JPH09270330A - Electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part such as noise filter structured so that its attenuation characteristic can be a wide band one at low cost in a simple structure, without providing any other circuit arrangement. SOLUTION: This electronic part has an insulation substrate 11, a laminate 15 composed of alternately laminated insulation resin layers 12a-d and conductor patterns 13a-d on the substrate 11, and external electrode terminals which are electrically connected to the patterns 13a-d and run between the substrate 11 and the laminate 15. The conductor patterns 13a-d has a lower layer formed on the insulation layers 12a-d or substrate 11, conductive film made of a conductive metal formed on this lower layer, and magnetic film made of a Ni-contained metal or alloy formed between the lower layer and conductive film or on this film.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component such as a chip component, and more particularly to an LCR element, a thin film EMI filter, a common mode choke coil, a signal transformer,
The present invention relates to a current sensor, a surface mount component such as a composite component, an electronic component such as a lead component, and a manufacturing method thereof.

[0002]

2. Description of the Related Art Conventionally, an electronic component shown in FIG. 10 is known (see Japanese Patent Laid-Open No. 3-201417). In this electronic component, an insulating resin layer 102 made of a polyimide resin and internal conductor patterns 103, 104 made of Ti, Ti-Ag, Ag formed by a sputtering method are alternately laminated on an insulating substrate 101 to form an insulating resin layer. The uppermost conductor pattern 10 is formed by removing the ends of 102.
The electronic component 100 is formed by exposing the end portion of No. 4.

A terminal base portion is formed on a side surface of the electronic component 100 so as to be connected to an end portion of the conductor pattern 104, and the terminal base portion is covered from the upper end portion of the electronic component body through the side surface. The external electrode terminal portion reaching the lower end portion is formed and used.

[0004]

However, when the above electronic component is used as a noise filter, the frequency band width with a desired attenuation characteristic becomes narrower as the size is reduced.

In order to make up for this drawback, it is sufficient to provide another circuit element. However, the number of circuit stages increases, the configuration becomes complicated, and the advantage that the device is simple and easy to manufacture is small. It has the disadvantage of damaging it.

Therefore, the technical problem of the present invention is, for example,
An object of the present invention is to provide an electronic component capable of inexpensively broadening a band in a noise filter with a simple configuration even if a circuit configuration or the like is not separately provided.

[0007]

According to the present invention, an insulating substrate, a laminate formed by alternately laminating a conductor pattern and an insulating layer on the insulating substrate, and an electrical connection to the conductor pattern are provided. In the electronic component including the insulating substrate and the external electrode terminal portion formed so as to be electrically connected to the conductor pattern across the laminated body, the conductor pattern has a magnetic film on at least a part thereof. An electronic component characterized by comprising:

Further, according to the present invention, in the electronic component, the magnetic film is made of a metal or an alloy having ferromagnetism.

Further, according to the present invention, in any one of the electronic components, the conductor pattern includes an underlayer formed on the insulating substrate or the insulating layer and a conductive layer formed on the underlayer. An electronic component characterized by comprising:

According to the present invention, in any one of the electronic parts, the magnetic film is provided between the underlayer and the conductive layer. can get.

Further, according to the present invention, in any one of the above electronic components, the electronic component is obtained in which the magnetic film is provided on the conductive layer.

Further, according to the present invention, in any one of the electronic components, the electronic component is obtained in which the conductor layer is made of Cu, Al, or an alloy thereof.

Further, according to the present invention, in any one of the electronic components, there is obtained an electronic component characterized in that the magnetic film is made of a metal or alloy containing Ni. Here, in the present invention, examples of the metal or alloy containing Ni include Ni and FeNi, but the present invention is not limited thereto.

Further, according to the present invention, in any one of the electronic components, the electronic component can be obtained in which the underlayer is made of Ti or Cr.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention. Referring to FIG. 1, an electronic component 10 according to an embodiment of the present invention is a noise filter,
The electronic component body 1 is provided with three external electrode terminal portions 2, 2, and 2 formed so as to cover both end faces and a part of the side surface portion of the electronic component body 1.

