JPH09241419A - Solventless composition and multilayered wiring board and production thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce a solventless composition, excellent in insulating properties and adhesion to a conductor layer and useful for production, etc., of a multilayerad wiring board without any breakage or short circuit of a wiring by dispersing a specific filler in the form of a particle or an aggregate in a specific matrix. SOLUTION: This solventless composition is obtained by dispersing (B) 1-300 pts.vol. filler which is a powder or a fiber of an inorganic substance, a powder of an organic substance or a fiber of an organic polymer (e.g. a cured epoxy resin having the biphenyl structure) in the form of a particle or an aggregate having <50μm particle diameter in (A) 100 pts.vol. matrix component which is a polymer (a precursor) (e.g. the one, deformable in a temperature region above ambient temperature and curable at a higher temperature then the temperature region, concretely a biphenyl-based epoxy resin) without using a solvent. The weight-average particle diameter of the component B is preferably regulated to <=10μm.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to manufacturing of a multi-layer wiring board, and more particularly to a computer such as a large computer, a workstation, a personal computer, a multimedia computer, an ATM (asynchronous transfer mode) switch for communication, etc. The present invention relates to a high-density multilayer wiring board, a multi-chip module board, a solvent-free composition which is a resin composition used for manufacturing these boards, and a method for manufacturing them.

[0002]

2. Description of the Related Art An example of a conventional method of manufacturing a multilayer wiring board using a ceramic wiring board as a base board will be described with reference to the process chart of FIG.

As shown in FIG. 5A, first, the substrate 50
A base metal layer 501, which can serve as an electrode for plating, is formed on the entire upper surface of 0, and a resist 502 which is punched into a desired conductor pattern shape is formed on the upper surface of the base metal layer 501, as shown in FIG. 5B. After that, the exposed groove part 5
No. 03 base metal layer 501 is used as an electrode for electroplating, and as shown in FIG. 5C, the groove portion 503 of the resist 502 is selectively filled with a conductor to form a conductor 504 such as a wiring, a via, a ground, and a power supply. To form. Then, FIG.
As shown in (d), the resist 502 is removed and the conductor 5 is removed.
After exposing 04, as shown in FIG.
The base metal layer 501 other than the portion facing 04 is removed. Next, as shown in FIG. 5F, the polymer insulating layer 50 is formed so as to wrap the conductor 504 on the entire upper surface of the substrate 501.
5G, the upper surface of the conductor 504 is exposed by polishing or the like and the insulating layer 5 is formed as shown in FIG.
The surface of 05 is surface-polished. The above steps are sequentially repeated a plurality of times to manufacture a multilayer wiring board.

A technique for forming a conductor pattern by the above method is disclosed in JP-A-57-50489.
JP-A-57-50490, JP-A-57-5049
No. 1 and the like, and a technique for forming an insulating layer is described in JP-A No. 50-64767.

Another method of manufacturing a multilayer wiring board is also known. Next, another manufacturing method will be described with reference to the process chart of FIG.

In this method, first, FIGS. 6 (a) and 6 (b) are used.
As shown in FIG. 6, a first conductive layer 601 and a second conductive layer 602 as a contact post are formed on a substrate 600, and an epoxy resin or a semi-cured polyimide 603 shown in FIG. 6C is formed on the surface thereof. Put on. Then, FIG.
As shown in (d), these resin layers are pressed and cured to form a flat insulating layer 605 in which the surface 604 of the contact post 602 is exposed. Next, as shown in FIG. 6E, the third conductive layer 606 connected to the surface 604 of the contact post 602 exposed on the insulating layer 605.
To form a multilayer wiring board. The method of manufacturing such a multilayer wiring board is described in Japanese Patent Publication No. 4-38157, Japanese Patent Publication No. 4-38158, and Japanese Patent Publication No. 6-57455.

Here, as a method of forming the underlying conductive film necessary for forming the wiring layer, Japanese Patent Laid-Open No. 57-504 is known.
89, JP-A-57-50490, JP-A-5
As generally described in JP-A-7-50491, a dry film forming method such as a sputtering method or a vapor deposition method is used.

There is also known a method of manufacturing a multilayer wiring board using a photosensitive insulating material such as photosensitive polyimide, which has a larger via diameter than the above-mentioned two conventional techniques but has a simple process. As an example, for example, Japanese Patent Publication No. 62-4
For example, the technique described in Japanese Patent No. 3544 is cited.

On the other hand, as an example of a multi-layer wiring board using a printed wiring board as a base substrate, one shown in FIG. 7 is known. The multilayer wiring board shown in FIG. 7 is manufactured based on the same concept as the method for manufacturing a multilayer wiring board using the photosensitive polyimide described above.

That is, in this multilayer wiring board, basically, an insulating layer having a via hole 703 is formed by forming a film of a photosensitive insulating material on the surface layer of the printed wiring board 700 on which the surface layer conductor 701 is patterned, exposing and developing it. 705 is formed,
Next, a step of forming a conductor layer on the entire surface (including the inner wall of the via hole 703) and then patterning the conductor layer to form the wiring 702 is repeated to form a multilayer, and finally, a through-plated through hole 704 is formed. Is the way. In addition, as a method of forming the underlying conductive film necessary for forming the wiring layer, generally, an electroless plating method is used.

A method of manufacturing such a multilayer wiring board is called a build-up method. As an example of such a build-up method, there is JP-A-4-148590. In the multilayer wiring board manufactured by this method, as shown in FIG.
As shown in FIG. 7, the connection between the printed wiring board surface layer conductor 701 and the buildup conductor layer 702 and the connection between the buildup conductor layers are not the connection by the through plating through hole 704 by drilling but the conformal via 703. Done by Therefore, a high-density multilayer printed wiring board can be obtained as compared with a conventional printed wiring board in which interlayer connection is made only by through-holes.

Further, as shown in FIG.
Are patterned and through-plated through holes 802,
A method of obtaining a multilayer printed wiring board by preparing a plurality of printed wiring boards 800 on which 803 are formed, stacking them with a prepreg insulating layer 806 interposed therebetween, and finally forming a through-plated through hole 805 is provided. Are known. In this method, the through holes 805a of the plated through holes 802 and 803 formed by drilling for interlayer connection are filled with a resin 806, and conductor pads 801 and 804 connected to the plated through holes are formed in the openings to form a plated plate. The area of through holes is effectively used. As a method of manufacturing such a multilayer printed circuit board, for example, there is a method disclosed in Japanese Patent Laid-Open No. 4-168794.

The first problem of the above-mentioned prior art lies in the insulating film forming step and the flattening step.

The insulating film forming process of FIG. 5 (f) and FIG. 5 (g)
In the flattening step, the polyimide-based material generally used as the polymer for forming the insulating layer 505 is likely to cause pinholes and voids because the solvent and water are evaporated by the thermosetting reaction. Further, since the insulating resin shrinks along the irregularities of the base during curing, an insulating film is formed along the irregularities of the substrate, and thus the flatness is remarkably poor. Therefore, FIG.
In the manufacturing method shown in (1), it is necessary to grind and polish the soft polyimide and the hard metal film to flatten them, and the process requires a long time. Further, it is not easy to remove foreign matter when removing grinding powder and polishing powder by washing. Further, since the polyimide material is applied with a polyamic acid solution or a polyimide solution and heated to form a film, a single coating cannot obtain a required film thickness. Therefore, the coating process must be repeated a plurality of times, and the number of processes such as coating and drying is large. In addition, there is a problem in that a polyimide-based material requires a high temperature and a long time for curing the polyimide.

Due to these many problems, the method for manufacturing a multilayer wiring board shown in FIG. 5 has a drawback that the yield is low, the number of steps is large, and the lead time is long, so that the mass productivity is remarkably inferior. was there.

Further, in the prior art shown in FIG. 6,
As shown in FIG. 6C, after applying the epoxy resin solution or the polyamic acid solution, the solvent is volatilized, and the epoxy resin or the polyamic acid is applied to the wiring layers 601, 602 and cured, When the resin is cured, the residual solvent volatilizes to generate voids and pinholes. Furthermore, when polyimide is used as the insulating resin, the condensation water generated during the curing of the polyamic acid also causes
Voids and pinholes occur. Further, even if the solvent is applied in a solvent-free state, air is trapped between the wiring layers 601 and 602 and the insulating layer 603, leaving gaps and bubbles, which causes voids and pinholes. These defects in the insulating film not only make it difficult to form the upper wiring layer, but also cause the processing liquid to be taken into the insulating film in the wet process such as plating and etching at the time of forming the wiring and cause the insulation failure. Become.

Therefore, when carrying out the method shown in FIG. 6, it is desirable to use a solventless epoxy resin or polyimide resin for forming the insulating film. However, if the viscosity of the insulating film forming material is high, not only the resin cannot be filled between the wirings, but also the resin remains thick on the wiring upper surface, and the surface 604 of the contact post 602 is not exposed. Therefore, if a material having low viscosity is used, the resin can be filled between the wirings, but in the process of curing while pressing the resin layer, the wiring is strongly pressed by the mold, so that the wiring is deformed or broken. .

Further, in the method shown in FIG. 6, since the pressure applied in the resin curing step is only the pressure, the pressure is not evenly applied to the resin, and the central portion of the insulating layer having a high pressure is low. There is a difference in physical properties such as heat resistance, thermal expansion coefficient, and mechanical strength between the pressure insulating layer peripheral part, and resin leaks from the substrate, and the film thickness of the insulating layer peripheral part becomes thin. The air entrained when the resin leaks, the dissolved air in the resin, and the voids and pinholes caused by the volatilization of water are generated in the periphery of the insulating layer. Also, if you just press
Actually, there is a problem that the resin on the upper surface of the wiring cannot be completely removed, and a resin thin film of about 1 μm which cannot be ignored remains on the wiring surface, which hinders the conduction between the wirings. Due to many of these problems, the method of manufacturing the multilayer wiring board shown in FIG. 6 has a drawback of low yield.

