JPH09270338A - Electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a small size and low cost composite electronic part having both large-capacity capacitance element and inductor having a high accuracy of L-value. SOLUTION: Desired conductive silver-palladium patterns are formed on a ferroelectric ceramic substrate 1A to form a thick laminate 5 having a capacitance 3, the laminate 5 is baked, a thin film coil 7 is formed on the upper part of the laminate, and terminal electrodes 11 are formed at both ends of a chip to form an electronic device. The coil 7 is composed of a thin film coil 13 formed by coiling a Cu coil conductor and benzocyclobutene resin-made insulation resin layer 15 laminated thereon.

Description

Detailed Description of the Invention

[0001]

TECHNICAL FIELD The present invention relates to an electronic component,
More specifically, it relates to a composite electronic component in which elements such as an inductor (L) and a capacitor (C) are configured as one component.

[0002]

2. Description of the Related Art As an example of such a conventional composite electronic component,
A device utilizing a thick film laminated structure is known.

That is, such a conventional composite electronic component is
For example, as shown in FIG. 9, a process of forming a desired conductive pattern 72 of silver palladium (AgPd) on a ferroelectric (high ε) ceramic substrate 71A by screen printing is repeated to form a capacitance 73, and The thick film laminated body 77 having the inductor 75 formed thereon is fired by repeating the process of forming the circular conductive pattern 74 made of AgPd on the ferroelectric ceramic substrate 71B by screen printing in the same manner. 77
Baking A with silver (Ag) paste applied to both ends of
The Ni layers 81 and 81 are formed on the g layers 79 and 79 by electroless plating, and the solder layers 83 and 83 are further formed thereon to form the terminal electrodes 85 and 85.

Further, another conventional composite electronic component is, for example, as shown in FIG.
The first thick film laminate 89 having the capacitance 73 formed by repeating the step of forming the desired conductive pattern 72 made of silver palladium (AgPd) on the screen 7 by screen printing, and further on the first thick film laminate 89, for example, low temperature glass alumina. The second thick film laminated body 95 having the inductor 93 formed thereon is integrally formed by repeating the process of forming the circular conductive pattern 92 made of AgPd on the non-magnetic / non-ferroelectric ceramic substrate 91 such as ceramics by screen printing. After being provided and after firing the first and second thick film laminates 89 and 95, baked Ag layers 79, 79, Ni layers 81, 81 and solder layers are formed on both end portions in the same manner as in the conventional example of FIG. 9 described above. 8
3, 83 are formed to form the terminal electrodes 85, 85.

[0005]

However, in the composite electronic component in which the capacitance and the inductor are embedded in the ferroelectric ceramics by utilizing the thick film laminated structure as shown in FIG. 9, although a large capacitance can be obtained, Since it is difficult to form a precise coil pattern, it is difficult to form an inductor with a high reactance.
That is, since the contraction rate after firing the thick film laminate 77 is different between the ferroelectric ceramics substrate 71A and the circulating conductive pattern 74 made of AgPd, together with the problem of screen mesh expansion in the screen printing process, There is a problem that a desired reactance accuracy cannot be obtained because the printed coil pattern is displaced. In addition, since the printed pattern is misaligned, there is also a problem in the accuracy of the capacitance. If this accuracy is attempted, the AgPd
The alignment of the ferroelectric ceramic substrates 71A on which the conductive pattern 72 made of was printed was difficult, and the manufacturing process was unavoidably complicated.

Further, if not only the capacitance but also the inductor (coil) is formed in the ferroelectric ceramic, there is a problem that stray capacitance is generated.

In the composite electronic component shown in FIG. 10, since the inductor (coil) is formed in the non-magnetic / non-ferroelectric ceramics such as low temperature glass alumina ceramics, it is possible to reduce the problem of stray capacitance as described above. Although it is possible, it is difficult to obtain the reactance accuracy due to the shrinkage rate after firing and the elongation of the screen mesh.
After all, it is inevitable that the positioning is complicated to obtain the capacitance accuracy. Furthermore, since low temperature glass alumina ceramics are expensive, it is difficult to obtain inexpensive composite electronic components.

Therefore, a technical object of the present invention is to provide a composite electronic component which is small in size, inexpensive, and thin.

Another technical object of the present invention is to provide a small and inexpensive composite electronic component having both a large capacity capacitance element and an inductor having a high L value.

Still another technical object of the present invention is to provide a small and inexpensive composite electronic component including an inductor having a relatively large L value.

