JPH09270327A - Electronic part and manufacture thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the yield of production and reliability, by a method wherein one surface of an insulated substrate and the surface of a laminated body to be formed on the above-mentioned surface are covered by a resin layer. SOLUTION: The main body 21 of this electronic part is provided with an insulated substrate 11 and a laminated body 3 formed on the insulated substrate 11. On the insulated substrate 11, a conductor pattern 13a and an insulating resin layer 12a, which is formed so as to cover the conductor pattern 13a, are formed. Besides, insulating resin layers 12b and 12c and conductor patterns 13b, 13c and 13d are formed in such a manner that they are alternately laminated. At this point, the insulated substrate 11 is composed of a ceramic substrate 2 and a resin layer 1 which is formed on one surface of the ceramic substrate 2. The ceramic having machinability is used for the ceramic substrate 2, and polyimide resin is used for the resin layer 1. Also, benzocyclobutene resin is used for the insulating resin layers 12a, 12b and 12c. As a result, the electronic part can be manufactured easily, chippings and the like are not generated when cutting, and the yield of production can be improved.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a method of manufacturing the same, and more specifically, to an inductor (L), a capacitor (C), an electric resistance element (R), a thin film EMI filter, a common mode choke coil, a current sensor. The present invention relates to a signal transformer, an electronic component that is a surface-mounted component or a lead component such as a composite electronic component in which these components are combined into a single component, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, an electronic component shown in FIG. 6 has been known (see Japanese Patent Laid-Open No. 3-201417). As shown in the partial cross-sectional view of FIG.
01, an insulating resin layer 102 made of a polyimide resin, and Ti, Ti-Ag formed by a sputtering method,
The inner conductor patterns 103 and 104 made of Ag are alternately laminated to form a laminate 105, and the uppermost conductor pattern 10 is formed by removing the end portion of the insulating resin layer 102.
The end portion 4 is exposed to form the electronic component 100.

A terminal base portion is formed on a side surface of the electronic component 100 so as to be connected to an end portion of the conductor pattern 104, and the terminal base portion is covered with the side surface from the top end portion of the electronic component body so as to cover the terminal base. The external electrode terminal portion reaching the lower end portion is formed and used.

In the above electronic component, it is usually formed by forming a plurality of the laminates 105 on a single plate made of an insulating substrate side by side in the vertical and horizontal directions and then cutting the insulating substrate into individual pieces. There is.

[0005]

However, since the surface of the insulating substrate has irregularities and is reflected in the laminated body formed thereon, the surface must be mirror-finished, which requires man-hours. There was a drawback.

Further, when the insulating substrate is cut into individual electronic component bodies, chipping or cracking occurs at the corners, chipping occurs, and the yield is not good.

Furthermore, when the above-mentioned electronic component is used in high humidity, water penetrates through the gaps between the resin layer and the conductor pattern, corrodes the conductor pattern and remarkably changes the characteristics, resulting in deterioration of quality.

Therefore, the technical problem of the present invention is that it is easy to manufacture, does not cause chipping or the like during cutting, and
An object of the present invention is to provide an electronic component having excellent yield and high reliability, and a manufacturing method thereof.

[0009]

According to the present invention, there is provided an electronic component comprising an insulating substrate, and a laminated body in which a plurality of insulating layers and a plurality of conductor patterns are alternately laminated on one surface side of the insulating substrate, A first resin layer formed between one surface of the insulating substrate and the laminated body, and a second resin layer covering the surface of the laminated body.
An electronic component having the resin layer of 1.

Further, according to the present invention, in the electronic component, the electronic component is obtained in which the first and second resin layers are made of polyimide.

Further, according to the present invention, a first resin layer is formed on one surface of the insulating substrate, and a plurality of insulating layers and a plurality of conductor patterns are alternately laminated on the first resin layer to form a laminate, A method of manufacturing an electronic component is obtained, which comprises covering the surface of the laminate with a second resin layer.

Further, according to the present invention, there is provided a method of manufacturing an electronic component, wherein the first and second resin layers are made of polyimide.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below.

FIG. 1 is a perspective view showing an electronic component according to a first embodiment of the present invention. Further, FIG. 2 is a perspective view schematically showing each layer of the laminated body of the insulating resin layer and the conductor pattern layer of the electronic component body 21 of FIG. 1 as separated. In the first embodiment of the present invention, a low-pass filter is illustrated as the electronic component 21.

Referring to FIG. 1, the electronic component 10 has an electronic component main body 21 and an external electrode terminal portion 22 formed so as to cover both end faces and part of the side faces of the electronic component main body 21.

