JP3000579B2 - Manufacturing method of chip coil - Google Patents
Manufacturing method of chip coilInfo
- Publication number
- JP3000579B2 JP3000579B2 JP63280874A JP28087488A JP3000579B2 JP 3000579 B2 JP3000579 B2 JP 3000579B2 JP 63280874 A JP63280874 A JP 63280874A JP 28087488 A JP28087488 A JP 28087488A JP 3000579 B2 JP3000579 B2 JP 3000579B2
- Authority
- JP
- Japan
- Prior art keywords
- coil conductor
- coil
- film
- conductor
- insulating film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Manufacturing Cores, Coils, And Magnets (AREA)
- Coils Or Transformers For Communication (AREA)
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、基板上にコイル導体を形成してなるチップ
コイルの製造方法に関して、特に小型のチップコイルに
おいてコイルのＱを向上できるようにした製造方法に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a method for manufacturing a chip coil in which a coil conductor is formed on a substrate, and particularly to a method for improving the Q of a small chip coil. It relates to a manufacturing method.
従来から、コイルとして、金属導体を螺旋状に巻回し
てなる空心コイル及びフェライトやアルミナ等のボビン
に巻線を施してなるボビン巻線コイル等がある。しかし
この両コイルは形状が大きく，特性が不安定であること
から、高周波領域では採用できない。これに対して絶縁
体基板の表面に金属薄膜からなる帯状のコイル導体を形
成してなる高周波コイルは、部品形状を小型化でき、し
かもマイクロ波帯の高周波領域に採用できる。この高周
波コイルを製造する場合は、従来、以下の方法が採用さ
れている。例えばガラス，セラミックス製基板の表面全
面にスパッタリングあるいは蒸着法等によりAg等の金属
薄膜を形成し、該薄膜の上面にコイルパターンに応じた
形状のレジスト膜を形成し、これにより上記薄膜の不要
部分をエッチングにより除去してコイル導体を形成す
る。Conventionally, coils include an air-core coil formed by spirally winding a metal conductor and a bobbin wound coil formed by winding a bobbin made of ferrite or alumina. However, these two coils cannot be used in a high frequency range because of their large shapes and unstable characteristics. On the other hand, a high-frequency coil in which a strip-shaped coil conductor made of a metal thin film is formed on the surface of an insulator substrate can reduce the size of components and can be used in a high-frequency region of a microwave band. When manufacturing this high-frequency coil, the following method has conventionally been adopted. For example, a metal thin film of Ag or the like is formed on the entire surface of a glass or ceramic substrate by sputtering or vapor deposition, and a resist film having a shape corresponding to a coil pattern is formed on the upper surface of the thin film. Is removed by etching to form a coil conductor.
ところで、上記従来の高周波コイルにおいては、コイ
ル導体をスパッタリング等の薄膜技術により形成するこ
とから、このコイル導体の膜厚が薄い分導体抵抗が大き
くなり、Ｑが低いという問題があり、このＱの向上が要
請されている。By the way, in the above-mentioned conventional high-frequency coil, since the coil conductor is formed by a thin film technique such as sputtering, there is a problem that the thinner the coil conductor, the larger the conductor resistance and the lower the Q. Improvement is required.
ここで、上記Ｑを向上させるには、コイル導体の膜厚
を厚くして導体抵抗を小さくしてやればよいことが知ら
れている。そこで、上記薄膜技術により形成されたコイ
ル導体の上面に、コイル導体を重ねて形成して膜厚を厚
くすることが考えられる。しかしながら線幅，間隔が数
十μｍと非常に細いコイル導体の上面にコイル導体を精
度よく重ねて形成するのは困難であり、結局コイル導体
の膜厚を厚くすることは現状では難しい。Here, it is known that the Q value can be improved by increasing the thickness of the coil conductor and decreasing the conductor resistance. Thus, it is conceivable to increase the film thickness by forming a coil conductor on the upper surface of the coil conductor formed by the thin film technique. However, it is difficult to accurately form a coil conductor on the top surface of a very thin coil conductor having a line width and an interval of several tens of μm, and it is currently difficult to increase the thickness of the coil conductor.
本発明は上記従来の状況に鑑みてなされたもので、コ
イル導体を重ねて形成する際の寸法精度を向上して厚膜
化を実現でき、Ｑを向上できるチップコイルの製造方法
を提供することを目的としている。The present invention has been made in view of the above-mentioned conventional circumstances, and provides a method of manufacturing a chip coil capable of improving the dimensional accuracy when forming coil conductors in an overlapping manner, realizing a thick film, and improving Q. It is an object.