The second problem of the above-mentioned conventional technique is the adhesive strength between the wiring conductor and the insulating film when the wiring layer is formed on the surface of the insulating film.

As a method for forming a base conductive film for electroless plating or electroplating, generally, Japanese Unexamined Patent Publication (Kokai) No. 5 (1999) -58187
As described in JP-A-7-50489, JP-A-57-50490, JP-A-57-50491, etc., a dry film forming method such as a sputtering method or a vapor deposition method is used. The sputtering method is preferable to the vapor deposition method in that a relatively high adhesive strength can be secured because the underlying conductive film material is physically bitten into the insulating film. However, the sputtering method or the vapor deposition method requires an expensive apparatus, requires a long film formation time, and cannot be said to be a low cost and high throughput method.

Therefore, the electroless plating method is often used in the production of printed wiring boards. JP-A-53-1
40344, JP-A-61-276875,
In the technique described in Japanese Patent Laid-Open No. 64-53497, the surface of the insulating film is etched to form irregularities depending on the strength of the etching, and then the underlying conductive film is formed by electroless plating. By doing so, the adhesive strength between the insulating film and the underlying conductive film is secured by the anchor effect of the unevenness of the insulating layer.

In order to make the insulating film stronger or weaker in etching, the insulating film may be made of a component that is easily etched and a component that is not easily etched. Generally, one of the components is a matrix polymer material forming the insulating film, but the problem here is the dispersibility of the component that is easily etched or the component that is not easily etched. If the components in the insulating film are uneven, the unevenness of the surface of the insulating film will be uneven, and the adhesive strength of the underlying conductive film will vary. In extreme cases, there will be no adhesive strength and wiring cannot be formed. Area is generated. Also, if there is a part where the component particles are partially aggregated,
During etching, large protrusions and recesses that are not suitable for forming wiring are generated.

In addition to the above-mentioned problems, the printed wiring board build-up method has the following problems related to fine wiring.

The conformal via 703 must have a bottom diameter of about 100 μm or more from the viewpoint of the resolution of a photosensitive insulating material such as a photosensitive epoxy material. Further, in order to prevent conductor breakage, It must be tapered. For this reason, the surface area occupied by the via including the land is large, and it is difficult to further reduce the via diameter and increase the density.

Further, since the conformal via 703 has irregularities on its upper part, the next conformal via or wiring conductor cannot be formed on this. This means that two vias are used to connect the thin-film multilayer wiring layers separated by one layer, resulting in a loss of the number of vias. Further, the above-mentioned conventional technique cannot form a thermal via.

It should be noted that the conductor requires a step area of a certain value or more in view of the wiring resistance. Therefore, forming a square pattern with a thick conductor can form a finer pattern than forming a rectangular pattern with a thin conductor. However, in the above-mentioned conventional technique, since the conductor layer is etched to form the wiring, if the conductor is made thick, a fine wiring pattern cannot be formed.

On the other hand, between the surface conductor and the inner layer conductor of the printed wiring board or between the conductors on the front and back of the printed wiring board,
Connections are made by through-plated through holes 704 formed at the final stage. However, since the through hole for forming the through plating through hole 704 is formed by mechanical perforation, it is difficult to perform fine work, and there is a drawback that the wiring density is further reduced by that amount.

If the through-plated through-hole is not completely filled with the conductor, the through-hole remains in the central portion. Since a liquid material such as a photosensitive insulating material or a resist cannot be formed on the surface of the printed wiring board in which such through holes remain, a thin film multilayer wiring layer cannot be formed by the build-up method.

Further, the hole of the plated through hole formed by drilling for interlayer connection is filled with resin, and a conductor pad for connecting with the plated through hole is formed on the upper part to effectively utilize the area of the plated through hole. -168
In the method described in Japanese Patent No. 794, two adjacent conductor layers (801/802 and 803/80) of a multilayer printed wiring board are disclosed.
Although it is effective for the connection of 4), the through-plated through hole 805 formed at the final stage is also used for the connection of both sides of the printed wiring board or the connection of two conductor layers with one or more conductor layers separated. There is no choice but to rely on, and the through-hole plated through holes 805 that are not filled up remain in the finished multilayer printed wiring board.

Therefore, as described in JP-A-6-334343, the fluid polymer precursor is used in a solvent-free state, the wiring gap is evacuated, and then the precursor is applied while applying hydrostatic pressure. There is proposed a manufacturing method for solving the above-mentioned problems by curing the resin to form an insulating layer. According to this method, the yield is high, the number of steps is small, the lead time is short, mass productivity is excellent, and a high-density multilayer wiring board can be manufactured at low cost. In addition, this method can be applied to a case where a ceramic wiring board is used as a base substrate and a case where a printed wiring board is used.
Moreover, the problem caused by the through-plated through-hole as described above can be avoided.

[0031]

[Patent Document 1] Japanese Patent Application Laid-Open No. 6-334
Japanese Patent No. 343 describes that a solvent-free polymer precursor composition, which is a mixture of the above-mentioned fluid polymer precursor and a filler, can be used for forming the insulating layer (claim 48). ). When an insulating layer is formed using a composition containing fine fillers, the surface of the insulating layer has dense irregularities, which increases the adhesion between the conductor layer (planar wiring, etc.) formed on it and the insulating layer. ,preferable. When using such a composition for forming an insulating layer, it is desirable that fine fillers are uniformly mixed. This is because the wiring formed on the surface of the insulating layer is not broken or short-circuited, and therefore the flatness of the surface of the insulating layer must be ensured.

Therefore, the object of the present invention is to provide a solventless composition for forming an insulating layer in which a filler is uniformly dispersed, a method for producing the same, and a method for producing a multilayer wiring board using the composition. And

[0033]

In order to achieve the above object, the present invention comprises 100 parts by volume of a matrix component and 1 to 300 parts by volume of a filler dispersed in the matrix component, and the matrix component is a polymer. At least one of the compound and the polymer compound precursor, the filler is at least one of inorganic powder, inorganic fiber, organic powder, and organic polymer fiber,
Solvent-free compositions are provided that are solvent-free. Here, the solvent means a good solvent for the matrix component and not included in the above-mentioned subcomponents. Incidentally, this solventless composition is a plasticizer, a lubricant, an antioxidant, a flame retardant, a flame retardant aid,
It may contain at least one kind of subcomponent selected from a filler, a curing catalyst, and a surface treatment agent.

When an insulating film is formed using the solvent-free composition of the present invention, the filler is uniformly dispersed in the insulating film (or only finely aggregated). Therefore, when the surface is etched in the step of exposing the upper surface of the vertical via conductor, a fine uneven structure having a uniform shape suitable for wiring formation can be formed on the insulating film surface.

The average particle size of the filler is preferably 10 μm or less. This is because the finer the filler, the finer the irregularities on the surface of the insulating film formed by using the composition containing the filler. In the composition of the present invention, it is desirable that the filler is not aggregated, but even if the filler is aggregated, the particle size of the aggregate is determined on the surface of the insulating layer in the wiring board produced using the composition. It is desirable that the width and interval of the formed wiring be smaller than the shorter one. At present, wiring widths and intervals of about 50 μm are desired. Therefore, the present invention provides a composition having an aggregate particle size of less than 50 μm.

Examples of the filler include silicate, alumina, calcium oxide, magnesium oxide, aluminum nitride, hydroxide, phosphate, carbonate, sulfate, hydrochloride, antimony trioxide, decabromobiphenyl, Various ceramics, polyimide, benzoguanamine resin, melamine resin, urea resin, epoxy resin cured product, bismaleimide triazine resin cured product, phenol resin cured product, cured product of benzocyclobutene compound, silicone, oxybenzoyl polyester, polyallyl sulfone, Polyether ether ketone, polyarylate, polyphenylene sulfide, polyether sulfone, polysulfone, polyethylene terephthalate, polybutylene terephthalate, polycarbonate, polyacetal, polyamide, various engineers Ring plastic, and the like.

As the epoxy resin cured product, bisphenol A type epoxy resin cured product, bisphenol F
Epoxy resin cured product, bisphenol AD epoxy resin cured product, novolac epoxy resin cured product, epoxy resin cured product having a biphenyl structure, epoxy resin cured product having a terphenyl structure, epoxy resin cured product having a quaterphenyl structure , Epoxy resin cured product having phenylene oxide structure, epoxy resin cured product having naphthalene structure, epoxy resin cured product having binaphthyl structure, triglycidyl isocyanate-based epoxy resin cured product, epoxy resin cured product having hydantoin structure, cyclohexane structure Examples thereof include an epoxy resin cured product, a glycidyl ester-based epoxy resin cured product, a glycidyl amine-based epoxy resin cured product, and an epoxy resin cured product having a tetraphenylethylene structure.

Examples of the cured product of a benzocyclobutene compound include a cured product of a benzocyclobutene compound having a vinylene structure and a cured product of a benzocyclobutene compound having a vinylene structure and a dimethylsiloxane structure.

It is preferable to use, as the filler, a cured product of a resin used for the matrix component, because the affinity between the matrix component and the filler can be increased. Among these filler materials, a cured epoxy resin having a biphenyl structure is particularly preferable. These filler substances may be used alone, or some of them may be used in combination.

The matrix component is preferably a thermosetting resin which is deformable in a first temperature range above room temperature and has a property of being cured at a second temperature higher than the first temperature range. Examples of matrix components include epoxy resins, bismaleimide triazine resins, phenol novolac resins, cresol novolac resins, benzocyclobutene compounds, and the like.

