JP3467615B2 - Electronic component and method of manufacturing the same - Google Patents

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an electronic component,
More specifically, the inductor (L), the capacitor (C),
Electric resistance (R) element, thin film EMI filter, common mode choke coil, current sensor, signal transformer,
Also, the present invention relates to an electronic component that is a surface mount component such as a composite electronic component or a lead component in which these components are configured as one component.

[0002]

2. Description of the Related Art Surface mount components such as LCR elements, thin film EMI filters, common mode choke coils, current sensors and signal transformers have been known. In particular,
As shown in FIG. 7, the chip-type electronic component has an insulating resin layer 42 made of polyimide resin on a ceramic substrate 41.
a, 42b, 42c, 42d and a primary conductor layer 4 made of Ti, Ti-Ag, Ag formed by a sputtering method.
3a-1, 43a-2, 43a-3, 43a-4 and 2
Next conductor layers 43b-1, 43b-2, 43b-3 are alternately laminated to form a laminated body 44, and the uppermost conductor layer 43 is formed.
The end of a-4 is exposed to form the electronic component body 48.

Further, the external electrode terminal portion 45 is formed so as to be connected to the end portion of the conductor pattern 43a-4 from the upper surface side edge portion of the electronic component main body 48 to the lower surface side edge portion through the side surface. It constitutes an electronic component.

[0004]

However, in the case of a chip type electronic component which is particularly remarkably miniaturized, when an insulating resin layer and a conductor layer are alternately laminated on a ceramic substrate,
Since the area is considerably limited, the conductor pattern of each conductor layer has to be formed at a narrow pitch,
Not only the distance 46 between the electrically conductive patterns having the same polarity but also the electrically different conductive patterns 43 formed in the same layer.
Insulation distance 47 between a-2 'and conductor pattern 43b-2'
Similarly, there was no choice but to narrow the pitch.

As a result, when moisture or moisture penetrates from the laminated interface, the insulation resistance between the different-pole conductors deteriorates, and the characteristics change, or significantly, the deterioration causes short-circuiting between the different-pole conductors.

Therefore, the technical problem of the present invention is to make the distance between the same-polarity conductors smaller by using a conductor forming technique which is easy to manufacture and is stable and highly accurate. An object of the present invention is to provide a highly reliable electronic component having desired characteristics, in which the insulation distance between conductors can be expanded.

[0007]

According to the present invention, an insulating substrate, a laminate formed by alternately laminating a plurality of insulating resins and a plurality of conductor layers on the insulating substrate, and a side surface of the laminate. To an electrically conductive pattern formed in the same layer of the conductor layer in an electronic component including an external electrode terminal portion connected to the conductor layer, the conductor pattern being formed over the side surface of the insulating substrate. An electronic component is obtained in which the distance between them is at least twice as large as the distance between electrically conductive patterns having the same polarity.

Further, according to the present invention, there can be obtained an electronic component characterized in that at least one of the insulating resin layers is substantially made of benzocyclobutene.

Further, according to the present invention, the conductor layer is composed of a base layer made of a conductive metal film and a Cu plating layer formed on the base layer by electrolytic plating. Parts are obtained.

Further, according to the present invention, there can be obtained an electronic component in which the underlayer is made of a Ti or Cr film formed by sputtering.

Further, according to the present invention, there is provided a method of manufacturing the electronic component, comprising a resist pattern forming step of forming a resist pattern for forming the conductor layer,
A conductor layer forming step of forming the conductor layer between the resist patterns after the resist pattern forming step, and a resist pattern peeling step of peeling the resist pattern to expose the conductor pattern after the conductor layer forming step. A method of manufacturing an electronic component is obtained which includes:

Further, according to the present invention, in the resist pattern forming step, the resist pattern is formed on an underlayer made of a conductive metal film, and after the resist pattern peeling step is completed, the conductor pattern is used as a mask. There is provided a method for manufacturing an electronic component, which has an underlayer etching step of etching an underlayer.

[0013]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an electronic component according to a first embodiment of the present invention, and FIG. 2 is a schematic view showing respective layers of an insulating resin layer and a conductor layer constituting a laminate of the electronic component shown in FIG. It is the perspective view shown. FIG. 3 is a sectional view taken along plane a shown in FIG. The electronic component 21 of this embodiment is embodied as a low pass filter.

Referring to FIG. 1, the electronic component 10 has an electronic component main body 21 and an external electrode terminal portion 22 formed so as to cover both end faces and part of the side faces of the electronic component main body 21. ing.

