CN216657561U - Adsorption pad attaching device - Google Patents
Adsorption pad attaching device Download PDFInfo
- Publication number
- CN216657561U CN216657561U CN202220245422.5U CN202220245422U CN216657561U CN 216657561 U CN216657561 U CN 216657561U CN 202220245422 U CN202220245422 U CN 202220245422U CN 216657561 U CN216657561 U CN 216657561U
- Authority
- CN
- China
- Prior art keywords
- adsorption pad
- pressing
- pad
- adjusting piece
- height
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The present disclosure provides an adsorption pad attaching device, including: a pressing block for moving on the adsorption pad to apply a pressing force to the adsorption pad, the pressing block including a flat pressing surface; the adjusting piece is used for moving on the surface of the adsorption pad and comprises a flat contact surface; the linkage frame is connected with the adjusting piece through the linkage frame, the adjusting piece can be driven to move by the pressing block when the surface of the adsorption pad moves, and the linkage frame can move relative to the pressing pad so that the adjusting piece can move in the direction vertical to the flat contact surface when the height of the surface of the adsorption pad changes; the height sensor is arranged on the linkage frame and can sense the height between the linkage frame and the surface of the adsorption pad in the direction vertical to the pressing flat surface; and the alarm is connected with the height sensor and is used for being triggered when the height change sensed by the height sensor reaches a threshold value and executing an alarm action. The attached device of adsorption pad of this disclosure ensures that assembled adsorption pad is attached not to have unusually, improves the operating efficiency, promotes attached quality.
Description
Technical Field
The utility model relates to the technical field of semiconductor manufacturing, in particular to an adsorption pad attaching device.
Background
In the wafer semiconductor industry, the polishing process for silicon wafers is often performed by Chemical Mechanical Polishing (CMP) equipment. And CMP is single-side polishing, and the silicon wafer needs to be fixed and effectively adsorbed by the assembled adsorption pad, so that the silicon wafer can be effectively polished on the polishing pad.
In order to ensure the quality of the CMP process, the assembled adsorption pad has a specified service life and needs to be replaced frequently. When the assembled adsorption pad is replaced in the polishing machine, an operator needs to paste the assembled adsorption pad with the diameter of about 365mm on the polishing head with the diameter of about 365mm, the whole current operation process is finished by manual pressing, and the operation efficiency is low. Moreover, the inspection of the adhesion abnormality of the adsorption pad is limited to human eyes, the adhesion deviation is very large due to the difference of operators, the adhesion abnormality cannot be found in time, the quality of the CMP processed silicon wafer is deteriorated, and the adsorption pad needs to be replaced again, so that the processing cost is increased. In addition, because the structure of assembled absorption pad contains polyurethane disc and epoxy ring, there is the difference in layer height in both junctions, causes operating personnel to press not really easily in the operation process, and is very difficult to discover unusually.
SUMMERY OF THE UTILITY MODEL
The embodiment of the disclosure provides an attaching device for an adsorption pad, which can ensure that the assembled adsorption pad is completely attached to a polishing head without abnormity, improve the operation efficiency and improve the attaching quality.
The technical scheme provided by the embodiment of the disclosure is as follows:
the utility model provides an attached device of adsorption pad for attach the adsorption pad in the burnishing head, the attached device of adsorption pad includes:
the pressing block is used for moving on the adsorption pad to apply pressing force to the adsorption pad and comprises a flat pressing surface used for being in contact with the adsorption pad;
the adjusting piece is used for moving on the surface of the adsorption pad and comprises a flat contact surface used for being in contact with the surface of the adsorption pad;
the linkage frame is connected with the adjusting piece through the linkage frame, the pressing piece can drive the adjusting piece to move when the surface of the adsorption pad moves, and the linkage frame can move relative to the pressing piece so that the adjusting piece can move in the direction vertical to the flat contact surface when the height of the surface of the adsorption pad changes;
the height sensor is arranged on the linkage frame and can sense the height between the linkage frame and the surface of the adsorption pad in the direction vertical to the pressing flat surface; and
and the alarm is connected with the height sensor and is used for being triggered when the height change sensed by the height sensor reaches a threshold value and executing an alarm action.
Illustratively, the linkage frame includes:
the transverse arm is arranged along the direction parallel to the flat pressing surface, and the height sensor is arranged on the transverse arm; and
and one end of the longitudinal arm is connected with the adjusting piece, and the other end of the longitudinal arm is connected to the transverse arm.