The electronic component body comprises an insulating substrate 11 and a laminated body 3 formed thereon.

Referring to FIG. 2, the electronic component body 21 includes an insulating substrate 11 and a laminated body 3 formed on the insulating substrate 11. The laminated body 3 includes a conductor pattern 13a, an insulating resin layer 12a formed so as to cover the conductor pattern 13a, and an insulating resin layer 12b on the insulating substrate 11.
12c and conductor patterns 13b, 13c and 13d are alternately laminated. The conductor pattern 13c 'can be used instead of the conductor pattern 13a.

Here, in the embodiment of the present invention, the insulating substrate 11 is composed of the ceramic substrate 2 and the resin layer 1 formed on one surface of the ceramic substrate 2. The ceramics substrate 2 is made of free-cutting ceramics (trade name: Macerite manufactured by Mitsui Mining Materials Co., Ltd.), and the resin layer 1 is made of polyimide resin.

Insulating resin layers 12a, 12b, 12c
Uses an ultraviolet-sensitive benzocyclobutene resin (BCB) that is easy to flatten.

Further, the conductor patterns 13a, 13b, 1
As 3c, a Ti film or a Cu film is sputtered on the Ti film, and electrolytic C is formed by electrolytic Cu plating.
u plating film is used.

FIG. 3 is a partial sectional view mainly showing the insulating substrate 11 of the electronic component body 21 according to the embodiment of the present invention.
A part of the laminated structure is omitted. As shown in FIG.
The insulating substrate 11 comprises a ceramic substrate 2 and a resin layer 1 made of polyimide formed on both surfaces. By providing this resin layer 1, it is possible to flatten the surface roughness of the surface of the ceramic substrate 2 and increase the strength of the ceramic substrate 2.

The conductor pattern 13 shown in FIGS. 2 and 3.
a, 13b, 13c and 13d are Ti films only or Ti
A film and a Cu film are formed on the film to form a base pattern layer, and an electrolytic Cu plating film is formed on the film. The steps of forming the conductor patterns 13a, 13b, 13c and 13d are as follows.

A Ti film and a Cu film are formed as an underlying layer by sputtering on an insulating substrate 11 made of a ceramic substrate 2 having a resin layer 1 made of polyimide on one surface, and a desired conductor is formed by photolithography. Obtain a resist pattern with recesses that match the pattern. After the surface treatment, an electrolytic Cu plating layer is formed in the recess,
The resist pattern is peeled off to obtain a continuous intermediate conductor pattern having the underlayer as the bottom. Next, the intermediate conductor pattern is subjected to wet etching (may be dry etching) to remove the exposed portion of the underlying layer and washed to form the conductor patterns 13a, 13b, 1 formed on the insulating substrate 11.
3c and 13d are obtained.

Insulating resin layers 12a, 12b, 12c
The steps of forming the are as follows.

An ultraviolet-sensitive BCB resin is applied by spin coating so as to cover the conductor pattern 13a formed on the insulating substrate 11, an insulating resin layer 12a is formed, and the insulating resin layer 12a is formed by photolithography.
Through holes are optionally formed to obtain contact with the lower conductor pattern 12a. Next, in a nitrogen atmosphere,
Half-curing is performed at 0 ° C. for 30 minutes to obtain the insulating resin layer 12a in which the conductor pattern 13a is embedded.

Insulating resin layers 12a, 12b, 12c
Other conductor patterns 13b, 13c, 13 formed on the top
Regarding d, if an insulating resin layer obtained by curing a UV-sensitive BCB resin is used instead of the insulating substrate 11, the respective conductor patterns can be similarly formed.

The insulating resin layer covering the conductor patterns 13b and 13c is manufactured as follows. The UV-sensitive BC is formed by spin coating so as to cover the conductor pattern 13b formed on the insulating resin layer 12a.
The B resin is applied to obtain the insulating resin layer 12a. Next, the insulating resin layer 12 is formed by using photolithography as needed.
A through hole is formed in a. Next, in a nitrogen atmosphere, 210
Half-curing is performed at 30 ° C. for 30 minutes to obtain an insulating resin layer 12b in which the conductor pattern 13b is embedded.

2 and 3 by repeating the above steps for a plurality of locations on the large-sized insulating substrate 11.
A plurality of the laminated bodies 3 shown in FIG. These laminated bodies are covered with a polyimide resin, and the metal patterns 16 are provided to close the through holes communicating with the internal conductor patterns, whereby the plurality of electronic component structures 23 shown in FIG. 4 are completed.