本件発明者らは、薄膜技術により形成したコイル導体
の上面に、コイル導体を重ねて形成して厚膜化する場
合、基板上に、コイル導体のパターン形状に応じた開口
を有する絶縁膜を形成し、これの開口内に導体膜を形成
するようにすれば寸法精度のよい厚膜のコイル導体が得
られることを見出した。そしてさらに検討を重ねた結
果、上記コイル導体に応じたパターンの絶縁膜を形成す
るには、該絶縁膜に微細加工ができなければならず、従
ってこの絶縁膜の材料として微細加工ができるものを選
定すれば寸法精度のよい厚膜のコイル導体を実現できる
ことに想到し、本発明を成したものである。The present inventors form an insulating film having an opening corresponding to the pattern shape of the coil conductor on the substrate when the coil conductor is formed on the upper surface of the coil conductor formed by the thin film technology and the coil conductor is formed to be thick. However, it has been found that if a conductor film is formed in the opening, a thick-film coil conductor with good dimensional accuracy can be obtained. As a result of further study, in order to form an insulating film having a pattern corresponding to the coil conductor, fine processing must be performed on the insulating film. The present invention is based on the idea that a thick-film coil conductor with good dimensional accuracy can be realized by selection.
そこで、本発明は、基板の表面に薄膜状の第１コイル
導体をパターン形成し、該コイル導体の上面を覆うよう
に上記基板の表面にポリイミドあるいはポリアミドから
なる絶縁膜をコーティングした後、該絶縁膜の第１コイ
ル導体に対応した所要部分をエッチング法により除去す
る。つまり必ずしも第１コイル導体全面ではなく、膜厚
を厚くしたい要厚膜化部分に対応した部分をエッチング
法により除去し、しかる後上記第１コイル導体の上面の
上記所要部分にメッキ法により第２コイル導体を形成し
たことを特徴としている。Accordingly, the present invention provides a method of forming a thin-film first coil conductor on the surface of a substrate, coating the surface of the substrate with an insulating film made of polyimide or polyamide so as to cover the upper surface of the coil conductor, A required portion of the film corresponding to the first coil conductor is removed by an etching method. In other words, the portion corresponding to the portion of the first coil conductor that is required to be thickened is removed by etching, not necessarily the entire surface of the first coil conductor, and then the required portion of the upper surface of the first coil conductor is plated with the second portion by plating. It is characterized in that a coil conductor is formed.
ここで、上記絶縁膜にポリイミドあるいはポリアミド
を採用した理由について説明する。Here, the reason why polyimide or polyamide is used for the insulating film will be described.
このポリイミド，ポリアミドは、従来から絶縁膜とし
て採用されているSiO2,Si3N4,PSG,SOG等の無機材料に比
べ、加工性，量産性，及び品質に対する信頼性に優れて
おり、しかも誘電率が小さい。また、感光性を有してい
るポリイミド，ポリアミドは、これを基板上にコーティ
ングした後に、また非感光性のものは、ホトレジストを
コートした後に、それぞれホトリソグラフィーの技術を
採用することにより、容易に微細加工ができる。These polyimides and polyamides are more excellent in workability, mass productivity, and reliability in quality than inorganic materials such as SiO 2 , Si 3 N 4 , PSG, and SOG which have been conventionally used as insulating films. Low dielectric constant. In addition, polyimide and polyamide having photosensitivity can be easily coated by coating them on a substrate, and non-photosensitive ones can be easily coated with a photoresist by using a photolithography technique. Fine processing is possible.
また、本発明のチップコイルは、基板上に第1,第２コ
イル導体及び絶縁膜を一層だけ形成してなる単層のも
の、コイル導体と絶縁膜を交互に積層してなる多層のも
のが含まれる。Further, the chip coil of the present invention may be a single layer having a single layer of the first and second coil conductors and an insulating film formed on a substrate, or a multilayer having a coil conductor and an insulating film alternately laminated. included.
さらに、本発明のコイル導体の形状としては、例えば
スパイラルタイプ，ミアンダタイプ等が考えられ、特に
限定されるものではない。Further, the shape of the coil conductor of the present invention may be, for example, a spiral type, meander type, etc., and is not particularly limited.
さらにまた、上記第１コイル導体の形成方法として
は、スパッタリング，蒸着，イオンレーティング法等が
採用できる。Furthermore, as a method for forming the first coil conductor, sputtering, vapor deposition, ion rating, or the like can be employed.
