection habit at the rear end and the driven shaft fixed to the upper end of the driven shaft. Each compression coil spring is wound around the rotary shaft between the upper end of the bearing block and the spring receiving collar just below the driven pulley, and on the other hand, on the upper end of the stand column upright on the other end of the lever plate. Basis A cantilever is rotatably and cantilevered so that it always has a neutral position. The backup pulley is fixed to the pulley shaft that freely stands up at the tip of the arm rod that is elastically urged, and the intermediate pulley is the drive pulley on the vertical axis. There is provided a sample thinning device in which an endless belt is stretched over a driven pulley of a shaft so that a rotational torque can be transmitted to the balls.

The eighteenth feature of the device of the present invention is that the bearing block according to the seventeenth feature of the device of the present invention has a follower pulley fixed at the upper end and a lower end instead of the ball fixed at the flange end at the lower end of the rotating shaft. It is a sample thinning device in which a rotating shaft having a sample bonding jig holder fixed thereto is supported through.

A nineteenth feature of the device of the present invention is that the rotary disc in the eighteenth feature of the device of the present invention is fitted and erected at the center of the abrasive film tensioning disc set to fit on the upper face of the rotary disc. A film holding ring is attached over the outer peripheral edge of the upper surface of the disk by sandwiching the outer peripheral edge of the hem of the abrasive film attached to the ball fixed to the upper end of the support rod to the outer peripheral edge of the disk to tension the abrasive film. It is in the sample thinning device.

The twentieth feature of the device of the present invention is the sample thinning device in which the polishing film in the nineteenth feature of the device of the present invention is a resin sheet in which diamond abrasive grains are embedded.

[0041]

The present invention takes the following actions because it takes the novel method and means as described above. First of all, in the present invention, after thinly processing a sample by flat polishing in the same device, subsequently, by rotating a dempling tool provided on a lever plate extending on the side opposite to the flat polishing tool by 180 degrees, A concentric concave spherical surface centered on the center of the sample δ can be formed.

Secondly, the tip of the pen is attached with a small spherical dempring tool having a small processing area, and the sample δ is slightly moved in the small area of the arc while the tool is brought into contact with the tool for processing. By doing so, a concave spherical surface having a diameter of 2 mm can be formed on the surface of a thin sample which is a processed sample.

Thirdly, when the processed sample is fixed, the surface of the demping tool is rotated as the surface of a cylindrical body, and when contacting and processing are performed while slightly swinging to the left and right, the concave cylindrical surface is a thin sample which is the processed sample. It can be formed on the surface of δ.

Fourth, to form a concave spherical surface on a thin sample, which is a processed sample, by attaching a spherical demping tool, which is a minute rotating body that can be polished and rotated, and performs relative motion with respect to the processed sample for demping. You can

Fifthly, a plastic film is sandwiched between the spherical dimple tool and the processed sample, and the spherical surface on which the plastic film is formed is pressed against the surface of the thin sample, which is the processed sample, while performing relative movement. A concave spherical surface on the surface of the thin sample δ can be formed by performing the demping process.

Sixth, by mounting an element capable of heating and cooling a polishing disc, a rotating disc, and a sample bonding jig, a chemical-reactive process promoting effect of heat and a soft material of a living body by cooling can be obtained. It enables processing in the freeze-cured state.

Seventh, by providing a ring groove and a rib for storing a polishing liquid on a rotating disk or a polishing disk, it is possible to prevent the liquid from scattering and the processing efficiency from being lowered.

[0048]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will now be described in more detail with reference to the accompanying drawings on the basis of its apparatus and method. In addition,
The present apparatus example and method example will be specifically described as a method of thinning a sample of a transmission electron microscope and further thinning the central portion into a concave spherical surface, but the invention is not limited to the thinning technology of these samples. .

(Device Example 1) A first device example of the device of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of this apparatus example, FIG. 2 is a partially cutaway front view of a thinning processing mechanism and a transmission rotary shaft mechanism, and FIG. 3A is a front view of a thinning processing mechanism at the time of demping. b) is an enlarged oblique view of the sample on the rotating disk, FIG. 4 is a plan view of the arrangement state of the drive torque transmission gear train mechanism, and FIG.
7 to 7 are sectional views taken along line VV, VI-VI, VII-VII in FIG.

In the figure, A is a sample thinning device of this device example, A
a is a thinning processing mechanism, Ab is a transmission rotary shaft mechanism, Ac is a drive torque transmission gear train mechanism, 1 is a grinding wheel as a depressing tool, 2 is a rotating disc, and the polishing disc 3 can be held and rotated. Reference numeral 4 is a sample bonding jig, and δ is a sample Si substrate, which is 5 mm square and about 500 μm thick. Reference numeral 5 denotes a disc rotation axis, which is a support shaft for rotating the rotation disc 2 and the polishing disc 3.

Reference numeral 6 is a dial gauge, and the plunger 7 is brought into contact with one end surface of the sample bonding jig 4 and pressed. As a result, it means that the sample δ is brought into contact with the thin polishing film sheet 8 attached to the surface of the polishing disc 3 to apply polishing processing pressure. Reference numeral 9 is a lever plate, on which a dialrel gauge 6 is installed, and a nut 1 is attached to a screw rod 10 attached to the lever plate 9.
It is concluded with 1.

As the processing and polishing progress, the value of the pointer of the dial gauge 6 decreases. Reference numeral 12 denotes a swing rotation vertical axis, and the lever plate 9 horizontally swings, and the sample δ is brought into contact with the polishing disc 3 while swinging, whereby polishing can be performed. Reference numeral 13 is a lever pin for pivotally attaching the lever plate 9 to the oscillating rotation vertical axis 12.
14 is an arm, 15 is a sample bonding jig holding hole, 16-19
Is a ball bearing, 20 is a vertical axis of intermediate rotation, 21 is a driven large eccentric cam, and 22 is a driven small eccentric cam.

