JPWO2006123467A1 - Electronic components - Google Patents

Abstract

All conventional electronic components have wide portions (including wedge-shaped portions) formed in an elongated conductor pattern, but these wide portions concentrate current and short-circuit between adjacent conductor patterns. Cheap. In addition, when having a wide part in the middle of the conductor pattern, it is difficult to prevent displacement from the ceramic green sheet due to the shrinkage of the conductor pattern during firing, resulting in displacement between the upper and lower conductor patterns, and electrical characteristics Deteriorates. The electronic component 10 of the present invention includes a laminate 11 in which insulating layers 111 to 114 are laminated, and conductor pattern layers 121 to 124 formed in the laminate 11, and the conductor pattern layers 121 to 124 include: There are corner portions at a plurality of locations, and each corner portion is integrally provided with a first shrinkage prevention portion 16A that bites into the insulating layers 111 to 114, and each first shrinkage prevention portion 16A is provided at each corner portion. Each is formed in a region.

Description

  The present invention relates to an electronic component such as an inductor used in a mobile phone, an electronic device, and the like, and more particularly to an electronic component having excellent electrical characteristics.

  An example of this type of electronic component is an inductor described in Patent Document 1. This technique relates to a method of manufacturing an inductor using a lithography method. That is, in this technique, for example, a PET film is used as a base substrate, and a photosensitive insulating paste is printed, exposed and developed on the base substrate, further exposed as necessary, and then dried to form an insulating layer. A photosensitive electrode paste is printed on this insulating layer, exposed, developed, and dried to form a coiled electrode pattern. Next, a photosensitive insulating paste is printed, exposed and developed on the upper surface of the electrode pattern, further exposed as necessary, and then dried to form an insulating layer and a via hole. Thereafter, a raw laminate is formed by alternately laminating electrode layers and insulating layers having via holes.

  When the base substrate is peeled from the raw laminate, for example, a raw laminate 1A shown in FIG. 6 (a) is obtained. As shown in the figure, the laminate 1A is formed by alternately and repeatedly laminating insulating layers 2A and coiled electrode patterns 3A formed on the upper surface of the insulating layer 2A. 3A is electrically connected via the via conductor 4A. The lead electrode portion 5A of the lowermost electrode pattern 3A is exposed from the left end surface of the multilayer body 1A on the lowermost insulating layer 2A, and the uppermost electrode pattern 3A is exposed on the second insulating layer 2A from the top. The lead electrode 6A is exposed from the right end surface of the multilayer body 1A. 6A and 6B show one inductor, an actual laminated body is obtained as an aggregate in which a plurality of inductors are collectively formed.

  Thereafter, an aggregate of raw laminates is fired at a predetermined temperature, and then cut into individual laminates to produce individual laminates 1 shown in FIG. 6 (b). Thereafter, by providing external electrodes on the individual laminates 1, a small inductor with high inductance and low DC resistance can be obtained.

  However, in the above-described inductor manufacturing method, since there is a difference in shrinkage behavior between the insulating layer 2A and the electrode pattern 3A at the time of firing, as shown in FIG. A positional deviation occurs from the reference position of the alternate long and short dash line between the three, the interlayer capacitance between the insulating layers 2A and 2A and the electromagnetic field distribution due to the electrode pattern 3 are deviated from the design values, and the electrical characteristics as an inductor deteriorate.

  Further, since the electrode pattern 3A during firing has a large difference in shrinkage behavior from the insulating layer 2A, the electrode pattern 3A is cut during firing, or the extraction electrodes 5A and 6A of the electrode pattern 3A are inward from the end face of the insulating layer 2A. The lead-out electrodes 5 and 6 after being retracted and fired are not exposed at the end face of the laminated body 1, and electrical connection with the external electrodes cannot be ensured, which may increase the defect rate.

  As a technique for preventing disconnection due to firing, for example, a technique described in Patent Document 2 is known. In this technology, a wide and thick part is formed in the middle part of an elongated conductor pattern for inductors to increase the amount of conductor paste applied, and a part where the amount of application is large even when shrinking by firing. The conductor paste is replenished to maintain the density of the conductor portion.

  In Patent Document 3, a technique similar to the technique described in Patent Document 2 is proposed. This technique is a technique in which a wedge-shaped portion is provided at an end portion of a conductor pattern. By providing a wedge-shaped part at the end of the conductor pattern, the shrinkage of the conductor pattern during the sintering process is suppressed, and the conductor is poorly connected due to the shrinkage, in particular, the conductor is reliably exposed at the end of the magnetic sheet. The connection failure with the external electrode is reduced.