本発明に係るチップコイルの製造方法によれば上記第
１コイル導体の上面にポリイミド，ポリアミドからなる
絶縁膜をコーティングして、該絶縁膜の第１コイル導体
の厚くしたい部分をエッチングで除去した後、第１コイ
ル導体の上面にメッキ法により第２コイル導体を形成し
たので、上記エッチングにより絶縁膜に微細加工ができ
るから、この絶縁膜に線幅の細いコイルパターンに応じ
た開口を形成でき、寸法精度を向上できる。According to the method of manufacturing a chip coil according to the present invention, the upper surface of the first coil conductor is coated with an insulating film made of polyimide or polyamide, and a portion of the insulating film where the first coil conductor is to be made thicker is removed by etching. Since the second coil conductor is formed on the upper surface of the first coil conductor by plating, fine processing can be performed on the insulating film by the above-described etching, so that an opening corresponding to a coil pattern having a small line width can be formed in the insulating film. The dimensional accuracy can be improved.
また、予め厚膜の導体膜を形成し、これをフォトエッ
チングしてコイル導体を形成する方法の場合、コイル導
体の側面がエッチングによって侵食され、寸法精度が出
ないという問題があるが、本発明は、メッキ法で第２コ
イル導体を形成することによって厚膜化する方法である
から、上述のような侵食の問題が生じることはない。Further, in the case of a method in which a thick conductor film is formed in advance, and the coil conductor is formed by photoetching the same, there is a problem that the side surface of the coil conductor is eroded by the etching and dimensional accuracy is not obtained. Is a method of increasing the film thickness by forming the second coil conductor by plating, so that the above-described erosion problem does not occur.
以下、本発明の実施例を図について説明する。 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
第１図ないし第３図は本発明の一実施例によるチップ
コイルの製造方法を説明するための図である。1 to 3 are views for explaining a method of manufacturing a chip coil according to one embodiment of the present invention.
まず、本発明の一実施例方法により製造されたチップ
コイルの構造について説明する。First, the structure of a chip coil manufactured by the method of one embodiment of the present invention will be described.
保護被膜を除いた平面状態を示す第１図において、１
は本実施例のチップコイルであり、これはガラス又はセ
ラミックスからなる絶縁体基板２の上面に、膜厚１〜20
μｍの金属膜からなるコイル導体４をパターン形成して
構成されている。このコイル導体４は、上記基板２上面
の左，右縁部に形成された端子電極3a,3b及び中央部に
形成されたスパイラルコイル５からなり、該コイル５の
外端5aは図面左側の端子電極3aに接続されており、内端
5bは後述するリード電極８を介して図面右側の端子電極
3bに接続されている。In FIG. 1 showing a plane state excluding the protective film, 1
Denotes a chip coil according to the present embodiment, which is formed on the upper surface of an insulating substrate 2 made of glass or ceramic, and has a film thickness of 1 to 20 mm.
The coil conductor 4 made of a metal film having a thickness of μm is formed by patterning. The coil conductor 4 is composed of terminal electrodes 3a and 3b formed on the left and right edges of the upper surface of the substrate 2 and a spiral coil 5 formed on the center, and the outer end 5a of the coil 5 is connected to a terminal on the left side of the drawing. Connected to electrode 3a, the inner end
5b is a terminal electrode on the right side of the drawing via a lead electrode 8 described later.
Connected to 3b.
また、上記コイル１の断面状態を示す第２図におい
て、上記コイル導体４は、上記絶縁体基板２に薄膜技術
により形成された第１コイル導体６と、該コイル導体６
の上面にメッキにより形成された第２コイル導体７とか
ら構成された２層構造となっている。上記第１コイル導
体６は、Ti,Cr,Pd等からなる金属膜の上面に、さらにN
i,Cu,Ag等からなる金属膜を蒸着，スパッタリングある
いはイオンプレーティング等の薄膜技術により形成して
導体膜を形成し、上記コイル導体４及び端子電極3a,3b
以外の部分をエッチングにより除去して形成されたもの
である。In FIG. 2 showing a sectional state of the coil 1, the coil conductor 4 includes a first coil conductor 6 formed on the insulator substrate 2 by a thin film technique,
And a second coil conductor 7 formed by plating on the upper surface. The first coil conductor 6 is further provided with N on the upper surface of a metal film made of Ti, Cr, Pd or the like.
A conductor film is formed by forming a metal film made of i, Cu, Ag, or the like by a thin film technique such as evaporation, sputtering, or ion plating, and the coil conductor 4 and the terminal electrodes 3a, 3b are formed.
The other parts are formed by removing the parts by etching.