Reference numeral 23 denotes a belt, which is connected to a driving pulley 24 attached to the intermediate rotary shaft 20 and a driven pulley 25 attached to the polishing wheel 1. 26 is an idler, and the belt 23 is a driving pulley 24 and a driven pulley 25.
It's there to keep it from going off. 27 is a seat block, 28 is a recess, 29 is a substrate, 30 is a housing, 31, 3
2 is a swing amplitude adjusting collar, 33 is a U-shaped clamp, 34 is a bifurcated bracket, and 35 is a grinding wheel shaft.

36 is a motor, 37 is a motor shaft, 38 is a motor gear, 39 is a disc rotary gear, 40 is a relay interlocking shaft, 4
0a is a spline part, 41 is a relay gear, 42 is a clutch mechanism, 42a is a clutch frame, 42b is a clutch lever, 43 is a lever guide, 43a is an upper switching setting guide, 43b is a lower switching setting guide, 44 is a sleeve guide, 45 Is a switching gear, 46 is a final interlocking shaft, 47 and 48 are a pair of upper and lower selection gears, and 49 is an idle sleeve.

Reference numeral 50 denotes a large driving eccentric cam fixed to the idle sleeve 49 with a key 51, a small driving eccentric cam fixed to the final interlocking shaft 46 with a key 53, 54 keys 55 to 60 vertical bearings, and 61 to 65. Is a ball bearing.

The example of this apparatus (A) is a thinning processing mechanism Aa for polishing a sample δ and measuring and processing a demp ring, a drive torque transmission gear train mechanism Ac, and a drive torque transmission gear train mechanism A.
It is composed of a transmission rotary shaft mechanism Ab for transmitting the torque of c to the thinning processing mechanism Aa as a processing rotational force and a rotational oscillating force.

The transmission rotary shaft mechanism Ab relays and transmits the rotational force of the disc rotating vertical axis 5 for rotating the rotary disc 2 which holds the polishing disc 3 which is the polishing tool, and the rotational force of the polishing wheel 1 which is the depressing tool. Along with this, an intermediate rotation vertical axis 20 that rotates and swings the lever plate 9, and a swing rotation vertical axis 12 that rotates and swings the lever plate 9.
With.

The thinning processing mechanism Aa includes a lever plate 9 which pivotally pivots through an upper portion of a swinging rotary ordinate 12 in an orthogonal manner to an intermediate portion, and a rotating disc which is located near the right end of the lever plate 9 and is rotatable. 7 The sample bonding jig holding hole 15 penetrating through the portion facing the central axis and the fastening nut 11 screwed to the screw rod 10 planted near the one side of the intermediate portion of the lever plate 9 are integrally displaced vertically. Arm 14
And the upper surface of the sample bonding jig 4 loaded in the sample bonding jig holding hole 15 is pressed by the plunger 7.
A dial gauge 6 for displaying the pressing force and a lever plate 9 are rotatably attached to the left end of the lever plate 9, and an intermediate rotation vertical shaft 20, a driving pulley 24 fixed to the upper end, and an idler pulley 26 in the middle are engaged and fixed to a polishing wheel shaft 35. The grinding wheel 1 is provided with a belt 23 extending endlessly between the driven pulleys 25 to transmit torque.

The drive torque transmission gear train mechanism Ac is fixed to the motor shaft 37, the disc rotation vertical axis 5, the relay interlocking shaft 40 and the final interlocking shaft 46, respectively, and the disc rotation vertical axis 5 has the motor shaft 37. A disk rotating gear 39 externally meshed with the motor gear 38 fixed to the motor gear 38 is fixed to the relay interlocking shaft 40, and a relay gear 41 externally meshing with the disk rotating gear 39 is fixed to the relay interlocking shaft 40. A switching gear 45, which is vertically displaced by vertical movement of the clutch lever 42b, is attached.
The output driving large eccentric cam 50, which is circumscribing corresponding to the driven large eccentric cam 21 of FIG. In addition, a pair of upper selection gears 48 selectively meshing with the switching gear 45 are fixedly fixed, and the lower selection gears 48 are idled so as to rotate through an output driving large eccentric cam 50 and an idler sleeve 49 which are freely rotatable. Install it.

In the polishing plate 9, during polishing, the center of the sample bonding jig holding hole 15 loaded with the sample bonding jig 4 faces the central axis of the rotating disc 2, and during polishing, the center of the polishing wheel 1 is rotated. It is formed so as to be pivotally positioned by 180 ° about the intermediate rotation vertical axis 20 or the swing rotation vertical axis 12 so as to face the central axis of the disc 2.

The thinning mechanism Aa is a receiving block 2 that receives the balls 67 of the rotating ball mounting jig 66 loaded in the sample bonding jig holding holes 15 of the lever plate 9 during the demping process.
A base plate 29 having a recessed portion 28 into which 7 is fitted is cantileveredly provided on the upper left end of the upper surface of a housing 30 containing the drive torque transmission gear train mechanism Ac.

The rotating disc 2 has a sample bonding jig fitting hole 68 recessed in the center of the upper surface thereof, and the sample bonding jig holding hole 1
Reference numeral 5 has a ball bearing 16 fitted therein so that the loaded sample bonding jig 4 or rotating ball mounting jig 66 can be held in rotation.

The specifications of this example of the apparatus present such a concrete embodiment, and the working method thereof will be described with reference to the drawings. In FIG. 2, the polishing disc 3 is fixed on the rotating disc 2. The arm 14 holding the dial gauge 6 is fixed to the screw rod 10 with a fastening nut 11. Sample bonding jig 4
Also, the sample Si substrate δ bonded to this is pressed by the spring reaction force from the tip of the plunger 7 of the dial gauge 6.

As a result, the sample Si substrate δ comes into contact with the polishing disc 3 while being pressed, and further rotates, so that the sample Si substrate δ can rotate, so that the sample Si substrate δ is attached to the polishing disc 3. The polishing film sheet 8 is used to polish the surface to a thin thickness of about 100 μm. In this case k, sample Si
Since the change in the thickness of the substrate δ is displayed as a change in the pointer of the dial gauge 6, the dial gauge 6 serves as a monitor for monitoring the change in the amount of processing and polishing.

