JPH09270342A - Electronic part and method of producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic part and a method of producing the same, in which the production process can be simplified and which can be produced without polluting the environment. SOLUTION: Insulating layers and conductive patterns are formed on a substrate 1, thereby forming an electronic part body 10. An external electrode 8 is so formed as to cover at least a part of a side face. The external electrode 8 has an underlying electrode 5 electrically connected to a conductive layer and a surface electrode covering the underlying electrode 5. This surface electrode is formed in such a manner that an electroless plating Ni film 6 is formed on the underlying electrode 5 formed by applying a conductive resin, and an electroless Pd plating film 7 is formed on the electroless plating Ni film 6.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component and a method of manufacturing the same, and more specifically, an inductance (L), a capacitance (C), an electric resistance (R) element, a thin film EMI.
The present invention relates to an electronic component used as a surface mount component or a lead component such as a filter, a common mode choke coil, a signal transformer, a current sensor, a composite component, and a manufacturing method thereof.

[0002]

2. Description of the Related Art In a conventional chip type electronic component, a conductor pattern, an insulating layer, and an electrode portion are superposed on a substrate having an insulating property and used as a base electrode for a terminal by baking silver or sputtering. It is formed by solder plating to form external electrodes.

On the other hand, as shown in FIG. 9, a conductor layer 2 and an insulating layer 3 made of polyimide are provided on an insulating substrate 1.
Are alternately superposed, an electrode portion 4 is provided on one end of the upper surface, a conductive resin is dip-coated on the end surface portion so as to be connected to the electrode portion 4, and the base electrode 5 is formed by drying. The Ni film and the solder film are formed on the electrode 5 by an electroplating method, and the external electrode 6 is formed (Japanese Patent Application No. 7-16).
6929 publication).

[0004]

However, the prior art method of forming the external electrode employs the barrel electroplating method in which the media are mixed when the metal plating film is applied on the base electrode of the electronic component. Therefore, there is a problem in terms of manufacturing cost due to the large size of the device and the separation process of media.

Further, the lead component used in the solder plating bath for forming the external electrode is contained in the plating waste liquid or discharged as a waste, which causes a problem of environmental pollution.

Therefore, a technical object of the present invention is to provide an electronic component which can simplify the manufacturing process and has no problem of environmental pollution during the manufacturing, and a manufacturing method thereof.

[0007]

According to the present invention, an electronic component body is formed by laminating an insulating layer and a conductor pattern on a substrate, and at least a part of a side surface of the electronic component body is covered. In an electronic component having an external electrode formed thereon, the external electrode includes a base electrode electrically connected to the conductor pattern, and a surface electrode covering the base electrode, and the surface electrode includes an electroless Ni plating film and the surface electrode. An electronic component having a noble metal film formed on an electroless Ni plating film is obtained.

Further, according to the present invention, in the electronic component, the base electrode is formed by mixing a conductive metal powder in a resin, coating the resin, and curing the powder. can get.

Here, in the electronic component of the present invention, the noble metal film is formed of gold, silver, or platinum group (Ru, Rh, Pd,
Any of a single layer or a multi-layer of a metal film made of a simple substance or an alloy of Os, Ir, Pt) can be selected, but an electroless Pd plated film formed by an electroless plating method is preferable.

Further, according to the present invention, an electronic component body is formed by laminating an insulating layer and a conductor layer on a substrate, and an external electrode is formed so as to cover at least a part of a side surface of the electronic component body. In the method of manufacturing an electronic component, a base electrode is formed so as to be electrically connected to the conductor layer, an electroless Ni plating film is formed on the base electrode, and the electroless N
A method of manufacturing an electronic component is obtained in which the external electrode is formed by forming a noble metal film on the i-plated film.

Further, according to the present invention, in the method of manufacturing an electronic component, the base electrode is formed by mixing conductive metal powder in resin and applying the powder. Can be obtained.

Here, in the method of manufacturing an electronic component of the present invention, the noble metal film is formed of gold, silver, or platinum group (Ru, R).
h, Pd, Os, Ir, Pt) can be selected from a single layer or a multi-layer of a metal film consisting of a simple substance or an alloy, but is composed of an electroless Pd plating film formed by an electroless plating method. It is preferable.