FIG. 2 is an exploded perspective view showing the electronic component body of FIG. 3 is a completed view of the electronic component body of FIG.

Referring to FIGS. 2 and 3, the electronic component body 1 comprises an insulating substrate 11 made of a ceramic material having a free-cutting property and an insulating resin layer made of benzocyclobutene resin (BCB) as an insulating layer. 12a is obtained by alternately laminating insulating resin layers 12a, 12b, 12c and 12d made of the same material and conductor patterns 13a, 13b, 13c and 13d to form a laminate 15. Through holes or notches 14 are provided in the insulating resin layers 12a to 12d. Further, the conductor pattern 13c 'may be used instead of the conductor pattern 13c. Here, BCB is used as the insulating resin, but polyimide can be used. Furthermore, the conductor pattern is
A Ti film or Cr film is formed as an underlayer, and Ni is formed on top of it.
Alternatively, an electrolytic Cu plating film is formed as a magnetic film and a conductive film made of a FeNi alloy film in this order or in the reverse order.

4 and 5 are sectional views schematically showing an example of a method for forming the conductor pattern of FIG. First, as shown in FIG. 4A, after the insulating substrate is organically washed, the insulating resin layer 12a made of UV-sensitive BCB is applied,
After UV exposure and curing, as shown in FIG. 4 (b), the surface is cleaned by reverse sputtering, and then a Ti film is formed as the underlying layer 3a of the conductor pattern. As shown in c), the Ni film 3 is used as the magnetic film 3b.
b was formed by the sputtering method. Here, in the first embodiment, the Ti film is used as the underlayer 3a, but a Cr film may be used. In addition, the magnetic film 3b, Ni
The film can also be formed by an electroless plating method or an electrolytic plating method.

Next, as shown in FIG.
Then, as shown in FIG. 4 (e), the resist pattern 4 ′ shown in FIG. 5 (a) was obtained by exposing and developing it through the mask 5 using photolithography. .

Next, as shown in FIG. 5B, electrolytic Cu
An electrolytic Cu plating layer 6 is obtained by plating. Electrolytic Cu
Plating was performed after the surface treatment. Next, the resist pattern 4'was peeled off to obtain an intermediate conductor pattern 7 having the shape shown in FIG. 5 (c). Next, the Ni film and the Ti film in the intermediate conductor pattern 7 shown in FIG. 5C are subjected to wet etching with dry sulfuric acid and hydrofluoric acid (dry etching is also possible), as shown in FIG. Insulating resin layer 12
An isolated conductive pattern 13a formed on a was obtained.

The conductor pattern 13a thus obtained is based on the underlayer 3
a Ti film with a thickness of about 0.05 μm, a magnetic film 3b with a Ni film of about 0.25 to 0.3 μm, and electrolytic Cu.
It has a pattern of the conductive film 6 made of a plating layer, and has a thickness of about 3 to 5 μm and a width of about 30 μm. Although the conductor pattern 13a is formed on the insulating substrate 11 via the insulating resin layer 12a in the above description, the insulating substrate 11 is also formed on the insulating substrate 11 as shown in FIG.
Insulating resin layer 1 of (b) to (e) and FIGS. 5 (a) to (d)
By using 2a as the insulating substrate 11, a conductor pattern can be directly formed in the same manner.

FIG. 6 is a sectional view schematically showing a method of forming the insulating resin layer shown in FIG. Referring to FIG. 6, as shown in FIG. 6A, the UV-sensitive BCB resin is spin-coated so as to cover the conductor pattern 13a formed on the insulating layer 12a shown in FIG. 5D. By coating, an insulating resin layer 8 was obtained. Next, as shown in FIG. 6B, photolithography was used to perform exposure through the mask 9 to form through holes 14 in the insulating layer 8 as shown in FIG. 6C. It is needless to say that the through holes 14 are for obtaining electrical contact with the conductors formed on the insulating resin layer 8 and need not necessarily be provided on all the conductor patterns 13a. Next, by heating and half-curing, an insulating resin layer 12b shown in FIG. 6D was obtained.

