JP2002307279A - Polishing tool, polishing tool holding device, polishing device, and combination polishing method for processing polishing tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a low-cost polishing tool assuring a high spherical accuracy generated by a combination processing. SOLUTION: A polishing tray 1 using a polishing seat 2 as a polishing surface has a band-shaped projection 3 on the back surface of the polishing surface, and in its center hole 3a a column 11a fixed to an upper form 11 of a tray holding jig 10 is inserted and fastened by a screw 12a. The level adjustment of the tray 1 is made by loosening the screw 12a and changing the inserting depth of the column 11a to the projection 3. Eventual production of a dint on the column 11a caused by the screw 12a may be cleared by replacing only the column 11a. A pin receptacle 4 for use in the combination processing of the tray 1 is formed at the bottom of the center hole 3a in the projection 3, and owing to a large combine fulcrum angle at the time of combination processing, it is possible to enhance the accuracy and stability of the combination processing.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a polishing tool used for polishing an optical element such as a lens, a polishing tool holding device, a polishing device, and a combined polishing method for processing the polishing tool.

[0002]

2. Description of the Related Art In a spherical polishing apparatus for polishing an optical element such as a lens, a polishing plate, which is a polishing tool, is mounted on a lower spindle side and rotated, and the polishing plate is pressed against a workpiece. The polishing plate is rocked by a rocking mechanism centered on the spherical curvature of the polishing plate. The polishing dish used in this polishing apparatus is generally held by a polishing dish holding jig having a mechanism as shown in FIG.

[0005] In FIG. 5, a polishing plate 101 has a surface to be polished by a polishing sheet 102.
01a is manufactured integrally with the columnar projection 103,
At the center of the columnar projection 103, a wrench holder 104 is attached. The dimensional tolerance of the columnar projection 103 of the polishing plate 101 is about ± 0.03 mm.

On the other hand, the polishing plate holding jig 110 is
01 has an upper die 111 having a fitting hole 111a to be fitted with the columnar projection 103 of the polishing plate 101.
3 is inserted to a predetermined depth of the fitting hole 111a of the upper die 111, and is fixed by tightening with a screw 112.

[0005] The upper die 111 is fixed to a lower die 114 which is integral with the rotating portion of the lower shaft of the main spindle by means of a shaft adjusting screw 113.

After the polishing sheet 102 is attached to the polishing plate 101 and the grinding process is performed, the center of the spherical curvature R of the polishing plate 101 is aligned with the center of rotation B-C of the polishing apparatus. The height A of 101 is adjusted.

As a method of adjusting the height, the polishing plate 101 is inserted into the fitting hole 111a of the upper die 111 of the polishing plate holding jig 110.
Are adjusted, the height is adjusted by measuring the center position of the spherical curvature R of the polishing dish 101 using an axis center / height measuring device (not shown), and fixed by screws 112.

The method of adjusting the shaft center is as follows. With the shaft center adjusting screw 113 loosened, the polishing center 10 is adjusted by the shaft center / height adjuster.
The eccentricity of the spherical surface of the polishing plate 101 is measured, and the spherical surface of the polishing plate 101 is adjusted within a predetermined eccentricity while the upper die 111 of the polishing plate holding jig 110 holding the polishing plate 101 is slightly slid. Tighten the center adjustment screw 113 to remove the upper mold 11
1 is fixed to the lower mold 114.

The above-mentioned shaft center adjustment and height adjustment both require an accuracy with a tolerance of ± 0.02 mm or less.

FIG. 6 is a diagram showing a combined polishing method for processing the surface of the polishing sheet 102 attached to the polishing plate 101 into a spherical surface having a predetermined spherical curvature R.

The mating plate 120 is a mating tool having a polished surface on which diamond pellets are stuck or a polished surface made of a diamond die and having a predetermined spherical curvature. The combination plate 120 is attached to a lower spindle of a combination polishing machine (not shown) and has a speed of approximately 100 to 200 rpm.
Spinning at.

The oscillating arm of the combined polishing machine has a hammer 1
21 is attached, and has a mechanism that swings right and left at a predetermined speed.

In this aligning method, the spherical surface of the polishing plate 101 is set so as to be in contact with the rotating aligning plate 120, and the wrench 121 is pressed against the wrench holder 104 attached to the center of the columnar projection 103 of the polishing plate 101. The polishing sheet 102 is polished by being swung right and left while being pressed and held and moved for a predetermined time. Thereby, the undulation of the polishing sheet 102 becomes flat, and a predetermined spherical precision can be created. The polishing amount of the polishing sheet 102 is usually 0.04 to 0.05 mm in order to flatten the waviness of the polishing sheet 102 and satisfy a predetermined spherical accuracy.
is necessary.