Thus, after the polishing process, the lever plate 9
Prior to the 80 ° horizontal swivel positioning, the polishing disc 3 is removed from the rotating disc 2 and the sample adhering jig 4 is taken out from the sample adhering jig holding hole 15 and the sample adhering jig fitting hole of the rotating disc 2 is removed. The tube 68 is inverted and fitted and set, the ball attachment jig 66 is loaded in the sample adhesive bond holding hole 15, and the setting is performed as shown in FIG.

When the arm 14 holding the dial gauge 6 is tightened and fixed to the threaded rod 10 with the tightening nut 11 in the demping process, the blanker 4 is attached to the end of the ball mounting jig 66 and the spring of the dial gauge 6 built-in. Contact while adding reaction force and heating force. As a result, the pointer on the dial gauge 6 indicates a certain number on the dial.

With the spring reaction force of the plunger 6, the lever plate 9 performs the balance function about the axis of the lever pin 13, so that the spring reaction force causes the polishing wheel 1 to rotate as shown in FIG. The surface is brought into contact while applying pressure. The polishing wheel 1 rotates, and the sample Si substrate δ also rotates together, and the pressing force is applied while contacting each other, so that the surface of the sample Si substrate δ transfers the shape of the contact arc of the polishing wheel 1, and Because they rotate with respect to each other, they are formed into spherical concave surfaces.

The belt 2 is driven by the intermediate rotation vertical axis 20 and the driving pulley 24 which are driven and rotated by the built-in motor 36.
3 is operated, the driven pulley 25 and the grinding wheel 1 rotate while being tensioned by the idler 26. on the other hand,
The disk rotation vertical axis 5 is likewise driven and rotated by the built-in electric motor 36 via the built-in gear train mechanism Ac, so that the rotary disk 2, the sample bonding jig 4, and the sample Si substrate δ are rotated together. It

The swing amplitude adjust 31 and the swing amplitude adjust collar 32 are provided on the intermediate rotation vertical axis 20 and the swing rotation vertical axis 1.
2 can be freely selected and attached or detached. The swing amplitude adjusting collars 31 and 32 reciprocally rotate within a rotation angle. Therefore, the driven large eccentric cam 21 and the driving small eccentric cam 52 are aligned so that the driven small eccentric cam 22 and the driving large eccentric cam 50 are circumscribed.

The driven small eccentric cam 22 and the driven large eccentric cam 21.
Since the eccentricity amounts are 1 mm and 25.5 mm, respectively, the swing amplitude adjusting collar 31 or 3 of the lever plate 9 is
2, the swing amplitude adjusting collar 31 has a swing width of 1.5 mm, and the swing amplitude adjusting collar 32 has a swing width of 50 mm to drive the lever plate 9 in a horizontal amplitude.

As described above, the diameter of the surface of the sample Si substrate δ thinly polished to the parallel plane is about 2 mm, and the plate thickness of the central portion of the thin plate sample of the parallel plane having the plate thickness of 100 μm is 1 to 1.
Dimple ring polishing is performed on the concave spherical surface until it becomes 2 μm. That is, flat polishing and concave spherical polishing can be performed with one device.

(Device Example 2) A second device example of the device of the present invention will be described with reference to the drawings. FIG. 8A is a partially cutaway plan view of the present apparatus example, and FIG. 8B is a partially cutaway front view of the same thin piece processing mechanism.

In the figure, B is a sample thinning device of this device example, 6
9 is a pen-type polishing tool as a depressing tool, 69a
Is a pen shaft, 70 is a pen shaft support plate, 9a is a notch, 71 is a driven pulley, 72 is a belt, 73 is a connecting bolt, 74
Is a pen polishing tool holding bolt. The same members as those of the first device example of FIG. 3 are designated by the same reference numerals to avoid duplication of description.

The pen type polishing tool 69 includes a driven pulley 71.
The pen shaft 69a fixed to the upper part is rotatably penetrated to the tip end, and the base end side part of the pen shaft support plate 70 supported by the presser bolt 74 is connected to the notch 9a on one side of the lever plate 9 with the connecting bolt 73. The belt 72 is continuously provided, and the belt 72 is stretched endlessly between the driven pulley 71 and the driving pulley 24 of the intermediate rotation vertical axis 20 so that torque can be transmitted.

While the rotary drive of the disk rotating shaft 5 rotates the rotating disk 2, the belt 72 is connected between the driving pulley 24 and the driven pulley 71, so that the intermediate rotating vertical axis 20
Rotation drive causes the rotation of the pen shaft 69a and the rotation of the pen type polishing tool 69. As described in the first device example, the spring reaction force when the plunger 4 of the dial gauge 6 is brought into contact with the seat block 27 via the ball mounting jig 66 is free with the lever pin 13 as a fulcrum. A rotation moment is generated in the lever plate 9 which can be tilted to the end, and eventually the tip Si 69b of the tip ball 69b of the pen-shaped polishing tool 69
Is pressed against the surface of.

When the aqueous solution δ of fine abrasive grains is wetted on the surface of the sample Si substrate δ, both the pen-shaped polishing tool 69 and the sample Si substrate δ are rotated, so that the sample Si substrate δ is polished into a concave spherical surface. Is processed. At this time, when the lever plate 9 is connected to the swing amplitude adjusting collar 31, a swing having a swing amplitude of 1.5 mm is added to the polishing process, so that a concave spherical shape having a diameter of 2 mm is formed.

The size of the ball 69b attached to the tip of the pen type polishing tool 69 is as small as about 0.5 mm in diameter. If a felt tip (not shown) is replaced in place of the ball 69b at the tip of the pen-type polishing tool 69 and finer abrasive grains such as diamond 0.1 μm grain size or colloidal silica are used, a concave spherical surface with a mirror surface is obtained.

In advance, a pen-type polishing tool 69 provided with balls 69b was used to perform polishing until the thickness became as thin as about 10 μm at the most recessed center portion, and then a pen-type polishing tool 69 provided with a felt tip was used for polishing. Processed, thin,
When polishing is performed to a thickness of 1 to 2 μm at the center so that it can be seen through, polishing of abrasive grains as an electron microscope sample is completed. The dial gauge 6 can be used as a monitor for observing the reduction in plate thickness.