さらに、上記第２コイル導体７は、上記第１コイル導
体６の上面の基板２上にポリイミドあるいはポリアミド
樹脂をコーティングして絶縁膜９を形成し、該絶縁膜９
の第１コイル導体６の上面部分をエッチングにより除去
して開口を形成し、この開口内に電解メッキあるいは無
電解メッキによりAg,Cu,Au等を被覆して形成されたもの
である。Further, the second coil conductor 7 is formed by coating a polyimide or polyamide resin on the substrate 2 on the upper surface of the first coil conductor 6 to form an insulating film 9.
The upper surface of the first coil conductor 6 is removed by etching to form an opening, and the opening is formed by coating the inside with Ag, Cu, Au or the like by electrolytic plating or electroless plating.
また、上記コイル導体４の両端子電極3a,3b部分を除
く基板２上にはポリイミドあるいはポリアミドからなる
保護被膜10が形成されており、該被膜10のスパイラルコ
イル５の内端5bを臨む部分にはスルーホール11が形成さ
れている。さらに、上記保護被膜10の上面にはリード電
極８が形成されており、該電極８の一端は上記スルーホ
ール11を介して内端5bに接続され、他端は端子電極3bに
接続されている。これにより本実施例の高周波コイル１
が構成されている。A protective coating 10 made of polyimide or polyamide is formed on the substrate 2 excluding the terminal electrodes 3a and 3b of the coil conductor 4, and a portion of the coating 10 facing the inner end 5b of the spiral coil 5 is formed. Has a through hole 11 formed therein. Further, a lead electrode 8 is formed on the upper surface of the protective film 10, one end of the electrode 8 is connected to the inner end 5b through the through hole 11, and the other end is connected to the terminal electrode 3b. . Thereby, the high-frequency coil 1 of the present embodiment
Is configured.
次に、本発明の実施例による上記チップコイル１の製
造方法を説明する。Next, a method of manufacturing the chip coil 1 according to an embodiment of the present invention will be described.
第３図（ａ）ないし第３図（ｉ）は本実施例の製造工
程を示す断面図であり、この各図は第２図の中央部分を
示す。3 (a) to 3 (i) are cross-sectional views showing the manufacturing steps of the present embodiment, and each figure shows a central portion of FIG.
まず、鏡面研磨が施された厚さ0.6mmのガラス基板
２の上面に、密着性を向上させるためのTi膜13aをスパ
ッタリング法により形成し、次に該Ti膜13aの表面にTi,
Agを同時に２元スパッタリングすることによりTi−Ag膜
13bを形成し、続いてこのTi−Ag膜13bの表面に導電性の
良いAg膜13cを同じくスバッタリングにより形成して、
３層構造からなる厚さ2200Åの導体膜13を形成する（第
３図（ａ））。First, a Ti film 13a for improving adhesion is formed on the mirror-polished glass substrate 2 having a thickness of 0.6 mm by sputtering, and then Ti, 13 is formed on the surface of the Ti film 13a.
Ti-Ag film by simultaneous sputtering of Ag
13b is formed, and then a conductive good Ag film 13c is formed on the surface of the Ti-Ag film 13b by the same sputtering,
A conductor film 13 having a three-layer structure and a thickness of 2200 ° is formed (FIG. 3A).
上記導体膜13の上面にレジスト膜12をコーティング
し、該レジスト膜12を予めスパイラルコイル５及び端子
電極3a,3bに応じてパターン設計されたマスクで覆い、
これを露光してレジスト膜12の残したい部分に光りを当
てる。これを現像処理してレジスト膜12の不要部分を除
去する（第３図（ｂ））。A resist film 12 is coated on the upper surface of the conductor film 13, and the resist film 12 is covered with a mask which is previously designed in accordance with the spiral coil 5 and the terminal electrodes 3a and 3b,
This is exposed to shine light on the portion of the resist film 12 that is desired to remain. This is developed to remove unnecessary portions of the resist film 12 (FIG. 3B).
次に、上記ガラス基板２にエッチング処理を施す
る。すると上記レジスト膜12のない部分の導体膜13が除
去され、線幅40μm,間隔40μｍのスパイラルコイル5,端
子電極3a,3bからなる第１コイル導体６が形成される
（第３図（ｃ））。しかる後、この第１コイル導体６の
上面のレジスト膜12を除去する。Next, the glass substrate 2 is subjected to an etching process. Then, the portion of the conductor film 13 without the resist film 12 is removed, and the first coil conductor 6 including the spiral coil 5 and the terminal electrodes 3a and 3b having a line width of 40 μm and an interval of 40 μm is formed (FIG. 3C). ). Thereafter, the resist film 12 on the upper surface of the first coil conductor 6 is removed.
