JP2016171160A - Laminated impedance element - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a laminated impedance element capable of achieving both an improvement in DC superposition characteristics and a noise absorption effect.SOLUTION: A laminated impedance element includes: an element assembly 2 comprising a plurality of magnetic ferrite-containing magnetic substance layers 9 laminated therein; and an internal conductor 3 extending between a pair of second side faces 2e, 2f of the element assembly 2, in between a pair of magnetic substance layers 9 adjacent to each other among the plurality of magnetic substance layers 9. Only a part of the internal conductor 3 is exposed to first side faces 2c, 2d of the element assembly 2.SELECTED DRAWING: Figure 4

Description

  The present invention relates to a laminated impedance element.

  A laminated impedance element comprising: an element body in which a plurality of magnetic layers containing magnetic ferrite are laminated; and an inner conductor extending between a pair of side surfaces of the element body in the same layer of the element body ( Multilayer bead inductors are known (see, for example, Patent Document 1).

Japanese Patent Laid-Open No. 06-061084

  In the laminated impedance element, in order to improve the direct current superimposition characteristics, it is conceivable to adopt a configuration in which a low magnetic permeability region having a magnetic permeability lower than that of the magnetic layer is in contact with the internal conductor. The low magnetic permeability region functions as a magnetic gap. For this reason, for example, when the low magnetic permeability region is arranged over the entire surface of the magnetic layer, the laminated impedance element has an open magnetic circuit structure, and the DC superposition characteristics are improved.

  However, it has been found that when the low magnetic permeability region exists in the element body, the following problems occur with respect to the noise absorption effect.

  The impedance (Z) of the laminated impedance element is expressed as a combined resistance of a reactance (X) component and a resistance (R) component. The frequency characteristic of the impedance of the laminated impedance element is such that the reactance component is dominant in the lower frequency region than the frequency (RX cross point) at which the reactance component and the resistance component are equal, and the higher frequency region than the RX cross point. Then, the resistance component is dominant. The resistance component absorbs noise by converting noise energy into heat. That is, in the multilayer impedance element, a noise absorption effect can be obtained in a higher frequency region than the RX cross point.

  If the low magnetic permeability region exists in the element body, the effective magnetic permeability of the laminated impedance element is lowered. For this reason, the RX cross point shifts to the high frequency side, and the frequency band in which the noise absorption effect is obtained becomes narrow. For example, when the low magnetic permeability region is arranged over the entire surface of the magnetic layer, the effective magnetic permeability is greatly reduced, and the RX cross point is shifted to a higher frequency side.

  An object of the present invention is to provide a multilayer impedance element capable of achieving both improvement in direct current superposition characteristics and noise absorption effect.

  The laminated impedance element according to the present invention includes a pair of side surfaces of an element body between an element body in which a plurality of magnetic substance layers containing magnetic ferrite are laminated and a pair of adjacent magnetic substance layers among the plurality of magnetic substance layers. And a part of the inner conductor is exposed on a side surface of the element body other than the pair of side surfaces.

  In the multilayer impedance element according to the present invention, since only a part of the inner conductor is exposed on the side surfaces other than the pair of side surfaces, an open magnetic circuit is partially formed in the length direction of the inner conductor. There is an area. Thereby, generation | occurrence | production of magnetic saturation is suppressed and a direct current | flow superimposition characteristic can be improved.

  Since only a part of the inner conductor is exposed on the side surfaces other than the pair of side surfaces, the effective permeability of the multilayer impedance element is, for example, compared to the configuration exposed on the side surface over the entire length of the inner conductor. Is suppressed. Therefore, the shift of the RX cross point to the high frequency side is suppressed, and the frequency band in which the noise absorption effect can be obtained can be suppressed from being narrowed.

  The element body has a rectangular parallelepiped shape, and the inner conductor extends along a second direction intersecting the first direction and a conductor portion extending along the first direction in which the pair of side surfaces face each other. The conductor portion extending along the first direction is exposed on the side surface extending so as to connect the pair of side surfaces and extends along the second direction. May be located in the body. In this case, a configuration in which only a part of the inner conductor is exposed on the side surface other than the pair of side surfaces can be easily realized.

