JP2003064268A - Resin composition, copper foil with resin and multilayer printed circuit board - Google Patents
Resin composition, copper foil with resin and multilayer printed circuit boardInfo
- Publication number
- JP2003064268A JP2003064268A JP2001253036A JP2001253036A JP2003064268A JP 2003064268 A JP2003064268 A JP 2003064268A JP 2001253036 A JP2001253036 A JP 2001253036A JP 2001253036 A JP2001253036 A JP 2001253036A JP 2003064268 A JP2003064268 A JP 2003064268A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- resin composition
- copper foil
- circuit board
- benzocyclobutene
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、樹脂組成物、樹脂
付き銅箔および多層プリント回路板に関する。TECHNICAL FIELD The present invention relates to a resin composition, a resin-coated copper foil and a multilayer printed circuit board.
【０００２】[0002]
【従来の技術】近年、ノート型パーソナルコンピュータ
ーや携帯電話等の携帯型電子機器は、より軽量かつ小型
化が求められている。そのため電子機器内部のＣＰＵや
ＬＳＩ等を実装するプリント回路板についても、小型軽
量化が自ずと求められる。小型軽量化を実現するために
は、絶縁樹脂層厚さやプリント配線幅及び配線間距離を
小さくすること、スルーホール径を小さくしスルーホー
ルのメッキ厚を薄くすることが必要である。ここで、メ
ッキ厚を薄くすると熱衝撃時にメッキ金属にクラックが
発生するおそれがあり、絶縁樹脂に耐熱性や耐クラック
性が要求される。また同時にこれらの情報処理用機器の
高速化も要求されており、ＣＰＵの高クロック周波数化
が進んでいる。このため信号伝搬速度の高速化が要求さ
れており、これを実現するために低誘電率、低誘電正接
のプリント回路板が必要とされる。2. Description of the Related Art In recent years, portable electronic devices such as notebook personal computers and mobile phones are required to be lighter and more compact. Therefore, a printed circuit board on which a CPU, an LSI, or the like inside an electronic device is mounted is naturally required to be small and lightweight. In order to realize the reduction in size and weight, it is necessary to reduce the thickness of the insulating resin layer, the width of the printed wiring and the distance between the wirings, and to reduce the diameter of the through hole and thin the through hole. Here, if the plating thickness is reduced, cracks may occur in the plated metal during thermal shock, and the insulating resin is required to have heat resistance and crack resistance. At the same time, there is a demand for higher speeds of these information processing devices, and the CPU clock frequency is increasing. Therefore, it is required to increase the signal propagation speed, and in order to realize this, a printed circuit board having a low dielectric constant and a low dielectric loss tangent is required.
【０００３】耐熱性に優れ、誘電特性に優れた樹脂とし
て、ベンゾシクロブテン樹脂が用いられる（例えば特開
２０００−２１８７２号公報）。ベンゾシクロブテン樹
脂は硬化反応により水酸基等の分極率の大きな官能基が
生じないため、誘電特性が非常に優れている。A benzocyclobutene resin is used as a resin having excellent heat resistance and excellent dielectric properties (for example, Japanese Patent Laid-Open No. 2000-21872). A benzocyclobutene resin does not generate a functional group having a large polarizability such as a hydroxyl group due to a curing reaction, and therefore has excellent dielectric properties.
【０００４】しかし、ベンゾシクロブテン樹脂はその骨
格構造により機械的特性において脆く、ベンゾシクロブ
テン樹脂を樹脂付き銅箔に用いた場合には、冷熱衝撃に
おける耐クラック性に問題が生じる。However, the benzocyclobutene resin is fragile in mechanical properties due to its skeletal structure, and when the benzocyclobutene resin is used for a resin-coated copper foil, there is a problem in the crack resistance against cold shock.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的は、誘電
特性、耐クラック性に優れた樹脂組成物、樹脂付き銅箔
およびプリント配線板を提供することである。SUMMARY OF THE INVENTION An object of the present invention is to provide a resin composition excellent in dielectric properties and crack resistance, a copper foil with resin and a printed wiring board.
