JPH0475870A - Surface lap polishing machine - Google Patents

Surface lap polishing machine

Info

Publication number
JPH0475870A
JPH0475870A JP2188189A JP18818990A JPH0475870A JP H0475870 A JPH0475870 A JP H0475870A JP 2188189 A JP2188189 A JP 2188189A JP 18818990 A JP18818990 A JP 18818990A JP H0475870 A JPH0475870 A JP H0475870A
Authority
JP
Japan
Prior art keywords
pulley
surface plate
transmission
plate
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2188189A
Other languages
Japanese (ja)
Inventor
Junichi Suzuki
淳一 鈴木
Masao Noguchi
野口 雅夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokin Corp
Original Assignee
Tokin Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokin Corp filed Critical Tokin Corp
Priority to JP2188189A priority Critical patent/JPH0475870A/en
Publication of JPH0475870A publication Critical patent/JPH0475870A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To improve a polishing accuracy, by using a driving pulley and transmission pulley provided with taper on the outer periphery of a surface plate with the rotation of the surface plate being utilized, and adjusting the azimuth speed of a correction ring and that of the surface plate identically with this space being joined by an O ring for transmission. CONSTITUTION:A rotation force is taken out of the side face of a rotating surface plate1 by a driving pulley 5 closely fitted to the surface plate 1 side face, the rotation force fed from the surface plate 1 is transmitted to a transmission pulley 4 via an O ring 6 for transmission and a correction ring 2 in which the body 3 to be polished is stored, is driven with its rotation to the inner diameter side by the transmission pulley 4 fixed to a plate 11 and an auxiliary pulley 7. Consequently, the polishing in a high accuracy with less vibration and small rotation error can be performed.

Description

【発明の詳細な説明】 イ9発明の目的 〔産業上の利用分野〕 本発明は、ラップ盤により被研磨物の加工面をサブミク
ロン単位で平滑に、及び平坦に研磨する平面ラップ研磨
盤に係り、特に新規な強制回転機構を備えた、構造が簡
単でしかも研磨精度の高い被研磨物が得られる平面ラッ
プ研磨盤に関するものである。
Detailed Description of the Invention A9.Objective of the Invention [Field of Industrial Application] The present invention is directed to a flat lapping polishing machine that uses a lapping machine to polish the processed surface of a workpiece to be smooth and flat in submicron units. In particular, the present invention relates to a flat lapping polishing machine that is equipped with a novel forced rotation mechanism, has a simple structure, and can produce objects to be polished with high polishing accuracy.

〔従来の技術〕[Conventional technology]

従来、この種の強制回転機構は、その動力源を定盤回転
用動力と、又修正リングの回転は、別途の動力より取り
出すために、伝達機構としてウオームやギヤ、又はベル
トやチェーンを必要とし、又これらの伝達機構を支持す
るための構造物とから構成されており、構造が複雑とな
ることと、形状が大きなものとなり、補修時の部品交換
や装置調整が繁雑となり、一方、研磨装置の重量も大き
くなり、−価格も高価になる等の欠点があった。又、被
研磨物の回転に対しては、別動力を用い、複雑な伝達機
構によるため振動源が多くなり、研磨加工中に被研磨物
へ損傷を与える等、高精度の研磨が不可能であった。
Conventionally, this type of forced rotation mechanism requires a worm, gears, belt, or chain as a transmission mechanism in order to derive its power source from the power for rotating the surface plate and a separate power source for rotation of the correction ring. , and structures to support these transmission mechanisms.The structure is complicated and the shape is large, making it complicated to replace parts and adjust the equipment during repairs.On the other hand, the polishing equipment It has disadvantages such as increased weight and high price. In addition, separate power is used to rotate the object to be polished, and a complicated transmission mechanism increases the number of vibration sources, which may damage the object during the polishing process and make high-precision polishing impossible. there were.