[0013]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a partial schematic sectional view showing an electronic component according to an embodiment of the present invention. Referring to FIG. 1, an electronic component 10 includes an insulating layer 2 made of an insulating resin and a conductor pattern 3 made of a conductor, which are formed on a substrate 1, and are alternately laminated to form a laminated body. The base electrode 5 is formed so as to cover the lower surface end including the electrode portion 4 and a part thereof at the end portion, and further, the electroless Ni plating film is formed so as to cover the electrode portion 4 and the base electrode 5. 6 is formed, and an electroless palladium plating film is further formed so as to cover it.

Although only two conductor patterns and three insulating layers are shown in FIG. 1, the conductor pattern and the insulating layers are actually about eight layers in total.

FIG. 2 is an exploded perspective view showing the structure of the electronic component body according to the embodiment of the present invention. Referring to FIG. 2, a substrate 1 made of an insulating ceramic material having a free-cutting property is washed with a mixed solution of acetone and methanol, and then an insulating resin made of benzocyclobutene (BCB) is applied,
It is completely cured to form the insulating layer 2a. In the embodiment of the present invention, the insulating resin is BCB.
Besides, a polyimide resin or the like can also be used.

Next, the surface of the insulating layer 2a is cleaned by the reverse sputtering method, and subsequently by the sputtering method, titanium is about 0.05 to 0.15 μm and Cu is 0.25 to 0.3 μm.
A thin film of about m is formed, a resist is applied so as to form a spiral pattern, and a recess pattern is formed by photolithography. Next, electrolytic Cu plating is performed so as to fill this concave pattern, and the resist is peeled off. Next, by wet etching (or dry etching is also possible), the conductor pattern 3a is formed as an isolated pattern. An electrode portion is formed at the end of the conductor pattern 3a. Next, B on the conductor pattern 3a
CB is applied, a desired notch 13 or through hole portion 14 is formed by photolithography, and curing is performed under appropriate conditions, and similarly to the conductor pattern 3a, the conductor pattern 3b and the insulating layer 2b are formed. , The insulating layer 2c, the conductor pattern 3c, the insulating layer 2d, and the conductor pattern 3d are respectively formed and laminated to form the electronic component body 11 shown in FIG.

Next, a method for forming the external electrodes 8 on the electronic component body 11 will be described with reference to FIGS. As described above, the formed electronic component body 11 shown in FIG. 3 is inserted into the insertion hole 12 of the carrier 18 in the longitudinal direction as shown in FIG. The electronic component body 11 is
As shown in FIG. 5A, the carrier 18 is inserted into the insertion hole 12. Further, as shown in FIG. 5 (b), the electronic component body 11 is pushed downward by the face-up pins 21 so that the lower end portion thereof projects from the carrier. next,
In this state, as shown in FIG. 6, the carrier 18 descends, and the end face portion of the electronic component body 11 is pressed by the conductive resin 20 stretched to a constant thickness on the surface plate 22, and the end face portion thereof is pressed. After the conductive resin is applied by dip coating, the carrier 18 rises. In this way, the electronic component main body whose end face is coated with the conductive resin 20 is exposed to the atmosphere of 120 to 200 ° C.
By performing temporary drying for 0 to 30 minutes, the base electrode 5 for one terminal is formed.

The other end face is also similarly provided with the surfacing pin 21.
The other end face of the electronic component is chamfered by the surface of the electronic component, and the conductive resin 20 spread to a constant thickness on the surface plate 22 is dip-coated on the end face and temporarily dried in the atmosphere to dry the other terminal base electrode. Also forms.

The external electrodes on the side surface are shown in FIG.
As shown in (a), a conductive paste 26 is printed on the mylar tape 24 on the jig 23 to which the mylar tape 24 is attached, via a screen plate 25 at an interval corresponding to the interval of the electrodes to be arranged. Then, the electronic component body 11 fixed to the mounting jig 27 is mounted on the mounting jig 27.
At the same time, it is lowered as shown by an arrow 29 to press the printed conductive paste 28 on the side surface of the electronic component body 11 to transfer the conductive paste to the side surface of the electronic component body 11 to form a base electrode. In addition, as a method of printing or applying the conductive paste on the side surface of the electronic component body 11, the screen may be directly printed on the electronic component body 11 fixed to the mounting jig 27 so that the side surface faces upward. Alternatively, a transfer method such as tampo printing may be used.

