JPH1197243A - Electronic component and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To eliminate fluctuations in the overlapped area between upper and lower conductive patterns due to displacements by making the widths of a plurality of overlapping conductive patterns different from one another. SOLUTION: Laminated on a ceramic insulating substrate 1 are an insulating layer 2 made of a photosensitive benzocyclobutene, a conductive pattern 3 made of a Cu thin film, and an insulating layer 4 made of a similar resin in the order they are mentioned. Further laminated sequentially on the layer 4 are a conductive pattern 5 made of a similar metal thin film having a narrow width obtained by subtracting printing displacements due to an equipment precision from the pattern 3, an insulating layer 6 made of a similar resin, and a conductive pattern made of a similar metal having the same width as the pattern 3. Finally, a laminate is formed by covering the upper layers with an insulating layer 8. As a result, fluctuations in the overlapped area between the upper and lower conductive patterns due to the printing displacements can be eliminated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to an electronic component,
More specifically, an inductor (L), a capacitor (C), an electric resistance (R) element, a thin-film EMI filter, a common mode coil, a current sensor, a signal transformer, and a composite electronic component having these components as one component. And electronic components which are lead components.

[0002]

2. Description of the Related Art Conventionally, surface mount components such as an LCR element, a thin-film EMI filter, a common mode coil, a current sensor, and a signal transformer have been known. In particular, as shown in FIG. 5, chip-type electronic components are formed on insulating substrates 52, 5 having the same width at predetermined intervals.
4, 56, 58 and the conductor patterns 53, 55, 57 are alternately laminated by a thin film technique such as photolithography, sputtering, or spin coating, and then the insulating substrate 51 is cut in accordance with the size of each laminated body. (See JP-A-6-20839).

[0003]

However, when a conductor pattern having the same width is formed by lamination in the laminated structure as shown in FIG.
It occurs more or less. In this case, due to a position shift at the time of superposition, a superimposed area between the upper and lower conductor patterns fluctuates, and particularly, a capacitance component fluctuates, so that variations in characteristics are increased.

[0004] Therefore, a technical problem of the present invention is to combine and superimpose a combination of a wide pattern conductor and a narrow pattern conductor in consideration of a printing position shift due to equipment accuracy in forming a laminate. It is an object of the present invention to provide an electronic component which can eliminate a variation in an overlapping area between upper and lower conductor patterns due to a printing position shift and has improved characteristic accuracy in which a capacitance component does not vary, and a method for manufacturing the same.

[0005]

According to the present invention, in an electronic component having a plurality of conductor patterns laminated on a substrate together with an insulating layer, the width of each of the conductor patterns superimposed on the plurality of conductor patterns is reduced. An electronic component characterized by being different is obtained.

According to another aspect of the present invention, there is provided an electronic component characterized in that the width of the lowermost conductive pattern is the widest and that the width of the integrated pattern is gradually reduced toward the uppermost layer.

According to another aspect of the present invention, there is provided an electronic component characterized in that the width of the lowermost conductive pattern is the narrowest, and the width of the conductive pattern gradually increases as the uppermost layer is formed. Can be

Further, according to the present invention, in an electronic component having a plurality of conductor patterns laminated on a substrate together with an insulating layer, the width of the upper conductor pattern in the plurality of conductor patterns is set to the immediately lower conductor pattern. Thus, a method for manufacturing an electronic component, which is different from the above, can be obtained.

[0009]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a sectional view showing a schematic configuration of an electronic component according to a first embodiment of the present invention. Referring to FIG. 1, a ceramic insulating substrate 1 having a thickness of about 0.5 mm
On the insulating layer 2 such as benzocyclobutene,
A conductive pattern 3 made of a thin film, furthermore, an insulating layer 4 made of a similar resin, and a conductive pattern 5 made of a similar thin metal film having a narrower width than that of the conductive pattern 3 by subtracting a printing position shift due to equipment precision; An insulating layer 6 made of a similar resin and a conductive pattern 7 made of a similar metal having the same width as the conductive pattern 3 are sequentially laminated, and finally covered with an insulating layer 8 to form a laminate having a thickness of about 30 μm.