[0011]

According to the present invention, a thick film laminated body in which a ferroelectric and a conductor are laminated to form at least one capacitance therein is baked, and thereafter, the thick film laminated body is formed on the thick film laminated body. An electronic component is obtained in which an inductor having a conductor pattern and an insulating resin laminated is provided and the inductor is electrically connected to the capacitance.

Further, according to the present invention, an electronic component characterized by using a benzocyclobutene resin as the insulating resin can be obtained.

Further, according to the present invention, a terminal electrode formed so as to be connected to a part of the conductor pattern is further provided, and the terminal electrode is electrically connected to the capacitance. It is possible to obtain an electronic component.

According to the present invention, the terminal electrode is
A base electrode electrically connected to the conductor pattern and a surface electrode covering the base electrode are provided, and the surface electrode is N
An electronic component including an i film and a noble metal film formed on the Ni film is obtained.

Further, according to the present invention, a magnetic material and a conductor are laminated to form at least one inductor inside, and after firing, a conductor pattern and a dielectric layer are laminated on the thick film laminated body. An electronic component is obtained, which is provided with a capacitance and is electrically connected to the inductor.

Further, according to the present invention, there can be obtained an electronic component characterized in that a benzocyclobutene resin is used for the dielectric layer.

Further, according to the present invention, a terminal electrode formed so as to be connected to a part of the conductor pattern is further provided, and the terminal electrode is electrically connected to the inductor. It is possible to obtain an electronic component.

According to the invention, the terminal electrode is
A base electrode electrically connected to the conductor pattern and a surface electrode covering the base electrode are provided, and the surface electrode is N
An electronic component including an i film and a noble metal film formed on the Ni film is obtained.

[0019]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a schematic structure of a composite electronic component according to the first embodiment of the present invention. With reference to FIG. 1, the composite electronic component according to the present embodiment is provided with a silver palladium (AgP) film on a ferroelectric (high ε) ceramic substrate 1A.
After the step of forming the desired conductive pattern 2 consisting of d) by screen printing is repeated, the thick film laminated body 5 having the capacitance 3 formed thereon is baked, and then the thin film coil portion 7 is further provided on the thick film laminated body 5 and the heat resistant resin 9 is coated thereon. The terminal electrodes 11 are formed on both ends of the chip.

FIG. 2 is a sectional view schematically showing the structure of the composite electronic component shown in FIG.

As shown in FIG. 2, the thin-film coil section 7 has a C
It has a structure in which a thin film coil 13 formed in a spiral shape using a coil conductor made of u and an insulating resin layer 15 made of polyimide are laminated. The terminal electrodes 11 and 11 are A
terminal base electrodes 11A, 11 formed by sputtering g
Ni layers 11B and 11B are provided on A by plating, and solder layers 11C and 11C are further formed.

In the composite electronic component according to the present embodiment, a large capacitance can be obtained, and since a precise coil pattern can be formed on the thin film coil portion 7, an inductor having a high reactance can be obtained. Further, since only the capacitance 3 is formed in the ferroelectric ceramic and the thin film coil 13 is provided in the thin film coil portion 7 in a structure laminated with the insulating resin layer 15 made of polyimide, the conventional composite electronic component shown in FIG. There is no problem that stray capacitance is generated unlike the above.

Therefore, it is possible to provide a composite electronic component which is compact and inexpensive and has a large capacitance element and an inductor with a high L value.

Although the thin-film coil section 7 is provided with the thin-film coil 13 in the above embodiment, it goes without saying that a resistor layer may be formed in addition to the inductor.

Next, a composite electronic component according to a second embodiment of the present invention will be described with reference to the drawings.

The basic structure of the composite electronic component according to the second embodiment is substantially the same as that of the first embodiment shown in FIG. In the composite electronic component of the second embodiment, benzocyclobutene (BCB) is used as the insulating resin layer 15 of the thin film coil section 7.
A major feature is that a resin is used.

Further, instead of the terminal electrodes 11 in the first embodiment shown in FIG. 1, a terminal electrode using a conductive resin and a plating electrode is adopted.

Here, first, a method of forming the thin film coil portion 7 in the second embodiment will be described.

FIGS. 3 and 4 are views showing a process of forming the conductor pattern 12 which is the Cu conductor layer of the thin-film coil portion 7 in the second embodiment.