As the epoxy resin, a bisphenol A epoxy resin, a bisphenol F epoxy resin, a bisphenol AD epoxy resin, a novolac epoxy resin, a biphenyl epoxy resin, an epoxy resin having a terphenyl structure, and a quaterphenyl structure. An epoxy resin having a phenylene oxide structure, an epoxy resin having a naphthalene structure, an epoxy resin having a binaphthyl structure, an epoxy resin having a triglycidyl isocyanate structure, an epoxy resin having a diglycidyl hydantoin structure, and a cyclohexene oxide structure. Epoxy resin, epoxy resin having glycidyl ester structure, epoxy resin having glycidyl amine structure, and tetraphenylethylene structure Epoxy resin.

Examples of the benzocyclobutene-based compound include a benzocyclobutene-based compound having a vinylene structure and a benzocyclobutene-based compound having a vinylene structure and a dimethylsiloxane structure.

Of these resins or compounds, biphenyl type epoxy resin is particularly preferable. These resins or compounds may be used alone, or some of them may be appropriately combined and used.

The solvent-free composition of the present invention preferably has a melt viscosity which decreases with heating and exhibits a minimum viscosity immediately before the curing temperature.

Further, in the present invention, a method for producing the above-mentioned solventless composition, that is, a part of the composition other than the filler in the composition of the target solventless composition and a filler are mixed to obtain a high solvent. Provided is a method for producing a solventless composition, which comprises a high-concentration step of obtaining a high-concentration composition and a dilution step of further adding and mixing the rest of the composition to the high-concentration composition in this order. The high-concentration composition may be a mixture of at least one other component constituting the solventless composition and a filler,
The one component may be a matrix component or the above-mentioned subcomponent. That is, the subcomponents may be mixed in the high-concentration step, may be mixed at the time of dilution, or may be divided and mixed in the high-concentration step and the dilution step. Mixing in the high-concentration step is preferably performed by a batch-type kneading device. This is because sufficient stirring can be performed while controlling the temperature in the system.

It is desirable that at least a part of the components mixed with the filler in the high concentration step and at least a part of the components added to the high concentration composition in the dilution step are the same. If they are the same, they are easy to mix,
This is because it is possible to ensure the dispersibility of the filler that is the dispersed phase.

Further, the present invention provides a multilayer wiring board having an insulating layer made of a cured product of the above solventless composition. In the multilayer wiring board of the present invention, it is desirable that the filler in the insulating layer is not aggregated. However, even if the filler is aggregated, the particle size of the aggregate depends on the width and spacing of the wiring formed on the surface of the insulating layer. It is desirable that it is smaller than the shorter one.
At present, wiring widths and intervals of about 50 μm are desired. Therefore, the present invention provides a multilayer wiring board in which the particle diameter of aggregates in the insulating layer is less than 50 μm.

Further, as a method for producing a multilayer wiring board using the composition of the present invention, a step of supplying the solventless composition of the present invention between a base substrate and a mold, Exhausting the gas to be discharged, filling the gap to fill the solventless composition with the gap, curing the solventless composition while applying hydrostatic pressure, and curing the surface of the wiring. Provided is a method for manufacturing a multilayer wiring board, which comprises an exposing step of exposing at least a part thereof in this order. Incidentally, known composition supply, a base substrate comprising a wiring formed on at least one surface of the front and back, a mold having a flat surface, the wiring of the base substrate,
It is a step of arranging the mold so as to face the flat surface with a gap therebetween, and supplying the solventless composition of the present invention to the gap. The filling step is a step of narrowing the distance between the base substrate and the mold to fill the gap with the solventless composition and further fill the space between the wirings with the solventless composition. The solvent-free composition of the present invention is particularly suitable for this method for producing a multilayer wiring board.

The evacuation process and the filling process may be performed at the same time. Further, a wiring forming step of forming a wiring may be provided after the exposing step on at least a part of the insulating layer surface and the exposed wiring surface. In this case, the thin film wiring layer can be formed in multiple layers by repeating the series of steps from the composition supplying step to the wiring forming step one or more times.

When a resin having a property of being deformable in the first temperature range above room temperature and having a property of curing at the second temperature higher than the first temperature range is used as the matrix component, in the filling step, It is desirable to keep the solventless composition (and preferably the substrate) in the first temperature range. Also,
In the pressure-curing step, it is desirable that the solventless composition is cured by heating it to the second temperature immediately after heating it to a temperature in the first temperature range where the viscosity of the solventless composition becomes the lowest. By doing so, the solventless composition spreads on the substrate at a uniform speed when flowing and filling the wiring, between the wirings or in the through hole having the conductor layer on the inner wall. This is because reaggregation of the filler can be prevented.

The present invention can also be applied to the case where the base substrate further includes a through hole in which a via wiring is formed by a conductor attached to the inner wall. This is because even when a substrate having through holes with holes remaining is used as a base substrate, the solvent-free composition is filled in the gaps inside the through holes as well as the gaps between the wirings in the filling step.

As an example of a multilayer wiring board manufactured by the method for manufacturing a multilayer wiring board of the present invention, a base board having a through hole having a conductor layer on the inner wall, and at least one of the front and back surfaces of the base board are provided. A multilayer wiring board having a formed first insulating layer, wherein a portion other than the conductor layer inside the through hole is filled with a columnar member, and the columnar member and the first insulating layer An example of the multilayer wiring board is a cured product of the solventless composition of the present invention and has a structure in which no interface is formed between the columnar member and the first insulating layer.

[0053]

BEST MODE FOR CARRYING OUT THE INVENTION An example of a method for manufacturing a multilayer wiring board according to the present invention will be described with reference to FIG. (1) First, a base substrate 100 having horizontal wirings 101 and vertical via conductors 102 as wiring layers on at least one of the front and back surfaces is manufactured (FIG. 1A). Only one of the planar wiring 101 and the vertical via conductor 102 may be used.

(2) The flat surface of the die 104 is opposed to the wiring layer side of the base substrate 100, and the flat surface of the die of the present invention is provided between the surface of the base substrate 100 having the wiring and the flat surface of the die 104. A solventless composition is provided. Here, for example, if the composition is the self-supporting sheet 103, the composition sheet is placed on the wiring (FIG. 1B), and the sheet and the substrate 100 are sandwiched by a mold. (FIG. 1 (c)). If the composition is a varnish having no self-supporting property, the varnish is applied to the surface of the substrate, which has wiring, and then the substrate 10 is formed.
Insert the front and back of 0 between the molds.

(3) The gap 105 between the die 104 and the base substrate 100 is exhausted from the air supply / exhaust port 106.

(4) The mold 104 is moved toward the base substrate 100, and the solventless composition 103 is applied to the base substrate 10.
The wiring gap above 0 (and the gap in the through-plated through hole) is filled (FIG. 1 (d)).

(5) The solventless composition 103 is cured under a predetermined hydrostatic pressure to cure the solventless composition 103 to form an insulating film 107.

(6) The substrate 100 is taken out from the mold 104 (FIG. 1E), and the surface of the insulating film 107 is etched back to expose the upper surface of the vertical via conductor 102 (FIG. 1).
(F)), the surface of the vertical via conductor 102 (horizontal wiring conductor 101 in the case of only the horizontal wiring conductor 101) is polished to flatten the substrate surface (FIG. 1 (g)).

From the above (1) to (6), a thick film / thin film composite multilayer wiring board having a base substrate and a thin film wiring layer can be obtained.

Further, (7) a horizontal wiring conductor 108 and a vertical via conductor 109 (only one of them may be formed) are formed on the exposed portion of the vertical via conductor 102 and at least a part of the surface of the insulating layer (FIG. 1 (h)). Later (2) to (7)
By repeating the series of steps up to, the thin film wiring layer can be formed in multiple layers.

As a wiring form on the base substrate, in FIG.
Although the case where the horizontal wiring conductor 101 and the vertical via conductor 102 are present as a pair is shown, only the horizontal wiring conductor 101 or only the vertical via conductor 102 may be present on the base substrate 100, and the horizontal wiring conductor 108 may be provided. Only or
In some cases, only the vertical via conductor 109 may be formed. Further, FIG. 1 shows a horizontal wiring conductor 10 on one surface of the base substrate 100.
1 and the vertical via conductor 102, and the multilayer wiring is formed on one surface, but the multilayer wiring can be simultaneously laminated on both front and back surfaces in the same step by the above method. By forming the multi-layer wiring on the front and back sides at the same time, it is possible to eliminate the warp of the base substrate 100 due to the difference from the thermal expansion coefficient of the base substrate material 100 when forming the insulating layer 107, and further improve the wiring density of the multi-layer wiring substrate. This can reduce the number of processes and lead time.

The base substrate 100 may or may not include a wiring conductor. The insulating material may be an organic insulator such as a printed wiring board, or an inorganic insulator such as a metal core wiring board or a ceramic wiring board. The conductor is preferably copper, especially for the thin film layer, from the viewpoint of wiring resistance, but tungsten or the like can be used for the conductor of the base substrate, and the conductor is not limited to copper.

FIG. 2 shows an example of the form of a wiring board that can be used as a base board in the multilayer wiring board of the present invention.

2A and 2B have through-plated through holes 200, and the surface conductor 2 is formed on the surface of the substrate 205.
Reference numeral 01 is an example of a patterned printed wiring board. The substrate of FIG. 2A is provided with via conductors 202 for connection with the upper layer at predetermined positions of the conductor of the through-plated through hole and the surface layer conductor. In FIG. 2 (c),
It has a through-plated through hole 200 and has a surface layer conductor 201.
1 shows an example of a printed wiring board which is not patterned. In this case, the surface layer conductor 201 is patterned later to form a planar wiring. The printed wiring board described above may have non-through holes such as blind holes and lead holes, or may have no through-plated through holes.