JP 2003-339660 A JP-A-11-288831 Japanese Patent Laid-Open No. 11-016731

  However, the conventional techniques described in Patent Documents 2 and 3 can solve problems such as disconnection and contraction of the conductor pattern by a wide portion (including the wedge-shaped portion) formed in the elongated conductor pattern. However, since these conductor patterns have a wide portion, current is concentrated on the wide portion, and it is easy to short-circuit between adjacent conductor patterns, and there is a limit to packing between adjacent conductor patterns. is there. In addition, when a wide part is provided in the middle of the conductor pattern, it is difficult to prevent the positional deviation of the end from the ceramic green sheet due to the contraction of the conductor pattern during firing, and the contraction between the upper and lower conductor patterns is uneven. Thus, positional deviation occurs between the upper and lower conductor patterns, and the electrical characteristics deteriorate. This is the same when the wide portion is provided at the end of the conductor pattern.

  The present invention has been made in order to solve the above-described problems, and an object thereof is to provide an electronic component having excellent electrical characteristics and high connection reliability with an external electrode.

  The electronic component according to claim 1 of the present invention includes a laminate in which a plurality of insulating layers are laminated, and at least one conductor pattern layer formed in the laminate, and the conductor pattern layer includes a plurality of locations. Each of the bent portions is integrally provided with a first shrinkage prevention portion that bites into the insulating layer, and each of the first shrinkage prevention portions is the bent portion. It is characterized by being formed in each of the regions.

  According to a second aspect of the present invention, in the electronic component according to the first aspect, the first shrinkage prevention portion is formed partway in the thickness direction of the insulating layer. To do.

  An electronic component according to a third aspect of the present invention is the electronic component according to the first or second aspect, further comprising an extraction electrode portion extending from the conductor pattern layer, wherein the extraction electrode portion includes the extraction electrode portion. A second shrinkage-preventing portion that bites into the insulating layer is integrally provided, and the second shrinkage-preventing portion is formed in the region of the extraction electrode portion.

  According to a fourth aspect of the present invention, in the electronic component according to the third aspect, the second shrinkage-preventing portion is formed partway in the thickness direction of the insulating layer. To do.

  According to a fifth aspect of the present invention, in the electronic component according to any one of the first to fourth aspects, a plurality of the conductor pattern layers are formed in the vertical direction via the insulating layer. The upper and lower conductor pattern layers are electrically connected to each other by via conductors.

  According to the first to fifth aspects of the present invention, it is possible to provide an electronic component that has excellent electrical characteristics and high connection reliability with an external electrode.

(A), (b) is a figure which shows one Embodiment of the electronic component of this invention, (a) is the perspective view, (b) is a perspective view which shows the internal structure, respectively. It is a disassembled perspective view which shows the electronic component shown in FIG. (A)-(c) is a figure which takes out and shows a part of electronic component shown in FIG. 1, respectively, (a) is the top view, (b) is sectional drawing of the BB line direction of (a), (C) is sectional drawing of the CC line direction of (a). (A)-(e) is process drawing for demonstrating a part of manufacturing process of the electronic component shown in FIG. 1, respectively. (A), (b) is a figure which shows the laminated body which is the main body of the electronic component shown in FIG. 1, respectively, (a) is sectional drawing which shows the raw laminated body before baking, (b) is the laminated | stacked after baking. It is sectional drawing which shows a body. (A), (b) is a figure which shows the laminated body which is the main body of the conventional electronic component, respectively, (a) is sectional drawing which shows the raw laminated body before baking, (b) is the laminated body after baking. It is sectional drawing shown.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Electronic component 11 Laminated body 12 Coil 12A, 12B Extraction electrode part 13A, 13B External electrode 16A 1st shrinkage | contraction deviation prevention part 16B 2nd shrinkage deviation prevention part 111-114 Insulating layer 121-124 Conductor pattern (conductive layer)

  Hereinafter, the electronic component of the present invention will be described based on the embodiment shown in FIGS.