続いて、上記ガラス基板２の第１コイル導体６の上
面に、感光体ポリイミド樹脂からなる絶縁膜９を厚さ10
μｍになるようにコーティングし、乾燥させる（第３図
（ｄ））。Subsequently, an insulating film 9 made of a photosensitive polyimide resin is formed on the upper surface of the first coil conductor 6 of the glass substrate 2 to a thickness of 10 mm.
It is coated to a thickness of μm and dried (FIG. 3 (d)).
そして、上記絶縁膜９の第１コイル導体６の厚くし
たい部分を、即ち、第１コイル導体６の全面を厚膜化す
る場合は全面を、一部のみ厚膜化する場合は該一部をマ
スクで覆い、これを露光した後、これを現像（エッチン
グ）する。すると、絶縁膜９は露光された第１コイル導
体６以外の部分だけが残り、第１コイル導体６に沿った
開口14が形成されて、上記スパイラルコイル5,端子電極
3a,3b部分が露出することになる（第３図（ｅ））。次
に、上記ガラス基板２をN2ガス中にて400℃に加熱して
絶縁膜９を硬化させる。なお、上記ポリイミドが非感光
性の場合は、ポジ形レジストを塗布した後、絶縁膜の残
さない部分を露光してエッチングすればよい。Then, the portion of the insulating film 9 where the first coil conductor 6 is desired to be thickened, that is, the entire surface of the first coil conductor 6 is made thicker, and the entirety of the first coil conductor 6 is made partly thicker. After covering with a mask and exposing it, it is developed (etched). Then, only the portion of the insulating film 9 other than the exposed first coil conductor 6 remains, and an opening 14 is formed along the first coil conductor 6, and the spiral coil 5, the terminal electrode
The portions 3a and 3b are exposed (FIG. 3 (e)). Next, the glass substrate 2 is heated to 400 ° C. in N 2 gas to cure the insulating film 9. In the case where the polyimide is non-photosensitive, after applying a positive resist, the remaining portion of the insulating film may be exposed and etched.
上記ガラス基板２をシアン化銀浴に浸漬して電解メ
ッキを行う。すると、上記第１コイル導体６の上面部分
だけにAgメッキ膜が付着して第２コイル導体７が形成さ
れる。これにより、第1,第２コイル導体6,7からなる厚
膜状のコイル導体４が形成されることとなる。The glass substrate 2 is immersed in a silver cyanide bath to perform electrolytic plating. Then, the Ag plating film adheres only to the upper surface portion of the first coil conductor 6 to form the second coil conductor 7. As a result, the thick-film coil conductor 4 including the first and second coil conductors 6 and 7 is formed.
次に、上記コイル導体４のガラス基板２上面に感光
性ポリイミド樹脂をコーティングして保護被膜10を形成
し、乾燥させる（第３図（ｇ））。そして、この保護被
膜10の、上記端子電極3a,3b（第２図参照），及びスル
ーホール11対応部を除く部分にマスクをかけ、上記工
程と同様の方法にて露光−現像を行う。すると、上記端
子電極3a,3b（第２図参照）部分が露出されるととも
に、内端5b部分にスルーホール11が形成されることにな
る（第３図（ｈ））。Next, a protective polyimide film 10 is formed by coating a photosensitive polyimide resin on the upper surface of the glass substrate 2 of the coil conductor 4 and dried (FIG. 3 (g)). Then, a mask is applied to a portion of the protective film 10 except for the terminal electrodes 3a and 3b (see FIG. 2) and a portion corresponding to the through hole 11, and exposure and development are performed in the same manner as in the above process. Then, the terminal electrodes 3a and 3b (see FIG. 2) are exposed, and the through hole 11 is formed at the inner end 5b (FIG. 3 (h)).
最後に、上記保護被膜10の上面にスパッタリングに
より導体膜を形成し、上記工程と同様の方法にてリー
ド電極８を形成して上記内端5bと端子電極3bを接続する
（第３図（ｉ））。これにより、本実施例の1.6×3.2×
0.7mmからなる大きさの高周波コイル１が製造される
（第１図及び第２図参照）。Finally, a conductor film is formed on the upper surface of the protective film 10 by sputtering, a lead electrode 8 is formed in the same manner as in the above process, and the inner end 5b and the terminal electrode 3b are connected (FIG. 3 (i) )). Thereby, 1.6 × 3.2 ×
A high-frequency coil 1 having a size of 0.7 mm is manufactured (see FIGS. 1 and 2).