Referring to FIG. 3, first, as shown in FIG. 3A, after the insulating layer 42a made of UV-curable BCB is UV-cured, degreasing and cleaning are performed, and then the first etching, A second etching was performed through cleaning, followed by washing with pure water, washing with pure water after applying a catalyst twice, and immersion in an electroless Cu plating bath. Electroless Cu plating bath is World Metal Co., Ltd. copper ion supplement (MCU-AHS) 125 ml /
L, reducing agent and complexing agent (MCU-BHS) 125 ml /
It has a composition of L and pure water 700 ml / L. Electroless C
After u-plating, the plate was washed with pure water, subjected to an antioxidant treatment, purely washed, then alcohol-washed, and dried.

FIG. 3B shows an insulating layer having an electroless Cu plating layer 43 formed on one surface. In FIG. 3B, the electroless Cu plating layer 43 has a thickness of 1 μm.

Next, as shown in FIG. 3C, the resist 5
3D, the resist pattern 54 'shown in FIG. 4A was obtained by exposing and developing it through the mask 55 using photolithography, as shown in FIG. 3D. .

Next, as shown in FIG. 4B, electrolytic Cu
An electrolytic Cu plating layer 56 was obtained by plating. Electrolysis C
The u plating was performed after the surface treatment. Next, the resist pattern 54 'was peeled off to obtain the whole conductor pattern 57 having the shape shown in FIG.

Next, all conductor patterns 5 shown in FIG.
The exposed portion of the electroless Cu-plated layer 43 in FIG. 7 was not removed by wet etching and was washed with HCl to obtain an isolated pattern 63 formed on the insulating layer 42a as shown in FIG. 4D. Although the surface of the electrolytic Cu plating layer 56 is also slightly etched by the etching, since it is thicker than the electroless Cu plating layer 43 ', the conductor pattern is not lost.

The obtained conductor pattern 63 is made of electroless Cu.
It consists of the pattern of the plating layer 43 'and the pattern of the electrolytic Cu plating layer 56, and has a thickness of about 3 to 5 m and a width of about 30 m.
In the cleaning, photolithography, etching, cleaning process, etc., no defect occurred during the manufacturing process.

FIG. 5 is a diagram showing a step of forming the insulating resin layer 15 of the thin film coil portion 7 shown in FIG. Referring to FIG. 5, as shown in FIG. 5A, the ultraviolet curable BCB is formed by spin coating so as to cover the conductor pattern 63 formed on the insulating layer 42a shown in FIG. 4D.
A resin was applied to obtain an insulating layer 58. Next, FIG. 5 (b)
As shown in FIG.
Exposure through the insulating layer 5 as shown in FIG.
A through hole 61 was formed in No. 8. The through holes 61 are for obtaining electrical contact with the conductors formed on the insulating layer 58, and not all the conductor patterns 63.
It does not have to be provided above.

Next, by half-curing at 210 ° C. for 30 minutes in a nitrogen atmosphere, the insulating layer 62b shown in FIG. 5D is formed.
I got

In the composite electronic component according to this embodiment, since the BCB resin is used for the insulating resin layer 15 of the thin-film coil portion 7, it is extremely excellent in flattening the unevenness of the conductive pattern by the insulating resin layer. It is possible to form a conductive pattern having high dimensional accuracy without waviness of the conductive pattern laminated on the substrate. Moreover, since the conductive pattern is not wavy, the thin-film coil portion 7 is correspondingly larger than that in the first embodiment.
Can be made thinner. Furthermore, since the conductive pattern having high dimensional accuracy without waviness of the conductive pattern can be formed, the thin film coil portion 7 can be provided with an inductor having a high L value.

Furthermore, since the BCB resin which does not cause Cu migration is used, a Cu pattern which has low resistance and can be electroplated and which can be easily wet-etched can be selected as the conductive pattern, thus providing a low-cost composite electronic component. can do.

Next, the structure of the terminal electrode in the second embodiment will be described with reference to FIG.

The terminal electrodes 38, 38 (only one shown in FIG. 6) are provided with a base electrode electrically connected to the conductor pattern 2 in the insulating substrate 10 made of glass epoxy or the like, and a surface electrode covering the base electrode. The surface electrode has an electroless Ni plating film and a noble metal film formed thereon.

That is, referring to FIG. 6, a wiring end portion 40 of the conductor pattern 2 is formed on the insulating substrate 10, and the wiring end portion 40 is composed of an insulating layer 42 made of an insulating resin and a conductor pattern 43 made of a conductor. And are alternately stacked. The terminal electrode 38 is a wiring end portion 40 composed of this laminated body.
A base electrode 45 made of a conductive resin is formed so as to cover the lower end portion including the electrode portion 44 and a part of the electrode portion 44 at the upper end portion thereof, and further cover the electrode portion 44 and the base electrode 45. Then, an electroless Ni plating film 46 is formed, and an electroless palladium plating film 47 is further formed so as to cover it.