FIG. 5 is a plan view of the electronic component structure shown in FIG. As shown in FIG. 5, the electronic component structures 23 are vertically and horizontally arranged on the insulating substrate 11.

Referring to FIGS. 4 and 5, the insulating substrate 11 is cut along the cutting margin 24 by a dicing saw to divide the electronic component structure into individual parts. As shown in FIG. 4, macerite containing a large amount of SiO ₂ components is apt to cause chipping during cutting, but the resin layer 1 made of polyimide is used.
Since the surface of the laminate is covered with the resin layer 5 made of polyimide, cutting stress is relieved by cutting the insulating substrate together with the polyimide, and chipping, pattern peeling, chipping, etc. are prevented. can do.

Next, in order to form the external electrode terminal portion in the electronic component structure 23, an insulating resin layer is provided on the uppermost layer, and the electrode lead-out portion formed of the through hole provided in the insulating resin layer is made conductive. An electrode extraction pattern is formed by sealing with metal, for example, Cu. Further, a protective layer is provided on the surface layer not covered with the electrode extraction pattern. Next, a Ni conductive paste made of epoxy resin or the like containing Ni powder is applied to the electronic component structure 23 so as to reach the lower surface of the electronic component structure 23 from the end of the electrode extraction pattern through the side surface and heat. Let it harden. Next, after the plating pretreatment, a Ni plating film is formed as a base layer by electrolytic barrel plating. next,
On this base layer, a solder plating film is formed as an external connection film by electrolytic barrel plating, and as shown in FIG. 1, an electronic component 10 having external electrode terminals 22 at both ends and a central portion of an electronic component body 21 is provided. Obtainable.

Here, the BCB forming the insulating resin layer is
Since it has brittleness, cracks or the like are generated during cutting, which makes it unsuitable for flattening the entire surface of the substrate. Instead of BCB, planarization of the insulating substrate 11 is performed in advance with a polyimide resin, and a Cu conductor pattern and a BCB that is compatible with Cu and is free of Cu migration are used thereon.
Form a laminate, the surface of the laminate again with polyimide,
By completely sealing, it is possible to realize an electronic component that has good cuttability, does not corrode the conductor pattern even in high humidity, and has stable quality.

In the embodiment of the present invention, the low-pass filter is exemplified as the electronic component, but the common mode choke coil, transformer, current sensor, LCR are used.
Obviously, it can be applied to circuit elements and the like.

[0034]

As described above, according to the present invention, since one surface of the insulating substrate and the surface of the laminate formed on the insulating substrate are covered with the resin layer, the manufacturing is easy, and the It is possible to provide an electronic component which does not cause chipping and the like, has an excellent yield, prevents moisture from entering the inside, and has high reliability, and a manufacturing method thereof.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view schematically showing each layer of a laminate of an insulating resin layer and a conductor pattern layer of the electronic component body 21 of FIG. 1 in a separated state.

FIG. 3 is a partial cross-sectional view mainly showing the insulating substrate of the electronic component body according to the embodiment of the present invention.

FIG. 4 is a sectional view showing an electronic component structure according to an embodiment of the present invention.

FIG. 5 is a plan view showing a cut state of the electronic component structure according to the embodiment of the present invention.

FIG. 6 is a cross-sectional view showing an example of a conventional electronic component.

[Explanation of symbols]

 1, 5 Resin layer 2 Ceramics substrate 3 Laminated body 10 Electronic component 11 Insulating substrate 12a, 12b, 12c Insulating resin layer 13a, 13b, 13c, 13d Conductor pattern 16 Metal pattern 21 Electronic component body 22 External electrode terminal portion 23 Electronic component structure Body 24 Cutting margin 101 Insulating substrate 102 Insulating resin layers 103, 104 Internal conductor pattern 105 Laminated body 100 Electronic component

Claims (4)

[Claims] 1. An electronic component comprising: an insulating substrate; and a laminated body in which a plurality of insulating layers and a plurality of conductor patterns are alternately laminated on one surface side of the insulating substrate, the one surface of the insulating substrate and the laminated body. An electronic component comprising: a first resin layer formed between the first and second resin layers; and a second resin layer that covers the surface of the laminate. 2. The electronic component according to claim 1, wherein the first and second resin layers are made of polyimide. 3. A first resin layer is formed on one surface of an insulating substrate, a plurality of insulating layers and a plurality of conductor patterns are alternately laminated on the first resin layer to form a laminate, and a surface of the laminate is formed. Second
A method for manufacturing an electronic component, which is characterized by covering with a resin layer. 4. The method of manufacturing an electronic component according to claim 3, wherein the first and second resin layers are made of polyimide.