なお、上記工程では、スパイラルコイル５の内端5b
と端子電極3bとをリード電極８で接続したが、上記両者
5b,3bをAu線によるワイヤボンディングにより接続し、
これをナイロン，エポキシ樹脂系の接着剤で固定しても
よい。In the above process, the inner end 5b of the spiral coil 5
And the terminal electrode 3b are connected by the lead electrode 8,
5b, 3b are connected by wire bonding with Au wire,
This may be fixed with a nylon or epoxy resin adhesive.
次に本実施例の作用効果について説明する。 Next, the operation and effect of this embodiment will be described.
本実施例方法で製造されたチップコイル１によれば、
ガラス基板２の上面に第１コイル導体６を形成し、これ
の上面に第２コイル導体７を形成してコイル導体４を構
成したので、例えば１〜20μｍの厚さからなるコイル導
体４を形成することができるから、それだけ導体抵抗を
小さくでき、Ｑを向上できる。これにより、高周波領
域,GHZ帯まで自己共振しない小型の平面コイルが得られ
る。According to the chip coil 1 manufactured by the method of the present embodiment,
Since the first coil conductor 6 is formed on the upper surface of the glass substrate 2 and the second coil conductor 7 is formed on the upper surface of the first coil conductor 6, the coil conductor 4 having a thickness of, for example, 1 to 20 μm is formed. Therefore, the conductor resistance can be reduced accordingly, and the Q can be improved. As a result, a small planar coil which does not self-resonate up to the high frequency region and the GHZ band is obtained.
また、本実施例の製造方法では、第１コイル導体６の
上面にポリイミド樹脂からなる絶縁膜９を形成し、これ
の第１コイル導体６部分をエッチングして開口14を形成
し、該開口14内の第１コイル導体６上にメッキにより第
２コイル導体７を形成したので、線幅が細く厚みの厚い
パターン形成する際の微細加工を可能にして寸法精度を
向上でき、品質の信頼性を向上できる。In the manufacturing method according to the present embodiment, an insulating film 9 made of a polyimide resin is formed on the upper surface of the first coil conductor 6, and the opening 14 is formed by etching the first coil conductor 6 portion. Since the second coil conductor 7 is formed on the first coil conductor 6 by plating, fine processing can be performed when a pattern having a small line width and a large thickness is formed, and dimensional accuracy can be improved, and reliability of quality can be improved. Can be improved.
さらに、本実施例では絶縁膜９にポリイミドあるいは
ポリアミドを採用することにより、耐熱性，耐湿性に優
れ、かつヒートショック性，耐振動性特性にも優れた部
品が得られる。Further, in this embodiment, by employing polyimide or polyamide for the insulating film 9, a component having excellent heat resistance, moisture resistance, heat shock resistance and vibration resistance can be obtained.
なお、上記実施例では、ガラス基板２上に、コイル導
体４及び保護被膜10を一層形成した場合を例にとって説
明したが、本発明は上記実施例のコイル１において、上
記保護被膜10の上面にさらにコイル導体，絶縁膜を繰り
返し形成してなる多層コイルにも適用でき、また上記基
板２を挟んだ両表面にコイルを形成してなるものにも適
用できる。In the above embodiment, the case where the coil conductor 4 and the protective film 10 are formed on the glass substrate 2 as one layer has been described as an example. However, in the present invention, in the coil 1 of the above embodiment, the upper surface of the protective film 10 is provided. Furthermore, the present invention can be applied to a multilayer coil in which a coil conductor and an insulating film are repeatedly formed, and also to a coil in which coils are formed on both surfaces sandwiching the substrate 2.
また、上記実施例では、第１コイル導体６の上面に絶
縁膜９をコーティングした後、エッチングして第１コイ
ル導体６を露出させたが、本発明の技術思想は、第１コ
イル導体６の所定の部分を露出させるようにして、スク
リーン印刷などを用いて所定の位置にポリイミドあるい
はポリアミドからなる絶縁膜を形成し、しかる後、メッ
キにより第２コイル導体７を形成する場合も包含するも
のである。Further, in the above embodiment, after the upper surface of the first coil conductor 6 is coated with the insulating film 9, the first coil conductor 6 is exposed by etching, but the technical idea of the present invention is that This includes a case where an insulating film made of polyimide or polyamide is formed at a predetermined position by using screen printing or the like so that a predetermined portion is exposed, and then the second coil conductor 7 is formed by plating. is there.
さらに、上記実施例ではスパイラル状のコイルを例に
とって説明したが、本発明は勿論これに限られるもので
はない。例えば、第４図に示すようなミアンダタイプの
コイル導体20にも適用でき、この場合も上記実施例と同
様の効果が得られる。Further, in the above-described embodiment, the spiral coil has been described as an example, but the present invention is of course not limited to this. For example, the present invention can be applied to a meander type coil conductor 20 as shown in FIG. 4, and in this case, the same effect as in the above embodiment can be obtained.