In the embodiment of the present invention, the conductor pattern is formed by using a Ti and Cu sputtered film as a base and a Cu thin film by photolithography and plating. The insulating layer is formed by applying, exposing, or the like using a photosensitive material. Specifically, the following, the insulating layer and the conductor pattern of the electronic component according to the embodiment of the present invention,
It is manufactured by the following process.

First, a process for forming a conductor pattern will be described. One surface of the insulating substrate or the insulating resin layer is cleaned by plasma ashing and reverse sputtering, and then a base thin film of a Ti thin film or a Cu thin film is formed by sputtering. Next, a resist is applied on the obtained base thin film, exposed through a mask, and developed to form a concave portion having a desired conductor pattern shape on the thin film. next,
The resist is peeled off by electro-Cu plating, and the front conductor pattern provided with the Cu plating film having the conductor pattern shape is subjected to wet or dry etching to remove the underlying thin film of the conductor pattern. Here, the upper surface portion of the conductor pattern is also slightly removed, but the electric Cu-plated portion of the conductor pattern is sufficiently thicker than the base film and the conductor pattern is not lost.

Next, a process for forming an insulating layer will be described.

The conductor pattern on the insulating resin on which the pattern is formed is cleaned by plasma ashing, and further,
After applying the photosensitive benzocyclobutene resin, through a mask of the desired pattern by photolithography,
Expose and develop. In this case, a through hole or a notch is formed on the conductor as necessary. Next, curing is performed under appropriate conditions, and the resin is completely cured to form an insulating layer formed on the conductor pattern.

When polyimide is used as the insulating layer material,
Cu is dissolved in the polyimide solvent, and Cu
Cannot be directly applied.
Therefore, it is necessary to form a cover metal layer of Ti or the like on the Cu surface, which complicates the process, and furthermore, when there is unevenness in the base, unevenness also occurs in the polyimide insulating layer formed thereon, It becomes difficult to form a stable laminate.

In the present invention, by using a photosensitive benzocyclophthene resin as the insulating layer material, it can be directly applied on Cu, and a pattern can be formed by photolithography. Further, even if the underlying layer is uneven, the surface of the formed insulating layer is planarized, so that a stable stacked body can be formed by a simple process.

By repeating the above process of forming the conductor pattern and the process of forming the insulating layer, the laminate shown in FIG. 1 is obtained.

The formed laminate is cut at the position indicated by the two-dot chain line to obtain the electronic component body 11 shown in FIG. The electronic component body includes electrode portions 7a, 7b, 7c connected to external electrodes at both ends of the upper surface.

Next, as shown in FIG. 2B, the electrodes 12a, 12b, 12c are covered so as to cover both ends of the electronic component body.
Is formed to obtain an electronic component.

FIG. 3 is a sectional view showing a schematic configuration of an electronic component according to a second embodiment of the present invention. Referring to FIG. 4, on a ceramic insulating substrate 1 having a thickness of about 0.5 mm, an insulating layer 13 of benzocyclobutene or the like, a conductor pattern 14 of a Cu thin film thereon, and an insulating layer of a similar resin 15, a conductor pattern 16 made of a thin metal thin film having a narrower width obtained by subtracting a printing position shift of equipment precision from the conductor pattern 14, and an insulating layer 17 made of a similar resin; A conductor pattern 18 made of a similar metal having a small width, from which the printing position deviation of the precision has been subtracted, is sequentially laminated, and finally covered with an insulating layer 19 to form a laminate having a thickness of about 30 pm.

In the second embodiment of the present invention, the conductor pattern and the insulating layer are formed in the same manner as in the first embodiment.