In FIGS. 2D and 2E, the substrate 206 is shown.
An example of a metal core wiring board having a plane wiring 203 on the surface is shown. In FIG. 2D, a via conductor 204 for connection with an upper layer is provided at a predetermined position on the surface of the plane wiring 203. FIGS. 2F and 2G show an example of a ceramic wiring board including the internal wiring 208 inside the substrate 207 and the surface wiring 203 inside the substrate 207. FIG.
In (g), the via conductor 204 for connection to the upper layer is provided at a predetermined position on the surface of the planar wiring 203.

Next, the manner of supplying the solventless composition 103 in the method for producing a multilayer wiring board of the present invention will be described with reference to FIG. Note that, in FIG. 3, the base substrate is illustrated as in FIG. 2H for the sake of simplicity of description, but as described above, the structure of the base substrate to which the present invention can be applied is not limited thereto. .

The solvent-free composition 103 may be in the form of a film as shown in FIG. 3 (a) or in the form of powder, pellets or flakes as shown in FIG. 3 (b). But,
In consideration of mass productivity and possibility of inclusion of foreign matter, it is preferable to use in a film form. The film-shaped solvent-free composition 103 is formed by, for example, thermocompression bonding or melt-fixing on the surface of the substrate on which the insulating layer is formed and / or the surface of the mold facing the surface of the substrate on which the insulating layer is formed. can do. Further, when the sheet of the solventless composition has self-supporting property, the sheet of the solventless composition 103 may be sandwiched between the surface of the substrate on which the insulating layer is formed and the mold. This sheet can be obtained, for example, by forming a film by coating the solventless composition 103 in a molten state on a temporary support having a flat surface, and then peeling the film from the temporary support. For forming the solventless composition 103, spin coating, roll coating, curtain coating, laminating, a melt discharge method using a dispenser, an extrusion molding method using a T die, or the like can be used. Further, the solvent-free composition 103 in the form of powder, pellets, or flakes forms the insulating layer of the substrate, and / or
Alternatively, it may be dispersed on the surface of the mold facing the surface of the substrate on which the insulating layer is formed.

In the evacuation process, the gap 105 between the die 104 and the base substrate 100 is evacuated so that the gap 105 is 20T.
It is desirable to carry out so as to be less than orr. This exhaust does not create a gap between the solvent-free composition 103 and the conductors 101 and 102 except for air in the wiring conductor gap and the through-plated through hole, and also in the atmosphere in the gap 105 ( It is necessary in order to prevent air bubbles, moisture, etc. already existing on the surface and inside of the solventless composition 103 from being incorporated into the solventless composition 103.

In the filling step, when the viscosity of the solventless composition 103 is particularly high, it is desirable to heat the solventless composition 103 to melt / soften it. Generally, the lower the viscosity, the easier the filling and the solvent-free composition 10 by exhausting.
It is preferable because the effect of removing bubbles, water and solvent in 3 is great. However, if the composition has a high viscosity at room temperature such that it has a self-supporting property, it is easy to use in the step of supplying the composition.

As a method of narrowing the distance between the base substrate and the mold 100, for example, it is considered that the gap 105 is depressurized. By doing this, the mold 104 becomes
It moves relative to the base substrate 100. Or,
The compression pressure may be applied in the vertical direction (direction perpendicular to the surface of the substrate on which the insulating film is formed). The compression pressure is 0.1 kgf / cm so as not to affect the substrate.
^It is preferably ² or more and 100 kgf / cm ² or less.

By thus reducing the distance between the base substrate and the mold 100, the surface of the base substrate 100 on which the wiring layer including the planar wiring conductor 101 and the vertical via conductor 102 is formed is solvent-free. It is filled with the object 103.
If the pressure reduction in the gap 105 or the compression pressure in the vertical direction is too large, the wiring layer is pressed by the mold 104,
Since the wire conductor is broken or broken, the relative movement of the mold 104 is stopped when the flat surface of the mold 104 on the wiring layer side and the upper surface of the wiring layer are almost in contact with each other. To do.

Next, after stopping the exhaust and returning to atmospheric pressure,
Hydrostatic pressure is applied to the solventless composition 103 filled in the wiring conductor gap (pressurizing and curing step). The hydrostatic pressure is applied by the compression pressure from the vertical direction and the pressure from the lateral direction. This lateral pressure is applied by injecting air, nitrogen, an inert gas or the like from the air supply / exhaust port 106. Hydrostatic pressure is 0.1k
It is preferably gf / cm ² or more and 99.9 kgf / cm ² or less.

It is desirable that the mold is not lifted by setting the compression pressure in the vertical direction to be equal to or higher than the pressure in the horizontal direction. The difference between the compression pressure in the vertical direction and the pressure in the horizontal direction is 0.1 kgf / cm ² or more 9
It is preferably 9.9 kgf / cm ² or less. If the compressive pressure from the vertical direction is larger than the pressure from the lateral direction, the mold 104 will be relatively closer to the wiring layer on the base substrate 100. Therefore, if the difference is larger than necessary, the wiring will be broken. Because there is something to do.

As described above, by applying the hydrostatic pressure to the solventless composition 103 filled in the wiring conductor gap, the bubbles in the solventless composition 103 are crushed, and the volatile components such as water and dissolved air are vaporized. Can be suppressed and the generation of voids can be suppressed. Furthermore, since the solventless composition 103 is uniformly pressed, the solventless composition 103 does not leak from the substrate, and the entire surface of the base substrate is
A flat layer of the solventless composition 103 having a uniform film thickness can be formed.

When the solventless composition 103 filled in the wiring conductor gap or the through-plated through hole is cured,
Curing is performed in the mold 104 while applying the above-mentioned hydrostatic pressure. By curing while applying the hydrostatic pressure, it is possible to form a flat resin-cured material film 107 having a uniform film thickness in which the generation of voids is suppressed. Further, since it is formed under uniform pressure, the insulating film 107 of the multilayer wiring board of the present invention is formed.
Has uniform physical properties such as heat resistance, coefficient of thermal expansion, and mechanical strength.

Once the solventless composition has been cured, it is not necessary to apply hydrostatic pressure. Therefore, set the curing temperature to 2
After the step or more, the solventless composition is cured at the first temperature, the hydrostatic pressure is released, the die is removed, and then the composition may be held at the second temperature for further curing.

In the solventless composition of the present invention, curing shrinkage is suppressed by the effect of the filler. Therefore, shrinkage of the hardened material 107 filled in the through-plated through holes is also suppressed, so that the flatness of the hardened material on the upper part of the through hole is ensured to the extent that there is no problem in forming wiring in the upper layer. .

In the multilayer wiring board formed by the above-described steps, the upper surface of the conductor may not be exposed as shown in FIG. 1 (e). This is because the surface of the mold 104 cannot actually be made completely flat, it is difficult to make the surface of the mold 104 completely adhere to the upper surface of the wiring, and the height of the wiring layer is completely This is because it is difficult to align them. Therefore, the insulating film 107
It is necessary to remove the surface by wet etching, dry etching, mechanical polishing, or a combination thereof to expose the upper surface of the wiring.

As the wet etching liquid used in the exposing step, an acidic aqueous solution, an alkaline aqueous solution, an oxidizing solution, which can dissolve or decompose and remove the insulating film 107,
And reducing solutions, and it is desirable to select and use an appropriate one among them depending on the properties of the insulating film and the conductor film. O ₂ is a dry etching method
Plasma asher or UV / O ₃ is good. Further, as the mechanical polishing method, a buffing method, a sandblasting method, an injection processing method represented by a liquid honing method, or a lapping method is preferable.

By this exposing step, the insulating film 107 can be uniformly etched back, and the etched or polished surface of the insulating film is a surface whose adhesiveness is secured to the underlying conductive film as described later. become.

Further, as shown in FIG. 1 (f), when the height of the exposed wiring conductor is significantly different, the conductor upper surface is polished by mechanical polishing, chemical polishing, or the like, if necessary. You may make height uniform. In this case, since only the conductor is ground and the amount thereof is small, it is not necessary to perform the difficult work that takes a long time as described in the prior art.

Here, the step of forming the underlying conductive film connected to the vertical via conductor of the base substrate in the wiring forming step will be described in more detail.

As a method for forming the underlying conductive film, known dry film forming methods such as sputtering method, vapor deposition method,
An ion plating method, a thermal spraying method, or the like can be used, and a wet method such as an electroless plating method can also be used. However, an electroless plating method is preferable as a film forming method which is low in cost and excellent in adhesive strength with an insulating film.

By forming the uneven structure on the surface of the insulating film, the adhesive strength of the electroless plated film can be improved. In the present invention, an inorganic powder, an inorganic fiber, an organic powder that behaves differently from the cured resin (matrix component) in the surface removal treatment (wet etching, dry etching, mechanical polishing, etc.) in the exposure step, or A filler made of organic polymer fibers or the like is dispersed in the insulating layer. Therefore, a complicated uneven structure can be formed due to the difference in the removal rate between the resin cured product and the filler in the exposure step. Such an insulating film roughening process may be performed before or after the exposure process as a process different from the exposure process.

It is desirable that the surface of the wiring layer before the insulating film is formed on the upper surface thereof is also roughened by, for example, blackening treatment, blackening reduction treatment, or treatment such as soft etching. .

By the manufacturing method of the multilayer wiring board described above, the thin film multilayer wiring structure can be formed not only on the ceramic wiring board and the metal core wiring board but also on the printed wiring board. FIG. 4 shows a structural example of a multilayer wiring board using the printed wiring board as a base substrate.