さらにまた、上記実施例では高周波コイル１を例にと
ったが、本発明はコイルとコンデンサとを組み合わせて
なるLCフィルタ、あるいはトランスなどにも適用でき
る。Furthermore, in the above embodiment, the high-frequency coil 1 is taken as an example, but the present invention can be applied to an LC filter or a transformer formed by combining a coil and a capacitor.
以上のように本発明に係るチップコイルの製造方法に
よれば、上記第１コイル導体の上面にポリイミドあるい
はポリアミドからなる絶縁膜を形成し、該絶縁膜の所要
部分をエッチング法により除去した後、第１コイル導体
の上面にメッキ法により第２コイル導体を形成したの
で、微細加工を可能にして寸法精度の高い、膜厚の厚い
コイル導体を形成でき、Ｑを向上できる効果がある。As described above, according to the method of manufacturing a chip coil according to the present invention, an insulating film made of polyimide or polyamide is formed on the upper surface of the first coil conductor, and a required portion of the insulating film is removed by an etching method. Since the second coil conductor is formed on the upper surface of the first coil conductor by a plating method, it is possible to form a coil conductor having high dimensional accuracy and a high film thickness by enabling fine processing, and has an effect of improving Q.
第１図ないし第３図は本発明の一実施例によるチップコ
イル及びその製造方法を説明するための図であり、第１
図はその平面図、第２図はその断面図、第３図（ａ）な
いし第３図（ｉ）はそれぞれ製造工程を示す断面図、第
４図は上記実施例の変形例を示す斜視図である。 図において、１はチップコイル、２はガラス基板（基
板）、４はコイル導体、６は第１コイル導体、７は第２
コイル導体、９は絶縁膜である。FIGS. 1 to 3 are views for explaining a chip coil and a method of manufacturing the same according to an embodiment of the present invention.
FIG. 2 is a plan view, FIG. 2 is a sectional view thereof, FIGS. 3 (a) to 3 (i) are sectional views showing manufacturing steps, respectively, and FIG. 4 is a perspective view showing a modification of the above embodiment. It is. In the figure, 1 is a chip coil, 2 is a glass substrate (substrate), 4 is a coil conductor, 6 is a first coil conductor, 7 is a second coil conductor.
The coil conductor 9 is an insulating film.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭59−74608（ＪＰ，Ａ) 特開 昭51−47259（ＪＰ，Ａ) 特開 昭60−254403（ＪＰ，Ａ) 実開 昭57−195809（ＪＰ，Ｕ) 実開 昭56−157715（ＪＰ，Ｕ) (58)調査した分野(Int.Cl.7，ＤＢ名) H01F 17/00 H01F 41/04 ──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-59-74608 (JP, A) JP-A-51-47259 (JP, A) JP-A-60-254403 (JP, A) 195809 (JP, U) Japanese Utility Model Showa 56-157715 (JP, U) (58) Fields investigated (Int. Cl. 7 , DB name) H01F 17/00 H01F 41/04
Claims (1)
ターン形成し、該コイル導体の上面を覆うように上記基
板の表面にポリイミドあるいはポリアミドからなる絶縁
膜をコーティングした後、該絶縁膜の上記第１コイル導
体に対応した所要部分をエッチング法により除去し、し
かる後該第１コイル導体の上面の所要部分にメッキ法に
より第２コイル導体を形成したことを特徴とするチップ
コイルの製造方法。A thin-film first coil conductor is formed on a surface of a substrate by patterning, and an insulating film made of polyimide or polyamide is coated on a surface of the substrate so as to cover an upper surface of the coil conductor. Manufacturing a chip coil, wherein a required portion corresponding to the first coil conductor is removed by an etching method, and then a second coil conductor is formed by a plating method on a required portion of the upper surface of the first coil conductor. Method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63280874A JP3000579B2 (en) | 1988-11-07 | 1988-11-07 | Manufacturing method of chip coil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63280874A JP3000579B2 (en) | 1988-11-07 | 1988-11-07 | Manufacturing method of chip coil |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02126610A JPH02126610A (en) | 1990-05-15 |
| JP3000579B2 true JP3000579B2 (en) | 2000-01-17 |
Family
ID=17631156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63280874A Expired - Lifetime JP3000579B2 (en) | 1988-11-07 | 1988-11-07 | Manufacturing method of chip coil |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3000579B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015115886B4 (en) | 2014-09-30 | 2023-06-15 | Subaru Corporation | control for a vehicle |
Families Citing this family (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2982193B2 (en) * | 1989-12-28 | 1999-11-22 | 株式会社村田製作所 | Manufacturing method of high frequency coil |