  An electronic component 10 according to the present embodiment includes, for example, a rectangular laminated body 11 and an inside of the laminated body 11 in the vertical direction according to the planar shape, as shown in FIGS. A coil 12 formed so as to extend in a spiral shape, and a pair of left and right external electrodes 13A and 13B that are connected to the extraction electrode portions 12A and 12B at both upper and lower ends of the coil 12 and cover the left and right end surfaces of the laminate 11, respectively. And is configured as a high-frequency coil component.

  For example, as shown in FIG. 2, the multilayer body 11 includes a plurality of (four layers in FIG. 2) insulating layers 111 to 114 stacked in the vertical direction and a protective layer 115 that protects the internal coil 12. Yes. The coil 12 includes a plurality of conductor pattern layers 121 to 124 formed spirally on the upper surfaces of the insulating layers 111 to 114 and via conductors 14 connecting the upper and lower conductor pattern layers (FIG. 5B). And is formed as a rectangular coil 12 that spirals in the vertical direction as a whole. Reference numerals 15A and 15B denote terminal electrodes for connection to electrodes formed on a mounting board surface such as a circuit board.

  By the way, when the laminate 11 is obtained by firing, the shrinkage accompanying the sintering of the photosensitive conductor paste is larger than the shrinkage accompanying the sintering of the photosensitive insulating paste. It is easy to apply shrinkage stress to the inside of the corner. Therefore, the conductive pattern layers 121 to 124 slide on the respective insulating layers 111 to 114 due to a difference in contraction behavior between the insulating layers 111 to 114, and particularly in the corner portion toward the inside of the corner. Misalignment is likely to occur.

  Therefore, in the present embodiment, as shown in FIGS. 1B, 2, and 3, the first contraction shift is caused on the lower surface of each bent portion (corner portion) of the rectangular spiral conductive pattern layers 121 to 124. The prevention part 16A is formed so as to bite into the respective insulating layers 111 to 114 to a predetermined depth, and these first shrinkage prevention parts 16A are integrated with the respective conductor pattern layers 121 to 124. In FIG. 3, the conductor pattern layer 123 formed on the insulating layer 113 is shown as an example. Since the other conductor pattern layers are formed in the same manner as the conductor pattern layer 123 shown in FIG. 3, the other conductor pattern layers will be described with reference to FIG.

  As described above, in the present embodiment, the first shrinkage prevention portion 16A is provided at each corner portion, and the conductor pattern layers 121 to 124 are constrained by the respective insulating layers 111 to 114. Even if the shrinkage stress acts on the corner portion in a concentrated manner, the conductor pattern layers 121 to 124 follow the respective insulation layers 111 to 114 and shrink by the first shrinkage prevention portion 16A. Misalignment between .about.114 can be prevented. Furthermore, since the conductor pattern layers 121 to 124 are contracted following the respective insulating layers 111 to 114 without being displaced on the upper surfaces of the respective insulating layers 111 to 114, the conductor pattern layers before and after firing are similar in shape. Thus, desired electrical characteristics (interlayer capacitance, electromagnetic field distribution, etc.) can be obtained while maintaining a shape in conformity with the design.

  Further, the outer diameter of the first shrinkage prevention portion 16A at each corner portion is formed to be smaller than the line width of the conductor pattern layer 123, as shown in FIGS. After providing a recess for the first shrinkage prevention part 16A on the upper surface of the insulating layer 113 as described later by making the outer diameter of the first shrinkage prevention part 16A smaller than the line width of the conductor pattern layer 123. When the conductor pattern layer 123 is aligned and printed on the upper surface of the insulating layer 113, even if there is a slight misalignment between the recess and the conductor pattern layer 123, the recess is formed in the region of the conductor pattern layer 123. Can fit inside. Further, the depth of biting into the insulating layer 113 of the first shrinkage prevention part 16A may be a depth that can prevent the positional deviation of the conductor pattern layer 123 from the insulating layer 113, and is usually shown in FIG. As shown in (b) and (c), the insulating layer 113 is formed thinner than the thickness. However, if there is no lower conductive pattern layer below the first shrinkage prevention part 16A, the first shrinkage prevention part 16A may penetrate the insulating layer 113.

  Further, as shown in FIG. 1B and FIG. 2, a second shrinkage prevention part 16B of the same type as the first shrinkage prevention part 16A is formed on the lower surfaces of both ends of the upper and lower lead electrode parts 12A, 12B of the coil 12. Is formed integrally with each of the lead electrode portions 12A and 12B, and is formed so as to bite into the respective insulating layers 111 and 114 to the same depth with substantially the same size.