【０００６】[0006]
【課題を解決するための手段】このような目的は、下記
（１）〜（７）の本発明により達成できる。
（１）ベンゾシクロブテン樹脂及び比誘電率２０以下の
無機充填材を必須成分とすることを特徴とする樹脂組成
物。
（２）前記ベンゾシクロブテン樹脂は、下記式で示され
るものである上記（１）に記載の樹脂組成物。These objects can be achieved by the present invention described in (1) to (7) below. (1) A resin composition comprising a benzocyclobutene resin and an inorganic filler having a relative dielectric constant of 20 or less as essential components. (2) The resin composition according to (1), wherein the benzocyclobutene resin is represented by the following formula.
【化２】
（３）前記ベンゾシクロブテン樹脂の含有量は、樹脂組
成物全体の４０〜９５重量％である上記（１）または
（２）に記載の樹脂組成物。
（４）前記無機充填材は、硫酸バリウム、アルミナ、シ
リカの群から選ばれる少なくとも１種以上である上記
（１）ないし（３）のいずれかに記載の樹脂組成物。
（５）前記無機充填材の含有量は、樹脂組成物全体の５
〜６０重量％である上記（１）ないし（４）のいずれか
に記載の樹脂組成物。
（６）上記（１）ないし（５）のいずれかに記載の樹脂
組成物を銅箔に塗工してなる樹脂付き銅箔。
（７）上記（６）に記載の樹脂付き銅箔を内層回路板の
片面又は両面に重ね合わせて加熱、加圧してなる多層プ
リント回路板。[Chemical 2] (3) The resin composition according to (1) or (2) above, wherein the content of the benzocyclobutene resin is 40 to 95% by weight of the entire resin composition. (4) The resin composition according to any one of (1) to (3) above, wherein the inorganic filler is at least one selected from the group consisting of barium sulfate, alumina and silica. (5) The content of the inorganic filler is 5 in the total resin composition.
The resin composition according to any one of (1) to (4) above, which is -60% by weight. (6) A resin-coated copper foil obtained by applying the resin composition according to any one of (1) to (5) to a copper foil. (7) A multilayer printed circuit board obtained by stacking the resin-coated copper foil according to (6) on one side or both sides of an inner layer circuit board and heating and pressing the same.
【０００７】[0007]
【発明の実施の形態】以下、本発明の樹脂組成物、樹脂
付き銅箔および多層プリント回路板について詳細に説明
する。本発明の樹脂組成物は、ベンゾシクロブテン樹脂
および比誘電率２０以下の無機充填材を必須成分とする
ことを特徴とする樹脂組成物である。本発明の樹脂付き
銅箔は、上記樹脂組成物を金属箔に塗工してなる樹脂付
き銅箔である。本発明の多層プリント回路板は、上記樹
脂付き銅箔を内層回路板の片面又は両面に重ね合わせて
加熱、加圧してなる多層プリント回路板である。BEST MODE FOR CARRYING OUT THE INVENTION The resin composition, resin-coated copper foil and multilayer printed circuit board of the present invention will be described in detail below. The resin composition of the present invention is a resin composition comprising a benzocyclobutene resin and an inorganic filler having a relative dielectric constant of 20 or less as essential components. The resin-coated copper foil of the present invention is a resin-coated copper foil obtained by applying the resin composition to a metal foil. The multilayer printed circuit board of the present invention is a multilayer printed circuit board obtained by stacking the above resin-coated copper foil on one side or both sides of an inner layer circuit board and heating and pressing.
【０００８】以下、樹脂組成物について説明する。本発
明の樹脂組成物は、ベンゾシクロブテン樹脂および比誘
電率２０以下の無機充填材を必須成分とするものであ
る。これにより、ベンゾシクロブテン樹脂の骨格構造に
よる脆さを克服し、冷熱衝撃による耐クラック性の機能
を付与ことができる。本発明で使用されるベンゾシクロ
ブテン樹脂は、特に限定されるものではなく、シクロブ
テン骨格を含む樹脂であればよい。これらの中でも下記
式で表せられるベンゾシクロブテン樹脂を含むこと好ま
しい。これにより、ガラス転移温度が高くでき、硬化後
の樹脂特性を向上することができる。The resin composition will be described below. The resin composition of the present invention contains a benzocyclobutene resin and an inorganic filler having a relative dielectric constant of 20 or less as essential components. This makes it possible to overcome the brittleness due to the skeleton structure of the benzocyclobutene resin and to impart the function of crack resistance due to thermal shock. The benzocyclobutene resin used in the present invention is not particularly limited as long as it is a resin containing a cyclobutene skeleton. Among these, it is preferable to include a benzocyclobutene resin represented by the following formula. Thereby, the glass transition temperature can be increased and the resin characteristics after curing can be improved.