又、定盤と修正リングとの間に、一定の比率の速度ベク
トルを与えて高精度な研磨を行うため、定盤の回転に同
期して修正リングを強制回転させるための電気的制御は
、定盤と修正リングの同期・非同期の監視用検出器、伝
達系の機械損欠を監視する制御側に組込んだコントロー
ラ、コントローラの指令に対し素早い動作を行う電動機
とするための複雑な制御系を必要とするなどの欠点があ
った6 〔発明が解決しようとする課題〕 本発明は、これらの欠点を除去するために、定盤側面に
押圧された駆動プーリで定盤より回転力を取り出し、伝
達機構を介して伝達プーリを回し。
In addition, in order to perform high-precision polishing by applying a speed vector of a fixed ratio between the surface plate and the correction ring, the electric control for forcibly rotating the correction ring in synchronization with the rotation of the surface plate is as follows. A detector for monitoring the synchronization and asynchronousness of the surface plate and the correction ring, a controller built into the control side to monitor mechanical damage in the transmission system, and a complex control system that allows the motor to operate quickly in response to controller commands. [Problems to be Solved by the Invention] In order to eliminate these drawbacks, the present invention extracts rotational force from the surface plate using a drive pulley pressed against the side surface of the surface plate. , turn the transmission pulley through the transmission mechanism.

補助プーリと共に伝達プーリに接する修正リングを強制
回転させ、駆動プーリと伝達プーリの間の伝達機構は夫
々のプーリにテーパを設けて定盤の回転数に対する修正
リングの回転数を変える構造とし、簡単な構造で電気的
制御が不必要で振動が少なく、調整が簡単で被研磨物表
面の平坦度の仕上げ精度がサブミクロンの研磨を可能と
する、修正リングの強制回転機構を有する平面ラップ盤
を提供するにある。
The correction ring in contact with the transmission pulley is forcibly rotated together with the auxiliary pulley, and the transmission mechanism between the drive pulley and the transmission pulley has a structure in which each pulley is tapered to change the rotation speed of the correction ring relative to the rotation speed of the surface plate. This is a flat lapping machine with a forced rotation mechanism for the correction ring, which has a structure that does not require electrical control, has little vibration, is easy to adjust, and enables submicron polishing of the flatness of the surface of the polished object. It is on offer.

又、前述の駆動プーリと、伝達プーリ間の回転数の調整
は、駆動プーリと、伝達プーリの外周部に設けたテーパ
部において夫々のプーリ径を変えるよう連結要素を移動
させ、無段変速を行える構造としてあり、定盤と修正リ
ングとをある一定比率で同期回転させることにより高精
度な研磨加工を行うもので、即ち研磨効率を向上させる
ために。
In addition, the rotation speed between the drive pulley and the transmission pulley can be adjusted by moving the connecting element to change the diameter of each pulley at the tapered part provided on the outer periphery of the drive pulley and the transmission pulley, thereby achieving continuously variable speed. This structure enables high-precision polishing by rotating the surface plate and correction ring synchronously at a certain ratio, in other words, to improve polishing efficiency.

定盤と修正リングの相対速度を高めた平坦度の高い研磨
が可能な平面ラップ研磨盤を提供するにある。
To provide a flat lapping polishing machine capable of polishing with high flatness by increasing the relative speed of a surface plate and a correction ring.