Illustratively, the longitudinal arm and the transverse arm are pivoted, and the longitudinal arm can rotate around the pivot joint to drive the adjusting piece to rotate around the pivot joint.
Exemplarily, the pressing block further comprises an operating surface facing away from the flat pressing surface, a connecting shaft perpendicular to the flat pressing surface is connected to the operating surface, and the transverse arm is connected to the connecting shaft.
In an exemplary embodiment, the pressing block further includes an outer peripheral surface located between the operating surface and the flat pressing surface, and a connecting position between the outer peripheral surface and the flat pressing surface has an edge angle.
Illustratively, the connecting position of the outer peripheral surface and the operation surface is chamfered.
Illustratively, the adjuster is a disc-like structure.
Illustratively, the height sensor comprises a CMOS sensor.
Illustratively, the pressing block is made of polyvinyl fluoride material.
Illustratively, the material of the regulating part is polyvinyl fluoride material.
The beneficial effects brought by the embodiment of the disclosure are as follows:
the adsorption pad attaching device provided by the embodiment of the disclosure can comprise a pressing block, a regulating part, a linkage frame, a height sensor and an alarm, wherein the pressing block can move along the surface of the adsorption pad in a certain direction under the action of manual or electric power so as to press and attach the adsorption pad on a polishing head, the regulating part can be in contact with the surface of the adsorption pad in the moving process of the pressing block, therefore, when the surface height of the adsorption pad changes, the regulating part can move up and down (namely move in the direction vertical to the flat pressing surface) along with the surface height change of the adsorption pad, the linkage frame connected with the regulating part can synchronously move along with the movement of the regulating part, at the moment, the height sensor arranged on the linkage frame can sense the height change, and when a sensing signal exceeds a threshold value, the alarm is triggered, so that an operator is prompted that an uneven adhesion area exists at the position where the regulating part is located, the operator can uncover the edge of the adsorption pad, and then repeatedly press the adsorption pad through the pressing block, so that complete attachment of the adsorption pad is effectively guaranteed. Therefore, the adsorption pad attaching device provided by the embodiment of the disclosure has a simple structure, can ensure that the assembled adsorption pad is completely attached to the polishing head without abnormity, improves the operation efficiency, and improves the attaching quality.
Drawings
Fig. 1 is a schematic structural view of an absorbent pad attachment apparatus according to some embodiments of the present disclosure.
Wherein the components are labeled as follows:
a pressing block 100; flattening the pressing surface 110; an operation surface 120; an outer peripheral surface 130; edge corners 140; chamfering 150; an adjusting member 200; flattening the contact surface 210; a linkage frame 300; a transverse arm 310; a longitudinal arm 320; a height sensor 400; is connected to the shaft 500.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present disclosure more apparent, the technical solutions of the embodiments of the present disclosure will be described clearly and completely with reference to the drawings of the embodiments of the present disclosure. It is to be understood that the described embodiments are only a few embodiments of the present disclosure, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the disclosure without any inventive step, are within the scope of protection of the disclosure.
Unless otherwise defined, technical or scientific terms used herein shall have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. The use of "first," "second," and similar terms in this disclosure is not intended to indicate any order, quantity, or importance, but rather is used to distinguish one element from another. Also, the use of the terms "a," "an," or "the" and similar referents do not denote a limitation of quantity, but rather denote the presence of at least one. The word "comprising" or "comprises", and the like, means that the element or item preceding the word comprises the element or item listed after the word and its equivalent, but does not exclude other elements or items. The terms "connected" or "coupled" and the like are not restricted to physical or mechanical connections, but may include electrical connections, whether direct or indirect. "upper", "lower", "left", "right", and the like are used only to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships may also be changed accordingly.
In order to solve the problems of poor attaching effect, low operating efficiency and the like existing when the assembled adsorption pad is attached to the polishing head in the polishing machine in the related art, the embodiment of the disclosure provides an adsorption pad attaching device which can be used for attaching the adsorption pad to the polishing head, can ensure that the assembled adsorption pad is completely attached to the polishing head without abnormity, improves the operating efficiency and improves the attaching quality.
Fig. 1 is a schematic structural view of an adsorption pad attaching device according to an embodiment of the present disclosure.