The polishing plate 101, which has been spherically formed in the above procedure and set on the polishing plate holding jig 110, is attached to the lower spindle of the above-mentioned ball-center polishing device, and is used for polishing a lens or the like. In the polishing using the spherical center polishing device, since the polishing pressure is directed toward the spherical center of the spherical surface of the polishing plate 101, stable lens accuracy can be obtained.

[0015]

However, according to the above prior art, there are the following unsolved problems.

In the apparatus shown in FIG. 5, the columnar projection 103 of the polishing dish 101 has a fitting depth with the fitting hole 111a of the upper die 111 of the polishing dish holding jig 110 for adjusting the height. The process of adjusting and tightening with the screw 112 is repeatedly performed. In this case, since the height needs to be constant, the screw 112 is always located at the same position on the columnar projection 103 of the polishing plate 101, and a dent is formed each time the screw 112 is tightened. , Marked dents,
A phenomenon occurs in which the height is shifted before and after the screw 112 is tightened.

For this reason, it takes an enormous amount of time to adjust the axis and height, and in the worst case, the height cannot be adjusted.
Expensive polishing dishes were unusable.

In addition, the following problem has also occurred in the combined polishing for creating the spherical surface of the polishing surface of the polishing dish 101. As shown in FIG. 6, the polishing dish 101 is held in a fitting hole 111a of an upper die 111 of a polishing dish holding jig 110.
Since it is integral with the fixed columnar projection 103, the rotation axis Z of the polishing plate 101 and the polishing sheet 102 of the polishing plate 101
The angle (alignment fulcrum angle) θ ₁ between a point G on the outer periphery of the upper spherical surface and a line GF connecting a point F at which the kansashi receiver 104 and the kansashi 121 of the polishing plate 101 come into contact with _{each other} is θ 1
01 on the polishing sheet 102 and the polishing plate 101
A point D on the rotation axis Z of the polishing plate 101 orthogonal to a line OG connecting the point G on the outer periphery of the spherical surface on the polishing sheet 102.
Between the line GD intersecting with the axis and the rotation axis Z (polishing dish contact angle)
smaller than θ _2. For this reason, the fulcrum at the time of the alignment processing is far from the processing surface of the alignment plate 120, and the contact surface between the polishing sheet 102 attached to the polishing plate 101 and the alignment plate 120 is pressed and held by the wrench 121. When a left-right swinging motion is given, vibration is generated, and the alignment processing is performed in a fluttering state.

The causes of such vibrations are presumed as follows. That is, the kansashi 121 and the polishing dish 101
At the contact point F of the kansashi receiver 104 repeats the left-right movement along the locus TR ₁ of the spherical curvature R ₁ . At this time, the contact surface between the polishing sheet 102 of the polishing plate 101 and the mating plate 120 moves along the locus TR of the spherical curvature R.
When the distance between trace TR of 21 trace TR ₁ and the abutment surface becomes longer, that each deviation of the direction line joining the force in the rotational moment fulcrum increases, obtaining a smooth operation on the abutment surface The friction resistance resulting from this
Problems caused by external factors such as the initial spherical accuracy of the polishing sheet 102 overlap, and chatter vibration occurs on the contact surface.

When chatter vibration occurs, the polishing sheet 10
The spherical surface of No. 2 wears much at the peripheral portion due to the flapping, and as a result, the spherical surface of the matching plate 120 cannot be transferred with high accuracy. Therefore, when the polishing plate 101 is set on the spherical center polishing device and the lens is processed. May not satisfy a predetermined accuracy standard.

In addition, there is a problem that the amount of polishing of the polishing sheet 102 with respect to the alignment time is significantly reduced due to the fluttering of the contact surface. As a result, a predetermined precision standard cannot be satisfied in lens polishing.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned unsolved problems of the prior art, and aims to prevent troubles in a mounting portion to a polishing tool holding device and to greatly improve processing accuracy in combined polishing. It is an object of the present invention to provide a polishing tool, a polishing tool holding device, a polishing device, and a combined polishing method for processing the polishing tool.

[0023]

To achieve the above object, a polishing tool according to the present invention comprises a main body having a spherical polishing surface, and a ring protruding from the back side of the main body with respect to the polishing surface. A belt projection, and fixing means for detachably fixing a columnar body inserted into a center hole of the annular zone projection to the annular zone projection, wherein the main body is polished through the columnar body. It is characterized by being attached to a tool holding device.