以下余白 口0発明の構成 〔課題を解決するための手段〕 本発明は、内径側に被研磨物を収める修正リングをその
表面にのせて回転する定盤に接近して、定盤と分離した
支柱に固定されたプレートと、プレートに固定し支持さ
れた伝達プーリと補助プーリとにより定盤上を回転する
修正リングを保持し、前記プレートに一点で支持された
補助プレートには、定盤外周に密接して回転する駆動プ
ーリが設けてあり、補助プレート先端の駆動プーリ取付
は位置とプレートとの間には圧縮コイルばねを取付は駆
動プーリを定盤の外周側面に密接させる。又駆動プーリ
と伝達プーリとの間は伝達用Oリングで結合してあり、
又駆動プーリと伝達プーリの回転軸側面にはテーパが設
けてあり、それ故夫々のプーリを結合する伝達0リング
の駆動位置により、駆動プーリの回転と伝達プーリとの
回転比を無段で変えることが出来る。即ち定盤の回転数
と修正リングとの回転比を連続的に変えることが出来る
こととなる0本発明の平面ラップ盤は、叙上の通りに構
成された平面ラップ盤であり、定盤上の修正リング内の
被研磨物の位置において、定盤中心から被研博物迄の距
離をrl、修正リング内の被研磨物と修正リングの中心
までの距離をr2とし、定盤の角速度を胃3、修正リン
グの角速度をw2とする時、胃1×rl=W2Xr2と
なるように修正リングの角速度を駆動プーリと伝達プー
リのOリングの位置を変え、合わせることにより、修正
リングの内径内に収めた被研磨物の、定盤と修正リング
の相対速度を修正リング内の位置に関係なく一様にする
ことが出来、修正リング内では位置に関係なく研磨を均
一にすることが出来る。従って、本発明の平面ラップ研
磨盤とすることにより被研磨物の平坦度をサブミクロン
に仕上げることが出来る。
The following is a configuration of the invention with zero margins [Means for solving the problem] The present invention is characterized in that a correction ring for storing a workpiece to be polished on the inner diameter side is placed on the surface of the correction ring, approached to a rotating surface plate, and separated from the surface plate. A correction ring that rotates on a surface plate is held by a plate fixed to a column, and a transmission pulley and an auxiliary pulley fixed and supported by the plate. A drive pulley is provided which rotates in close contact with the auxiliary plate, and a compression coil spring is installed between the position of the drive pulley at the tip of the auxiliary plate and the plate to bring the drive pulley into close contact with the outer circumferential surface of the surface plate. Also, the drive pulley and transmission pulley are connected by a transmission O-ring.
In addition, there is a taper on the side of the rotation shaft of the drive pulley and transmission pulley, so the rotation ratio between the rotation of the drive pulley and the transmission pulley can be changed steplessly depending on the drive position of the transmission O-ring that connects each pulley. I can do it. In other words, it is possible to continuously change the rotation speed of the surface plate and the rotation ratio of the correction ring. At the position of the object to be polished in the correction ring, the distance from the center of the surface plate to the object to be polished is rl, the distance between the object to be polished in the correction ring and the center of the correction ring is r2, and the angular velocity of the surface plate is 3. When the angular velocity of the correction ring is w2, change the angular velocity of the correction ring so that it becomes 1 x rl = W2 The relative speed between the surface plate and the correction ring of the housed object to be polished can be made uniform regardless of the position within the correction ring, and polishing can be made uniform regardless of the position within the correction ring. Therefore, by using the flat lapping polishing machine of the present invention, the flatness of the object to be polished can be finished to submicron level.

〔作用〕[Effect]

本発明は、回転する定盤の側面から、定盤側面に密接す
る駆動プーリにより回転力を取り出し、伝達用0リング
を介して伝達プーリに定盤からの回転力を伝達し、プレ
ートに固定された伝達プーリと補助プーリとにより内径
側に被研磨物を収めた修正リングを回転駆動する。叉、
駆動ブ・〜りど伝達プーリの回転軸外側の伝達用0リン
グを取り付けた部分にはテーパが設υてあり、夫々のプ
ーリの伝達用0リングの位置を変え、調整用ゴムにより
位置を固定して定盤に対する修正リングの回転数を変え
ることが出来る。この時、修正リングの角速度がW2、
定盤の角速度を胃、で、被研磨物と定盤中心との距離が
r2、被研磨物と修正リング中心との距M6がr2であ
る時、修正リングの角速度と定盤の角速度を同じ値に調
整することIJより、修正リング内における被研磨物の
定盤との相対速度を一定にすることが出来る。
The present invention extracts rotational force from the side surface of a rotating surface plate using a drive pulley that is in close contact with the surface plate side surface, transmits the rotational force from the surface plate to the transmission pulley via a transmission O-ring, and fixes the surface plate to the plate. A transmission pulley and an auxiliary pulley rotate a correction ring containing an object to be polished on the inner diameter side. Fork,
There is a taper in the part where the transmission O-ring is installed on the outside of the rotation axis of the drive brake/rider transmission pulley, and the position of the transmission O-ring on each pulley can be changed and the position fixed using the adjustment rubber. The rotation speed of the correction ring relative to the surface plate can be changed by At this time, the angular velocity of the correction ring is W2,
When the angular velocity of the surface plate is 2, the distance between the object to be polished and the center of the surface plate is r2, and the distance M6 between the object to be polished and the center of the correction ring is r2, the angular velocity of the correction ring and the surface plate are the same. By adjusting the IJ value, the relative velocity of the object to be polished with respect to the surface plate within the correction ring can be made constant.