The base electrode 45 is made of conductive metal powder mixed with resin, applied, and cured.

In the composite electronic component obtained in the second embodiment, there is no peeling of the terminal electrodes 38, 38,
It was as reliable as the prior art.

According to the second embodiment, the terminal electrode 3
Since no solder is used for the portions 8 and 38, it is not necessary to treat waste liquid such as Pb, and the problem of environmental pollution does not occur.

Next, a composite electronic component according to the third embodiment of the present invention will be described.

FIG. 7 is a sectional view showing a schematic structure of a composite electronic component according to the third embodiment of the present invention. Referring to FIG. 7, the composite electronic component according to the present embodiment has a conductive pattern 22 formed in a spiral shape made of silver (Ag) or silver palladium (AgPd) on a magnetic substrate 21A made of Ni—Zn ferrite. After firing the thick film laminated body 25 on which the inductor 23 is formed by repeating the step of forming by screen printing, the thin film capacitance section 27 is further provided on the thick film laminated body 25, and the terminal electrodes 31 are provided on both ends of the chip coated with the heat resistant resin 29. 31 is formed.

FIG. 8 is a sectional view schematically showing the structure of the composite electronic component shown in FIG.

As shown in FIG. 8, the thin-film capacitance section 27 has internal capacitor electrodes 33, 33 made of Cu.
And a capacitance 36 in which a dielectric layer 35 made of polyimide is laminated. The configuration of the terminal electrodes 31, 31 is the same as that of the terminal electrode 11 in the first embodiment described above.
The same as 11.

The composite electronic component according to this embodiment can provide a small and inexpensive composite electronic component including an inductor having a relatively large L value.

In the above embodiment, the inductor 23 is provided on the thick film laminate 25, but a transformer may be formed instead of the inductor. Of course, a resistor layer may be formed in the thin film capacitance section 27 in addition to the capacitance 36.

Next, a composite electronic component according to the fourth embodiment of the present invention will be described.

The basic structure of the composite electronic component according to the fourth embodiment is substantially the same as that of the third embodiment shown in FIG. The composite electronic component of the fourth embodiment is characterized in that a benzocyclobutene (BCB) resin is used for the dielectric layer 35 of the thin film capacitance section 27. Further, instead of the terminal electrodes 31 and 31 in the third embodiment shown in FIG. 7, a terminal electrode using a conductive resin and a plated electrode is used as in the second embodiment shown in FIG. It is adopted.

First, in order to form the thin film capacitance portion 27 in the fourth embodiment, a step of forming the capacitor internal electrodes 33, 33 made of Cu and the conductor pattern 12 shown in FIG. 3 and FIG. It is formed by substantially the same process.

Further, the dielectric layer 35 is formed in a process substantially similar to the process of forming the insulating resin layer 15 shown in FIG.

In the composite electronic component according to this embodiment, since the BCB resin is used for the dielectric layer 35 of the thin film capacitance section 27, it is extremely excellent in flattening the unevenness of the conductive pattern by the dielectric layer. It is possible to form a conductive pattern having high dimensional accuracy without waviness of the conductive pattern laminated on the substrate. Further, since the conductive pattern is not corrugated, the thin film capacitance section 27 can be made thinner by that amount as compared with the third embodiment. Further, since the conductive pattern having no undulation of the conductive pattern and having a high dimensional accuracy can be formed, the positional displacement between the capacitor internal electrodes 33, 33 with the dielectric layer 35 therebetween is eliminated, and the accuracy of the capacitance 36 can be improved.

Further, since the BCB resin which does not cause Cu migration is used, a Cu pattern which has low resistance and can be electroplated and which can be easily wet-etched can be selected as a conductive pattern, thus providing a low-cost composite electronic component. can do.

[0059]

As described above, according to the first aspect of the present invention, there is provided a composite electronic component which is small and inexpensive and has a large capacitance element and an inductor having a high L value. obtain.

According to the second aspect of the invention, since the BCB resin is used for the insulator layer, it is possible to provide an inductor having a higher L value and further,
Since the BCB resin is used, it is possible to select a Cu pattern that has low resistance and can be electroplated as the conductive pattern and is easy to perform wet etching, and it is possible to provide a low-cost composite electronic component. Therefore, it is possible to provide a small-sized and thin composite electronic component having a large-capacitance capacitance element and an inductor having a high L value with low cost.