It is preferable that a wrench holder is provided at the bottom of the center hole of the annular projection.

It is preferable that the fixing means has a screw penetrating through the annular projection in the radial direction.

The polishing tool holding device of the present invention comprises: a columnar body to be inserted into a center hole of the annular projection of the polishing tool; an upper mold for holding the columnar body; And has a lower die that can be adjusted finely.

[0027] The columnar body may have a small diameter portion that fits into the center hole of the annular projection of the polishing tool.

A polishing apparatus according to the present invention comprises:
The polishing tool is characterized by having driving means for driving the polishing tool to rotate.

Further, the polishing tool may have a polishing tool held by the above-mentioned polishing tool holding device, and a driving means for driving the polishing tool to rotate.

The combined polishing method of the present invention is a combined polishing method in which the above-mentioned polishing tool is combined and polished with a combination plate, and the polishing is performed by setting the fulcrum angle of the polishing tool larger than the contact angle of the polishing tool. It is characterized by the following.

[0031]

An annular projection is provided on the back side of the main body of a polishing dish, which is a polishing tool, and the columnar body of the polishing tool holding device is inserted into the center hole thereof, and the depth of the insertion is adjusted by adjusting the insertion depth. Perform height adjustment.

When the columnar body is damaged by a dent due to height adjustment, only the columnar body needs to be replaced. Therefore, an expensive polishing plate as in the case where the main body of the polishing plate and the columnar body are integrated is used. There is no need for replacement, which can contribute to maintenance cost reduction.

Further, by providing a wrench holder on the bottom surface of the center hole of the annular projection, the fulcrum angle of the polishing tool can be set larger than the contact angle of the polishing tool. Is greatly improved, and a polishing tool having a polishing surface with high spherical accuracy can be realized.

[0034]

Embodiments of the present invention will be described with reference to the drawings.

FIG. 1 shows a polishing tool and a polishing tool holding device according to an embodiment.
Has a polishing surface made of a polishing sheet 2, and the main body 1 a of the polishing plate 1 has an annular projection 3 on the back side of the polishing surface, and a bottom of a center hole 3 a of the annular projection 3. A kansashi receiver 4 is attached.

On the other hand, a polishing dish holding jig 10 serving as a polishing tool holding device has an upper die 11 having a columnar body 11a fitted into the center hole 3a of the annular projection 3 of the polishing dish 1. Dish 1
The columnar body 11a of the upper mold 11 is inserted into the center hole 3a of
To a predetermined depth, and fastened and fixed by screws 12a as fixing means. The columnar body 11a is fixed to the upper mold 11 by screws 12b, and the upper mold 11 is fixed by a shaft center adjusting screw 13 to a lower mold 14 integrated with the rotating portion of the main shaft lower shaft.
Fixed to

After the polishing sheet 2 is adhered to the polishing plate 1 and the lamination process is performed, the polishing plate 1 is adjusted so that the center point O of the spherical curvature R of the polishing plate 1 and the swinging center BC of the polishing device coincide. 1. Adjust the height A.

As a method of adjusting the height, the columnar body 11a of the upper die 11 of the polishing dish holding jig 10 is fitted into the center hole 3a of the annular projection 3 of the polishing dish 1, and the axis center and height (not shown) are set. Using a height measuring device, the center position of the spherical curvature R of the polishing plate 1 is measured to adjust the height, and fixed with screws 12a.

The method of adjusting the shaft center is as follows. With the shaft center adjusting screw 13 loosened, the eccentricity of the spherical surface of the polishing plate 1 is measured by the shaft center / height adjuster, and the polishing with the polishing plate 1 held is performed. While the upper die 11 of the plate holding jig 10 slides finely, the polishing plate 1
Is adjusted within a predetermined eccentricity accuracy, and then the shaft center adjusting screw 13 is tightened to fix the upper mold 11 to the lower mold 14.

Each of the above-described shaft center adjustment and height adjustment requires an accuracy with a tolerance of ± 0.02 mm or less.

FIG. 4 shows a method of processing the polishing plate 1. The polishing plate 20 has a polishing surface to which diamond pellets are adhered or a polishing surface made of a diamond die and having a predetermined spherical curvature. It is a mating tool having a surface. The combination tray 20 is attached to a lower spindle of a combination machine (not shown) and rotates at approximately 100 to 200 rpm.

A screw 21 is attached to the swing arm of the aligner, and has a mechanism that swings left and right at a predetermined speed.