  The element body has a rectangular parallelepiped shape, and the inner conductor has a first conductor portion having one end exposed on one side surface of the pair of side surfaces, and a side surface facing the one side surface of the pair of side surfaces. A second conductor part having one end exposed at the first conductor part, a third conductor part having one end connected to the other end of the first conductor part and extending in a direction intersecting the first conductor part, A fourth conductor portion having one end connected to the other end of the two-conductor portion and extending in a direction in which the third conductor portion extends; the other end of the third conductor portion; and the other end of the fourth conductor portion A fifth conductor portion connected to each other, and the fifth conductor portion is exposed at a side surface extending so as to connect the pair of side surfaces, and the third conductor portion and the fourth conductor portion are , May be located in the body. In this case, since the length of the inner conductor is longer than, for example, a configuration in which the inner conductor is linear, the inductance is increased. As a result, the impedance can be increased. Further, it is possible to easily realize a configuration in which only a part of the inner conductor is exposed on a side surface other than the pair of side surfaces.

  The first conductor portion and the second conductor portion may be exposed at a side surface facing the side surface at which the fifth conductor portion is exposed. In this case, since an open magnetic circuit is formed not only in the fifth conductor portion but also in the first conductor portion and the second conductor portion, the occurrence of magnetic saturation is further suppressed, and the DC superposition characteristics can be further improved. it can. Further, the lengths of the third conductor portion and the fourth conductor portion located in the element body are larger than, for example, a configuration in which the first conductor portion and the second conductor portion are not exposed on the side surface. Therefore, a decrease in effective magnetic permeability of the laminated impedance element is further suppressed. Therefore, the shift of the RX cross point to the high frequency side is further suppressed, and the frequency band where the noise absorption effect can be obtained can be further suppressed.

  ADVANTAGE OF THE INVENTION According to this invention, the lamination | stacking impedance element which can aim at coexistence with the improvement of a DC superposition characteristic and a noise absorption effect can be provided.

1 is a perspective view showing a multilayer impedance element according to an embodiment of the present invention. It is a figure for demonstrating the cross-sectional structure along the II-II line | wire in FIG. It is a disassembled perspective view which shows the structure of an element body. It is a top view which shows an internal conductor. It is a top view which shows one modification of an internal conductor. It is a top view which shows another modification of an internal conductor.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and redundant description is omitted.

  With reference to FIGS. 1-4, the structure of the laminated impedance element 1 which concerns on this embodiment is demonstrated. FIG. 1 is a perspective view showing the multilayer impedance element according to the present embodiment. FIG. 2 is a view for explaining a cross-sectional configuration along the line II-II in FIG. FIG. 3 is an exploded perspective view showing the configuration of the element body. FIG. 4 is a plan view showing the inner conductor.

  As shown in FIGS. 1 to 3, the laminated impedance element 1 includes an element body 2, an internal conductor 3 disposed on the element body 2, and a pair of terminals disposed on both ends of the element body 2. Electrodes 4 and 5 are provided. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which corners and ridge lines are chamfered and a rectangular parallelepiped shape in which corners and ridge lines are rounded. The laminated impedance element 1 is a so-called laminated chip bead.

  The element body 2 has a rectangular parallelepiped shape, and as its outer surface, a pair of substantially rectangular main surfaces 2a, 2b facing each other, a pair of first side surfaces 2c, 2d facing each other, It has a pair of 2nd side surfaces 2e and 2f which have mutually opposed. The direction in which the pair of second side surfaces 2e, 2f is opposed is the first direction D1, and the direction in which the pair of first side surfaces 2c, 2d is opposed is the second direction D2. In the present embodiment, the first direction D1 is the longitudinal direction of the element body 2. The second direction D2 is the width direction of the element body 2 and is orthogonal to the first direction D1. The first direction D1 and the second direction D2 are orthogonal to the direction in which the pair of main surfaces 2a and 2b are opposed to each other (hereinafter referred to as “the facing direction of the pair of main surfaces 2a and 2b”).

  The pair of first side surfaces 2c, 2d extends in the opposing direction of the pair of main surfaces 2a, 2b so as to connect the pair of main surfaces 2a, 2b. The pair of first side surfaces 2c and 2d also extend in the first direction D1 (the long side direction of the pair of main surfaces 2a and 2b). The pair of second side surfaces 2e, 2f extends in the opposing direction of the pair of main surfaces 2a, 2b so as to connect the pair of main surfaces 2a, 2b. The pair of second side surfaces 2e, 2f also extends in the second direction D2 (the short side direction of the pair of main surfaces 2a, 2b).