【化３】
ベンゾシクロブテン樹脂は硬化反応によって水酸基など
の分極率の大きな官能基が生じないため、誘電特性が非
常に優れており、かつ低吸水率である。また、剛直な化
学構造を有するため耐熱性に優れている。また、前記ベ
ンゾシクロブテン樹脂をＢステージ化したものも成形
性、流動性を調整するために好ましく使用され、本発明
に含まれるものである。Ｂステージ化は加熱溶融して行
われる。Ｂステージ化したベンゾシクロブテン樹脂の数
平均分子量は、通常３，０００〜１，０００，０００で
ある。数平均分子量は、例えばＧＰＣを用いて測定する
ことができる。[Chemical 3] The benzocyclobutene resin does not generate a functional group having a large polarizability such as a hydroxyl group due to the curing reaction, and therefore has excellent dielectric properties and low water absorption. Moreover, it has excellent heat resistance because it has a rigid chemical structure. In addition, those obtained by converting the benzocyclobutene resin into B-stage are also preferably used for adjusting moldability and fluidity, and are included in the present invention. B stage conversion is performed by heating and melting. The number average molecular weight of the B-staged benzocyclobutene resin is usually 3,000 to 1,000,000. The number average molecular weight can be measured using GPC, for example.
【０００９】ベンゾシクロブテン樹脂の含有量は、特に
限定されないが、樹脂組成物全体の４０〜９５重量％が
好ましく、特に５０〜９０重量％が好ましい。含有量が
前記下限値未満では比誘電率、誘電正接等の誘電特性が
向上する効果が不十分な場合があり、前記上限値を越え
ると樹脂流れ（フロー）が低下する場合がある。ベンゾ
シクロブテン樹脂と併用する樹脂としては、例えばポリ
ブタジエンゴム、スチレン−ブタジエンゴム、アクリロ
ニトリル−ブタジエン共重合体、アクリロニトリル−ブ
タジエン−スチレン共重合体等が挙げられ、これらを併
用することにより熱衝撃時における絶縁樹脂の耐クラッ
ク性等の特性が向上する。The content of the benzocyclobutene resin is not particularly limited, but is preferably 40 to 95% by weight, and particularly preferably 50 to 90% by weight based on the total resin composition. If the content is less than the lower limit, the effect of improving the dielectric properties such as relative dielectric constant and dielectric loss tangent may be insufficient, and if the content exceeds the upper limit, the resin flow may decrease. Examples of the resin used in combination with the benzocyclobutene resin include polybutadiene rubber, styrene-butadiene rubber, acrylonitrile-butadiene copolymer, acrylonitrile-butadiene-styrene copolymer and the like. Properties such as crack resistance of the insulating resin are improved.