(Device Example 3) A third device example of the device of the present invention will be described with reference to the drawings. FIG. 9A is a plan view of this apparatus example, and FIG. 9B is a partially cutaway front view of the same thinning processing mechanism. In the figure, C is a sample thinning device of this device example, 75 is an electromagnetic contact, and 76 is an electromagnetic brake. The same members as those of the first device example shown in FIG. 3A are designated by the same reference numerals to avoid redundant description.

In the same figure, the rotary disc 2 is deenergized by the electromagnetic joint 75, and the electromagnetic brake 76 is urged and braked to restrain and fix the rotation. On the other hand, the polishing wheel 1 is rotated by the drive transmission of the driving pulley 24, the driven pulley 25, and the belt 23, as in the first device example.

Further, in order to give a swinging swing of a slight 1.5 mm width, the swing amplitude adjusting collar 31 is selected, and the lever pin 13 of the lever plate 9 is moved to the swing amplitude adjusting collar 3.
According to the pin hole 01 or 02 of 1 or 32,
To combine. The lever plate 9 is fitted with the swing amplitude adjusting collar 31 or 32, and the lever plate 9 has a hole (not shown) so that it can slide freely.

Sample S in which the polishing wheel 1 is restrained from rotating
When the surface of the i substrate δ is pressed and brought into contact with the surface of the i substrate δ in the same manner as in the first example, and abrasive grains are added, the polishing wheel 1 rotates,
It swings with a width of 1.5 mm, and processing and polishing starts. as a result,
The sample Si substrate δ has a cylindrical concave shape, and can be processed to a plate thickness of about 10 μm at the center.

In the next step, a felt-like soft circular ring was fitted to the polishing wheel 1 on the outer periphery of the polishing wheel 1 and processed with a finer 0.1 μm diamond abrasive grain suspension to obtain a plate thickness of 1 to 2 μm. The center part can be processed so that it can be seen through thinly, and the cylindrical concave surface is formed in a mirror surface. At this stage, the polishing / dempling process of the electron microscope sample δ is completed. Similarly, the dial gauge 6 can be used as a monitor for observing the amount of reduction in plate thickness during the progress of processing.

(Device Example 4) A fourth device example of the device of the present invention will be described with reference to the drawings. FIG. 10 is a front view of the thinning processing mechanism of this apparatus example, FIG. 11 is a right side view of the same, and FIG. 11 is a central longitudinal enlarged front view of the same.

In the figure, D is a sample thinning device of this device example, 7
7 is a rotating shaft, and 77a is a ball 77c on the lower brim end 77b.
, 78 is a straight plate type movable guide plate, 79 is a vertical guide groove, 80 is a protractor type fixed guide circular arc plate, 81 is a semi-circular arc shaped guide groove, 82 is a slide rod, 82a is a male screw part, and 82b is Is a collar, 82c is a female screw cylinder, 83 is a compression coil spring, 84 is a bearing block, 85 and 86 are compression coil springs, and 87 is a spring receiving collar.

Reference numeral 88 is a stand column, 89 is an arm rod, 90 is a torsion coil spring, 91 is a bolt, 92 is a nut,
93 backup pulley, 94 pulley shaft, 95 semi-circular arc cover, 96 driven pulley, 97 belt, 9
8 to 107 are ball bearings. As shown in FIGS. 1 to 3, the same members as those in the first embodiment are designated by the same reference numerals to avoid duplication of description.

The ball 7 is attached to the end of the collar 77b at the lower end of the rotary shaft 77a.
The dimple ring tool 77 to which 7c is fixed stands upright on the right end of the lever plate 9 and the movable guide plate 78 extending through the vertical guide groove 79, and upright on the housing 30 so as to be superposed and slidable.
The semi-circular guide groove 81 of the fixed arc plate 80 extending through the semi-circular guide groove 81 and the vertical guide groove 79 penetrate through the female screw cylinder 82a with the brim 80c, and the compression coil spring 83 is used. The driven block 96 is fixed to the upper end of the bearing block 84 that is fixed to the front end of the slide rod 82 that is biased to project into the female screw cylinder 82a, and the rotary shaft 77a is pierced and supported while the lower surface of the bearing block 84 and the collar 77b rod are connected. Compression coil springs 85 and 86 are respectively wound around the rotary shaft 77a and between the upper surface of the bearing block 84 and the spring receiving collar 87, while the upper end of a stand column 88 standing upright on the left end of the lever plate 9. The base end is rotatably and cantileveredly protruded to the tip of the arm rod 89 urged by the torsion coil spring 90 so that it always returns to its original neutral position. And backup pulley 93 fixed to the pulley shaft 94 and the driving pulley 24 of the intermediate rotary vertical shaft 20 over the driven pulley 96 of the rotary shaft 77a by stretching the endless belt 97 becomes as freely transmit rotational torque to the ball 77c that.

The specifications of the present apparatus example show such a concrete embodiment, and the working method will be described below with reference to the drawings. The rotating shaft 77a is supported by the bearing block 84. As shown in the front view of FIG. 11, the bearing block 84 can freely change the coordinates of the bearing block 84 within a two-dimensional plane of the paper. That is, the bearing block 84 can be guided and constrained by the semi-arcuate guide groove 81 in the fixed guide arc plate 20 to change its position in an arc shape. Cannot move to a position other than an arc.

Further, the vertical guide groove 7 of the movable guide plate 78
9 is also fitted, and the movement of the bearing block 84 in the diametrical direction of the arc of the semi-circular guide groove 81 is caused by the vertical guide groove 79.
You can move freely within the range restricted by. As a result of being connected to the swing amplitude adjusting collar 32 and swinging by 50 mm, the movable guide plate 78 swings horizontally by 50 mm.