Next, in an atmosphere of 200 to 250 ° C.,
By performing heat treatment for curing for 20 to 30 minutes, the base electrode 5 for terminals is formed on both ends and one side of the electronic component.

Next, to cover the base electrode 5 for the terminal,
An electroless Ni plating film and an electroless Pd plating film are formed in the next step. First, degreasing, washing with pure water, and activation treatment are performed. After applying catalyst and pure washing, electroless Ni-
B plating is performed to a thickness of about 0.2 μm. Then, after pure cleaning, electroless Ni-P plating is applied to a thickness of 2.0 to 5.0 μm.
Do about. After electroless Ni-P plating and washing with pure water,
The electroless Pd plating was formed to a thickness of about 2.0 to 5.0 μm. After Pd plating, it was washed with pure water and dried to form the electronic component shown in FIG. The external electrodes of the obtained electronic parts did not come off, and had the same level of reliability as the conventional technology.

In the embodiment of the present invention, the chip type electronic component in which the external electrode terminal portion is formed on the side surface of the electronic component is shown. However, if a lead wire is attached to the external electrode terminal portion by soldering or the like. Needless to say, lead parts can be obtained.

[0024]

As described above, according to the present invention, since solder is not used for the external electrode portions, there is no need to treat waste liquid such as Pb, environmental pollution does not occur, and during the barrel plating process. Since there is no step of separating from the medium, it is possible to provide an electronic component and a manufacturing method thereof that can reduce the cost.

[Brief description of drawings]

FIG. 1 is a partial schematic cross-sectional view showing an electronic component according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view showing the configuration of the electronic component body according to the embodiment of the present invention.

FIG. 3 is a perspective view showing an electronic component body according to an embodiment of the present invention.

FIG. 4 is a diagram provided for explaining a method of forming external electrodes on the electronic component body of FIG.

5A and 5B are views provided for explaining a method of forming external electrodes on the electronic component body of FIG.

FIG. 6 is a diagram which is used for explaining a method of forming external electrodes on the electronic component body of FIG.

FIG. 7 is a diagram which is used for explaining a method of forming external electrodes on the electronic component body of FIG.

FIG. 8 is a perspective view provided for explaining the electronic component of FIG.

FIG. 9 is a partial cross-sectional view showing an example of a conventional electronic component body.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2, 2a, 2b, 2c, 2d Insulating layer 3, 3a, 3b, 3c, 3d Conductor pattern 4 Electrode part 5 Base electrode 6 Electroless Ni plating film 7 Electroless Pd plating film 8 External electrode 10 Electronic component 11 Electronic Parts body 12 Insertion hole 18 Carrier 20 Conductive resin 21 Chamfering pin 22 Surface plate

Claims (6)

[Claims] 1. An electronic component in which an insulating layer and a conductor pattern are laminated on a substrate to form an electronic component body, and an external electrode is formed so as to cover at least a part of a side surface of the electronic component body. The external electrode includes a base electrode electrically connected to the conductor pattern and a surface electrode covering the base electrode, and the surface electrode is formed on the electroless Ni plating film and the electroless Ni plating film. An electronic component having a precious metal film. 2. The electronic component according to claim 1, wherein the base electrode is formed by mixing a conductive metal powder in a resin and coating the resin. 3. The electronic component according to claim 1 or 2, wherein the noble metal film is an electroless Pd plating film. 4. A method of manufacturing an electronic component, wherein an insulating layer and a conductor pattern are laminated on a substrate to form an electronic component body, and an external electrode is formed so as to cover at least a part of a side surface of the electronic component body. In the above, by forming a base electrode so as to be electrically connected to the conductor layer, forming an electroless Ni plating film on the base electrode, and further forming a noble metal film on the electroless Ni plating film. A method for manufacturing an electronic component, which comprises forming an electrode. 5. The method of manufacturing an electronic component according to claim 4, wherein the base electrode is formed by mixing a conductive metal powder in a resin and applying the powder. Method. 6. The method of manufacturing an electronic component according to claim 4, wherein the noble metal film is formed of an electroless Pd plating film.