| JP2997729B2 (en) * | 1990-06-29 | 2000-01-11 | 日本電信電話株式会社 | Inductance element formation method |
| JPH0430707U (en) * | 1990-07-04 | 1992-03-12 | ||
| JPH04276608A (en) * | 1991-03-04 | 1992-10-01 | Nippon Telegr & Teleph Corp <Ntt> | Inductance element |
| JP3197022B2 (en) * | 1991-05-13 | 2001-08-13 | ティーディーケイ株式会社 | Multilayer ceramic parts for noise suppressor |
| JPH0810658B2 (en) * | 1991-05-31 | 1996-01-31 | 株式会社アモルファス・電子デバイス研究所 | Split coil type inductance element |
| US5363080A (en) * | 1991-12-27 | 1994-11-08 | Avx Corporation | High accuracy surface mount inductor |
| JP2897091B2 (en) * | 1992-07-09 | 1999-05-31 | 株式会社村田製作所 | Line transformer |
| JP2000323345A (en) * | 1999-05-11 | 2000-11-24 | Tdk Corp | High-frequency electronic parts and its manufacture |
| JP2001319312A (en) | 2000-05-10 | 2001-11-16 | Tdk Corp | Thin-film coil, its manufacturing method, thin-film magnetic head and its manufacturing method |
| JP4191506B2 (en) | 2003-02-21 | 2008-12-03 | Ｔｄｋ株式会社 | High density inductor and manufacturing method thereof |
| KR101862409B1 (en) * | 2011-12-22 | 2018-07-05 | 삼성전기주식회사 | Chip inductor and method for manufacturing chip inductor |
| JP6312997B2 (en) * | 2013-07-31 | 2018-04-18 | 新光電気工業株式会社 | Coil substrate, manufacturing method thereof, and inductor |
| KR101751117B1 (en) * | 2015-07-31 | 2017-06-26 | 삼성전기주식회사 | Coil electronic part and manufacturing method thereof |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5147259A (en) * | 1974-10-22 | 1976-04-22 | Soshin Electric | MAIKABANJONIKEISEISHITAPURINTOKOIRU |
| JPS5974608A (en) * | 1982-10-21 | 1984-04-27 | Hitachi Ltd | Formation of wiring structure |
| JPS60254403A (en) * | 1984-05-31 | 1985-12-16 | Fujitsu Ltd | Manufacture of thin-film coil |
-
1988
- 1988-11-07 JP JP63280874A patent/JP3000579B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102015115886B4 (en) | 2014-09-30 | 2023-06-15 | Subaru Corporation | control for a vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02126610A (en) | 1990-05-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5071509A (en) | Chip coil manufacturing method | |
| KR101049610B1 (en) | Coil Parts and Manufacturing Method | |
| JP3000579B2 (en) | Manufacturing method of chip coil | |
| US7453343B2 (en) | Thin-film type common-mode choke coil | |
| US7508292B2 (en) | Coil component | |
| US7002446B2 (en) | Coil component | |
| JPH06290951A (en) | Highly accurate surface mounting type inductor | |
| JPH09270325A (en) | Electronic part | |
| JP2982193B2 (en) | Manufacturing method of high frequency coil | |
| US12020837B2 (en) | Laminated inductor component | |
| JP2003332141A (en) | Chip common mode choke coil | |
| JPH02123706A (en) | High frequency coil and manufacture thereof | |
| JP2714343B2 (en) | High frequency coil and method of manufacturing the same | |
| JP3467615B2 (en) | Electronic component and method of manufacturing the same | |
| JPH09270330A (en) | Electronic part | |
| JP2002359115A (en) | Chip type common mode choke coil | |
| JP2002110423A (en) | Common mode choke coil | |
| JPH04223307A (en) | Chip type coil with shield | |
| JPS63283004A (en) | Flat surface inductor and manufacture thereof | |
| KR0167392B1 (en) | A film-type inductor and method for preparing the same | |
| JPH0945570A (en) | Electronic component and manufacture thereof | |
| JP2000049013A (en) | Electronic components | |
| JP2021048419A (en) | Laminated inductor component | |
| JPH09270329A (en) | Electronic part and manufacturing method thereof | |
| JP2001006936A (en) | Electronic component |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20071112 Year of fee payment: 8 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20081112 Year of fee payment: 9 |
|
| EXPY | Cancellation because of completion of term |