Therefore, according to the swinging motion of the lever plate 9, the bearing block 84 is moved along the arc shape of the semi-arc guide groove 81.
Works. The compression coil spring 85 generates a repulsive force between the collar 77b and the bearing block 84, and the ball 77c.
Applies a pressing force when the sample contacts the sample Si substrate δ.

The method of contacting the sample Si substrate δ and the ball 77c is performed by operating the dial gauge 6 as in the first to third device examples. The ball 77c has a semi-circular guide groove 8
1 draws an arc in a concentric circle centered on the contact point with the sample Si substrate δ, while rotating on the rotating shaft 77a and also rotating the sample Si substrate δ, it is polished,
The sample Si substrate δ has a concave spherical surface.

After the thin concave spherical surface is processed, the ball 77c is formed in the same manner as in the first to third device examples in order to finish the mirror surface.
The material of can be attached to and detached from another soft ball, and the abrasive grains can be replaced with finer particles. The material of the ball 77c is copper, brass, tin, soft metal, plastic felt, artificial leather, or the like.

(Example 5 of Device) A fifth example of the device of the present invention will be described with reference to the drawings. FIG. 13 is a partially cutaway right side view of the thinning mechanism of this apparatus example. In the figure, E is a sample thinning device of this device example, 108 is a holder, 109 is a polishing film tension disc, 109a is a central recess, 109b is a rib, 1
Reference numeral 09c is a setting convex portion, 110 is a supporting rod, 111 is a ball, 112 is a polishing film, 113 is a film pressing ring, and 114 is a setting concave hole. The same members as those in the fourth embodiment shown in FIGS. 11 to 12 are designated by the same reference numerals to avoid duplication of description.

The rotary disc 2 has a setting recess 114 at the center of the upper surface.
The outer peripheral edge of the skirt of the polishing film 112 fitted to the ball 111 fixed to the upper end of the support rod 110 which is fitted upright in the central recess 109a of the polishing film tensioning inner plate 109 in which the setting convex portion 109c of the center of the lower surface is fitted and set into a disk. 109 A film pressing ring 113 that clings to the outer peripheral rib 109b and tensions the polishing film 112 is fitted over the outer peripheral rib 109b.

The specifications of the present apparatus example present such a concrete embodiment, and the working method thereof will be described. Rotating shaft 77
The sample bonding jig 4 is held by the sample holder 108 attached to the lower end of a. On the other hand, the polishing film 112 is attached to the ball 1
While pressing 11 to apply tension, the film retainer ring 1
The polishing film 112 is pressed by 13 and the polishing film 11 is pressed.
2 is a resin sheet in which abrasive grains of 20, 3, 3, 1 or 0.1 μm grain size are selected and abrasive grains are embedded therein, which is soft and flexible. Tension is generated on the rib 109b by the film pressing ring 113, the spherical surface of the ball 111 is transferred, and the spherical surface is transferred and formed on the polishing film 112.

The sample Si substrate δ rotates with the rotation of the rotating shaft 77a, while the polishing film 112 rotates with the rotation of the rotating disk 2. As in the first to fourth apparatus examples, the sample Si substrate δ is brought into contact with the polishing film 112 by the operation of the dial gauge 6 and pressure is applied to perform polishing, and the surface of the sample Si substrate δ is the polishing film. The spherical shape of the surface of 112 is transferred and becomes a concave spherical surface.

If the radius of the tip-shaped ball 111 is selected,
The concave spherical surface shape of the processed surface of the sample Si substrate δ that is transferred and can be relatively set to have a diameter of 2 mm and a depth of about 68 μm. At this time, the plate thickness of the sample Si substrate δ is about 70 μm. After that, the polishing film 11 is used for finishing the mirror surface.
Do by replacing 2. Then, the thin plate thickness at the center of the concave spherical surface is finished to 1 to 2 μm.

(Device Example 6) A sixth device example of the device of the present invention will be described with reference to the drawings. FIG. 14A is a cross-sectional view of the rotary disk and the lever plate on the right side during the polishing process of this apparatus example, and FIG. 14B is a cutaway view of the rotary disk during the same dempling process.

In the figure, F is a sample thinning device of this device example, 1
15 is a Peltier effect element, 116 is a lead wire, 117 is a Peltier effect element, 118 is a lead wire, 119 is a sliding ring, 120 is a sliding brush, 121 is a lead wire, 122
Is a stand bracket. In addition, as shown in FIG. 2, the same members as those of the first device example are designated by the same reference numerals to avoid duplication of description.

The lever plate 9 forms and surrounds the intermediate inner surface of the sample bonding jig holding hole 15 to embed the Peltier effect element 117 and to connect the lead wire 116 to the Peltier effect element 117 and draw it out.

The rotary disc 2 forms and surrounds the lower inner surface of the sample bonding jig fitting hole 15 to embed the Peltier effect element 117 therein, and slides around the Peltier effect element 117 and the entire outer circumference of the rotary disc 2. The stand bracket 12 to which a sliding brush 120 is attached, which is connected to the sliding ring 119 at all times while being connected to the ring 119 by a lead wire 118.
2 is provided near one side of the rotary disc 2.

The specifications of this apparatus example show such a concrete embodiment, and the working method thereof will be described with reference to the drawings. When the power transmitter sliding brush 120 is brought into contact with the sliding ring 119 from the outside by the power transmitter sliding brush 120 and a voltage is applied, the rotating disk 2 is kept rotating and the sample bonding jig holding hole 15 is fixed. While the sample Si substrate δ is processed, the sample bonding jig 4 and the rotary disc 2 can be cooled or warmed by the Peltier effect.

Further, the temperature of the sample bonding jig 4 and the rotary disc 2 can be adjusted by installing cold air or hot air or a pipe for sending cold water or hot water in the apparatus. In the range from -20 ° C to + 40 ° C, this allows processing to be carried out while taking advantage of cold and warm temperatures. Further, this makes it possible to polish the soft substance such as a living body by making the sample δ below the freezing point and analyze it with a transmission electron microscope.

(Device Example 7) A seventh device example of the device of the present invention will be described with reference to the drawings. FIG. 15A is a central longitudinal sectional view of the polishing disc, and FIG. 15B is a central longitudinal sectional view of the rotating disc.

