JPH09270329A - Electronic part and manufacturing method thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part and manufacturing method thereof which satisfies required electric characteristics and reliability enough, provides a satisfactory adhesion, and enables the wet etching and low-cost production process. SOLUTION: This electronic part has an insulation substrate 11, a laminate 15 composed of alternately laminated insulation resin layers 12a-d and conductor patterns 13a-d on the substrate 11, and external electrode terminals which are electrically connected to the patterns 13a-d and run between the substrate 11 and the laminate 15. The conductor patterns 13a-d have a lower layer formed on the insulation layers 12a-d or substrate 11 and conductive film made of a conductive metal on the lower layer which has a first Ti or Cr lower film and second Ni lower film formed on this first film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a chip component, and more particularly to an LCR element, a thin film EMI filter, a common mode choke coil, a signal transformer,
The present invention relates to a current sensor, a surface mount component such as a composite component, an electronic component such as a lead component, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, an electronic component shown in FIG. 13 is known (see Japanese Patent Laid-Open No. 3-201417). In this electronic component, an insulating resin layer 102 made of a polyimide resin and internal conductor patterns 103, 104 made of Ti, Ti-Ag, Ag formed by a sputtering method are alternately laminated on an insulating substrate 101 to form an insulating resin layer. The uppermost conductor pattern 10 is formed by removing the ends of 102.
The electronic component 100 is formed by exposing the end portion of No. 4.

A terminal base portion is formed on a side surface of the electronic component 100 so as to be connected to an end portion of the conductor pattern 104, and the terminal base portion is covered from the upper end portion of the electronic component body through the side surface. The external electrode terminal portion reaching the lower end portion is formed and used.

[0004]

However, in order to form a sputtered film, it is necessary to use an expensive vacuum device and a sputter device with a long work-holding time, and the process becomes complicated, resulting in a cost reduction of the product. It has the drawback of becoming high.

Further, for example, there has been proposed a method of forming an inner conductor pattern of a multilayer wiring board by applying electrolytic Cu plating with Ti as an underlayer, but the underlayer is melted during plating, It has a drawback that uniform plating cannot be obtained. Further, in the step of removing the unnecessary portion of the underlayer, the pattern formed by plating is also scraped off at the same time, which causes a decrease in accuracy.

Therefore, the technical problem of the present invention is to obtain sufficient adhesion between the conductor pattern and the insulating layer or the insulating substrate.
An object of the present invention is to provide an electronic component that can sufficiently satisfy electrical characteristics and reliability, a conductor pattern can be wet-etched, and can be manufactured by a low cost process, and a manufacturing method thereof.

[0007]

According to the present invention, an insulating substrate, a laminate formed by alternately laminating a conductor pattern and an insulating layer on the insulating substrate, and an electrical connection to the conductor pattern are provided. In the electronic component including the insulating substrate and the laminated body, and the external electrode terminal portion formed so as to be electrically connected to the conductor pattern, the conductor pattern includes the insulating layer or the substrate. An underlying layer formed on the underlying layer; and a conductive film made of a conductive metal formed on the underlying layer, the underlying layer comprising a first underlying film made of a Ti or Cr film and the first underlying film. An electronic component having a second undercoating film made of a Ni film formed on the undercoating film is obtained.

Further, according to the present invention, in the electronic component, the electronic component is obtained in which the conductive film is a Cu plating film.

Further, according to the present invention, in a method of manufacturing an electronic component in which an insulating layer and a conductor pattern are alternately laminated on an insulating substrate, a first layer made of a Ti or Cr film is formed on the insulating layer or the insulating substrate. Forming a base film, forming a second base film made of a Ni film on the first base film, and forming a second base film on the second base film by an electroplating film having a predetermined pattern. Then, a method for manufacturing an electronic component is obtained, which is characterized in that the substrate is formed and further covered with an insulating layer.

Further, according to the present invention, in the method of manufacturing an electronic component, at least one of the first and second base films is formed by a sputtering method. can get.

According to the present invention, there is also provided a method of manufacturing an electronic component according to any one of the methods of manufacturing an electronic component, characterized in that the conductive film is formed by an electric Cu plating method.