This matching method uses a rotating matching plate 20.
The spherical surface of the polishing plate 1 is set so as to be in contact with
The polishing sheet 2 is polished by pressing the wrench 21 against the wrench holder 4 attached to the center of the annular projection 3, pressing and holding it, swinging it to the left and right, and moving it for a certain time. Thereby, the undulation of the polishing sheet 2 becomes flat and a predetermined spherical precision can be created. The amount of wear of the polishing sheet 2 is usually required to be 0.04 to 0.05 mm in order to flatten the undulation of the polishing sheet 2 and satisfy a predetermined spherical accuracy.

The polishing dish 1 created by the above-described procedure and set on the polishing dish holding jig 10 is attached to the lower spindle of the spherical polishing machine, and is used for polishing a lens or the like. In the polishing process using the spherical center polishing machine, the polishing pressure is directed to the spherical center direction of the spherical surface of the polishing plate 1, so that stable lens accuracy can be obtained.

Since the wrench holder 4 of the polishing plate 1 is disposed at the bottom of the center hole 3a of the annular projection 3 as described above, the polishing plate having the fulcrum angle in the polishing process shown in FIG. The fulcrum angle θ ₁ is larger than the polishing dish contact angle θ ₂ which is a polishing tool contact angle. As a result, the fulcrum F at the time of alignment
Is brought close to the processing surface, and the contact surface between the polishing sheet 2 attached to the polishing plate 1 and the matching plate 20 is pressed and held by the wrench 21 so that no vibration is generated even when the left and right swinging motion is given. Transferability is improved stably.

That is, the fulcrum F where the kansetsu 21 of the alignment process and the kansashi receiver 4 of the polishing plate 1 are in contact is the spherical curvature R
_The left-right swing is repeated along _one locus TR1. At this time, the contact surfaces of the polishing sheet 2 of the polishing plate 1 and the combination plate 20 are
It moves along the locus TR of the spherical curvature R,
The closer the distance between the _first trajectory TR1 and the trajectory TR, the more stable the alignment processing without troubles such as vibration can be performed.

The polishing procedure using the polishing plate 1 is as follows.
A polishing sheet 2 made of polyurethane or the like is attached to and adhered to a polishing dish 1. The spherical surface of the polishing sheet 2 after application is completed to have a spherical curvature close to a target value in a state where the polishing sheet 2 itself has undulations and irregularities.

Next, in order to make the spherical surface accuracy and the surface state of the polishing sheet 2 into a predetermined shape, matching processing is performed with the matching plate 20. Kansashi 21 and polishing dish 1 at the time of alignment processing
Since the fulcrum F contacting the kansashi receiver 4 is set so as to approach the contact surface between the polishing sheet 2 attached to the polishing plate 1 and the matching plate 20, the fulcrum F is pressed and held on the matching plate 20 by the wrench 21. Even when a left and right swinging motion is applied to the ground polishing dish 1, no vibration is generated, the transferability is improved, and the polishing is stabilized. Therefore, a predetermined spherical accuracy can be reliably obtained. In addition, the required wear amount of the polishing sheet 2 (0.04 to
(About 0.05 mm) can be achieved in a short time.

In setting the polishing plate fulcrum angle θ ₁ , it has been found from experimental results that there is a boundary angle at which a problem occurs near the polishing plate contact angle θ _2. Setting value.

The polishing dish 1 after the alignment processing is held by the polishing dish holding jig 10 as described above, and is mounted on a polishing apparatus.
Polish the lens and the like. The columnar body 11a of the upper die 11 of the polishing dish holding jig 10 needs to be replaced when the damage due to the tightening by the screw 12a progresses. There is a cost merit that the cost is extremely low as compared with the case of replacing.

FIG. 2 shows a modification. This is a polishing dish 1
When the spherical curvature is relatively small, the annular shape of the annular projection 3 also becomes small.
A small-diameter portion 11b is provided on an upper portion of a columnar body 11a which can be attached and detached by a fixing screw 12b, and the small-diameter portion 11b is fitted into a center hole 3a of an annular projection 3 of the polishing plate 1.

FIG. 3 shows a polishing apparatus equipped with a polishing dish having the above-described configuration. A polishing plate 201 similar to the polishing plate 1 is provided with a tool shaft 221 as a lower shaft via a polishing plate holding jig (not shown).
Attached to. The work W, which is a lens material, is held by a holder 204 via a holding member 203, and the work shaft 205 is supported by a bearing in a radial direction with respect to a work shaft sleeve 206, and can freely rotate and swing. . The work shaft sleeve 206 is slidable with respect to the work shaft housing 207 in the vertical direction on the paper surface, and a stopper S is attached to the upper end to prevent the stopper S from coming off.