Referring to fig. 1, the adsorption pad application apparatus may include:
the pressing block 100 is used for moving on the adsorption pad to apply pressing force to the adsorption pad, and the pressing block 100 comprises a flat pressing surface 110 used for being in contact with the adsorption pad;
a conditioning member 200 for moving on the surface of the adsorption pad, the conditioning member 200 comprising a flat contact surface 210 for contacting the surface of the adsorption pad;
the linkage frame 300, the pressing block 100 and the adjusting part 200 are connected through the linkage frame 300, the pressing block 100 can drive the adjusting part 200 to move when the surface of the adsorption pad moves, and the linkage frame 300 can move relative to the pressing block 100, so that the adjusting part 200 can move in the direction perpendicular to the flat contact surface 210 when the height of the surface of the adsorption pad changes;
a height sensor 400, disposed on the linkage frame 300, capable of sensing a height between the linkage frame and the surface of the adsorption pad in a direction perpendicular to the pressing plane; and
and an alarm (not shown in the figures) connected to the height sensor 400 for triggering when the height change sensed by the height sensor 400 reaches a threshold value, and performing an alarm action.
In the above solution, the pressing block 100 can move along the surface of the absorption pad in a certain direction under manual or electric action to press and attach the absorption pad to the polishing head, the adjusting member 200 can contact with the surface of the absorption pad during the movement of the pressing block 100, so that when the height of the surface of the absorption pad changes, the adjusting member 200 can move up and down (i.e. move in a direction perpendicular to the flat pressing surface 110) along with the height change of the surface of the absorption pad, the linkage frame 300 connected to the adjusting member 200 can move synchronously along with the movement of the adjusting member 200, at this time, the height sensor arranged on the linkage frame 300 can sense the height change, and when the sensing signal exceeds the threshold value, the alarm is triggered, so as to prompt an operator that an uneven adhesion area exists at the current position of the adjusting member 200, and the operator can uncover the edge of the absorption pad, and then the adsorption pad is repeatedly pressed by the pressing block 100, thereby effectively ensuring the complete attachment of the adsorption pad.
Therefore, the adsorption pad attaching device provided by the embodiment of the disclosure has a simple structure, can simply, quickly and efficiently complete the attaching process of the assembled adsorption pad by using the adsorption pad attaching device, can ensure that the assembled adsorption pad is completely attached to the polishing head without abnormity, improves the operation efficiency and improves the attaching quality.
In some exemplary embodiments, as shown in fig. 1, the linkage frame 300 includes:
a lateral arm 310, wherein the lateral arm 310 is disposed in a direction parallel to the flat pressing surface 110, and the height sensor 400 is disposed on the lateral arm 310; and
a longitudinal arm 320, one end of the longitudinal arm 320 being connected to the adjusting member 200 and the other end being connected to the transverse arm 310.
With the above scheme, the linkage frame 300 may include a transverse arm 310 and a longitudinal arm 320, when the adjusting member 200 moves due to a change in the height of the surface of the adsorption pad during the pressing process, the longitudinal arm 320 connected to the adjusting member 200 is linked to drive the transverse arm 310 to move, and the height sensor 400 is disposed on the transverse arm 310, so that a sensing signal of the height sensor 400 changes. The structure is simple, the operation is easy, and the purpose of reflecting the position change of the adjusting piece 200 through the height sensor 400 can be realized by arranging the transverse arm 310 and the longitudinal arm 320, so that the purpose of measuring the surface height of the adsorption pad is realized. It should be noted that, when the variation value of the sensing signal of the height sensor 400 reaches a certain threshold value, it is determined that the adsorption pad is not flat, for example, bubbles exist, and therefore, the height sensor 400 triggers the alarm when the variation value of the sensing signal exceeds the threshold value.
It should be noted that the above is an exemplary illustration of the linkage frame 300, and in other non-illustrated embodiments, the structure of the linkage frame 300 is not limited thereto.
In addition, in some exemplary embodiments, as shown in fig. 1, the longitudinal arm 320 is pivotally connected to the transverse arm 310, and the longitudinal arm 320 can rotate around the pivotal connection to rotate the adjusting member 200 around the pivotal connection. With the above arrangement, the adjusting member 200 can rotate around the pivot joint to be away from the surface of the adsorption pad when not needed for use or other occasions. It is understood that, in practical applications, the transverse arm 310 and the longitudinal arm 320 may also be fixedly connected.
In addition, in some exemplary embodiments, as shown in fig. 1, the pressing block 100 further includes an operation surface 120 facing away from the flat pressing surface 110, a connection shaft 500 disposed perpendicular to the flat pressing surface 110 is connected to the operation surface 120, and the transverse arm 310 is connected to the connection shaft 500. Illustratively, the transverse arm 310 is movably connected to the connecting shaft 500 and is movable relative to the connecting shaft 500 when the transverse arm 310 moves in a direction perpendicular to the flat pressing surface 110. Thus, the transverse arm 310 can move up and down according to the height change of the adjusting member 200.