[0012]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention. Referring to FIG. 1, an electronic component 10 according to an embodiment of the present invention is a low-pass filter, and is formed so as to cover the electronic component body 1 and both end surfaces and a part of a side surface portion of the electronic component body 1. The external electrode terminal portions 2, 2, and 2 are provided.

FIG. 2 is an exploded perspective view showing the electronic component body of FIG. 3 is a completed view of the electronic component body of FIG.

Referring to FIGS. 2 and 3, the electronic component body 1 comprises insulating resin layers 12a, 12b, 1 as insulating layers on an insulating substrate 11 made of free-cutting ceramics.
2c, 12d and conductor patterns 13a, 13b, 13
It is obtained by alternately stacking c and 13d to form a stack 15. Here, the insulating resin layers 12a to 12d
A through hole or notch 14 is provided in the. Also, instead of the conductor pattern 13c, the conductor pattern layer 13
You may use c '.

4 and 5 are sectional views schematically showing a method of forming the conductor pattern of FIG. First, FIG.
As shown in FIG. 4 (a), after the insulating substrate is organically washed, an insulating resin layer 12a made of UV-sensitive BCB is applied, exposed to ultraviolet light, and after curing, as shown in FIG. 4 (b), The surface is cleaned by reverse sputtering, a Ti film 3a is subsequently formed as a first base film, and the Ti film 3a is formed on the Ti film 3a.
As shown in (c), a Ni film 3b was formed as a second base film by the sputtering method. Here, in the present embodiment, the Ti film is used as the first base film, but a Cr film may be used. Further, the Ni film 4 which is the second base film can also be formed by an electroless plating method or an electrolytic plating method.

Next, as shown in FIG.
After coating, as shown in FIG. 4 (e), using photolithography, through the mask 5, exposing and developing,
A resist pattern 4 ′ shown in FIG. 5A was obtained.

Next, as shown in FIG. 5B, electrolytic Cu
An electrolytic Cu plating layer 6 is obtained by plating. Electrolytic Cu
Plating was performed after the surface treatment. Next, the resist pattern 4'was peeled off to obtain an intermediate conductor pattern 7 having the shape shown in FIG. 5 (c). Next, the Ti film 3a and the Ni film 3b in the intermediate conductor pattern 7 shown in FIG. 5 (c) are wet-etched to form an isolated layer formed on the insulating resin layer 12a as shown in FIG. 5 (d). The conductive pattern 13a was obtained. As the etching liquid, dilute sulfuric acid was used for Ni, but dilute phosphoric acid, chromic acid or the like can also be used. Further, hydrofluoric acid was used for the Ti film.

The obtained conductor pattern 13a is composed of a Ti film 3a having a thickness of about 0.05 μm, which is a first underlayer film, and a Ni film having a thickness of about 0.25 to 0.3 μm, which is a second underlayer film. 3b
And a pattern of the electrolytic Cu plating layer 6 and having a thickness of about 3 to 5 μm and a width of about 30 μm, no defects occurred during the manufacturing process in cleaning, photolithography, etching, cleaning steps, and the like. Although the conductor pattern 13a is formed on the insulating substrate 11 via the insulating resin layer 12a in the above description, the conductive pattern 13a is also formed on the insulating substrate 11 as shown in FIG.
By using the insulating resin layer 12a of FIGS. 5E to 5A to 5D as the insulating substrate 11, it is possible to directly form a conductor pattern.

FIG. 6 is a sectional view schematically showing a method of forming the insulating resin layer shown in FIG. Referring to FIG. 6, as shown in FIG. 6A, the UV-sensitive BCB resin is spin-coated so as to cover the conductor pattern 13a formed on the insulating layer 12a shown in FIG. 5D. By coating, an insulating resin layer 8 was obtained. Next, as shown in FIG. 6B, photolithography was used to perform exposure through the mask 9 to form through holes 14 in the insulating layer 8 as shown in FIG. 6C. It is needless to say that the through holes 14 are for obtaining electrical contact with the conductors formed on the insulating resin layer 8 and need not necessarily be provided on all the conductor patterns 13a. Next, by heating and half-curing, an insulating resin layer 12b shown in FIG. 6D was obtained.

Further, another conductor pattern 13 shown in FIG.
b, 13c and 13d are also obtained in the same manner as the steps shown in FIGS. Also, the insulating resin layers 12b, 12c, 1
2d is also obtained in the same manner as the step shown in FIG.