第3図において、修正リング2の半径をχとし。In FIG. 3, the radius of the correction ring 2 is assumed to be χ.

修正リングの内径内で被研磨物を研磨する時、被研磨物
の設置位置を定盤の外周に接したA点、修正リングの中
心02点、定盤の中心に近いB点にある時の各被研磨物
の相対速度は、 a)A点では Wl (a+2 z )−Z 12胃1
−胃2の時  t+(a”z) 1))02点では Wl (z +a)+O=w+ (
a+ z )c)B点では Wia”W2Z W1″訃である故 wl(a+χ) 即ち定盤と修正リングの角度を一定の条件どすることに
より、修正リングの内部では条件a)、 b)、C)共
定盤と被研磨物との相対速度は一定とすることが出来る
When polishing an object to be polished within the inner diameter of the correction ring, the installation position of the object to be polished is at point A touching the outer periphery of the surface plate, point 02 at the center of the correction ring, and point B near the center of the surface plate. The relative velocity of each object to be polished is: a) At point A, Wl (a+2 z ) - Z 12
- At stomach 2 t+(a”z) 1)) At 02 points Wl (z +a)+O=w+ (
a+ z ) c) At point B, Wia"W2Z W1", so wl(a+χ) In other words, by setting the angle between the surface plate and the correction ring to a certain condition, conditions a), b), C) The relative speed between the co-surface plate and the object to be polished can be constant.

〔実施例〕〔Example〕

以下、本発明の実施例について図面を用い詳細に説明す
る。
Embodiments of the present invention will be described in detail below with reference to the drawings.

第1図は、本発明による平面ラップ盤の修正リングの強
制回転機構の一実施例の構成を示す斜視図である。強制
回転機構本体は、回転する定盤1に接近した位置の固定
された支柱12に一体に支持されたプレート11に固定
された伝達プーリ4と、補助プーリ7と、プレート11
に、支点13により回転自在に支持された補助プレート
10の一端に固定された駆動プーリ5と、駆動プーリ5
は定盤1の外側に密接し、駆動プーリの回転力を伝達用
0リング6を介し伝達プーリに伝達する。伝達用0リン
グ6と駆動プーリ5を定盤1に絶えず押しつけるだめに
、補助ブ1ノ〜l・10の先端とブlノー 1−11と
の間には圧縮コイルばね9が取り付けられ構成されてい
る。
FIG. 1 is a perspective view showing the structure of an embodiment of a forced rotation mechanism for a correction ring of a flat lapping machine according to the present invention. The forced rotation mechanism main body includes a transmission pulley 4 fixed to a plate 11 that is integrally supported by a fixed column 12 located close to the rotating surface plate 1, an auxiliary pulley 7, and a plate 11.
, a drive pulley 5 fixed to one end of an auxiliary plate 10 rotatably supported by a fulcrum 13;
is in close contact with the outside of the surface plate 1, and transmits the rotational force of the drive pulley to the transmission pulley via the transmission O-ring 6. In order to constantly press the transmission O-ring 6 and the driving pulley 5 against the surface plate 1, a compression coil spring 9 is installed between the tips of the auxiliary valves 1 to 10 and the cylinders 1-11. ing.

次に、この強制回転機構の作用について説明する。駆動
プーリ5は支点13を中心に揺動可能どなっており、プ
レート11と補助ブlノーhioとに連結された圧縮コ
イルばね9により、回転する定盤1の外側面に絶えず押
しつけられており、該定盤1が回転すると同時に駆動プ
ーリ5は回転する。又、この時、駆動プーリ5と伝達プ
ーリ4との間にかけられた伝達用Oリング6を介して該
伝達プーリ4も回転駆動力が加えられる。
Next, the operation of this forced rotation mechanism will be explained. The drive pulley 5 is capable of swinging around a fulcrum 13, and is constantly pressed against the outer surface of the rotating surface plate 1 by a compression coil spring 9 connected to a plate 11 and an auxiliary bracket 13. , the drive pulley 5 rotates at the same time as the surface plate 1 rotates. At this time, a rotational driving force is also applied to the transmission pulley 4 via the transmission O-ring 6 placed between the drive pulley 5 and the transmission pulley 4.