In some embodiments, the transverse arm 310 may be sleeved on the connecting shaft 500 and may freely move along the connecting shaft 500 relative to the connecting shaft 500. It will be understood that the above is only illustrative, and in practical applications, the manner of implementing the up-and-down movement of the transverse arm 310 is not limited thereto, and is not listed here.
In addition, in some exemplary embodiments, as shown in fig. 1, the pressing block 100 further includes an outer circumferential surface 130 located between the operating surface 120 and the flat pressing surface 110, wherein a connection position of the outer circumferential surface 130 and the flat pressing surface 110 is not chamfered and has an edge corner 140. With this arrangement, the edge corner 140 may be more conducive to pressing the absorbent pad.
Further, in some exemplary embodiments, as shown in fig. 1, the outer peripheral surface 130 is chamfered 150 at a location where it joins the operating surface 120. With the arrangement, when an operator holds the pressing block 100 by hand, the pressing block has better hand feeling and is easier to operate.
Further, in some exemplary embodiments, as shown in fig. 1, the adjuster 200 is a disc-like structure. It will be appreciated, of course, that the adjustment member 200 may be of any suitable construction, such as a block-like construction.
Further, in some exemplary embodiments, as shown in fig. 1, the height sensor 400 comprises a CMOS (Complementary Metal-Oxide-Semiconductor) sensor. The induction device has the advantages of accurate induction precision, simple structure, low cost and the like. Illustratively, the resolution of the CMOS sensor is 0.5 μm. Namely, the height measurement precision of the CMOS sensor is 0.5 mu m. Of course, the height sensor may be any other suitable sensor.
In addition, in some exemplary embodiments, the pressing block 100 is made of polyvinyl fluoride. The adjusting member 200 is made of polyvinyl fluoride.
The attached device of adsorption pad that this disclosed embodiment provided is when carrying out the attached process of adsorption pad as follows:
on the premise of ensuring the surface cleanness of the polishing head, the adjusting member 200 can rotate around the pivot joint between the transverse arm 310 and the longitudinal arm 320 until the adjusting member does not contact the surface of the adsorption pad, and the pressing block 100 is pressed manually or electrically, so that the pressing block 100 is slowly pressed from one side of the assembled adsorption pad to the other side, which is beneficial for the flat pressing surface 110 to slowly and continuously discharge the gas between the adsorption pad and the polishing head; after the assembled absorption pad is preliminarily pasted to the polishing head, the adjusting piece 200 can be rotationally placed on the surface of the absorption pad, the pressing block 100 is slowly pushed, the pressing block 100 moves, the adjusting piece 200 and the height sensor detects whether the attachment abnormality exists or not, and the assembled absorption pad is completely pasted without abnormality.
The following points need to be explained:
(1) the drawings of the embodiments of the disclosure only relate to the structures related to the embodiments of the disclosure, and other structures can refer to the common design.
(2) For purposes of clarity, the thickness of layers or regions in the figures used to describe embodiments of the present disclosure are exaggerated or reduced, i.e., the figures are not drawn on a true scale. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(3) Without conflict, embodiments of the present disclosure and features of the embodiments may be combined with each other to arrive at new embodiments.
The above is only a specific embodiment of the present disclosure, but the scope of the present disclosure is not limited thereto, and the scope of the present disclosure should be determined by the scope of the claims.
Claims (10)
1. The utility model provides an attached device of adsorption pad for with attached in rubbing head of adsorption pad, its characterized in that, the attached device of adsorption pad includes:
the pressing block is used for moving on the adsorption pad to apply pressing force to the adsorption pad and comprises a flat pressing surface which is used for being in contact with the adsorption pad;
the adjusting piece is used for moving on the surface of the adsorption pad and comprises a flat contact surface used for being in contact with the surface of the adsorption pad;
the linkage frame is connected with the adjusting piece through the linkage frame, the pressing piece can drive the adjusting piece to move when the surface of the adsorption pad moves, and the linkage frame can move relative to the pressing piece so that the adjusting piece can move in the direction vertical to the flat contact surface when the height of the surface of the adsorption pad changes;
the height sensor is arranged on the linkage frame and can sense the height between the linkage frame and the surface of the adsorption pad in the direction vertical to the flat pressing surface; and
and the alarm is connected with the height sensor and is used for being triggered when the height change sensed by the height sensor reaches a threshold value and executing an alarm action.