Further, another conductor pattern 13 in FIG.
b, 13c and 13d are also obtained in the same manner as the steps shown in FIGS. Also, the insulating resin layers 12b, 12c, 1
2d is also obtained in the same manner as the step shown in FIG.

After coating the lead-out electrode portion 22 of the electronic component body 10 shown in FIG. 3 and across the side surface of the insulating substrate 11 to the lower surface, a conductive paste in which Ni powder is mixed with epoxy resin is applied, dried and cured. ， By electrolytic barrel plating,
By forming a Ni plating film and a solder plating film thereon, the external electrode terminal portion 2 of the electronic component shown in FIG. 1 is formed, and the electronic component 1 is completed.

7 and 8 are sectional views schematically showing another example of the method for forming the conductor pattern of FIG. First, as shown in FIG. 7A, after the insulating substrate is organically washed,
An insulating resin layer 12a made of UV-sensitive BCB is applied, exposed to UV light, and after curing, as shown in FIG.
As shown in Fig. 3, the surface of the reverse sputter is cleaned, followed by the underlayer 3
A Ti film is formed as a. Here, the Ti film is used as the underlayer 3a, but a Cr film may be used.

Next, as shown in FIG. 7C, the resist 4
Then, as shown in FIG. 7D, the resist pattern 4 ′ shown in FIG. 8A was obtained by exposing and developing it through the mask 5 using photolithography.

Next, as shown in FIG. 8B, electrolytic Cu
A conductive film 6 made of an electrolytic Cu plating film is obtained by plating. Further, FeNi is formed on the conductive film 6 of the electrolytic Cu plating film.
The magnetic layer 3b made of an alloy layer is formed by electrolytic FeNi alloy plating. Although the FeNi alloy layer is used as the magnetic layer 3b in the second embodiment of the present invention,
An electrolytic Ni plated film can also be used.

Next, the resist pattern 4'is peeled off to obtain an intermediate conductor pattern 7 having the shape shown in FIG. 8 (c). Next, T in the intermediate conductor pattern 7 shown in FIG.
The i film was subjected to wet etching with hydrofluoric acid (dry etching is also possible), and as shown in FIG.
An isolated conductive pattern 13a formed on the insulating resin layer 12a was obtained.

The conductor pattern 13a thus obtained is based on the underlayer 3
a Ti film having a thickness of about 0.05 μm, a pattern of a conductive film 6 made of an electrolytic Cu plating film, and a magnetic film 3b made of a FeNi alloy plating film formed on the pattern.
With a thickness of about 3 to 5 μm and a width of about 30 μm, no defects occurred during the manufacturing process in the cleaning, photolithography, etching, cleaning steps, etc. In the above,
Although the conductor pattern 13a is formed on the insulating substrate 11 via the insulating resin layer 12a, the conductive pattern 13a is formed on the insulating substrate 11 as shown in FIG.
Insulating resin layer 1 of (b)-(d) and FIGS. 9 (a)-(d)
By using 2a as the insulating substrate 11, a conductor pattern can be directly formed in the same manner.

FIG. 10 is a sectional view schematically showing another example of the method of forming the insulating resin layer shown in FIG. Referring to FIG. 10, the UV-sensitive BCB resin is spin-coated as illustrated in FIG. 10A so as to cover the conductor pattern 13a formed on the insulating layer 12a illustrated in FIG. 9D. By coating, an insulating resin layer 8 was obtained. Next, as shown in FIG. 10B, using photolithography,
By exposing through the mask 9, a through hole 14 was formed in the insulating resin layer 8 as shown in FIG. It is needless to say that the through holes 14 are for obtaining electrical contact with the conductors formed on the insulating resin layer 8 and need not necessarily be provided on all the conductor patterns 13a. Next, by heating and half-curing, an insulating resin layer 12b shown in FIG. 10 (d) was obtained.