Referring to FIG. 2, the electronic component body 21 comprises a ceramic substrate 1 and a laminated body 3 formed on the ceramic substrate. The laminated body 3 is formed as follows. First, the insulating resin layer 12a that is the first insulating layer is formed on the ceramic substrate 1. Next, on the insulating resin layer 12a, the primary conductor layer 13a-1 which is the first conductor layer is formed.
And a second conductor layer 13b-1 is formed. Next, an insulating resin layer 12b which is a second insulating layer is formed so as to cover these conductor layers 13a-1 and 13b-1. Next, similarly to the first conductor layer, the first conductor layer 13a-2 and the second conductor layer 13b-2, which are the second conductor layers, are formed on the insulating resin layer 12b. Hereinafter, similarly, the insulating resin layers 12c and 12d and the primary and secondary conductor layers 13a-3, 13b-3, 13a are similarly formed.
The laminated body 3 is formed by alternately laminating -4 and 13b-4. Here, as is apparent from FIG. 3, the gap 25 between the conductor pattern 13a-2 'of the primary conductor layer 13a-2 and the conductor pattern 13b-2' of the secondary conductor layer 13b-2, which are electrically different in polarity, from each other. Is more than twice as large as the electrically conductive pattern spacing 23. Incidentally, FIG.
As shown in, the conductor layer 13b'-3 can be used instead of the secondary conductor layer 13b-3.

As for the step of forming the external electrode terminal portion 22, first, as shown in FIG. 3, a primary conductor layer (particularly this The part is referred to as an "extracting electrode part" 13a-4 is exposed. An epoxy resin containing Ni powder on the side surfaces of the ceramic substrate 1 and the laminate 3 so as to be connected to the extracting electrode part 13a-4. A Ni conductive paste thermosetting film 26 was formed by applying a Ni conductive paste made of, for example, and thermally curing it. Next, a Ni plating film was formed on the Ni conductive paste thermosetting film 26 as the base layer 22a by electrolytic barrel plating. Here, Ni is excellent in electrolytic migration resistance, and prevents solder or the like from diffusing into the drawer.
Finally, a solder plating film 22b as an external connection film was formed on the base layer 22a by electrolytic parel plating from a solder bath.

4 to 6 are schematic views showing a method of forming each insulating resin layer and each conductor layer shown in FIG.

Referring to FIG. 4, a ceramic substrate (not shown) is washed with acetone, methanol or the like, and if necessary, reverse sputtering is performed to wash, and an insulating resin layer 12a is formed on this ceramic substrate. Then, a base layer 31 made of a Ti film and a Cu film formed thereon is sputtered thereon by a sputtering method. FIG. 4B shows the underlayer 31.
The insulating resin layer 12a formed on one surface is shown. Figure 4
In (b), the Ti film has a thickness of 0.05 μm, and the Cu film has a thickness of 0.25 to 0.3 μm.

Next, as shown in FIG. 4C, the resist 3
After applying 2, the resist pattern 3 shown in FIG. 5A is exposed and developed through the resist mask 33 using photolithography as shown in FIG. 4D.
Get 2 '.

Next, as shown in FIG. 5 (a), H ₂ SO ₄
After surface treatment with Cu, as shown in FIG.
The electrolytic Cu plated layer 34 is obtained by plating.

Next, the resist pattern 32 'is peeled off to obtain an intermediate conductor pattern 35 having the shape shown in FIG. 5 (c).

Next, the intermediate conductor pattern 35 shown in FIG. 5C is subjected to wet etching (or dry etching is possible) to remove the portion of the base layer 31 exposed between the electrolytic Cu plating layers 34. And then washed with HCl, as shown in FIG.
As shown in (d), a conductor pattern 13a-1 'formed on the insulating resin layer 12a is obtained. Although the upper surface of the electrolytic Cu plating layer 34 is slightly etched by the etching, the conductive pattern is not lost because it is thicker than the base layer 31.

The obtained conductor layer 13a-1 is the underlayer 3
The pattern of 1'and the pattern of the electrolytic Cu plating layer 34 have a thickness of about 3 to 5 μm and a pattern width of about 30 μm.
In the cleaning, photolithography, etching, cleaning process, etc., no defect occurred during the manufacturing process.

FIG. 6 is a diagram schematically showing a method of forming a resin insulating layer. Referring to FIG. 6, as shown in FIG. 6 (a), UV photosensitivity is applied by spin coating so as to cover conductor layer 13a-1 formed on insulating resin layer 12a shown in FIG. 5 (d). Benzocyclobutene (BC
B) A resin is applied to form the insulating resin layer 36. Next, as shown in FIG. 6B, photolithography is used to perform exposure through the insulating resin mask 37, and then, as shown in FIG.
As shown in (c), a through hole 38 is formed in the insulating resin layer 36. It is needless to say that the through hole 38 is not required to be provided on all the conductor patterns 13a-1 'because it is for obtaining electrical contact with the conductor formed on the upper surface of the insulating resin layer 36.

Next, by half-curing at 190 ° C. for 60 minutes in a nitrogen atmosphere, the insulating resin layer 1 shown in FIG.
You get 2b.

By repeating the above steps, FIG.
The electronic component body 21 shown in is obtained.

Further, another conductor layer 1 shown in FIGS. 2 and 3 is used.
3a-2, 13a-3, 13a-4, 13b-1, 13
b-2, 13b-3 and 13b-4 are also obtained in the same manner as the steps shown in FIGS. In addition, the insulating resin layer 12
b, 12c and 12d are also obtained in the same manner as the process shown in FIG.