【００１０】本発明では、比誘電率２０以下の無機充填
材を用いるものである。これにより、本発明の樹脂組成
物を多層プリント回路板にした場合、誘電特性を低下す
ることなく、耐クラック性を向上することができる。ま
た、比誘電率２０以下の無機充填材と前述したベンゾシ
クロブテン樹脂との組合せにより、誘電率を低下するこ
となく、耐クラック性を向上することができる。また、
無機充填材の比誘電率が２０を超えると、誘電率や誘電
正接が大きくなるなど、樹脂組成物の誘電特性が低下す
る。また、比誘電率は、特に限定されないが、１０以下
が好ましく、特に１〜８が好ましい。これにより、誘電
率が大きくなるのを特に抑えることができる。このよう
な無機充填材としては、例えばアルミナ等のアルミニウ
ム化合物、シリカ、マグネシア、ベリリア等の金属酸化
物、硫酸バリウムが挙げられる。これらの中でも硫酸バ
リウム、アルミナ、シリカの群から選ばれる少なくとも
１種以上が好ましい。これにより、ベンゾシクロブテン
樹脂の低誘電率、低誘電正接という特長を保持すること
ができる。In the present invention, an inorganic filler having a relative dielectric constant of 20 or less is used. Thereby, when the resin composition of the present invention is used for a multilayer printed circuit board, crack resistance can be improved without lowering the dielectric properties. Further, by combining the inorganic filler having a relative dielectric constant of 20 or less with the above-mentioned benzocyclobutene resin, crack resistance can be improved without lowering the dielectric constant. Also,
When the relative dielectric constant of the inorganic filler exceeds 20, the dielectric property of the resin composition deteriorates, such as the dielectric constant and dielectric loss tangent becoming large. The relative dielectric constant is not particularly limited, but is preferably 10 or less, and particularly preferably 1 to 8. This makes it possible to prevent the dielectric constant from increasing. Examples of such an inorganic filler include aluminum compounds such as alumina, metal oxides such as silica, magnesia and beryllia, and barium sulfate. Among these, at least one selected from the group consisting of barium sulfate, alumina and silica is preferable. As a result, the characteristics of the benzocyclobutene resin such as low dielectric constant and low dielectric loss tangent can be maintained.
【００１１】また、前記無機充填材は、焼結後に０．１
〜１０μｍに粉砕したものであることが好ましい。これ
により、耐クラック性を更に向上することができる。前
記無機充填材の含有量は、特に限定されないが、樹脂組
成物全体の５〜６０重量％が好ましく、特に１０〜５０
重量％が好ましい。無機充填材の含有量が前記下限値未
満では、耐クラック性の向上効果が低下する場合があ
り、前記上限値を越えるとピール強度が低下する場合が
ある。The inorganic filler is 0.1% after sintering.
It is preferably ground to 10 μm. Thereby, the crack resistance can be further improved. The content of the inorganic filler is not particularly limited, but is preferably 5 to 60% by weight of the entire resin composition, and particularly 10 to 50%.
Weight percent is preferred. If the content of the inorganic filler is less than the lower limit, the effect of improving crack resistance may be reduced, and if it exceeds the upper limit, the peel strength may be reduced.
【００１２】本発明の絶縁樹脂組成物は、上述したベン
ゾシクロブテン樹脂を含むが、本発明の目的に反しない
範囲において、その他の樹脂、硬化促進剤、カップリン
グ剤、難燃剤、その他の成分を添加することができる。The insulating resin composition of the present invention contains the above-mentioned benzocyclobutene resin, but other resins, curing accelerators, coupling agents, flame retardants, and other components within the range not deviating from the object of the present invention. Can be added.
【００１３】次に、本発明の樹脂付き銅箔について説明
する。本発明の樹脂付き銅箔は、上記樹脂組成物を銅箔
に塗工して得られるものである。樹脂組成物を銅箔に塗
工する際には、通常ワニスの形態で行われる。これによ
り、塗工性を向上することができる。ワニスを調製する
のに用いられる溶媒は、組成に対して良好な溶解性を示
すことが望ましいが、悪影響を及ばさない範囲で貧溶媒
を使用しても構わない。良溶媒としては、トルエン、キ
シレン、メシチレン、シクロヘキサノン等が挙げられ
る。また、ワニスを調製する場合、樹脂組成物の固形分
は、特に限定されないが２０〜９０重量％が好ましく、
特に３０〜７０重量％が好ましい。Next, the resin-coated copper foil of the present invention will be described. The resin-coated copper foil of the present invention is obtained by applying the resin composition to a copper foil. When the resin composition is applied to the copper foil, it is usually performed in the form of varnish. Thereby, the coatability can be improved. The solvent used for preparing the varnish preferably has good solubility in the composition, but a poor solvent may be used as long as it does not adversely affect the composition. Examples of the good solvent include toluene, xylene, mesitylene, cyclohexanone and the like. When preparing a varnish, the solid content of the resin composition is not particularly limited, but is preferably 20 to 90% by weight,
In particular, 30 to 70% by weight is preferable.