The printed wiring board 400 shown in FIG.
The interlayer connection through hole 406, the plane wiring 407, and the via wiring 402 are provided. Interlayer connection through hole 406
The inner wall of (1) is covered with a conductor 401, and the through hole inside is filled with a cured product of the solventless composition of the present invention. The via wiring 402 is formed on the surfaces of the conductors 401 and 407.

Interlayer insulating layers 404 and conductor pattern layers 403 made of a cured product of the solventless composition of the present invention are alternately formed on both front and back surfaces of the printed wiring board 400 shown in FIG. 407 and conductor pattern layer 403
Vias and between the conductor pattern layer 403 and the conductor pattern layer 403 above it.
Are connected so as to be conductive. No interface is formed between the insulating layer 404a formed on the surface of the printed wiring board and the columnar insulator inside the through hole 406. According to the manufacturing method of the present invention, the via conductor 405 may have a fine columnar shape.

According to the above-mentioned substrate manufacturing method of the present invention,
An insulating film that does not deform or break the conductor, is flat (including the top of the through-plated through hole that is filled in the case of a printed wiring board), has no voids or pinholes, and has a uniform film thickness and physical properties over the entire board. Can be formed at once. Further, when the upper surface of the horizontal wiring conductor or the vertical via conductor is covered with the insulating film, the step of exposing the upper surface is an insulating film composed of other components by one or more methods selected from wet etching, dry etching, and mechanical polishing. Since the etching back is performed, the upper surface of the conductor can be exposed while maintaining the flatness of the insulating film, and the adhesiveness of the surface of the insulating film can be secured. Furthermore, since the conductor is polished with the conductor surface slightly exposed to make the conductor height uniform, the polishing process is very simple and takes a short time. In addition, if the above manufacturing method is performed on both front and back surfaces of the base substrate at the same time, not only the warp of the base substrate can be reduced but also the number of steps and the lead time can be shortened.

According to the method for manufacturing a multilayer wiring board as described above, when a double-sided printed wiring board is used as the base board, resin is used to fill the through-plated through holes connecting the wirings on both the front and back surfaces with each other on the surface wirings. Since the insulating layer can be formed, the gap in the through-plated through hole of the double-sided printed wiring board of the base does not affect the formation of the upper thin film wiring layer. Further, according to the manufacturing method of the present invention, the connection between the thin-film multilayer wiring layer and the inner conductor layer of the base substrate, or the connection of both surfaces of the base substrate, through-plated through holes for the connection of each conductor layer, Since it is not necessary to form after lamination, the wiring density of the thin film multilayer wiring layer can be maximized.

Further, according to the present invention, since the via conductor has a columnar shape, the surface area occupied by the via conductor including the land is smaller than that of the conformal via. Therefore,
Since high-density wiring is possible, it is possible to form a high-density multilayer wiring board that has never been seen before in the area of the printed wiring board. In addition, since the upper portion of the via conductor is flat, there is an advantage that a columnar via conductor can be further formed on the upper surface of the via conductor. Therefore, according to the present invention, it is possible to connect the thin-film multilayer wiring layers separated by one layer without using two via conductors.
It is made of via conductors on the same line, and the wiring area is not lost. Moreover, a thermal via can also be formed by this.

Quantitatively calculating this effect, in a normal printed wiring board having interlayer connection with through through holes or interstitial via holes, the grid pitch is 1.2.
If the wiring density (considering the number of grids and the wiring length) is 7 when the wiring density is 7 mm and two wirings can be formed between the grids, the thin-film multilayer wiring formed by the method for manufacturing a multilayer wiring board according to the present invention. Since at least three wirings can be formed in the layer with a grid pitch of 0.635 mm, the relative wiring density is about 3 or more. This is a calculation that can reduce the number of signal layers of a normal printed wiring board to 1/3 or less if the areas are the same, and conversely if the number of signal layers is the same, the area can be reduced to 1/3 or less. Effect of cost reduction and cost reduction. On the other hand, in the build-up method, the relative wiring density is about 2. Further, if the through-plated through holes are formed in the final stage of manufacturing, the wiring for that area will be lost.

[0093]

Embodiments of the present invention will be described below with reference to the drawings. Note that the present invention is not limited to these examples.

Example 1 A. Fabrication of Base Substrate In this example, a printed wiring board was used as the base substrate to fabricate the multilayer wiring board shown in FIG. This board is a multi-layer wiring board having two surface layer conductors of a double-sided printed wiring board as two kinds of power supply layers and two XY signal layers and one ground / cap layer on both sides. A four-layer plate having two XY signal layers as the inner layer may be used, and the layer structure and the number of layers are not particularly limited. Further, a thin film multilayer wiring layer may be formed on one surface of the double-sided printed wiring board.

In this example, first, a double-sided copper-clad glass epoxy printed wiring board having an interlayer connection through hole, surface wiring, and via conductor having the structure shown in FIG. 2A was manufactured. That is, first, a dry film resist (thickness of 50 μm) is laminated on the surface of a double-sided copper-clad glass epoxy printed wiring board having a through-plated through hole, and a punching pattern is formed at a desired position. And
A via conductor is filled in the resist removal pattern by electrolytic copper plating using an aqueous solution of copper sulfate, and the resist is peeled off.
Next, an electrodeposition resist is formed on the formed via conductor surface, the copper foil surface of the printed circuit board, or the plating surface of the through-hole, and a pattern is formed at a desired position. And
The copper foil of the printed circuit board was patterned into a desired shape using a cupric chloride etchant so as to leave the via conductor, and the resist was peeled off.

In this example, a thin-film wiring layer was formed on the surface of the printed wiring board manufactured as described above in the same manner as in FIGS. 1B to 1H to manufacture a multilayer wiring board.
However, in FIG. 1, the insulating layer and the thin film wiring layer are formed only on one surface of the base substrate, but in this example, the insulating layer and the thin film wiring layer were laminated on both front and back surfaces of the base substrate.

B. Preparation of Solvent-Free Composition First, 75 parts by volume of a filler made of silica (“FB-3S” manufactured by Denki Kagaku Kogyo Co., Ltd .: weight average particle diameter 2.4 μm) and an epoxy resin (produced by Yuka Shell Epoxy Co., Ltd.) "YX
-4000H ") and 16 parts by volume of phenolic resin (Dainippon Ink and Chemicals, Inc." Barcam TD-213 ").
1 ") 9 parts by volume are kneaded using a batch-type kneading device at a kneading start temperature of 75 ° C., a blade rotation speed of 50 rpm, and a kneading time of 7 minutes to obtain a composition containing a high concentration of filler (high Concentration composition) was prepared.

Then, to 67 parts by volume of this high-concentration composition,
21 parts by volume of the epoxy resin and 12 of the phenol resin
After adding a volume part and kneading for 5 minutes at a starting temperature of 50 ° C. and a rotation speed of 50 rpm using the Labo Plastomill, and cooling to 50 ° C., a curing catalyst (imidazole type, “2PHZ” manufactured by Shikoku Chemicals Co., Ltd.) ) Was added to 100 parts by weight of the epoxy resin and kneaded for 5 minutes to prepare a solvent-free silica filler-containing epoxy resin composition (solvent-free composition).

In this dilution step, another batch type kneading device may be used, or a different type of kneading device such as an extruder or a planetary mixer may be used. A schematic cross-sectional view seen from the front of the batch-type kneading apparatus used in this example,
It is shown in FIG. Further, a sectional view taken along the line AA ′ of FIG. 9A is shown in FIG. 9B, and a sectional view taken along the line BB ′ of FIG. 9A is shown in FIG. 9C.

The kneading apparatus used in this example is shown in FIG.
As shown in FIG. 11, a housing 90 having two cylindrical kneading chambers 91, a triangular prism-shaped blade 92 for kneading the substances in the kneading chambers 91, and a floating weight for closing the kneading object inlet. 93 and a heater (not shown) for heating the housing 90. Two kneading chambers 91
Are communicated with each other through a flow channel 95, and a kneading target charging port is provided at an upper portion of the flow channel 95. The floating weight 93 is vertically movably mounted on the kneading object feeding port. When the floating weight 93 is in the lowest position, the kneading object feeding port is closed, and in the most raised state, the kneading object feeding port is open. Therefore, it becomes possible to add the material to be kneaded. Each of the two blades is provided with a shaft 94 connected to a motor (not shown), and as the shaft 94 rotates, the two blades rotate in opposite directions, so that the kneading chamber 9
The material to be kneaded in 1 is kneaded.

As such a device, for example,
There is a "Labo Plastomill" manufactured by Toyo Seiki Seisakusho. In addition to this, as a closed type device with better mass productivity
Kobe Steel "MIXTRON BB" and "MIX
TRON KD ”and the open type include a general three-roll type kneading device.

C. The multilayer wiring Preparation of substrate (1) composition supply step the solventless composition, in an atmosphere of 10 torr, applying a pneumatic pressure 4.5 kgf / cm ² from the compression pressure 5 kgf / cm ² and lateral vertical At the same time, at 70 ° C., a Teflon sheet was used as a release film, and melt-fixed to both of the two surfaces of the mold 104 having upper and lower surfaces facing Teflon facing the substrate.
I got 03. Here, the up-down direction means the direction of the normals to the front and back surfaces of the film, and the lateral direction means the direction horizontal to the front and back surfaces of the film. In this embodiment, as described above, the mold 1
04 After applying the solventless composition to the surface, the mold 104
And the base substrate 100, the solventless composition film 103
The solventless composition 103 was supplied by assembling the mold 104 with the wiring 101 and the wiring 101 and 102 facing each other.