In the figure, reference numeral 123 is a ring groove for storing an aqueous solution of abrasive grains, 1
Reference numeral 24 is a rib, 125 is an annular groove for storing an abrasive grain aqueous solution, 126 is a rib, and L is an abrasive grain aqueous solution. The same members as those of the polishing disk 3 of the first apparatus example as shown in FIG. 2 and the rotating disk 2 of the sixth apparatus example as shown in FIG. Avoided.

The rotary disc 2 is formed by digging a ring groove 125 for accumulating an aqueous solution of abrasive grains on the upper surface surrounding the outer periphery of the sample bonding jig fitting hole 68 and edging a rib 126 on the entire length of the outer peripheral edge of the upper surface.

The polishing disc 3, which is a polishing tool, has a ring groove 123 for accumulating an aqueous solution of abrasive grains, which is dug in the upper surface surrounding the central portion, and a rib 124 is trimmed along the entire length of the outer peripheral edge of the upper surface.

Since the specifications of the polishing disc 3 and the rotating disc 2 of this example of the apparatus show such a specific embodiment, the surface of the polishing disc 3 on the rotating disc 2 is shown in FIG. It is possible to form the pool of the aqueous solution L by forming the abrasive grain aqueous solution accumulating ring groove 123 or the rib 124 as a slight step as shown in FIG. As a result, it is possible to perform a clean operation without causing the abrasive grain aqueous solution L to fly outside the apparatus.

Similarly, it becomes possible to form a slight step difference in the abrasive grain aqueous solution accumulating ring groove 125 or the rib 126 on the rotary disc 2 to perform clean work.

[0110]

As described above, by using the apparatus and method of the present invention, thinning of a sample and a concave surface of a transmission electron microscope can be carried out easily and quickly at the same time, so that the process can be shortened and the cost of the polishing and demping process can be reduced. Has a great effect on. In addition, at a temperature other than room temperature, in the polishing and demping processes below freezing, it is possible to easily polish and depress a soft substance such as a living body. On the other hand, in the heated polishing and demping steps, the chemical reaction is promoted, so that the polishing and dempling speeds can be accelerated, which is very effective in accelerating the sample processing.

[Brief description of drawings]

FIG. 1 is a plan view showing a first device example of the present invention.

FIG. 2 is a partially cutaway and omitted front view of the above-described thinning processing mechanism and transmission rotary shaft mechanism.

FIG. 3 (a) is a partially cutaway front view of the thinning processing mechanism at the time of dempling, and FIG. 3 (b) is an enlarged oblique view of the sample.

FIG. 4 is a plan view illustrating an arrangement state of the transmission rotary shaft mechanism and the drive torque transmission gear train mechanism of the above.

5 is a cross-sectional view of a portion corresponding to line VV in FIG.

FIG. 6 is a cross-sectional view of a portion corresponding to line VI-VI in FIG.

FIG. 7 is a cross-sectional view of a portion corresponding to the line VII-VII in FIG.

FIG. 8 is a partially cutaway plan view of the second device example of the present invention, and FIG. 8B is a partially cutaway front view of the thinning processing mechanism.

9A and 9B are a third device example of the present invention, in which FIG. 9A is a plan view during demping, FIG. 9B is a partially cutaway front view of the same thinning processing mechanism, and FIG. Is.

FIG. 10 is a front view of a thinning mechanism of a fourth apparatus example of the present invention.

FIG. 11 is a right side view of the above.

FIG. 12 is a front view of the central longitudinal section of the above.

FIG. 13 is a partially cutaway right side view of the thinning mechanism of the fifth device example of the present invention.

FIG. 14 is a sixth apparatus example of the present invention, in which (a) is a central longitudinal front view on the right side of the rotary disc and lever plate during polishing;
(B) is a central vertical sectional front view of the rotating disk at the time of dempling.

FIG. 15A is a central longitudinal sectional front view of a polishing disk, and FIG. 15B is a central longitudinal sectional front view of a rotating disk in a seventh apparatus example of the present invention.

16 (a) to 16 (g) are views showing a step of sequentially thinning a sample.

[Explanation of symbols]

 A ... Sample thinning device Aa ... Thinning processing mechanism Ab ... Transmission rotary shaft mechanism Ac ... Drive torque transmission gear train mechanism L ... Abrasive grain aqueous solution δ ... Sample 1 ... Polishing wheel 2 ... Rotating disc 3 ... Polishing disc 4 ... Specimen bonding jig 5 ... Disk rotation axis 6 ... Dial gauge 7 ... Plunger 8 ... Abrasive film sheet 9 ... Lever plate 9a ... Notch 10 ... Screw rod 11 ... Fastening nut 12 ... Oscillating rotation vertical axis 13 ... Lever pin 14 ... Arm 15 ... Sample bonding jig holding hole 16 to 19 ... Ball bearing 20 ... Intermediate rotation vertical axis 21 ... Followed large eccentric cam 22 ... Followed small eccentric cam 23 ... Belt 24 ... Driving pulley 25 ... Followed pulley 26 ... Idler 27 ... Seat block 28 ... Recess 29 ... Substrate 30 ... Enclosure 31, 32 ... Swing amplitude adjustment collar 33 ... U-shaped clamp 34 ... Bifurcated blanket 35 ... Polishing wheel shaft 36 ... motor 37 ... motor shaft 38 ... motor gear 39 ... disk rotary gear 40 ... relay interlocking shaft 40a ... spline part 41 ... relay gear 42 ... clutch mechanism 42a ... clutch frame 42b ... clutch lever 43 ... lever guide 43a ... upper switching setting Guide 43b ... Lower switching setting guide 44 ... Sleeve guide 45 ... Switching gear 46 ... Final interlocking shaft 47, 48 ... Selection gear 49 ... Idle sleeve 50 ... Large eccentric cam 51 ... Key 52 ... Small eccentric cam 53,54 ... Key 55-60 ... Vertical bearing 60-65 ... Ball bearing 66 ... Rotating ball mounting jig 67 ... Ball 68 ... Sample bonding jig fitting hole 69 ... Pen type polishing tool 69a ... Pen shaft 70 ... Pen shaft support plate 71 ... Driven pulley 72 ... Belt 73 ... Coupling bolt 74 ... Pen polishing tool holding bolt 75 ... Electromagnetic joint 76 ... Magnetic brake 77 ... Dimple ring tool 77a ... Rotating shaft 78 ... Movable guide plate 79 ... Vertical guide groove 80 ... Fixed guide arc plate 81 ... Semi-arc guide groove 82 ... Slide rod 82a ... Male screw part 82b ... Female screw cylinder 82c ... Tsuba 83, 85, 86 ... Compression coil spring 84 ... Bearing block 87 ... Spring receiving collar 88 ... Stand pivot 89 ... Arm rod 90 ... Torsion coil spring 91 ... Bolt 92 ... Nut 93 ... Backup pulley 94 ... Pulley shaft 95 ... Half arc Cover 96 ... Pulley 97 ... Belt 98 to 107 ... Ball bearing 108 ... Holder 109 ... Abrasion film tension disc 109a ... Center recess 109b ... Rib 109c ... Setting protrusion 110 ... Support rod 111 ... Ball 112 ... Abrasion film 113 ... Film presser Ring 114 ... Setting Holes 115 and 117 ... Peltier effect elements 116,118,121 ... leads 119 ... swinging ring 120 ... swing brush 122 ... stand bracket 123, 125 ... abrasive solution reservoir for ring grooves 124, 126 ... rib