【００１４】また、前述のワニスを、銅箔に塗工し８０
℃以上２００℃以下で乾燥することにより樹脂付き銅箔
を得ることが出来る。塗工、乾燥後の樹脂厚さは１０〜
１００μｍが好ましく、特に２０〜８０μｍが樹脂層の
割れ発生が無く裁断時の粉落ちも少ないなどの点で好ま
しい。Further, the above-mentioned varnish is coated on a copper foil to make 80
A resin-coated copper foil can be obtained by drying at not less than 200 ° C and not more than 200 ° C. Resin thickness after coating and drying is 10
100 μm is preferable, and particularly 20 to 80 μm is preferable in that the resin layer does not crack and the powder is less likely to drop during cutting.
【００１５】次に、本発明の多層プリント回路板につい
て説明する。本発明の多層プリント回路板は、前述の樹
脂付き銅箔を内層回路板の片面又は両面に重ね合わせて
加熱、加圧して積層板を得る。加熱する温度は、特に限
定されないが、１４０〜２４０℃が好ましい。加圧する
圧力は、特に限定されないが、１０〜４０ｋｇ／ｃｍ2
が好ましい。また、内層回路板は、例えば銅張積層版の
両面に回路を形成し、黒化処理したものを挙げることが
できる。Next, the multilayer printed circuit board of the present invention will be described. The multilayer printed circuit board of the present invention is obtained by stacking the above-mentioned resin-coated copper foil on one side or both sides of the inner layer circuit board and heating and pressing to obtain a laminated board. The heating temperature is not particularly limited, but 140 to 240 ° C. is preferable. The pressure to be applied is not particularly limited, but is 10 to 40 kg / cm 2
Is preferred. Further, the inner layer circuit board may be, for example, one in which circuits are formed on both surfaces of a copper clad laminate and blackened.
【００１６】[0016]
【実施例】以下、本発明を実施例及び比較例により説明
するが、本発明はこれに限定されるものではない。EXAMPLES The present invention will be described below with reference to examples and comparative examples, but the present invention is not limited thereto.
【００１７】（実施例１）
ワニスの調製
ベンゾシクロブテン樹脂として、ジビニルシロキサン−
ビスベンゾシクロブテン（Ｂステージ化したもの。数平
均分子量１４００００、ダウケミカル社製サイクロテン
ＸＵＲ）８０重量部、絶縁性無機充填材として、シリカ
（（株）アドマテックス社製 ＳＯ−２５Ｈ）２０重量
部をメシチレンに溶解し、不揮発分濃度５０重量％に調
整してワニスを得た。(Example 1) Preparation of varnish As a benzocyclobutene resin, divinylsiloxane-
Bisbenzocyclobutene (B-staged, number average molecular weight 140,000, Cycloten XUR manufactured by Dow Chemical Co., Ltd.) 80 parts by weight, silica as an insulating inorganic filler (SO-25H manufactured by Admatex Co., Ltd.) 20 parts by weight A part was dissolved in mesitylene and adjusted to a nonvolatile concentration of 50% by weight to obtain a varnish.
【００１８】銅箔への塗工
銅箔（厚さ０．０１８ｍｍ、古河サーキットフォイル
（株）製）に、上記ワニスを厚さ０．１４ｍｍで塗工
し、１５０℃の乾燥機炉で１０分、１７０℃の乾燥機炉
で１０分乾燥させ、樹脂厚さ０．０７ｍｍの樹脂付き銅
箔を作成した。Coating on Copper Foil A copper foil (thickness 0.018 mm, manufactured by Furukawa Circuit Foil Co., Ltd.) was coated with the above varnish to a thickness of 0.14 mm and dried in a dryer oven at 150 ° C. for 10 minutes. , And dried in a dryer oven at 170 ° C. for 10 minutes to prepare a resin-coated copper foil having a resin thickness of 0.07 mm.
【００１９】多層プリント配線板の製造
両面銅張積層板の銅箔表面を黒化処理（酸化銅形成）し
た後、還元したものをコアとして、その両面に上記樹脂
付き銅箔を１７０℃１時間、２００℃２時間で加熱加圧
接着することにより多層プリント配線板を製造した。Production of Multilayer Printed Wiring Board A copper foil surface of a double-sided copper-clad laminate is blackened (forms copper oxide) and then reduced, and the reduced resin is used as a core. A multi-layer printed wiring board was manufactured by heating and pressure bonding at 200 ° C. for 2 hours.