Further, according to the inventions of claims 3 to 4, there is provided a composite electronic component which has both a capacitance element having a large capacity and an inductor having a high L value and which does not cause environmental pollution during manufacturing. obtain.

According to the fifth aspect of the invention, it is possible to provide a small-sized and inexpensive composite electronic component including an inductor having a relatively large L value.

Further, according to the invention of claim 6, since BCB resin is used for the dielectric layer, a small and thin composite electronic component including an inductor having a relatively large L value is provided at low cost. You can

Further, according to the inventions of claims 7 to 8, it is possible to provide a composite electronic component which includes an inductor having a relatively large L value and has no problem of environmental pollution during manufacturing.

[Brief description of drawings]

FIG. 1 is a schematic view showing a composite electronic component according to a first embodiment of the present invention.

FIG. 2 is a diagram showing a configuration of a composite electronic component shown in FIG.

3 (a), (b), (c), and (d) are cross-sectional views sequentially showing steps of forming a conductor layer of a thin-film coil portion of the composite electronic component shown in FIG.

4 (a), (b), (c), and (d) are cross-sectional views sequentially showing steps of forming a conductor layer of a thin-film coil portion of the composite electronic component shown in FIG.

5 (a), (b), (c), and (d) are cross-sectional views sequentially showing a step of forming an insulating layer of a thin-film coil portion of the composite electronic component shown in FIG.

FIG. 6 is a diagram which is used for describing a method of forming a terminal electrode on the electronic component body of FIG.

FIG. 7 is a schematic diagram showing a composite electronic component according to a third embodiment of the present invention.

8 is a diagram showing a configuration of the composite electronic component shown in FIG.

FIG. 9 is a diagram showing a composite electronic component in which a capacitance and an inductor are embedded in a ferroelectric ceramic using a conventional thick film laminated structure.

FIG. 10 is a diagram showing a composite electronic component in which a thick film laminated body in which an inductor is embedded in a non-magnetic / non-ferroelectric ceramic is stacked on a thick film laminated body of a ferroelectric ceramic in which a conventional capacitance is embedded. is there.

[Explanation of symbols]

 1A Ferroelectric Ceramics Substrate 2 Conductive Pattern 3 Capacitance 5 Thick Film Laminate 7 Thin Film Coil Section 9 Heat Resistant Resin 11 Terminal Electrode 13 Thin Film Coil 15 Insulating Resin Layer 11A Terminal Base Electrode 11B Ni Layer 11C Solder Layer 21A Magnetic Substrate 22 Conductive Pattern 23 Inductor 25 Thick Film Laminate 27 Thin Film Capacitance Section 29 Heat Resistant Resin 31 Terminal Electrode 33 Capacitor Internal Electrode 35 Dielectric Layer 36 Capacitance

Claims (8)

[Claims] 1. An inductor in which a ferroelectric film and a conductor are laminated to form at least one capacitance inside and a thick film laminate is fired, and then a conductor pattern and an insulating resin are laminated on the thick film laminate. And an inductor electrically connected to the capacitance. 2. The electronic component according to claim 1, wherein a benzocyclobutene resin is used as the insulating resin. 3. The electronic component according to claim 1, further comprising a terminal electrode formed so as to be connected to a part of the conductor pattern, the terminal electrode being electrically connected to the capacitance. Electronic parts characterized by the following. 4. The electronic component according to claim 3, wherein the terminal electrode includes a base electrode electrically connected to the conductor pattern and a surface electrode covering the base electrode, and the surface electrode is made of Ni. An electronic component comprising a film and a noble metal film formed on the Ni film. 5. A capacitor in which a conductor pattern and a dielectric layer are laminated is provided on the thick film laminated body after laminating a magnetic material and a conductor to form at least one inductor therein and firing the inductor. Is electrically connected to the inductor. 6. The electronic component according to claim 5, wherein a benzocyclobutene resin is used for the dielectric layer. 7. The electronic component according to claim 5, further comprising a terminal electrode formed so as to be connected to a part of the conductor pattern, the terminal electrode being electrically connected to the inductor. Electronic parts characterized by the following. 8. The electronic component according to claim 7, wherein the terminal electrode includes a base electrode electrically connected to the conductor pattern and a surface electrode covering the base electrode, and the surface electrode is made of Ni. An electronic component comprising a film and a noble metal film formed on the Ni film.