  The second shrinkage-preventing portions 16B are respectively disposed at both ends in the longitudinal direction of the extraction electrode portion 12A. These second shrinkage-preventing portions 16B and 16B follow the insulating layer 111 during firing in the longitudinal direction (lamination). (Direction along the end surface of the body 11), and displacement between the insulating layer 111 and the insulating layer 111 can be prevented. The second shrinkage prevention unit 16B at the corner portion also serves as the first shrinkage prevention unit 16A.

  Further, the second shrinkage deviation prevention portion 16B (first shrinkage deviation prevention portion 16A) disposed at the corner portion serving as a connection portion between the lead electrode portion 12A and the conductor pattern layer 121 prevents the positional deviation of the corner portion. Thus, the lead electrode portion 12A is prevented from being drawn into the laminated body 11, so that the end face in the longitudinal direction of the lead electrode portion 12A is reliably exposed at the end face of the laminated body 11.

  The outer diameters of the first and second shrinkage prevention parts 16A and 16B are not particularly limited as long as they are within the width of the conductor pattern layer, but the actual value of the alignment (positioning) accuracy of the exposure apparatus to be used. It is preferable to make it smaller than the value subtracted from the conductor width, for example, the range of 80 to 90% of the width of the conductor pattern layer is preferable. If it exceeds 90%, the recessed portions for providing these may protrude from the conductor pattern layer during printing, and may be electrically short-circuited between adjacent patterns. If it is less than 80%, the effect of preventing shrinkage deviation cannot be obtained. There is a fear. Further, the depth of penetration of the first and second shrinkage prevention portions 16A and 16B into the insulating layer is not particularly limited as long as it is a depth that can be accommodated in the insulating layer. A range of 50% is preferred. If it exceeds 50%, there is a risk of electrical short circuit with the lower conductor pattern layer, and if it is less than 25%, the effect of preventing shrinkage deviation cannot be obtained.

  Further, as shown in FIG. 3C, via conductors 14 for connection to the lower conductor pattern layer 122 (see FIG. 2) are formed in the insulating layer 113 on the lower surface of the outer end portion of the conductor pattern layer 123. Is formed. A via conductor 14 is formed in the insulating layer 114 to connect to the upper conductor pattern layer 124 (see FIG. 2) on the upper surface of the inner end portion of the conductor pattern layer 123. These via conductors 14 can exhibit substantially the same function as the first and second shrinkage prevention portions 16A and 16B as well as the function as a conductor.

Thus, all of the insulating layers 111 to 114 can be formed by firing ceramic powder. The ceramic powder is not particularly limited, but the ceramic powder includes, for example, K ₂ O—B ₂ O ₃ —SiO ₂ glass powder as a main component and Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ as a subcomponent. What contains a system glass powder can be used. Bi ₂ O ₃ —B ₂ O ₃ —SiO ₂ glass powder, which is an accessory component, has a softening point of 450 to 550 ° C. and a lower melting point than K ₂ O—B ₂ O ₃ —SiO ₂ glass powder. Therefore, in the present invention, a glass powder having a melting point lower than that of the main component of the ceramic powder is defined as a low melting point glass powder.

The conductor patterns 121 to 124 can be formed by firing metal powder. The metal powder is not particularly limited, and for example, silver powder, copper powder, or the like can be used as the metal powder. Further, as the ceramic powder, in addition to K ₂ O—B ₂ O ₃ —SiO ₂ glass powder, two or more ceramic glass powders that can be fired simultaneously with metal powder such as silver powder and copper powder are used in appropriate combination. May be.

  The electronic component 10 of the present embodiment can be manufactured using a lithography method. Therefore, a method for manufacturing the electronic component 10 of the present embodiment will be described with reference to FIG.

In this embodiment, a PET film is prepared in advance as a base substrate for producing the laminate 11. As the photosensitive conductor paste, for example, a paste containing silver powder having a particle size of 0.5 to 3.0 μm is prepared, and as the photosensitive insulating paste, ceramic powder having a particle size of 0.5 to 3.0 μm is included. Prepare things. The ceramic powder includes _{K 2 O-B 2 O 3} -SiO 2 based glass powder as the main _{component, Bi 2 O 3 -B 2 O} 3 contains -SiO ₂ based glass powder as a secondary component. In this embodiment, the low melting point glass powder is contained in the ceramic powder by 5 wt%.