【００２０】（実施例２）ベンゾシクロブテン樹脂とシ
リカの配合量を、ベンゾシクロブテン樹脂７０重量部、
シリカ３０重量部にした以外は、実施例１と同様にし
た。Example 2 The blending amount of benzocyclobutene resin and silica was 70 parts by weight of benzocyclobutene resin,
Example 1 was repeated except that the amount of silica was changed to 30 parts by weight.
【００２１】（実施例３）シリカの代わりにアルミナ
（昭和電工（株）社製、ＵＥ−３０８３）を用いた以外
は、実施例１と同様にした。(Example 3) The same procedure as in Example 1 was carried out except that alumina (UE-3083, manufactured by Showa Denko KK) was used instead of silica.
【００２２】（実施例４）ベンゾシクロブテン樹脂とシ
リカの配合量を、ベンゾシクロブテン樹脂９５重量部、
シリカ５重量部にした以外は、実施例１と同様にした。Example 4 The blending amount of benzocyclobutene resin and silica was changed to 95 parts by weight of benzocyclobutene resin,
Example 1 was repeated except that the amount of silica was changed to 5 parts by weight.
【００２３】（実施例５）ベンゾシクロブテン樹脂とシ
リカの配合量を、ベンゾシクロブテン樹脂４０重量部、
シリカ６０重量部にした以外は、実施例１と同様にし
た。Example 5 The blending amount of benzocyclobutene resin and silica was changed to 40 parts by weight of benzocyclobutene resin,
Example 1 was repeated except that the amount of silica was changed to 60 parts by weight.
【００２４】（比較例１）ベンゾシクロブテン樹脂１０
０重量部とし、比誘電率２０以下の無機充填材を使用し
なかった以外は、実施例１と同様にした。Comparative Example 1 Benzocyclobutene resin 10
The same procedure was performed as in Example 1 except that the inorganic filler having a relative dielectric constant of 20 or less was used as 0 part by weight.
【００２５】（比較例２）シリカの代わりに水酸化アル
ミニウム（住友化学工業社製、Ｃ−３００５）を用いた
以外は、実施例１と同様にした。(Comparative Example 2) The procedure of Example 1 was repeated except that aluminum hydroxide (C-3005, manufactured by Sumitomo Chemical Co., Ltd.) was used instead of silica.
【００２６】（比較例３）ベンゾシクロブテン樹脂の代
わりにクレゾールノボラックエポキシ樹脂（大日本イン
キ化学工業社製、Ｎ−６９０）を用いた以外は、実施例
１と同様にした。Comparative Example 3 The procedure of Example 1 was repeated except that a cresol novolac epoxy resin (N-690 manufactured by Dainippon Ink and Chemicals, Inc.) was used instead of the benzocyclobutene resin.
【００２７】得られた多層プリント配線板について、誘
電特性、耐クラック性および成形性を測定した。得られ
た結果を表１に示す。誘電率は、空隙測定法で測定し
た。耐クラック性は、液相冷熱試験（−６５℃⇔１２５
℃／１００サイクル）で評価した。○はクラック発生せ
ず、×はクラック発生を表す。成形性は、ボイドの発生
の有無で評価した。○はボイド発生なし、△はボイド一
部発生するが実用状問題なしを表す、×はボイド発生を
表す。The dielectric properties, crack resistance and moldability of the obtained multilayer printed wiring board were measured. The results obtained are shown in Table 1. The dielectric constant was measured by the void measurement method. The crack resistance is determined by a liquid phase cold heat test (-65 ° C ⇔ 125
(° C / 100 cycles). O indicates that no cracks occurred, and X indicates that cracks occurred. The formability was evaluated by the presence or absence of voids. ◯ indicates that no void was generated, Δ indicates that some voids were generated, but there was no problem in practical use, and x indicates that voids were generated.