FIG. 4 is a sectional view showing a schematic configuration of an electronic component according to a third embodiment of the present invention. The electronic component according to the third embodiment is different from the electronic component according to the second embodiment in that the conductor pattern has a configuration in which the width of the conductor pattern gradually increases as it moves upward.

Referring to FIG. 4, an insulating layer 20 such as benzocyclobutene is formed on a ceramic insulating substrate 1 having a thickness of about 0.5 mm, and a conductor pattern 2 made of a Cu thin film is formed thereon.
1, furthermore, an insulating layer 22 made of a similar resin, and a conductive pattern 23 made of a similar metal thin film having a wider width obtained by adding a printing position shift of equipment accuracy than the conductive pattern 21 thereon.
Further, an insulating layer 24 made of a similar resin, and a conductor pattern 25 made of a similar metal having a wider width than the conductor pattern 23 and having a printing position shift of equipment precision added thereto are sequentially laminated,
Finally, the laminate is covered with the insulating layer 26 and has a thickness of about 30 μm.

In the third embodiment of the present invention, the conductor pattern and the insulating layer are formed in the same manner as in the first embodiment.

In the embodiment of the present invention, an electronic component having a three-terminal structure has been described. However, a two-terminal structure and a four-terminal structure can be manufactured in the same manner as the embodiment of the present invention.

Further, in the embodiment of the present invention,
Although only electronic components with external electrode terminals have been described,
It goes without saying that a lead electronic component can be formed by soldering a lead wire to the external electrode terminal.

[0027]

As described above, according to the present invention, a pattern conductor having a large width and a pattern conductor having a small width in consideration of a printing position shift due to equipment accuracy in forming a layer are laminated. By superimposing, it is possible to eliminate the fluctuation of the superimposed area between the upper and lower conductor patterns due to the printing position shift, and to provide an electronic component with improved characteristic accuracy in which the capacitance component does not fluctuate and a method of manufacturing the same.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a schematic configuration of an electronic component body according to a first embodiment of the present invention.

FIG. 2A is a schematic view showing the electronic component body of FIG. 1; (B) is a schematic diagram showing the electronic component of (a).

FIG. 3 is a sectional view illustrating a schematic configuration of an electronic component body according to a second embodiment of the present invention.

FIG. 4 is a sectional view showing a schematic configuration of an electronic component body according to a third embodiment of the present invention.

FIG. 5 is a cross-sectional view illustrating an example of an electronic component according to the related art.

[Explanation of symbols]

1, 51 Insulated substrate 2, 4, 6, 8, 13, 13, 15, 17, 1
9 Insulating layer 20, 22, 24, 26 Insulating layer 52, 54, 56, 58 Insulating layer 3, 5, 7, 14, 16, 16, 18, 21
Conductor patterns 23, 25, 53, 55, 57 Conductor patterns 7a, 7b, 7c Electrode part 11 Electronic component main body 12a, 12b, 12c Electrode

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01F 41/04 H01F 41/12 B 41/12 15/14

Claims (6)

[Claims] 1. An electronic component having a plurality of conductor patterns laminated on a substrate together with an insulating layer, wherein the widths of the conductor patterns superimposed on the plurality of conductor patterns are different from each other. . 2. The electronic component according to claim 1, wherein the width of the lowermost conductive pattern is the widest, and the width of the conductive pattern is gradually reduced toward the uppermost layer. 3. The electronic component according to claim 1, wherein the width of the lowermost conductive pattern is narrowest, and the width of the conductive pattern gradually increases toward the uppermost layer. 4. The electronic component according to claim 1, wherein said insulating layer is made of a photosensitive benzocyclobutene resin. 5. An electronic component having a plurality of conductor patterns laminated on an insulating layer on a substrate, wherein the width of the upper conductor pattern in the plurality of conductor patterns is different from that of the immediately lower conductor pattern. A method for manufacturing an electronic component, comprising: 6. The method for manufacturing an electronic component according to claim 5, wherein said insulating layer is made of a photosensitive benzocyclobutene resin.