2. The suction pad application device according to claim 1,
the link frame includes:
the transverse arm is arranged along the direction parallel to the flat pressing surface, and the height sensor is arranged on the transverse arm; and
and one end of the longitudinal arm is connected with the adjusting piece, and the other end of the longitudinal arm is connected to the transverse arm.
3. The suction pad application device according to claim 2,
the longitudinal arm and the transverse arm are pivoted, and the longitudinal arm can rotate around the pivoting position to drive the adjusting piece to rotate around the pivoting position.
4. The suction pad application device according to claim 2,
the pressing block further comprises an operating surface back to the flat pressing surface, a connecting shaft perpendicular to the flat pressing surface is connected to the operating surface, and the transverse arm is connected to the connecting shaft.
5. The suction pad application device according to claim 4,
the pressing block further comprises an outer peripheral surface located between the operating surface and the flat pressing surface, wherein an edge corner is formed at the connecting position of the outer peripheral surface and the flat pressing surface.
6. The suction pad application device according to claim 5,
and the connecting position of the peripheral surface and the operating surface is chamfered.
7. The suction pad application device according to claim 1,
the adjusting piece is of a disc-shaped structure.
8. The suction pad application device according to claim 1,
the height sensor comprises a CMOS sensor.
9. The suction pad application device of claim 1,
the pressing block is made of polyvinyl fluoride materials.
10. The pad attaching apparatus as claimed in any one of claims 1 to 9,
the adjusting piece is made of polyvinyl fluoride materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220245422.5U CN216657561U (en) | 2022-01-29 | 2022-01-29 | Adsorption pad attaching device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220245422.5U CN216657561U (en) | 2022-01-29 | 2022-01-29 | Adsorption pad attaching device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216657561U true CN216657561U (en) | 2022-06-03 |
Family
ID=81763906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220245422.5U Active CN216657561U (en) | 2022-01-29 | 2022-01-29 | Adsorption pad attaching device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216657561U (en) |
-
2022
- 2022-01-29 CN CN202220245422.5U patent/CN216657561U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6113624B2 (en) | Substrate processing apparatus and substrate processing method | |
| TWI275451B (en) | Measurement of thickness profile and elastic modulus profile of polishing pad | |
| CN115662932B (en) | Monitoring device for wafer position and wafer carrying platform with monitoring device | |
| CN111730430B (en) | Grinding apparatus with adjustable suction cup turntable | |
| TWI653100B (en) | Wiping mechanism and wafer residue cleaning device using the same | |
| US7775853B2 (en) | Configurable polishing apparatus | |
| CN102403196B (en) | Sheet adhering apparatus and method of attaching | |
| JP2007123687A (en) | Grinding method for underside of semiconductor wafer and grinding apparatus for semiconductor wafer | |
| CN216657561U (en) | Adsorption pad attaching device | |
| JPH054482U (en) | Wafer reversing sticker | |
| KR101755281B1 (en) | Apparatus and Method for forming a probe pin | |
| CN205789887U (en) | Substrate flattening equipment | |
| JP3863624B2 (en) | Wafer polishing apparatus and wafer polishing method | |
| CN114871876B (en) | Wafer grinding monitoring method and monitoring system | |
| JP6313611B2 (en) | Polishing equipment | |
| JP5829927B2 (en) | Processing equipment | |
| CN111823084B (en) | Grinding apparatus with differential thread structure | |
| CN211490890U (en) | Precision grinding tool polishing robot | |
| CN220358057U (en) | Wafer wax pasting mechanism | |
| JP4032268B2 (en) | Wafer planar processing equipment | |
| JPH0192063A (en) | Both surfaces polishing machine | |
| CN103753379A (en) | Grinding speed detection apparatus, grinding device and method for detecting grinding speed in real time | |
| CN107861063A (en) | A kind of motor testing apparatus | |
| CN214374387U (en) | Preliminary visual inspection device for wafer | |
| JPH0651251B2 (en) | Wafer manufacturing method and manufacturing apparatus therefor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee after: Xi'an Yisiwei Material Technology Co.,Ltd. Patentee after: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. Address before: 710000 room 1-3-029, No. 1888, Xifeng South Road, high tech Zone, Xi'an, Shaanxi Province Patentee before: Xi'an yisiwei Material Technology Co.,Ltd. Patentee before: XI'AN ESWIN SILICON WAFER TECHNOLOGY Co.,Ltd. |