  When the electronic component 10 is manufactured, a PET film 100 is installed as shown in FIG. 4A, a photosensitive conductor paste is applied to the upper surface of the PET film 100, and then the terminal electrodes 15A and 15B are formed. Irradiate light such as ultraviolet rays through a mask (not shown) having a through-hole formed in a pattern, cure the portions to be the terminal electrodes 15A, 15B, remove the uncured portions by development processing, Terminal electrode portions 15A ′ and 15B ′ are formed.

  Thereafter, as shown in FIG. 4B, after the photosensitive insulating paste is applied to the upper surface of the PET film 100, the entire surface is irradiated with light to cure the photosensitive insulating paste to form the insulating layer portion 111A. As shown in the figure, the upper surface of the insulating layer part 111A is irradiated with, for example, energy-adjusted laser light L, and the first and second shrinkage prevention parts 16A and 16B as shown in FIG. The shallow circular recesses 111B and 111C for forming the film are formed in a predetermined pattern on the upper surface of the insulating layer 111A. The method for forming these recessed portions 111B and 111C is not limited to the method using the laser beam L as long as it is a method for forming the recessed portions.

  Next, as shown in FIG. 4D, a photosensitive conductive paste is applied on the insulating layer portion 111A, and the photosensitive portions are exposed in the recessed portions 111B and 111C for the first and second shrinkage prevention portions 16A and 16B. The conductive paste is filled and the conductive paste layer 121A is formed at the same time. Subsequently, as shown in the figure, the light UV is irradiated through a mask (not shown) having a through hole corresponding to the pattern of the conductor pattern layer 121 and the lead electrode portion 12A, and the conductor pattern layer 121 and the lead electrode portion. The portion to be 12A is cured, and the uncured portion is removed by development processing to form a conductor pattern layer portion 121B and a lead electrode portion 12A ′ as shown in FIG. At this time, since the recessed portion 111B is located at the corner portion of the conductor pattern layer portion 121B and the recessed portion 111C is disposed in the lead electrode portion 12A ′, the first and second contraction displacement preventing portions 16A ′ and 16B ′ are It is formed together with the spiral conductive pattern layer portion 121A by irradiation with light UV, and the insulating layer portion 111A is exposed in other portions.

  Next, in the same manner as the insulating layer portion 111A and the conductor pattern layer portion 121A on the upper surface, the insulating layer portion 112A, the conductor pattern layer portion 122A, the insulating layer portion 113A, the conductor pattern layer portion 123A, The insulating layer portion 116A, the conductor pattern layer portion 124A, and the uppermost protective layer portion 115A are sequentially laminated in this order to obtain a raw laminated body 11A shown in FIG. When forming each conductor pattern layer portion and the other lead electrode portion 12B ', the first and second shrinkage prevention portions 16A' and 16B 'and the via conductor portion 14A are formed. The raw laminate 11A thus obtained is fired at a predetermined temperature, for example, a temperature of 850 to 900 ° C. to obtain a laminate 11 shown in FIG.

  In the present embodiment, as shown in FIG. 5B, the first shrinkage prevention portions 16A are formed at the corner portions of the conductor pattern layers 121 to 124, respectively, and the lead electrode portions 12A and 12B have the second portions. Since the shrinkage prevention portions 16B are respectively formed, the conductive pattern layers 121 to 124 follow the respective insulating layers 111 to 114 during shrinking, and are positioned between the respective insulating layers 111 to 114. The upper and lower conductor pattern layers 121 to 124 are aligned at the same position as indicated by the alternate long and short dash line in FIG. 5B, thereby preventing the relative displacement between the upper and lower conductor pattern layers. it can. Therefore, the coil 12 has no variation in the inner diameter of each of the conductor pattern layers 121 to 124 and is aligned on the same inner peripheral surface, and can obtain an interlayer capacitance and electromagnetic field distribution in conformity with the design. Satisfactory and excellent electrical properties can be obtained.

  In addition, since the second shrinkage prevention portions 16B are formed in the extraction electrode portions 12A and 12B, the end surfaces of the extraction electrode portions 12A and 12B are surely exposed from the end surface of the multilayer body 11, and the extraction electrodes 12A and 12B. And the external electrodes 13A and 13B can be reliably electrically connected, and the defect rate can be reduced.

  Next, specific examples will be described.