【００２８】[0028]
【表１】 [Table 1]
【００２９】実施例１〜９は、誘電率、耐クラック性お
よび成形性に優れている。また、実施例１および２は、
特に誘電率に優れる。Examples 1 to 9 are excellent in dielectric constant, crack resistance and moldability. In addition, in Examples 1 and 2,
Particularly excellent in dielectric constant.
【００３０】[0030]
【発明の効果】本発明により、誘電特性および耐クラッ
ク性に優れた樹脂組成物、樹脂付き銅箔および多層プリ
ント配線板を提供することができる。また、ベンゾシク
ロブテン樹脂を特定の含有量にする場合は、特に耐クラ
ック性および成形性を向上することができる。According to the present invention, it is possible to provide a resin composition, a resin-coated copper foil and a multilayer printed wiring board which are excellent in dielectric properties and crack resistance. When the benzocyclobutene resin has a specific content, crack resistance and moldability can be particularly improved.
Claims (7)
０以下の無機充填材を必須成分とすることを特徴とする
樹脂組成物。1. A benzocyclobutene resin and a relative dielectric constant of 2
A resin composition comprising an inorganic filler of 0 or less as an essential component.
で示されるものである請求項１に記載の樹脂組成物。 【化１】 2. The resin composition according to claim 1, wherein the benzocyclobutene resin is represented by the following formula. [Chemical 1]
は、樹脂組成物全体の４０〜９５重量％である請求項１
または２に記載の樹脂組成物。3. The content of the benzocyclobutene resin is 40 to 95% by weight of the total resin composition.
Or the resin composition according to 2.
ミナ、シリカの群から選ばれる少なくとも１種以上であ
る請求項１ないし３のいずれかに記載の樹脂組成物。4. The resin composition according to claim 1, wherein the inorganic filler is at least one selected from the group consisting of barium sulfate, alumina and silica.
全体の５〜６０重量％である請求項１ないし４のいずれ
かに記載の樹脂組成物。5. The resin composition according to claim 1, wherein the content of the inorganic filler is 5 to 60% by weight of the whole resin composition.
脂組成物を銅箔に塗工してなる樹脂付き銅箔。6. A resin-coated copper foil obtained by coating the resin composition according to claim 1 on a copper foil.
路板の片面又は両面に重ね合わせて加熱、加圧してなる
多層プリント回路板。7. A multilayer printed circuit board obtained by stacking the resin-coated copper foil according to claim 6 on one surface or both surfaces of an inner layer circuit board and heating and pressing the same.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001253036A JP4132751B2 (en) | 2001-08-23 | 2001-08-23 | Resin composition, resin-coated copper foil and multilayer printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2001253036A JP4132751B2 (en) | 2001-08-23 | 2001-08-23 | Resin composition, resin-coated copper foil and multilayer printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2003064268A true JP2003064268A (en) | 2003-03-05 |
| JP4132751B2 JP4132751B2 (en) | 2008-08-13 |
Family
ID=19081421
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2001253036A Expired - Lifetime JP4132751B2 (en) | 2001-08-23 | 2001-08-23 | Resin composition, resin-coated copper foil and multilayer printed circuit board |
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| Country | Link |
|---|---|
| JP (1) | JP4132751B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11920023B2 (en) | 2022-04-28 | 2024-03-05 | Rohm And Haas Electronic Materials Llc. | Composite materials for dielectric applications |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04171796A (en) * | 1990-11-05 | 1992-06-18 | Nec Corp | Low dielectric constant wiring board |
| JPH09194549A (en) * | 1996-01-11 | 1997-07-29 | Nitto Denko Corp | Thermosetting resin |
| JPH09241419A (en) * | 1996-03-06 | 1997-09-16 | Hitachi Ltd | Solventless composition and multilayered wiring board and production thereof |
-
2001
- 2001-08-23 JP JP2001253036A patent/JP4132751B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04171796A (en) * | 1990-11-05 | 1992-06-18 | Nec Corp | Low dielectric constant wiring board |
| JPH09194549A (en) * | 1996-01-11 | 1997-07-29 | Nitto Denko Corp | Thermosetting resin |
| JPH09241419A (en) * | 1996-03-06 | 1997-09-16 | Hitachi Ltd | Solventless composition and multilayered wiring board and production thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4132751B2 (en) | 2008-08-13 |
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