一方、修正リング2は、内側に被研磨物3を保持し、伝
達プーリ4と補助プーリ7に接しており、該伝達プーリ
4に回転駆動力が加えられることにより修正リング2が
回転される。駆動プーリ5、伝達プーリ4、補助プーリ
7の定盤及び修正リングに接する外周には、0リング8
がそれぞれのプーリに設りられた溝部にはめ込まれてお
り、0リング8を介して定盤及び修正リングに接触する
故、回転時の衝撃をやわらげ、又振動を押さえている。
On the other hand, the correction ring 2 holds the object to be polished 3 inside and is in contact with the transmission pulley 4 and the auxiliary pulley 7, and the correction ring 2 is rotated by applying rotational driving force to the transmission pulley 4. An O-ring 8 is attached to the outer periphery of the driving pulley 5, transmission pulley 4, and auxiliary pulley 7 in contact with the surface plate and the correction ring.
are fitted into grooves provided in each pulley, and contact the surface plate and correction ring via the O-ring 8, which softens the impact during rotation and suppresses vibration.

第2図は、本発明の平面ラップ盤の修正リング強制回転
機構における無断変速機構の説明図である。修正リング
2を定盤1に同期回転させるために、予め定盤1、修正
リング2の直径により駆動プーリ5と、伝達プーリ4の
直径を決め、角速度の設計を行うが、0リング8の接触
時の変形や滑りにより14差を生じる。このため本発明
では、その誤差を最小にするために、第2図に示すよう
に、定盤の回転数と修正リングの回転数を誤差がなく直
線的に回転数の割合を変えられる無断変速機構を設けた
ものである。無断変速機構は、駆動プーリ5と伝達用プ
ーリ4の外周の円筒部にテーパを設け、その回りに伝達
用Oリング6を取り伺け、調整用ゴム14a、調整用ゴ
ム141)を上下させることにより駆動ブ・−りと伝達
プーリの伝達用0リング接する直径の値の比を変えるこ
とで、無断9速を実現するものである。ナラ1−15は
ダブルナツトとじてあり、調整用ゴム14a、調整用ゴ
ム1413を固定する。
FIG. 2 is an explanatory diagram of the continuously variable speed change mechanism in the correction ring forced rotation mechanism of the flat lapping machine of the present invention. In order to rotate the correction ring 2 synchronously with the surface plate 1, the diameters of the drive pulley 5 and transmission pulley 4 are determined in advance according to the diameters of the surface plate 1 and correction ring 2, and the angular velocity is designed. A difference of 14 occurs due to deformation and slippage over time. For this reason, in the present invention, in order to minimize the error, as shown in FIG. It is equipped with a mechanism. The variable speed mechanism has a tapered outer cylindrical portion of the driving pulley 5 and the transmission pulley 4, around which the transmission O-ring 6 can be inserted, and the adjustment rubber 14a and the adjustment rubber 141) can be moved up and down. By changing the ratio of the diameters of the drive pulley and the transmission O-ring of the transmission pulley in contact with each other, nine speeds can be achieved without permission. The nuts 1-15 are closed with double nuts, and fix the adjusting rubber 14a and the adjusting rubber 1413.

以下、本発明による平面ラップ盤により被研磨物を研磨
した例について説明する6 第1図において、定盤の外径は300mmφ、内径90
履履φで錫定盤を用い、修正リングはセラミックス製で
、外径140■園φ、内径10抛厘φの物を用いた。
An example of polishing an object to be polished using a flat lapping machine according to the present invention will be described below.6 In Fig. 1, the outer diameter of the surface plate is 300 mmφ, and the inner diameter is 90 mm.
A tin surface plate was used for the shoe φ, and the correction ring was made of ceramic and had an outer diameter of 140 mm and an inner diameter of 10 mm.