  As shown in FIG. 3, the element body 2 is configured by laminating a plurality of magnetic layers 9 in the opposing direction of the pair of main surfaces 2 a and 2 b. In the element body 2, the direction in which the plurality of magnetic layers 9 are stacked (hereinafter referred to as “the stacking direction of the magnetic layers 9”) coincides with the facing direction of the pair of main surfaces 2 a and 2 b. Each magnetic layer 9 is a magnetic green layer containing magnetic ferrite (for example, Ni-Cu-Zn-based ferrite, Ni-Cu-Zn-Mg-based ferrite, Cu-Zn-based ferrite, or Ni-Cu-based ferrite). It is comprised from the sintered compact of this. That is, each magnetic layer 9 contains magnetic ferrite. In the actual element body 2, the magnetic layers 9 are integrated so that the boundary between the magnetic layers 9 cannot be visually recognized.

  The internal conductor 3 extends between a pair of side surfaces of the element body 2 between a pair of adjacent magnetic layers 9 among the plurality of magnetic layers 9. In the present embodiment, the inner conductor 3 extends between the pair of second side surfaces 2e and 2f. As shown in FIG. 4, the inner conductor 3 has a first conductor portion 11, a second conductor portion 13, a third conductor portion 15, a fourth conductor portion 17, and a fifth conductor portion 19. The first conductor portion 11, the second conductor portion 13, the third conductor portion 15, the fourth conductor portion 17, and the fifth conductor portion 19 are between a pair of adjacent magnetic layers 9 among the plurality of magnetic layers 9. positioned.

  The inner conductor 3 (the first conductor portion 11, the second conductor portion 13, the third conductor portion 15, the fourth conductor portion 17, and the fifth conductor portion 19) is a conductive material (usually used as a laminated electronic component). For example, it is made of silver, copper, nickel, or the like. The inner conductor 3 is configured as a sintered body of a film (conductive paste film) made of a conductive paste containing the conductive material.

  The first conductor portion 11 has one end exposed at the second side surface 2 e of the element body 2. The first conductor portion 11 extends along the first direction D1. The first conductor portion 11 is disposed so as to be exposed to the first side surface 2d over the length direction along the first direction D1. That is, the first conductor portion 11 has an end surface that is exposed to the first side surface 2d and extends along the first direction D1. The first conductor portion 11 is exposed on the second side surface 2e and the first side surface 2d.

  The second conductor portion 13 has one end exposed at the second side surface 2 f of the element body 2. Similar to the first conductor portion 11, the second conductor portion 13 extends along the first direction D1. The second conductor portion 13 is disposed so as to be exposed to the first side surface 2d over the length direction along the first direction D1. That is, the first conductor portion 11 has an end surface that is exposed to the first side surface 2d and extends along the first direction D1. The second conductor portion 13 is exposed on the second side surface 2f and the first side surface 2d.

  The third conductor portion 15 has one end connected to the other end of the first conductor portion 11 and is located in the element body 2. The third conductor portion 15 extends in a direction intersecting with the first conductor portion 11. In the present embodiment, the third conductor portion 15 extends along the second direction D2. The third conductor portion 15 is located in the element body 2.

  The fourth conductor portion 17 has one end connected to the other end of the second conductor portion 13 and is located in the element body 2. The fourth conductor portion 17 extends in a direction intersecting with the second conductor portion 13. In the present embodiment, the fourth conductor portion 17 extends along the second direction D2 similarly to the third conductor portion 15. The fourth conductor portion 17 is located in the element body 2.

  The fifth conductor portion 19 is connected to the other end of the third conductor portion 15 and the other end of the fourth conductor portion 17. That is, the fifth conductor portion 19 has one end connected to the other end of the third conductor portion 15 and the other end connected to the other end of the fourth conductor portion 17. The fifth conductor portion 19 extends along the first direction D1. The fifth conductor portion 19 is disposed so as to be exposed to the first side surface 2c over the length direction along the first direction D1. That is, the fifth conductor portion 19 has an end surface that is exposed to the first side surface 2c and extends along the first direction D1. The fifth conductor portion 19 is exposed on the first side surface 2c.