(2) Exhaust process and filling process Next, the gap 105 between the mold 100 and the substrate 100 is 10 t.
The air is exhausted from the intake / exhaust port 106 so as to become orr, and the mold 1
04 heating started. When the mold temperature reaches 50 ° C., the gap 105 between the mold 104 and the substrate 100 is returned to atmospheric pressure, and at the same time, the vertical compression pressure is 5 kgf / cm ² and the lateral air pressure is 4.5 kgf / cm ² . Is applied,
The solventless composition 103 was filled in the gap between the conductors 101 and 102 and the through-plated through holes (not shown in FIG. 1). The temperature at which the pressure in the vertical direction and the pressure in the horizontal direction are applied at the same time when the gap 105 is returned to the atmospheric pressure is hereinafter referred to as the hydrostatic pressure application temperature.

(3) Pressure-Curing Step The mold 104 is heated while maintaining the hydrostatic pressure, and when the mold temperature reaches 160 ° C., the state is maintained as it is for 30 minutes.
Hold for minutes to allow composition 103 to cure. As a result, a cured film 107 that was flat and had uniform physical properties without voids or pinholes was obtained.

(4) Exposing Step On the upper surface of the via conductor 102 of the substrate thus manufactured, there were places where the conductor was exposed and places where the conductor was not exposed. Therefore, the substrate 100 is further heated at 180 ° C. for 1 hour, and then an etching composition liquid (80 mol) containing potassium permanganate (0.3 mol / l) and sodium hydroxide (2 mol / l) is used.
C.) for 45 minutes to etch back the insulating layer to expose the via conductor covered with the insulating layer, and buff the upper surface of the exposed via conductor with # 240 at a rotation speed of 2000 rpm to remove the via conductor. The conductor height was made uniform, the top surface was cleaned, and the insulating layer surface was roughened.

(5) Wiring Layer Forming Step Next, on the substrate 100 having the insulating layer 107 formed thereon,
A thin film wiring layer was formed. First, after forming an underlying conductive film of about 0.5 μm on the surface of the insulating layer 107 of the substrate 100 by an electroless copper plating method, a first dry film resist film is formed to obtain a desired horizontal wiring conductor. A blank pattern was formed. Next, a planar wiring conductor 108 having the same height as the film thickness of the first resist was formed on the exposed portion of the underlying conductive film by using the electrolytic copper plating method.

Next, a second dry film resist film is formed on the surfaces of the first resist film and the plane wiring conductor 108, a desired punching pattern for a vertical via conductor is formed, and an electrolytic copper plating method is used. Then, a vertical via conductor 109 having the same height as the second resist film thickness was formed on the exposed portion of the planar wiring conductor 108. Then, the plane wiring conductor 108
The first and second resist films used for forming the vertical via conductors 109 were peeled off, and the underlying conductive film was removed by etching with a cupric chloride etchant. As described above, a thin film wiring layer including the planar wiring conductor 108 and the vertical via conductor 109 was obtained.

(6) Lamination of Thin Film Wiring Layer The surface of the thin film wiring layer obtained as described above is further subjected to the same treatments as in (1) to (5) above, and then (1) to
The same treatment as in (4) is performed, and finally, the uppermost plane wiring conductor is treated in the same manner as in (5) above (the materials and processes used are essentially the same. And not only two layers of vertical via conductors, but only one layer of planar wiring conductors.). As a result, a thick film / thin film composite multilayer wiring board having the structure shown in FIG. 4 was obtained. The minimum conductor width of the planar wiring conductor is 50 μm, the minimum pitch is 100 μm, the conductor height is 35 μm in the innermost layer, and the other is 25 μm, the vertical via conductor is 50 μmφ, and the wiring height is 50 μm.

The filler was uniformly dispersed in the insulating layer of the obtained multilayer wiring board, and no aggregate of filler having a particle size of 50 μm or more was found. Therefore, the obtained multilayer wiring board had good adhesiveness between the insulating layer and the conductor layer, and no disconnection or short circuit of the wiring was observed.

Example 2 In this example, a multilayer wiring board having eight wiring layers similar to that shown in FIG. 4 was prepared in the same manner as in Example 1. However, in this embodiment,
"E" made by Dainippon Ink and Chemicals, Inc. as an epoxy resin
XA-4700 "was used," Tamanor 758 "manufactured by Arakawa Chemical Industry Co., Ltd. was used as a phenol resin, and a curing catalyst was not used. Also, as a filler made of silica, "Admafine SO-E2" manufactured by Admatechs Co., Ltd.
(Weight average particle size 0.6 μm), the kneading start temperature at the time of preparing the high-concentration composition was 100 ° C., the starting temperature of the dilution step was 70 ° C., and the hydrostatic pressure application temperature was 70 ° C. Also,
In the pressure curing step (3), the mold 104 is heated while maintaining the hydrostatic pressure, and when the mold temperature reaches 200 ° C., the state is maintained for 30 minutes and then the hydrostatic pressure is released. Then, the temperature was further raised, and when it reached 220 ° C., the state as it was was maintained for 1 hour to cure the composition 103. Also in this example, a good substrate similar to that in Example 1 was obtained.

Example 3 Eight wiring layers were formed in the same manner as in Example 1 except that in the exposing step, the insulating layer was etched back by O ₂ plasma ashing instead of being etched back using the etching composition liquid. A multi-layer wiring board having The conditions for the O ₂ plasma ashing system are
O ₂ flow rate: 5 SCCM, O ₂ partial pressure: 2.7 Pa, incident power: 100 W, processing time: 15 minutes. Also in this example, a good substrate similar to that in Example 1 was obtained.

Example 4 In this example, a multilayer wiring board having eight wiring layers was prepared in the same manner as in Example 1. However, in this example, a filler made of polyimide (“UPILEX UIP-R” manufactured by Ube Industries, Ltd .: weight average particle diameter 8.9 μm) was used as the filler, and the kneading start temperature of the high-concentration composition was 100 ° C. And the kneading start temperature in the dilution step was 70 ° C. The temperature at which the solventless composition was melted and fixed to the mold 104 was 90 ° C, and the hydrostatic pressure application temperature was 80 ° C. Further, the time of immersion in the potassium permanganate-sodium hydroxide-based etching composition liquid was set to 20 minutes. Also in this embodiment, the first embodiment
A good substrate similar to the above was obtained.

Example 5 A multilayer wiring board was produced in the same manner as in Example 1 except that the solventless composition prepared as follows was used. A good substrate was obtained. The raw materials (filler, resin and curing catalyst) of the solventless composition are the same as in Example 1. A method for preparing a solventless composition in this example,
This will be described below.

First, 75 parts by volume of a filler made of silica and 25 parts by volume of a phenol resin were used in a "Laboplast mill" at a kneading start temperature of 70 ° C. and a blade rotation number of 5
A high-concentration composition was prepared by kneading at 0 rpm for 7 minutes. Next, 32 parts by volume of the epoxy resin was added to 68 parts by volume of the high-concentration composition, and the above "Labo Plastomill" was used to perform 5
After kneading for 10 minutes and cooling to 50 ° C., 1.5 wt% of an imidazole-based curing catalyst is added to 100 parts by weight of an epoxy resin, and kneading for another 5 minutes, which is used for forming an insulating layer. Got

[Embodiment 6] In the exposure process, after etching back, the exposed upper surface of the via conductor is lapped instead of being buffed, in the same manner as in Embodiment 1,
A multilayer wiring board having eight wiring layers was produced. The obtained substrate was good as in Example 1. In the lapping process of this example, cast iron was used as the lap, # 240 silicon carbide was used as the abrasive grains, and water was used as the lap liquid. The lap pressure was 150 g / cm ² , and the substrate / lap relative speed was 30 mm / min. By lapping the insulating layer and the via conductor, the height of the via conductor was made uniform, the upper surface was cleaned, and the surface of the insulating layer was roughened at once.

Example 7 In this example, an antioxidant (“Sumilyzer BHT”) was used when preparing a high-concentration composition.
(Manufactured by Sumitomo Chemical Co., Ltd.) and a lubricant (calcium stearate (manufactured by NOF CORPORATION)) in an amount of 1% by weight based on the total amount of the epoxy resin and the phenol resin, respectively.
A multilayer wiring board having eight wiring layers was produced in the same manner as in Example 1 except that the wiring layers were added one by one. The obtained substrate is
It was good as in Example 1.

Example 8 In this example, an antioxidant (“Sumilyzer BHT”) was used when preparing a high-concentration composition.
And 8 layers in the same manner as in Example 1 except that "Sumilyzer TPL" (both manufactured by Sumitomo Chemical Co., Ltd.) and a lubricant ("Polyethylene wax" (manufactured by Nippon Oil Co., Ltd.)) were added. A multilayer wiring board having a wiring layer was produced. The obtained substrate was good as in Example 1.
The amount of each antioxidant added was 0.5 wt% with respect to the total amount of the epoxy resin and the phenol resin. The amount of the lubricant added was 0.5% by weight based on the total amount of the epoxy resin and the phenol resin.

Example 9 In this example, a multilayer wiring board having eight wiring layers was prepared in the same manner as in Example 5. However, in this example, when preparing a high-concentration composition, 1% by weight of a curing catalyst (triphenylphosphine (KAI Co., Ltd.)) with respect to the phenol resin,
2% by weight of an antioxidant (“Sumilyzer BHT” (manufactured by Sumitomo Chemical Co., Ltd.)) was added to the phenol resin. In addition, in the dilution step, when diluting the high-concentration composition, a lubricant (calcium stearate (manufactured by NOF CORPORATION)) was added to the total amount of the epoxy resin and the phenol resin without adding a curing catalyst. 0.5 wt% was added. The obtained substrate was good as in Example 5.