第1図に示す樹脂製のワークキャリヤに一辺が20關の
立方体状のモリブデン酸のブロックを接着し、定盤と被
研磨物であるモリブデン酸鉛の間にはダイヤモンド砥粒
を流し、定盤の回転数を毎分20回乃至30回とし研磨
を行ったところ、研磨面の平面度が0.16μ璽に達す
る迄の時間が、従来の平面ラップ盤によれば研磨時間3
0分を要したのに対し、本発明の平面ラップ盤では研磨
時間をほぼ半分の時間で従来と同様な平面度が得られた
A cube-shaped block of molybdate with 20 squares on each side is glued to the resin work carrier shown in Figure 1, and diamond abrasive grains are poured between the surface plate and lead molybdate, which is the workpiece to be polished. When polishing was carried out at a rotation speed of 20 to 30 times per minute, the time it took for the polished surface to reach a flatness of 0.16 μm was as long as 3 polishing times using a conventional flat lapping machine.
In contrast, the flat lapping machine of the present invention required approximately half the polishing time to obtain the same level of flatness as the conventional method.

ハ1発明の効果 〔発明の効果〕 以上述べたごとく本発明の平面ラップ研磨盤によれば、
修正リングを駆動する別駆動源を用いずに、定盤の回転
を利用して、定盤の外周にテーパを設けた駆動プーリと
伝達プーリを用い、その間を伝達用Oリングで接合して
修正リングの回転角速度と定盤の回転角速度とを同じに
なる様、簡単な構造で安価で構成したものであり、振動
も少なく、回転誤差の小さい、高精度に研磨加工が行え
又、研磨効率を向上させるために定盤と修正リングの回
転速度を上げる際にも、無段変速が簡単な調整ですむ等
の利点を持った平面ラップ研磨盤の提供が可能となった
C1 Effects of the invention [Effects of the invention] As described above, according to the flat lapping polishing machine of the present invention,
Instead of using a separate drive source to drive the correction ring, corrections can be made by using the rotation of the surface plate, using a drive pulley and a transmission pulley with a tapered outer periphery of the surface plate, and connecting them with a transmission O-ring. It has a simple structure and is inexpensive so that the rotational angular velocity of the ring and the surface plate are the same, and it produces less vibration, less rotational error, and can perform highly accurate polishing, and also improves polishing efficiency. It has now become possible to provide a flat surface lapping polishing machine that has the advantage of a stepless variable speed that requires simple adjustment when increasing the rotational speed of the surface plate and correction ring in order to improve the polishing performance.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、本発明の平面ラップ研磨盤を示す斜視図。 第2図は、本発明の平面ラップ研磨盤の無段変速機構を
示す正面図。 第3図は、本発明の平面ラップ研磨盤の修正リングと定
盤との角速度と被研磨物の相対速度を説明する平面図。 1・・・定盤、2・・・修正リング、3・・・被研磨物
、4・・・伝達プーリ、5・・・駆動プーリ、6・・・
伝達用0リング、7・・・補助プーリ、8・・・Oリン
グ、9・・・圧縮コイルばね、10・・・補助プレート
、11・・・プレート、12・・・支柱、13・・・支
点、14a、 14b・・・調整用ゴム、15・・・ナ
ツト、16・・・ワークキャリヤ。 第1図
FIG. 1 is a perspective view showing a flat lapping polishing machine of the present invention. FIG. 2 is a front view showing the continuously variable transmission mechanism of the flat lapping polishing machine of the present invention. FIG. 3 is a plan view illustrating the angular velocity between the correction ring and surface plate of the flat lapping polishing machine of the present invention and the relative velocity of the object to be polished. DESCRIPTION OF SYMBOLS 1... Surface plate, 2... Correction ring, 3... Work to be polished, 4... Transmission pulley, 5... Drive pulley, 6...
Transmission O-ring, 7... Auxiliary pulley, 8... O-ring, 9... Compression coil spring, 10... Auxiliary plate, 11... Plate, 12... Support column, 13... Fulcrum, 14a, 14b... Adjustment rubber, 15... Nut, 16... Work carrier. Figure 1

Claims (1)