  The terminal electrode 4 is located at the end of the element body 2 on the second side surface 2e side when viewed in the first direction D1. The terminal electrode 4 covers the entire surface of the second side surface 2e of the element body 2 and covers a part of the pair of main surfaces 2a, 2b and the pair of first side surfaces 2c, 2d adjacent to the second side surface 2e. Is formed. That is, the terminal electrode 4 is formed on the five surfaces 2a, 2b, 2c, 2d, and 2e.

  The terminal electrode 5 is located at the end of the element body 2 on the second side surface 2f side when viewed in the first direction D1. The terminal electrode 5 covers the entire surface of the second side surface 2f of the element body 2 and covers a part of the pair of main surfaces 2a, 2b and the pair of first side surfaces 2c, 2d adjacent to the second side surface 2f. Is formed. That is, the terminal electrode 5 is formed on the five surfaces 2a, 2b, 2c, 2d, and 2f.

  The terminal electrode 4 covers all of the portion exposed to the second side surface 2 e at one end of the first conductor portion 11, and is directly connected to one end of the first conductor portion 11. The terminal electrode 5 covers all of the portion exposed to the second side surface 2 f at one end of the second conductor portion 13, and is directly connected to one end of the second conductor portion 13. Thereby, the inner conductor 3 is electrically connected to the terminal electrode 4 and the terminal electrode 5. In the present embodiment, a part of the first conductor portion 11 is exposed from the terminal electrode 4 and a part of the second conductor portion 13 is exposed from the terminal electrode 5 on the first side surface 2d.

  The terminal electrodes 4 and 5 are formed by applying a conductive paste containing a conductive metal powder and glass frit to the outer surface of the element body 2 and baking it. A plating layer may be formed on the terminal electrodes 4 and 5.

  As described above, in the present embodiment, only a part of the inner conductor 3 (the first conductor portion 11, the second conductor portion 13, and the fifth conductor portion 19) is the first other than the pair of second side surfaces 2e and 2f. Since the side surfaces 2c and 2d are exposed, there is a region where an open magnetic circuit is formed in the length direction of the inner conductor 3, although it is partially. Thereby, generation | occurrence | production of magnetic saturation is suppressed in the lamination | stacking impedance element 1, and direct current superimposition characteristics can be improved.

  Only a part of the inner conductor 3 is exposed on the first side surfaces 2c and 2d. Therefore, in the laminated impedance element 1, for example, a decrease in effective magnetic permeability is suppressed as compared with the laminated impedance element exposed to the first side surface 2c over the entire length direction of the inner conductor 3. For this reason, in the laminated impedance element 1, the shift of the RX cross point to the high frequency side is suppressed, and the frequency band in which the noise absorption effect can be obtained can be suppressed.

  The element body 2 has a rectangular parallelepiped shape. The pair of second side surfaces 2e and 2f face each other. The inner conductor 3 includes a first conductor portion 11, a second conductor portion 13, and a fifth conductor portion 19 extending along the first direction D1, and a third conductor extending along the second direction D2. A portion 15 and a fourth conductor portion 17 are included. The first conductor portion 11 and the second conductor portion 13 are exposed at the first side surface 2d extending so as to connect the pair of second side surfaces 2e and 2f, and the fifth conductor portion 19 is exposed to the pair of second side surfaces 2e. , 2f are exposed at the first side surface 2c extending. The third conductor portion 15 and the fourth conductor portion 17 are located in the element body 2. In this case, a configuration in which only a part of the inner conductor 3 is exposed to the first side surfaces 2c and 2d can be easily realized.

  The inner conductor 3 has a first conductor portion 11, a second conductor portion 13, a third conductor portion 15, a fourth conductor portion 17, and a fifth conductor portion 19. Thereby, in the multilayer impedance element 1, the length of the inner conductor 3 is longer than that of, for example, a multilayer impedance element in which the inner conductor is linear, so that the inductance of the multilayer impedance element 1 is increased. As a result, the impedance of the laminated impedance element 1 can be increased.