Example 10 A solventless composition prepared as follows was used, and the hydrostatic pressure application temperature was set to 7
After the temperature is set to 0 ° C. and the curing condition is kept under pressure at 160 ° C. for 30 minutes, the pressure is released and further heated to 180 ° C.
Other than forming a flame-retardant insulating layer for holding time,
A multilayer wiring board was produced in the same manner as in Example 1. Also in this example, a good substrate similar to that in Example 1 was obtained. The method for preparing the solventless composition in this example is described below.

First, 70 parts by volume of a filler made of silica (“FB-3S” manufactured by Denki Kagaku Kogyo KK) and a bromine-containing epoxy resin (“BREN-S” manufactured by Nippon Kayaku Co., Ltd.) 1
4.5 parts by volume, phenol resin (Dainippon Ink and Chemicals, Incorporated "Burkham TD-2131") 14.5% by volume, flame retardant auxiliary (antimony trioxide) 0.8 parts by volume, An antioxidant (“Sumilyzer BHT” (manufactured by Sumitomo Chemical Co., Ltd.)) 0.1 part by volume and a lubricant (calcium stearate (manufactured by NOF Corporation)) 0.1 part by volume were used as in Example 1. Using the same batch type closed type kneading device (“Labo Plastomill”), kneading was performed at a kneading start temperature of 70 ° C., a blade rotation speed of 50 rpm, and a kneading time of 7 minutes to prepare a high-concentration composition.

Next, 14 parts by volume of the epoxy resin and 14 parts by volume of the phenolic resin were added to 72 parts by volume of the high-concentration composition, and the starting temperature was 55 ° C. with a “Labo Plastomill”.
After kneading at a rotation speed of 50 rpm for 5 minutes and cooling to 55 ° C., a curing catalyst (imidazole type, “2PHZ” manufactured by Shikoku Chemicals Co., Ltd.) was added to the epoxy resin at 1.5% by weight.
The mixture was added and kneaded for a further 5 minutes to obtain a silica filler-containing epoxy resin composition (solvent-free composition).

Example 11 A multilayer wiring board was produced in the same manner as in Example 1 except that the solventless composition used was different. However, in this example, in the composition supplying step,
Instead of melting and fixing a film of the solventless composition 103 on the surface of the mold 104, a composition obtained by crushing the solventless composition into a weight average particle size of 100 μm is spread on the upper surface of the substrate and the lower mold to supply the composition. did. Moreover, the hydrostatic pressure application temperature is set to 12
0 ° C, vertical compression pressure of 30 kgf / cm
² and the air pressure from the lateral direction was 3.0 kgf / cm ² .
Further, the curing condition under pressure is 190 ° C. for 30 minutes, and in addition to this, heating is performed while releasing the pressure, and the temperature is set to 1 at 230 ° C.
The solventless composition was heated and cured by holding for a time. further,
In this example, the time of immersion in the etching composition liquid in the exposing step was set to 20 minutes. Also in this example, as in the case of Example 1, a good substrate was obtained. The method for preparing the solventless composition in this example is described below.

First, 60 parts by volume of a filler made of silica (“FB-3S” manufactured by Denki Kagaku Kogyo Co., Ltd.) and an epoxy resin (Epicoat 100 manufactured by Yuka Shell Epoxy Co., Ltd.) are used.
4 ") and 35 parts by volume of carboxylic acid anhydride (Dainippon Ink and Chemicals, Inc." Epiclon B-4400 ") 4.7.
0.2 parts by volume of an antioxidant (“Sumilyzer BHT” (manufactured by Sumitomo Chemical Co., Ltd.)) and 0.2 parts by volume of a lubricant (calcium stearate (manufactured by NOF Corporation)). Using the same batch type closed kneading apparatus as in Example 1,
A high-concentration composition was prepared by kneading at a kneading start temperature of 110 ° C., a blade rotation speed of 50 rpm, and a kneading time of 7 minutes.

Next, 29 parts by volume of the epoxy resin and 4 parts by volume of carboxylic acid anhydride were added to 67 parts by volume of the high-concentration composition, and the starting temperature was 90 ° C. and the rotation speed was 50 at the kneading device.
After kneading at rpm for 5 minutes and cooling to 90 ° C., a lubricant (calcium stearate) and an antioxidant (“Sumilyzer BHT”) were further added to the epoxy resin and the carboxylic anhydride in an amount of 0.5% by weight. Each of them was added and kneaded for 5 minutes to obtain a solventless composition used for forming an insulating layer.

Example 12 A multilayer wiring board was produced in the same manner as in Example 1 except that a solventless composition containing a bismaleimide triazine resin was used. However, in this example, the hydrostatic pressure application temperature was 60 ° C., the compression pressure in the vertical direction in the filling step was 5.5 kgf / cm ² , and the air pressure in the lateral direction was 4.5 kgf / cm ² . In addition, the curing condition under pressure in the pressure curing step is 120 ° C. 30
Minutes, then release the pressure and heat to 150
The temperature was maintained for 1 hour at 0 ° C. to cure the solventless composition. Further, the time of immersion in the etching composition liquid in the exposing step was set to 30 minutes. Also in this example, as in the case of Example 1, a good substrate was obtained. The method for preparing the solventless composition in this example is described below.

First, 75 parts by volume of silica filler (“FB-3S” manufactured by Denki Kagaku Kogyo KK) and bismaleimide triazine resin (“BT-330” manufactured by Mitsubishi Gas Chemical Co., Inc.).
9T ") 25 parts by volume using the same batch type closed type kneading device as in Example 1 and kneading at a kneading start temperature of 80 ° C., a blade rotation speed of 50 rpm, and a kneading time of 7 minutes to obtain a high concentration composition. Was prepared. Then, 33 parts by volume of the bismaleimide triazide resin was added to 67 parts by volume of the high-concentration composition, and the kneading device was used to start temperature 45 ° C. and rotation speed 50.
The mixture was kneaded at rpm for 10 minutes to obtain a solventless composition used for forming an insulating layer.

Example 13 A multilayer wiring board was produced in the same manner as in Example 1 except that a solventless composition containing a benzocyclobutene compound was used. However, in this embodiment,
The hydrostatic pressure application temperature was 30 ° C., the compression pressure in the vertical direction in the filling step was 5.0 kgf / cm ² , and the air pressure in the horizontal direction was 4.9 kgf / cm ² . In addition, the curing condition under pressure in the pressure curing step was 250 ° C. for 30 minutes, the pressure was released thereafter, and the temperature was kept at 250 ° C. for 1 hour to cure the solventless composition. Furthermore, the time of immersion in the etching composition liquid in the exposing step is set to 60.
Minutes. Also in this embodiment, as in the first embodiment,
A good substrate was obtained. The method for preparing the solventless composition in this example is described below.

First, 75 parts by volume of a filler made of silica (“FB-3S” manufactured by Denki Kagaku Kogyo KK) and 180 ° C.
24.9 parts by volume of cis-bisbenzocyclobutenyl ethene oligomerized by heating for 5 hours, and an antioxidant (“Sumilyzer TPL” (manufactured by Sumitomo Chemical Co., Ltd.)) 0.1
Using the same batch-type closed-type kneading device as in Example 1, kneading start temperature of 30 ° C. and blade rotation speed of 50 r
A high-concentration composition was prepared by kneading at pm for 7 minutes. Next, 33 parts by volume of the bisbenzocyclobutene-based oligomer was added to 67 parts by volume of the high-concentration composition, and the starting temperature was 30 ° C. and the rotation speed was 5 using the kneading device.
The mixture was kneaded at 0 rpm for 10 minutes to obtain a solventless composition used for forming an insulating layer.

Comparative Example 1 Using the same raw material as the solvent-free composition prepared in Example 1, silica filler, epoxy resin, and phenol resin were mixed at a kneading start temperature of 50 ° C. using a batch type closed kneading device. The mixture was kneaded at a blade rotation speed of 50 rpm for 20 minutes to prepare a solventless composition having the same composition ratio as in Example 1. When the melt viscosity of this composition was measured while increasing the temperature (5 ° C./min), it showed a minimum viscosity near 80 ° C. as shown in FIG.
The result was that the viscosity gradually increased up to about 60 ° C.). As shown in FIG. 10 (b), the composition prepared in Example 1 had a decrease in melt viscosity until curing started.

Using the solvent-free composition obtained as described above, an attempt was made to manufacture a multilayer wiring board having 8 wiring layers in the same manner as in Example 1. A non-dispersed portion of silica having a width of several millimeters was radially generated in the vicinity of the portion, and a wiring having sufficient adhesive strength could not be formed thereon.

[Comparative Example 2] Using the same raw material as the solvent-free composition prepared in Example 1, silica filler, epoxy resin, and phenol resin (composition ratio is the same as in Example 1).
30% by weight of N, N-dimethylformamide (DMF) with respect to the total amount thereof was added, and the mixture was kneaded using a three-roll (roll diameter 50 mm) at room temperature and 100 rpm for 10 minutes. The silica filler-containing epoxy resin composition was produced by removing under reduced pressure at 10 ° C. and 10 Torr. Using this composition, operating as in Example 1,
An attempt was made to produce a multilayer wiring board having eight wiring layers.
In the formed insulating layer, spotty silica undispersed parts and voids / pinholes derived from DMF remaining in the composition were generated, and wiring having sufficient adhesive strength could not be formed on them.

[0132]

According to the present invention, a solventless composition in which fine fillers are uniformly dispersed can be obtained. Further, by forming an insulating layer using this solvent-free composition, a multilayer wiring board having good adhesiveness between the insulating layer and the conductor layer and free from disconnection or short circuit of wiring can be obtained.

[Brief description of drawings]

FIG. 1 is a process chart showing an example of a method for manufacturing a multilayer wiring board according to the present invention.

FIG. 2 is a partial cross-sectional view showing a form example of a base substrate according to the present invention.