【特許請求の範囲】[Claims] 1、定盤上方に位置する支柱に固定されたプレートに、
被研磨物を収納する修正リングに回転駆動を伝達する伝
達プーリと、修正リングに応動回転する補助プーリと、
前記プレートの支点に回転自在に取り付けた補助プレー
ト先端に固定され前記定盤の外周に密接して回転する駆
動プーリとを設け、補助プレート先端とプレートの間を
圧縮コイルばねにより連結して補助プーリを定盤の外側
面に常に押圧し、補助プーリと伝達プーリの間を伝達用
Oリングにより連結し、駆動プーリと伝達プーリの外周
には夫々テーパが取り付けられ、夫々のプーリ径の変化
する方向に連結要素を移動させることにより、定盤と修
正リングとの角速度を同じに調整し、修正リング内の被
研磨物を研磨するように構成したことを特徴とする平面
ラップ研磨盤。
1. On the plate fixed to the support located above the surface plate,
A transmission pulley that transmits rotational drive to a correction ring that stores the object to be polished, and an auxiliary pulley that rotates in response to the correction ring.
A drive pulley is provided which is fixed to the tip of the auxiliary plate which is rotatably attached to the fulcrum of the plate and rotates in close contact with the outer periphery of the surface plate, and the tip of the auxiliary plate and the plate are connected by a compression coil spring to drive the auxiliary pulley. is always pressed against the outer surface of the surface plate, the auxiliary pulley and the transmission pulley are connected by a transmission O-ring, and a taper is attached to the outer periphery of the drive pulley and transmission pulley, respectively, so that the diameter of each pulley changes in the direction A flat lapping polishing machine characterized in that the surface plate and the correction ring are adjusted to have the same angular velocity by moving a connecting element to polish the object to be polished in the correction ring.
JP2188189A 1990-07-16 1990-07-16 Surface lap polishing machine Pending JPH0475870A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2188189A JPH0475870A (en) 1990-07-16 1990-07-16 Surface lap polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2188189A JPH0475870A (en) 1990-07-16 1990-07-16 Surface lap polishing machine

Publications (1)

Publication Number Publication Date
JPH0475870A true JPH0475870A (en) 1992-03-10

Family

ID=16219327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2188189A Pending JPH0475870A (en) 1990-07-16 1990-07-16 Surface lap polishing machine

Country Status (1)

Country Link
JP (1) JPH0475870A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine
JP2007182587A (en) * 2003-07-16 2007-07-19 Daikin Ind Ltd Method for producing fluorine-containing polymer, aqueous dispersion of fluorine-containing polymer, 2-acyloxycarboxylic acid derivative, and surface active agent
JP2009274209A (en) * 2009-08-27 2009-11-26 Topcon Corp Polishing device
JP2009274210A (en) * 2009-08-27 2009-11-26 Topcon Corp Polishing device
JP2009274211A (en) * 2009-08-27 2009-11-26 Topcon Corp Polishing device
JP2023039454A (en) * 2021-08-30 2023-03-22 直江津電子工業株式会社 Workpiece polishing device, polishing assist device, and workpiece manufacturing method
JP2023055826A (en) * 2021-08-30 2023-04-18 直江津電子工業株式会社 Work-piece polishing device and polishing assistance device

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6093088A (en) * 1998-06-30 2000-07-25 Nec Corporation Surface polishing machine
JP2007182587A (en) * 2003-07-16 2007-07-19 Daikin Ind Ltd Method for producing fluorine-containing polymer, aqueous dispersion of fluorine-containing polymer, 2-acyloxycarboxylic acid derivative, and surface active agent
JP2009274209A (en) * 2009-08-27 2009-11-26 Topcon Corp Polishing device
JP2009274210A (en) * 2009-08-27 2009-11-26 Topcon Corp Polishing device
JP2009274211A (en) * 2009-08-27 2009-11-26 Topcon Corp Polishing device
JP2023039454A (en) * 2021-08-30 2023-03-22 直江津電子工業株式会社 Workpiece polishing device, polishing assist device, and workpiece manufacturing method
JP2023055826A (en) * 2021-08-30 2023-04-18 直江津電子工業株式会社 Work-piece polishing device and polishing assistance device

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