  In the multilayer impedance element 1, as described above, an open magnetic path is formed not only in the fifth conductor portion 19 but also in the first conductor portion 11 and the second conductor portion 13, so that the occurrence of magnetic saturation is further suppressed. The DC superimposition characteristics can be further improved. In the multilayer impedance element 1, the lengths of the third conductor portion 15 and the fourth conductor portion 17 located in the element body 2 are set such that, for example, the first conductor portion 11 and the second conductor portion 13 are the first side surfaces. Since it becomes larger than the laminated impedance element that is not exposed to 2d, a decrease in effective magnetic permeability is further suppressed. Therefore, the shift of the RX cross point to the high frequency side is further suppressed, and the frequency band where the noise absorption effect can be obtained can be further suppressed.

  Here, the manufacturing process of the laminated impedance element 1 will be described.

  First, a laminated body including a plurality of laminated magnetic green layers and a conductive paste film that becomes the inner conductor 3 is prepared (laminated body preparing step). The magnetic green layer contains magnetic ferrite. Only a part of the conductive paste film is exposed on the outer surface of the laminate.

  The laminate is obtained by cutting a laminated green substrate obtained by a printing method or a sheet method into chips. The obtained laminate may be barrel-polished to round the ridges of the laminate. The conductive paste film can be formed, for example, by printing a conductive paste in a predetermined pattern on the magnetic green layer. By forming the conductive paste film so as to cross the planned cutting line, in the laminate obtained by cutting the laminated green substrate, only a part of the conductive paste film is exposed on the outer surface of the laminate. The printing method or the sheet method is well known to those skilled in the art and will not be described in detail.

  Next, after removing the binder resin from the laminate, the laminate from which the binder resin has been removed is fired (firing step). By this firing, the element body 2 is obtained. That is, the magnetic layer 9 is formed from the magnetic green layer, and the internal conductor 3 is formed from the conductive paste film. The sintering shrinkage rate of the magnetic green layer is smaller than the sintering shrinkage rate of the conductive paste film.

  Next, a conductive paste is applied to the outer surface of the element body 2, and the conductive paste is baked onto the element body 2 by heat treatment to form the terminal electrodes 4 and 5 (terminal electrode formation step). As the conductive paste, for example, a metal powder mainly containing Cu mixed with glass frit and an organic vehicle can be used. The metal powder may contain Ni, Ag—Pd, or Ag as a main component.

  Plating may be performed on the electrode formed by baking the conductive paste. For the plating, metal plating such as Ni, Sn, Ni—Sn alloy, Sn—Ag alloy, or Sn—Bi alloy can be applied. For example, the metal plating may have a multi-layer structure in which two or more layers such as a two-layer structure including a Ni layer and a Sn layer formed on the Ni layer are formed.

  Through these processes, the above-described laminated impedance element 1 is obtained.

  When the laminate is fired, the magnetic layer 9 is pulled in the direction in which the magnetic layer 9 is pulled by the internal conductor 3 due to the difference between the sintering shrinkage of the magnetic green layer and the sintering shrinkage of the conductive paste film. Internal stress is generated. Due to this internal stress, the effective magnetic permeability of the magnetic layer 9 may be reduced, and the RX cross point may shift to the high frequency side.

  In this manufacturing process, the portion of the conductive paste film exposed on the outer surface of the laminate does not contact the magnetic green layer, so the internal stress generated when the laminate is fired is reduced. . Therefore, in the obtained laminated impedance element 1, a decrease in the effective magnetic permeability of the magnetic layer 9 is suppressed, and a shift of the RX cross point to the high frequency side can be suppressed.

  As mentioned above, although embodiment of this invention has been described, this invention is not necessarily limited to embodiment mentioned above, A various change is possible in the range which does not deviate from the summary.

  The shape of the inner conductor 3 is not limited to the shape shown in the above-described embodiment. For example, as shown in FIG. 5, the first conductor portion 11, the second conductor portion 13, and the connection portion 23 may be included. The connection portion 23 is connected to the other end of the first conductor portion 11 and the other end of the second conductor portion 13. The connection portion 23 extends in a direction intersecting with the first and second conductor portions 11 and 13. In this modification, the connection portion 23 extends along the second direction D2. The connecting portion 23 may extend along a direction that intersects the first direction D1 and the second direction D2. The connecting portion 23 is located in the element body 2.