FIG. 3 is an explanatory diagram showing an example of a supply form of a fluid polymer precursor containing no filler and containing a solvent according to the present invention.

FIG. 4 is a sectional view showing an example of a multilayer printed wiring board according to the present invention.

FIG. 5 is a process drawing showing an example of a conventional method for manufacturing a multilayer wiring board.

FIG. 6 is a process chart showing an example of a conventional method for manufacturing a multilayer wiring board.

FIG. 7 is a partial cross-sectional view showing an example of a conventional multilayer printed wiring board.

FIG. 8 is a partial cross-sectional view showing an example of a conventional multilayer printed wiring board.

FIG. 9 is a cross-sectional view showing the structure of the batch-type kneading device used in Example 1.

FIG. 10 is a graph showing the melt viscosity behavior of a solventless composition.

[Explanation of symbols]

100 ... Base substrate, 101, 108 ... Planar wiring, 10
2, 109 ... Vertical via, 103 ... Solventless composition, 104
... Mold, 105 ... Gap between mold and base substrate, 106 ...
Air supply / exhaust port, 107 ... Insulating layer, 200 ... Through-plated through hole, 201 ... Surface conductor, 202 ... Via conductor, 203
... Planar wiring, 204 ... Vertical via conductors, 205 ... Printed wiring board, 206 ... Metal core wiring board, 207 ... Ceramic wiring board, 400 ... Printed wiring board, 401 ...
Interlayer connection through-hole conductor, 402 ... Via, 403 ...
Conductor pattern layer, 404 ... Interlayer insulating film layer, 405 ... Via conductor, 500 ... Substrate, 501 ... Base metal layer, 502 ... Resist, 503 ... Resist groove portion, 504 ... Conductor, 5
05 ... Insulating layer, 600 ... Substrate, 601 ... First conductive layer, 6
Reference numeral 02 ... Second conductive layer, 603 ... Epoxy resin or semi-cured polyimide, 604 ... Second conductive layer surface, 60
Reference numeral 5 ... Insulating film, 606 ... Third conductive layer, 701 ... Printed wiring board surface layer conductor, 702 ... Build-up conductor layer, 70
3 ... Conformal via, 704 ... Through-plated through hole, 800 ... Printed wiring board, 801, 802, 8
03, 804, 807 ... Conductor layer, 805a ... Through-plated through hole, 806 ... Cured product of solventless composition, 90 ... Casing, 91 ... Kneading chamber 91, 92 ... Blade 92, 93 ... Floating weight, 94 ... Shaft, 95 ... Channel 95.

Continuation of front page (51) Int.Cl. ⁶ Identification number Office reference number FI Technical indication location H05K 1/03 610 H05K 1/03 610S 3/46 3/46 T N B (72) Inventor Takashi Kashimura Kanagawa 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Hitachi, Ltd., Production Technology Research Institute (72) Inventor Toshiyuki Osawa, 292, Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd., Hitachi, Ltd., Production Technology Research Institute (72) Inventor Keii Masayuki, 292 Yoshida-cho, Totsuka-ku, Yokohama-shi, Kanagawa, Ltd., Hitachi, Ltd., Production Engineering Laboratory (72) Inventor, Satoru Hashimoto, 216 Totsuka-cho, Totsuka-ku, Yokohama, Kanagawa Prefecture, Hitachi, Ltd., Information & Communication Division

Claims (21)

[Claims] 1. A matrix component comprising 100 parts by volume and a filler 1 to 300 parts by volume, wherein the matrix component is at least one of a polymer compound and a polymer compound precursor, and the filler is an inorganic substance. At least one of powder, inorganic fiber, organic powder, and organic polymer fiber, which are dispersed in the matrix component in the form of particles and / or aggregates, and particles of the filler and / or Or the particle size of the aggregate is 5
A solventless composition having a size of less than 0 μm and containing no solvent. 2. The solventless composition according to claim 1, wherein the filler is an epoxy resin cured product having a biphenyl structure. 3. The solventless composition according to claim 1, wherein the weight average particle diameter of the filler is 10 μm or less. 4. The matrix component according to claim 1, wherein the matrix component is deformable in a first temperature range of room temperature or higher and has a property of being hardened at a second temperature higher than the first temperature range. And a solventless composition. 5. The solventless composition according to claim 4, wherein the matrix component is a biphenyl epoxy resin. 6. The method according to claim 1, wherein at least one auxiliary component selected from the group consisting of a plasticizer, a lubricant, an antioxidant, a flame retardant, a flame retardant aid, a filler, a curing catalyst, and a surface treatment agent is added. A solventless composition, further comprising: 7. A method for producing a solventless composition comprising a filler and a matrix component, wherein a part of the composition other than the filler in the composition of the solventless composition and a filler are mixed to form a high concentration composition. A high-concentration step of obtaining a product, a high-concentration composition, the rest of the above composition is further added and mixed, and a dilution step of preparing the above solvent-free composition is provided in this order. A method for producing a composition. 8. The matrix component according to claim 7, wherein the matrix component is at least one of a polymer compound and a polymer compound precursor, and is softened at the softening temperature and at a second temperature higher than the softening temperature. The filler has a property of curing, and the filler is at least one of inorganic powder, inorganic fiber, organic powder, and organic polymer fiber. A method for producing a solventless composition, characterized in that the solvent is maintained at a softening temperature. 9. The filler concentration of the high-concentration composition according to claim 7, which is 40 to 90% by volume.
The filler concentration of the solventless composition is 20 to 60% by volume.
And a method for producing a solventless composition. 10. The filler concentration of the high-concentration composition according to claim 9, which is 50 to 75% by volume.
The filler concentration of the solventless composition is 30 to 50% by volume.
And a method for producing a solventless composition. 11. The at least one auxiliary component selected from the group consisting of a plasticizer, a lubricant, an antioxidant, a flame retardant, a flame retardant aid, a filler, a curing catalyst and a surface treatment agent according to claim 7. A method for producing a solventless composition, which is further mixed in at least one of the high concentration step and the dilution step. 12. The method according to claim 7, wherein at least a part of the components mixed with the filler in the high concentration step and at least a part of the components added to the high concentration composition in the dilution step are the same compound. A method for producing a solventless composition, comprising: 13. The method for producing a solventless composition according to claim 7, wherein in the high-concentration step, the mixing is performed by a batch-type kneading device. 14. A multilayer wiring board having an insulating layer and a wiring layer, wherein the insulating layer comprises a cured product of a resin composition, and the resin composition comprises at least one of a polymer compound and a polymer compound precursor. And a filler composed of at least one of an inorganic powder, an inorganic fiber, an organic powder, and an organic polymer fiber dispersed in the matrix component, and does not contain a solvent. A multilayer wiring board in which particles and / or agglomerates of the filler having a particle diameter smaller than the smaller width and spacing of the wiring are dispersed in the insulating layer. 15. A multilayer wiring board having a base substrate having a through hole having a conductor layer on an inner wall thereof, and a first insulating layer formed on at least one of front and back surfaces of the base substrate. The portion other than the conductor layer inside is filled with a columnar member, the columnar member and the first insulating layer are made of a cured product of a resin composition, and the columnar member and the first insulating layer are formed. No interface is formed between and, and the resin composition has a matrix component composed of at least one of a polymer compound and a polymer compound precursor, an inorganic powder, an inorganic fiber, and an organic powder. And a filler made of at least one kind of fiber of an organic polymer, and the particle size of the filler particles and / or the aggregate is 5
A multilayer wiring board having a thickness of less than 0 μm and containing no solvent. 16. A base substrate having wiring formed on at least one of front and back surfaces, a mold having a flat surface, the wiring of the base substrate, and the flat surface of the mold. Are arranged so as to face each other with a gap interposed therebetween, a composition supply step of supplying a solventless composition to the gap, an exhaust step of exhausting gas present in the gap, the base substrate, and the mold. By narrowing the distance of, the gap is filled with the solventless composition, further,
A filling step of filling the solventless composition between the wirings, a pressure curing step of curing the solventless composition while applying hydrostatic pressure, and an exposing step of exposing at least a part of the surface of the wirings. The solventless composition comprises a matrix component comprising at least one of a polymer compound and a polymer compound precursor, an inorganic powder, an inorganic fiber, an organic powder, and an organic powder. A filler particle and / or an agglomerate comprising at least one kind of molecular fiber, wherein the particle diameter of the filler particle and / or the agglomerate is 5
A method for producing a multilayer wiring board, which is less than 0 μm and does not contain a solvent. 17. The multilayer wiring according to claim 16, further comprising a wiring forming step of forming wiring on at least a part of the insulating layer surface and the exposed wiring surface after the exposing step. Substrate manufacturing method. 18. The method for manufacturing a multilayer wiring board according to claim 17, wherein after the wiring forming step, the steps from the composition supplying step to the wiring forming step are repeated one or more times. 19. The matrix component according to claim 16, wherein the matrix component is deformable in a first temperature range equal to or higher than room temperature and has a property of hardening at a second temperature higher than the first temperature range, In the pressure-curing step, the solventless composition held in the first temperature range at which the viscosity of the solventless composition is the lowest is heated to the second temperature to obtain the solventless composition. A method for manufacturing a multilayer wiring board, comprising: 20. The base substrate according to claim 16, further comprising a through hole in which a via wiring is formed by a conductor attached to an inner wall of the base substrate, and the filling step includes forming a gap in the through hole.
A method for producing a multilayer wiring board, which comprises filling the above solventless composition. 21. The matrix component according to claim 16, wherein the matrix component is deformable in a first temperature range equal to or higher than room temperature and has a property of being cured at a second temperature higher than the first temperature range, The method for manufacturing a multilayer wiring board, wherein the filling step includes a step performed while holding the solventless composition in the first temperature range.