In this embodiment, the low-pass filter is exemplified as the electronic component, but the present invention is a common mode choke coil, transformer, current sensor, LC.
Obviously, it can also be applied to R circuit elements and the like.

[0030]

EXAMPLES In the above embodiment, the ceramic substrate 1
As the material, macerite (registered trademark of Mitsui Mining Materials Co., Ltd.), which is a free-cutting ceramic, is used.

Insulating resin layers 12a, 12b, 12
For c and 12d, a benzocyclobutene resin (BCB) that is easy to flatten and is photosensitive to ultraviolet rays is used.
By using BCB as the insulating resin layer,
Since the flatness of the insulating resin layer is well ensured, it is possible to obtain a laminated body having a flat surface without unevenness, and the electrical characteristics are improved.

Further, the conductor layers 13a-1, 13a-2, 1
3a-3, 13a-4, 13b-1, 13b-2, 13
b-3, 13b-4, a Ti film or Cu on the Ti film
A film is formed by sputtering, and an electrolytic Cu plating film formed by electrolytic Cu plating is used.

[0033]

As described above, in the electronic component of the present invention, the distance between the electrically different conductor patterns formed in the same conductor layer is determined by the distance between the electrically same conductor patterns. Since the distance is at least twice as large as the distance between them, it is possible to reliably prevent a change in characteristics and a short circuit between different-polarity conductors.

In the method of manufacturing an electronic component of the present invention,
First, a resist pattern is formed, a conductor layer is formed between the resist patterns, and then the resist pattern is peeled off to form the conductor pattern. Therefore, the manufacturing is easy, stable, and It is possible to form a highly accurate conductor layer, and by this highly accurate conductor forming technology, the distance between the same-polarity conductors can be further narrowed, and the insulation distance between different-polarity conductors can be expanded accordingly. As a result, it is possible to provide a highly reliable electronic component having desired characteristics.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is a perspective view schematically showing each layer of an insulating resin layer and a conductor layer that form a laminate of the electronic component shown in FIG.

FIG. 3 is a cross-sectional view taken along plane a shown in FIG.

4 is a cross-sectional view schematically showing a step of forming a conductor layer of the electronic component shown in FIG.

FIG. 5 is a cross-sectional view that schematically shows the step of forming a conductor layer following FIG.

6 is a cross-sectional view schematically showing a step of forming an insulating resin layer on the conductor layer of the electronic component shown in FIG.

FIG. 7 is a sectional view of a main part of an example of a conventional electronic component.

[Explanation of symbols]

1 Ceramic substrate 3 laminate 10 electronic components 12a Insulating resin layer 12b Insulating resin layer 12c Insulating resin layer 12d Insulating resin layer 13a-1 primary conductor layer 13a-2 primary conductor layer 13a-3 Primary conductor layer 13a-4 primary conductor layer 13b-1 Secondary conductor layer 13b-2 Secondary conductor layer 13b-3 Secondary conductor layer 13b-4 secondary conductor layer 21 Electronic component body 22 External electrode terminal 22a Underlayer 22b Solder plating film 23 Distance between homopolar conductor patterns 25 Insulation distance between different pole conductor patterns 26 Ni conductive paste thermosetting film 31 Underlayer 32 resist 33 Mask for resist 34 Electrolytic Cu plating layer 35 Intermediate conductor pattern 36 Insulating resin layer 37 Mask for insulating resin 38 through hole

Claims (6)

(57) [Claims] 1. An insulating substrate, and a laminate formed by alternately laminating a plurality of insulating resins and a plurality of conductor layers on the insulating substrate,
In an electronic component including an external electrode terminal portion that is formed from a side surface of the laminated body to a side surface of the insulating substrate and that is electrically connected to the conductor layer, electrically formed in the same layer of the conductor layer. An electronic component, wherein a distance between conductor patterns having different polarities is at least twice as large as a distance between conductor patterns having electrically same polarity. 2. At least one of the insulating resin layers is
The electronic component according to claim 1, which is substantially composed of benzocyclobutene. 3. The conductor layer according to claim 1, wherein the conductor layer is composed of an underlayer made of a conductive metal film and a Cu plating layer formed on the underlayer by electrolytic plating. Electronic components. 4. The electronic component according to claim 1, wherein the underlayer is made of a Ti or Cr film formed by sputtering. 5. The method of manufacturing an electronic component according to claim 1, wherein a resist pattern forming step of forming a resist pattern for forming the conductor layer, and the resist pattern forming step after the resist pattern forming step are completed. Manufacturing of an electronic component comprising: a conductor layer forming step of forming the conductor layer therebetween; and a resist pattern peeling step of peeling the resist pattern to expose the conductor pattern after the conductor layer forming step is completed. Method. 6. In the resist pattern forming step, the resist pattern is formed on an underlying layer made of a conductive metal film, and after the resist pattern peeling step is completed, the underlying layer is etched using the conductor pattern as a mask. The method for manufacturing an electronic component according to claim 5, further comprising a formation etching step.