 ─────────────────────────────────────────────────── ─── Continuation of front page (72) Inventor Fumiwa Ohira 1-1-6 Uchisaiwaicho, Chiyoda-ku, Tokyo Nihon Telegraph and Telephone Corporation (72) Inventor Mitsuo Kajita 1-3-1 Gotenyama, Musashino-shi, Tokyo No. NTT Advanced Technology Co., Ltd. (72) Inventor Masahiro Seki No. 1-3 Gotenyama, Musashino City, Tokyo NTT Advanced Technology Co., Ltd.

Claims (29)

[Claims] 1. When cutting, processing, polishing, depressing and ion milling a sample to thin the sample, a polishing tool and a demping tool are provided in one device.
It is installed at a position corresponding to 0 ° and one machining work position is provided, and after the polishing work is completed at the machining work position, the polishing work tool and the dempling work tool are turned integrally by 180 ° to turn the demping work tool. A method for thinning a sample, characterized in that the polishing process and the templating process are carried out by one device by bringing them to the processing work position and then continuing the dempling process. 2. The sample thinning method according to claim 1, wherein the polishing process and the dempling process are performed by cooling and hardening the sample. 3. The method of thinning a sample according to claim 1, wherein the polishing is performed in an ice-like state at a temperature below the freezing point. 4. The sample thinning method according to claim 1, 2 or 3, wherein in the polishing process, the sample is heated to accelerate the reaction of the process. 5. The sample thin piece according to claim 1, 2, 3 or 4, wherein the polishing and dempling are cold or warm working at -20 ° C to + 40 ° C. Method. 6. The sample thinning method according to claim 1, wherein the polishing is performed while horizontally swinging the sample. 7. The method of thinning a sample according to claim 1, wherein the demping is performed by rotating the sample axially and swinging horizontally. 8. The dempling process is performed by fixing a sample and performing a horizontal rotation and a horizontal swing amplitude of the dempling tool.
The method for thinning a sample according to. 9. The method for thinning a sample according to claim 6, 7 or 8, wherein the swing amplitude is variable and variable in amplitude width. 10. A drive torque transmission gear train mechanism, a thinning processing mechanism for polishing a sample and measuring a demp ring, and a torque of the drive torque transmission gear train mechanism for processing torque to the thinning processing mechanism. A transmission rotary shaft mechanism for transmitting as a rotational oscillating force, and the transmission rotary shaft mechanism has a disc rotation vertical axis for rotating a rotary disc for processing work holding a polishing tool or a sample bonding jig to which a sample is bonded, An intermediate rotation vertical axis for rotating and swinging the thinning processing mechanism and a swinging vertical axis for rotating and swinging the thinning processing mechanism while relaying the rotational force of the demping tool. Sample thinning device. 11. A thinning mechanism comprises a lever plate pivotally pivoted through an upper part of an oscillating rotary vertical axis orthogonal to an intermediate part, and a lever plate near one end of the lever plate and a center of a rotating disk. A sample bonding jig holding hole penetrating the part facing the axis and a tip of an arm that is vertically displaced integrally by rotation of a fastening nut screwed with a screw rod planted near the one side of the intermediate part of the lever plate. And a plunger to press the upper surface of the sample bonding jig loaded in the sample bonding jig holding hole with a plunger, and a dial gauge for displaying the pressing force, and rotatably attached to the other end of the lever plate, and an intermediate rotation length. The sample thinning device according to claim 10, further comprising: a shaft and a dempling tool that is connected by a pulley / belt transmission mechanism so as to freely transmit torque. 12. The intermediate rotation vertical axis has a lower end driven eccentric cam fixed to the upper end and rocking amplitude adjusting collars respectively fixed thereto, and axially rotatably penetrates through the axial center of the swing rotation vertical axis. 12. The sample thinning device according to claim 10 or 11, wherein the rocking amplitude adjusting collar is fixed, and the driven eccentric cam is fixed in the intermediate portion. 13. A drive torque transmission gear train mechanism is provided with a clutch mechanism for selectively switching and transmitting torque output to either a driven eccentric cam of a swing rotation vertical axis or a driven eccentric cam of an intermediate rotation vertical axis. The sample thinning device according to claim 10, 11, or 12. 14. A drive torque transmission gear train mechanism is fixed to a motor shaft, a disc rotation longitudinal axis, a relay interlocking shaft and a final interlocking shaft, respectively, and the disc rotation longitudinal axis is fixed to the motor shaft. A disk rotating gear that meshes externally with the motor gear is fixed, and a relay gear that externally meshes with the disk rotating gear is fixed to the relay interlocking shaft, and a switching gear that slides the spline part up and down by a clutch mechanism is attached. , An output driving eccentric cam which is circumscribing corresponding to the driven eccentric cam of the oscillating rotation vertical axis is fixed to the upper part of the final interlocking shaft, and an output driving eccentric cam which is circumscribing corresponding to the driven eccentric cam of the intermediate rotation longitudinal axis is idled. It is freely attached, and one of a pair of selection gears that selectively meshes with the switching gear is fixed to the lower part,
The other end is mounted so as to rotate freely so as to rotate integrally with the idle output power eccentric cam.