  The first conductor portion 11 is exposed on the second side surface 2e and the first side surface 2d. The second conductor portion 13 is exposed on the second side surface 2f and the first side surface 2c. In this modification, a part of the first conductor portion 11 is exposed from the terminal electrode 4 on the first side surface 2d, and a part of the second conductor portion 13 is exposed from the terminal electrode 5 on the first side surface 2c. ing.

  In the modification shown in FIG. 5, the length of the portion of the inner conductor 3 located in the element body 2 is smaller than the configuration shown in the above-described embodiment. Therefore, in the configuration shown in the above-described embodiment, the inductance of the multilayer impedance element 1 is higher than that of the modification shown in FIG.

  The first conductor portion 11, the second conductor portion 13, and the fifth conductor portion 19 do not have to be exposed at the outer surface of the element body 2. For example, as shown in FIG. 6, only the fifth conductor portion 19 may be exposed on the outer surface (first side surface 2 c) of the element body 2. In this case, the first conductor portion 11 and the second conductor portion 13 are not exposed on the first side surface 2d.

  In the modification shown in FIG. 6, the length of the portion of the inner conductor 3 exposed on the outer surface of the element body 2 is smaller than the configuration shown in the above-described embodiment. Therefore, in the configuration shown in the above-described embodiment, the occurrence of magnetic saturation can be suppressed and the DC superposition characteristics can be improved as compared with the modification shown in FIG.

  The first side surfaces 2c and 2d of the element body 2 may be covered with an insulating nonmagnetic material (for example, a glass material or a resin material). In this case, the part (the first conductor part 11, the second conductor part 13, or the fifth conductor part 19) exposed on the outer surface of the element body 2 in the inner conductor 3 is in contact with the conductor part of another electronic device. Can be prevented.

  The number of the inner conductors 3 is not limited to the number shown in the above-described embodiments and modifications, that is, one. The laminated impedance element 1 may include a plurality of internal conductors 3. The plurality of inner conductors 3 are not necessarily located between the same pair of magnetic layers 9. The plurality of inner conductors 3 may be positioned between a pair of different magnetic layers 9. When the multilayer impedance element 1 includes a plurality of inner conductors 3, only a part of at least one inner conductor 3 needs to be exposed on the first side surface 2c or the first side surface 2d.

  DESCRIPTION OF SYMBOLS 1 ... Laminated impedance element, 2 ... Element body, 2c, 2d ... 1st side surface, 2e, 2f ... 2nd side surface, 3 ... Internal conductor, 9 ... Magnetic body layer, 11 ... 1st conductor part, 13 ... 2nd conductor Part 15: Third conductor part 17: Fourth conductor part 19: Fifth conductor part D1: First direction D2: Second direction

Claims (4)

An element body formed by laminating a plurality of magnetic layers containing magnetic ferrite;
An internal conductor extending between a pair of side surfaces of the element body between a pair of adjacent magnetic material layers among the plurality of magnetic material layers,
The internal conductor is a multilayer impedance element in which only a part thereof is exposed on a side surface other than the pair of side surfaces of the element body. The element body has a rectangular parallelepiped shape,
The inner conductor has a conductor portion extending along a first direction in which the pair of side surfaces oppose each other and a conductor portion extending along a second direction intersecting the first direction. And
The conductor portion extending along the first direction is exposed at a side surface extending so as to connect the pair of side surfaces;
The laminated impedance element according to claim 1, wherein the conductor portion extending along the second direction is located in the element body. The element body has a rectangular parallelepiped shape,
The inner conductor is
A first conductor portion having one end exposed on one side surface of the pair of side surfaces;
A second conductor portion having one end exposed at a side surface facing the one side surface of the pair of side surfaces;
A third conductor portion having one end connected to the other end of the first conductor portion and extending in a direction intersecting the first conductor portion;
A fourth conductor portion having one end connected to the other end of the second conductor portion and extending in a direction in which the third conductor portion extends;
A fifth conductor portion connected to the other end of the third conductor portion and the other end of the fourth conductor portion,
The fifth conductor portion is exposed on a side surface extending to connect the pair of side surfaces;
The laminated impedance element according to claim 1, wherein the third conductor portion and the fourth conductor portion are located in the element body.   4. The multilayer impedance element according to claim 3, wherein the first conductor portion and the second conductor portion are exposed at a side surface facing the side surface at which the fifth conductor portion is exposed. 5.

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