Example 1
In this example, a photosensitive conductor paste containing, for example, silver powder having a particle size of 3 μm was prepared, and a photosensitive insulating paste containing a ceramic powder having a particle size of 3 μm was prepared. The ceramic powder includes _{K 2 O-B 2 O 3} -SiO 2 based glass powder as the main _{component, Bi 2 O 3 -B 2 O} 3 contains -SiO ₂ based glass powder as a secondary component. In this example, 5 wt% of the low melting glass powder is contained in the ceramic powder. In this example, the laminate 11 having the first shrinkage prevention portion 16A at the corners of the conductor pattern layers 121 to 124 and the second electrode 12A and 12B without the second shrinkage prevention 16B is produced. The effect of the first shrinkage prevention unit 16A was examined.

  In this example, an electronic component having a coil composed of four conductive pattern layers was produced in the manner described above using the above-described photosensitive conductive paste and photosensitive insulating paste. The depth of the first shrinkage prevention portion formed at the corner portion of each conductor pattern layer was 5 μm, and the outer diameter thereof was 80% of the line width of the conductor pattern layer. The inductance value of this electronic component was 27 nH.

  Moreover, the conventional laminated body which does not have a shrinkage | contraction deviation prevention part was produced as a comparative example. The inductance value of the electronic component made of this laminate was 27 nH.

  And the electronic component of a present Example was cut | disconnected, the positional offset amount of the conductor pattern layer in the cut surface was measured, and the result was shown in Table 1. Further, after measuring the inductance value (L value) of the electronic component of this example, the variation was obtained, and the result is shown in Table 1. These measurements were performed on 100 electronic components, and the average values are shown in Table 1. Moreover, the amount of positional deviation and variation were obtained for the electronic parts of the comparative examples, and the results are shown in Table 1.

  According to the results shown in Table 1, since the electronic component of this example had the first shrinkage deviation prevention portion, the average positional deviation amount of each conductor pattern layer was ± 10%, and the variation in inductance value was 3%. . On the other hand, the electronic component of Comparative Example 1 has an average positional deviation amount of ± 20% and a large variation in inductance value of 5%, and it has been found that both have inferior electrical characteristics as compared with the present example.

Example 2
In this example, an electronic component was manufactured in the same manner as the electronic component of Example 1, except that the second shrinkage prevention unit was provided in the lead electrode portion of the electronic component of Example 1. And in order to investigate the connection state of the extraction electrode part of this electronic component and an external electrode, the continuity test was done and the result was shown in Table 2. The same test was performed on the electronic component of Comparative Example 1 and the results are shown in Table 1.

  According to the results shown in Table 2, the open defect rate of the electronic component of this example was 5%. On the other hand, the open failure rate of the electronic component of Comparative Example 1 was 10%, and it was found that the contact failure rate between the lead electrode portion and the external electrode was higher than that of this example, and the yield was poor.

  In the above embodiment, the present invention has been described by taking a high-frequency coil component having a coil composed of a plurality of conductor pattern layers as an example. However, the electronic component of the present invention has at least one conductor pattern layer having bent portions at a plurality of locations. It is sufficient if it has one. Moreover, as long as at least one conductor pattern having a bent portion is provided at a plurality of locations, the high-frequency coil component is not limited.

  The present invention can be suitably used for electronic components such as high-frequency coil components used in mobile phones and the like.

Claims (5)

  A laminate in which a plurality of insulating layers are laminated, and at least one conductor pattern layer formed in the laminate, wherein the conductor pattern layer is an electronic component having bent portions at a plurality of locations, Each of the bent portions is integrally provided with a first shrinkage deviation prevention portion that bites into the insulating layer, and each of the first shrinkage deviation prevention portions is formed in a region of each of the bent portions. Electronic parts.   2. The electronic component according to claim 1, wherein the first shrinkage prevention unit is formed halfway in a thickness direction of the insulating layer.   A lead electrode portion extending from the conductor pattern layer, the lead electrode portion integrally provided with a second shrinkage prevention portion that bites into the insulating layer, and the second shrinkage prevention portion is The electronic component according to claim 1, wherein the electronic component is formed in a region of the extraction electrode portion.   The electronic component according to claim 3, wherein the second shrinkage prevention unit is formed partway along a thickness direction of the insulating layer.   5. The plurality of conductor pattern layers are formed in the vertical direction through the insulating layer, and the upper and lower conductor pattern layers are electrically connected to each other by via conductors. The electronic component according to any one of the above.

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