The work shaft housing 207 is integrated with the work shaft slide 212, and the work shaft slide 212 is driven with respect to the guide 213 by using the air cylinder 215 in the vertical direction on the paper.

Further, the pressing spring 209 attached between the upper end of the work shaft sleeve 206 and the upper end of the work shaft housing 207 extends beyond its natural length, so that the work W is transferred to the polishing plate 201 via the holder 204. A load can be applied by pressing the sheet downward. At this time, the applied load is adjusted by a screw 211 that stops the lower end of the pressure spring 209 on the pressure adjustment plate 210.

On the other hand, the tool shaft rotating motor 2
The rotation of 25 is transmitted via the rotating belt 223, and the tool shaft 221 rotates together with the polishing plate 201 and the holder 204. The oscillating rotation shaft 226 to which the eccentric link 227 is attached is rotated by a motor (not shown) to drive the oscillating plate 220.

After the load value is adjusted according to the position of the screw 211, the work W slide placed on the polishing plate 201 is moved down by the work shaft slide 212, and the holder 204 presses the work W. Thereafter, by rotating the tool shaft 221 and the oscillating rotation shaft 226, the polishing plate 201 rotates and oscillates, and performs polishing for a certain period of time.

At this time, the spherical center O of the spherical curvature of the polishing plate 201 is set so as to coincide with the center of rotation, and the work W is held by the holder 204, and the work shaft shaft integrated with the holder 204. It rotates by the frictional force received from the processing surface together with 205.

As described above, since the polishing plate 201 has high transferability of the spherical accuracy of the matching plate at the time of the aligning process, the spherical surface is formed with high accuracy, and the height of the spherical center is adjusted with high accuracy. Is possible. Lenses polished under such favorable conditions have extremely high spherical accuracy with good reproducibility,
High quality is guaranteed.

[0059]

Since the present invention is configured as described above, the following effects can be obtained.

The processing accuracy and stability in the polishing of the polishing plate can be greatly improved, and the tool cost can be reduced.

As a result, the accuracy of the spherical processing in the polishing of the lens or the like is greatly improved, and a high-quality lens can be manufactured at low cost.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing a polishing dish and a polishing dish holding jig according to an embodiment.

FIG. 2 is a schematic diagram showing a modification.

FIG. 3 is a diagram illustrating a polishing apparatus.

FIG. 4 is a view for explaining a process of aligning the polishing plate of FIG. 1;

FIG. 5 is a schematic diagram showing one conventional example.

FIG. 6 is a view for explaining a process of aligning the polishing plate of FIG. 5;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1, 201 Polishing dish 1a Main body part 2 Polishing sheet 3 Ring projection 3a Center hole 4 Kansashi receiver 10 Polishing dish holding jig 11 Upper mold 11a Columnar body 11b Small diameter part 12a, 12b Screw 13 Axis adjustment screw 14 Lower mold 20 Fitting plate 21 Kansashi 204 Holder 205 Work axis shaft 210 Pressurizing adjustment shaft 212 Work axis slide 215 Air cylinder 221 Tool axis 225 Tool axis rotation motor 226 Swing rotation axis

Claims (8)

[Claims] 1. A main body having a spherical polishing surface, an annular projection protruding from the back side of the main body with respect to the polishing surface, and a columnar shape inserted into a center hole of the annular projection. A polishing tool comprising fixing means for detachably fixing a body to the annular projection, wherein the main body is attached to a polishing tool holding device via the columnar body. 2. The polishing tool according to claim 1, wherein a wrench holder is provided at the bottom of the center hole of the annular projection. 3. The polishing tool according to claim 1, wherein the fixing means has a screw penetrating through the annular projection in the radial direction. 4. A polishing tool holding device for holding a polishing tool according to claim 1, wherein the columnar body is inserted into a center hole of a ring-shaped projection of the polishing tool, and the columnar body. A polishing tool holding device having an upper die for holding a body and a lower die for holding the upper die so as to be finely adjustable in a predetermined plane. 5. The columnar body has a small-diameter portion that fits into a center hole of an annular projection of the polishing tool.
The polishing tool holding device according to the above. 6. A polishing apparatus comprising: the polishing tool according to claim 1; and driving means for rotating and driving the polishing tool. 7. A polishing apparatus comprising: a polishing tool held by the polishing tool holding device according to claim 4; and driving means for rotating and driving the polishing tool. 8. A polishing method for polishing a polishing tool according to claim 1, wherein said polishing tool is polished by a lapping plate, wherein a fulcrum angle of said polishing tool is set to be larger than a contact angle of said polishing tool. A combined polishing method characterized by performing processing.