The other conductor pattern 13 in FIG.
b, 13c and 13d are also obtained in the same manner as the steps shown in FIGS. Also, the insulating resin layers 12b, 12c, 1
2d is also obtained in the same manner as the step shown in FIG.

As described above, according to the embodiment of the present invention, by forming the magnetic film made of a ferromagnetic material on the upper layer or the conductive film of the conductor pattern, in the desired frequency band, If the material is appropriately selected so that the μ ″ (loss) characteristic due to the magnetic field in the surface direction of the magnetic film is increased in the current flowing through the conductor pattern, it has a function of forming a filter element having a broadband attenuation characteristic.

In the embodiment of the present invention, a low-pass filter having three terminals is illustrated as an electronic component, but an LCR element having two terminals, a common mode choke coil having four terminals, a transformer, a current sensor. The electronic parts such as can be manufactured in the same process only by changing the shapes of the insulating resin layer and the conductor pattern.

Further, in the embodiment of the present invention, the chip type is shown as the electronic component, but it goes without saying that the lead component can be constructed by providing a lead wire to the external electrode terminal portion by soldering or the like. Yes.

[0036]

As described above, according to the present invention, for example, in a noise filter, there is provided an electronic component which has a simple attenuation characteristic and can be used for a wide band at low cost without separately providing a circuit configuration or the like. Can be provided.

[Brief description of drawings]

FIG. 1 is a perspective view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the electronic component body shown in FIG.

FIG. 3 is a perspective view showing a completed state of the electronic component body of FIG.

4 (a), (b), (c), (d) and (e) are cross-sectional views sequentially showing steps of forming the conductor pattern of FIG.

5 (a), (b), (c), and (d) are cross-sectional views schematically showing an example of a method for forming the conductor pattern of FIG.

6 (a), (b), (c), and (d) are cross-sectional views schematically showing an example of a method of forming the insulating resin layer of FIG.

7 (a), (b), (c), and (d) are cross-sectional views schematically showing another example of the method of forming the conductor pattern of FIG.

8 (a), (b), (c), and (d) are cross-sectional views schematically showing another example of the method of forming the conductor pattern of FIG.

9 (a), (b), (c), and (d) are cross-sectional views schematically showing another example of the method of forming the insulating resin layer of FIG.

FIG. 10 is a sectional view showing an example of a conventional electronic component.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Electronic component 2 External electrode terminal part 3a Underlayer 3b Magnetic film 4 Resist 4'Pattern 5 Mask 6 Conductive film 7 Intermediate conductor pattern 8 Insulating resin layer 9 Mask 10 Electronic component main body 11 Insulating substrate 12a, 12b, 12c, 12d Insulating resin Layers 13a, 13b, 13c, 13c ', and 13d Conductor pattern 14 Through hole or notch 15 Laminated body 22 Extraction electrode part 100 Electronic component 101 Insulating substrate 102 Insulating resin layer 103, 104 Internal conductor pattern

Claims (8)

[Claims] 1. An insulating substrate, and a laminated body formed by alternately laminating conductive patterns and insulating layers on the insulating substrate,
In an electronic component that is electrically connected to the conductor pattern and includes an external electrode terminal portion that is formed so as to be electrically connected to the conductor pattern across the insulating substrate and the laminated body, the conductor pattern is An electronic component having a magnetic film on at least a part thereof. 2. The electronic component according to claim 1, wherein the magnetic film is made of a metal or an alloy having ferromagnetism. 3. The electronic component according to claim 1, wherein the conductor pattern includes a base layer formed on the insulating substrate or the insulating layer and a conductive layer formed on the base layer. An electronic component characterized by being. 4. The electronic component according to claim 1, wherein the magnetic film is provided between the base layer and the conductive layer. Electronic components. 5. The electronic component according to claim 1, wherein the magnetic film is provided on the conductive layer. 6. The electronic component according to claim 1, wherein the conductor layer is made of Cu, Al, or an alloy thereof. 7. The electronic component according to claim 1, wherein the magnetic film is made of a metal or alloy containing Ni. 8. The electronic component according to claim 1, wherein the underlayer is made of Ti or Cr.