The sample thinning apparatus according to 0, 11, 12, or 13. 15. The lever plate is such that during polishing, the center of the sample bonding jig holding hole loaded with the sample bonding jig faces the central axis of the rotating disk, and during the demping process, the center of the depressing tool is the rotating circle. 15. The sample slice according to claim 11, 12, 13 or 14, wherein the plate is formed so that it can be pivotally positioned by 180 ° around the intermediate rotation vertical axis or the swing rotation vertical axis so as to face the central axis of the plate. apparatus. 16. The thinning mechanism has a base plate having a recessed portion into which a receiving block for receiving a ball of a rotary ball mounting jig loaded in a sample bonding jig holding hole of a lever plate at the time of demping is recessed. Is provided on a housing containing a drive torque transmission gear train mechanism.
Or the sample thinning apparatus as described in 17 above. 17. A ball bearing is fitted into the sample bonding jig holding hole so that the loaded sample bonding jig or the rotating ball mounting jig can be rotatably held therein. 14, 15
Or the sample thinning apparatus as described in 16 above. 18. The rotating disk has a sample bonding jig fitting hole recessed in the center of the upper surface thereof.
The sample thinning device as described in 4, 15, 16 or 17. 19. The rotating disc has a ring groove for accumulating an aqueous solution of abrasive grains, which is formed on the upper surface surrounding the outer periphery of the fitting hole for the sample bonding jig, and a rib is trimmed along the entire length of the outer peripheral edge of the upper surface. The sample thinning device according to claim 18. 20. A polishing tool is a polishing disc, wherein an annular groove for accumulating an aqueous solution of abrasive grains is dug in an upper surface surrounding a central portion, and a rib is trimmed along the entire length of the outer peripheral edge of the upper surface. Claims 10, 11, 12, 13, 1
The sample thinning device as described in 4, 15, 16 or 17. 21. A rotating ring forms and surrounds a lower inner surface of a hole for fitting a sample bonding jig to embed a Peltier effect element, and a sliding ring provided around the Peltier effect element and the entire outer circumference of the rotating disc. The sample according to claim 18 or 19, wherein a sliding brush, which is connected to the sliding ring at all times while being in contact with the sliding ring, is provided near one side of the rotating disk while being connected to the sliding ring with a lead wire. Thinning device. 22. The lever plate is formed by surrounding and forming an intermediate inner surface of the sample bonding jig holding hole to embed the Peltier effect element, and connect and draw out a lead wire to the Peltier effect element. 11, 12, 13, 14, 1
The sample thinning device according to 5, 16, 18, 19, 20 or 21. 23. The dempling tool is any one of a grinding wheel, a pen-shaped grinding tool, and a ball fixed to a flange end at a lower end of a rotary shaft.
4, 15, 16, 17, 18, 19, 20, 21 or 2
The sample thinning device as described in 2. 24. The polishing wheel is characterized in that a follower pulley is fixed to a bifurcated bracket projecting from the other end of the lever plate and fixed to a wheel shaft between the bifurcated brackets rotatably pierced. Item 23. A sample thinning device. 25. A pen type polishing tool, wherein a pen shaft supporting plate having a driven pulley fixed to an upper portion thereof is rotatably supported at a tip end thereof and a base end side portion of the pen shaft supporting plate is connected to a notch portion on one side of the lever plate. 24. The sample thinning device according to claim 23, wherein the belt is stretched endlessly between the driven pulley and the driving pulley of the intermediate rotation longitudinal axis so that torque can be transmitted. 26. The ball fixed to the flange end at the lower end of the rotary shaft is erected upright on one end of the lever plate and the movable guide plate extending through the vertical guide groove, and upright on the casing so that the movable guide plate is superposed and slidable. In addition, the protractor-type fixed guide circular arc plate extending through the semi-circular guide groove penetrates the rear end over the semi-circular guide groove and the vertical guide groove, and the rear end is always elastic with protrusion habit. The bearing block fixed to the front end of the biased slide rod penetrates and supports the rotary shaft having the driven pulley fixed to the upper end, while the lower surface of the bearing block is between the flange end and the upper spring of the bearing block is directly below the driven pulley. Each compression coil spring is wound around each rotating shaft between the collars, while the base end is rotatably cantilevered on the upper end of the stand column standing upright on the other end of the lever plate to maintain the original neutral position. Elastically biased Endless belt is stretched over a backup pulley fixed to a pulley shaft that freely stands upright at the end of the rod, a driving pulley on the intermediate rotation vertical axis and a driven pulley on the upper end of the rotation shaft, and rotational torque can be transmitted to the ball. The sample thinning device according to claim 23, wherein: 27. In the bearing block, instead of the ball fixed to the flange end at the lower end of the rotary shaft, the driven pulley is fixed to the upper end and the rotary shaft having the sample bonding jig holder fixed to the lower end is pierced and supported. 27. The sample thinning device according to claim 26. 28. The rotating disc has a hem outer peripheral edge of a polishing film mounted on a ball fixed to an upper end of a support rod fitted and set upright in the center of a polishing film tensioning disc fitted and set on the upper surface of the rotating disc. 28. The sample thinning device according to claim 27, wherein a film pressing ring that clings to the outer peripheral edge of the disk to tension the polishing film is fitted over the outer peripheral edge of the upper surface of the disk. 29. The sample thinning device according to claim 28, wherein the polishing film is a resin sheet having diamond abrasive grains embedded therein.