After coating the lead electrode portion 22 of the electronic component body 10 shown in FIG. 3 and across the side surface of the insulating substrate 11 to the lower surface, a conductive paste in which Ni powder is mixed with epoxy resin is applied, dried and cured. ， By electrolytic barrel plating,
By forming a Ni plating film and a solder plating film thereon, the external electrode terminal portion 2 of the electronic component shown in FIG. 1 is formed, and the electronic component 1 is completed.

As described above, in the embodiment of the present invention, by forming the Ni film as the upper layer of the underlying layer of the conductor pattern, it is possible to form a uniform Cu plating film which is a conductor film. It is possible to reduce variations in parts and parts characteristics.

Further, since the base layer in the conductor pattern is made of a metal different from that of the conductive film, the conductive film is not melted when the base layer is etched, and an accurate conductive pattern can be obtained.

In the embodiment of the present invention, a low-pass filter having three terminals is illustrated as an electronic component, but an LCR element having two terminals, a common mode choke coil having four terminals, a transformer, a current sensor. The electronic parts such as can be manufactured in the same process only by changing the shapes of the insulating resin layer and the conductor pattern.

Further, in the embodiment of the present invention, the chip type electronic component is shown as the electronic component, but it goes without saying that the lead component is constituted by providing the lead wire to the external electrode terminal portion.

[0027]

As described above, sufficient conductor pattern and adhesion to the insulating layer or the insulating substrate can be obtained, electrical characteristics and reliability can be sufficiently satisfied, and the conductor pattern is wet-etched. It is possible to provide an electronic component that can be manufactured by a low cost process and a manufacturing method thereof.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the electronic component body shown in FIG.

FIG. 3 is a perspective view showing a completed state of the electronic component body of FIG.

4 (a), (b), (c), (d) and (e) are cross-sectional views schematically showing a method of forming the conductor pattern of FIG.

5 (a), (b), (c), and (d) are cross-sectional views schematically showing a method of forming the conductor pattern of FIG.

6 (a), (b), (c), and (d) are cross-sectional views schematically showing a method of forming the insulating resin layer of FIG.

FIG. 7 is a cross-sectional view showing an example of a conventional printed wiring board.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic component 2 External electrode terminal part 3a Ti film 3b Ni film 4 Resist 4'Pattern 5 Mask 6 Cu electrolytic plating layer 7 All conductor pattern 8 Insulating layer 9 Mask 10 Electronic component main body 11 Insulating substrate 12a, 12b, 12c, 12d Insulation Resin layers 13a, 13b, 13c, 13c ', and 13d Conductor pattern 14 Through hole or notch 15 Laminated body 22 Extraction electrode part 100 Electronic component 101 Insulating substrate 102 Insulating resin layer 103, 104 Internal conductor pattern

Claims (5)

[Claims] 1. An insulating substrate, and a laminated body formed by alternately laminating conductive patterns and insulating layers on the insulating substrate,
In the electronic component, which is electrically connected to the conductor pattern and includes an external electrode terminal portion formed so as to be electrically connected to the conductor pattern across the insulating substrate and the laminated body, the conductor pattern is A base layer formed on the insulating layer or the substrate, and a conductive film made of a conductive metal formed on the base layer, wherein the base layer is a first layer made of a Ti or Cr film. An electronic component comprising a base film and a second base film made of a Ni film formed on the first base film. 2. The electronic component according to claim 1, wherein the conductive film is a Cu plating film. 3. A method of manufacturing an electronic component in which an insulating layer and a conductor pattern are alternately laminated on an insulating substrate, wherein a first layer made of a Ti or Cr film is formed on the insulating layer or the insulating substrate.
Forming a base film, forming a second base film made of a Ni film on the first base film, and forming a second base film on the second base film by an electroplating film having a predetermined pattern. A method for manufacturing an electronic component, which comprises forming a film and further covering it with an insulating layer. 4. The method of manufacturing an electronic component according to claim 3, wherein at least one of the first and second base films is formed by a sputtering method. 5. The method of manufacturing an electronic component according to claim 3, wherein the conductive film is formed by an electric Cu plating method.