JP5471800B2 - Laminated material for printed wiring board and use thereof - Google Patents

Description

  The present invention relates to a laminated material for a printed wiring board and its use.

  In current electronic devices, higher speed transmission and higher density integration are progressing. As a printed wiring board used in these electronic devices, a build-up type multilayer printed wiring board is often used. Examples of the laminated material used for build-up include the following.

  Patent Document 1 discloses a metal foil with an adhesion assistant having a layer of adhesion assistant on the metal foil and a printed wiring board produced using the metal foil. It is described that this adhesion assistant includes a novolac type epoxy resin, a polyvinyl acetal resin, a triazine ring-containing novolac type phenol resin as a curing agent for epoxy resin, and a curing accelerator.

  Patent Document 2 discloses a metal foil-clad laminate in which a metal foil, a block copolymerized polyimide resin layer, and an insulating layer are laminated. And the manufacturing method of the printed wiring board which removes the metal foil of this metal foil tension laminated board and forms a conductor layer by plating on a polyimide resin layer is described. This document describes that the adhesion between the conductor layer and the insulating layer is excellent.

  Patent Document 3 discloses a metal-clad laminate in which an adhesive layer made of a polyimide resin having a predetermined water absorption rate is disposed between an insulating base material and a metal layer. This document describes that this adhesive layer is excellent in adhesiveness.

  Patent Document 4 discloses an insulation with a film or a metal foil formed by laminating an insulating resin layer composed of a resin composition containing a predetermined cyanate ester resin, an epoxy resin and an inorganic filler on a film or a metal foil. A resin sheet is disclosed.

JP 2006-159900 A JP 2006-196863 A JP 2007-326962 A JP 2008-198774 A

  However, the laminated materials and the like described in Patent Documents 1 to 4 have room for improvement in the following points.

  If there is a difference in coefficient of thermal expansion between the laminated plate and the semiconductor element, the mounting reliability is lowered, so that the laminated material constituting the laminated plate is required to have a low coefficient of thermal expansion. Further, in the laminated material, if there is a difference in thermal expansion coefficient between the resin layer and the conductor, the connection reliability is lowered, so that the insulating layer is required to have a low thermal expansion coefficient. Therefore, in order to reduce the coefficient of thermal expansion, it is necessary to increase the content of the inorganic filler in the insulating resin layer.

  On the other hand, in the build-up method for manufacturing a multilayer printed wiring board, after laminating a laminated material on a core substrate, via holes are formed by a laser or the like, desmear treatment is performed, and then a plating layer is formed.

  However, after the desmear treatment, the adhesion between the resin layer and the plating layer or metal foil (support base material) formed on the resin layer may be lowered. When the adhesive layer is provided on the resin layer, there is still room for improvement although the adhesion to the metal foil and the plating layer is improved.

  The present inventor has intensively studied in view of the above problems, and although it is necessary to contain a large amount of inorganic filler in order to reduce the thermal expansion coefficient of the insulating layer, if the amount of the inorganic filler in the insulating layer is increased, It has been found that a phenomenon occurs in which the adhesion between the adhesive layer formed on the insulating layer and the plating layer decreases. That is, the low thermal expansion coefficient of the insulating layer and the adhesiveness between the adhesive layer and the plated metal layer have a trade-off relationship.

  The inventors of the present application further examined this new problem. When the insulating layer contains a large amount of an inorganic filler, the phenomenon that the adhesiveness between the adhesive layer and the plated metal layer decreases is the water absorption property of the resin layer. I got the knowledge that it was caused by.

  Therefore, the inventors of the present application have examined the water absorption rate of the entire resin layer, and although the water absorption rate decreases with an increase in the amount of the inorganic filler in the insulating layer, the water absorption rate of the entire resin layer and the adhesive layer A correlation could not be found between the adhesive strength of the plated metal layer and the like.

  Therefore, the inventors of the present application further examined and found that the water absorption of the cured product excluding the inorganic filler constituting the insulating layer is correlated with the adhesiveness, not the water absorption of the entire resin layer. As a result of further earnest research based on such knowledge, even when the insulating layer contains an inorganic filler in an amount capable of maintaining a low coefficient of thermal expansion, the water absorption rate of the cured product of the insulating layer is set within a predetermined range. As a result, it was found that the adhesion between the adhesive layer and the plated metal layer was improved, and the present invention was completed.

The present invention can be described below.
(1) A laminated material for a printed wiring board in which an adhesive layer and a resin layer constituting an insulating layer of a printed wiring board are laminated in order on a supporting substrate,
The said resin layer is 1-2.5% of the water absorption rate of the hardened | cured material except an inorganic filler, and contains 55-75 weight% of inorganic fillers, The laminated material for printed wiring boards characterized by the above-mentioned.

(2) The laminated material for a printed wiring board according to (1), wherein the adhesive layer contains an inorganic filler having an average particle size of 0.1 μm or less.

(3) The laminated material for a printed wiring board according to (1) or (2), wherein the adhesive layer contains an aromatic polyamide resin containing at least one hydroxyl group.

(4) The aromatic polyamide resin containing at least one hydroxyl group includes a segment in which four or more carbon chains having a diene skeleton are connected to each other. (1) to (3) The laminated material for printed wiring boards as described in 2.

(5) The laminated material for a printed wiring board according to any one of (1) to (4), wherein the resin layer includes a dicyclopentadiene type epoxy resin.

(6) The laminated material for a printed wiring board according to any one of (1) to (5), wherein the resin layer includes a cyanate ester resin.

(7) Any of (1) to (6), wherein the total surface area of the inorganic filler contained in the resin layer per unit weight is 1.8 m ^{2 to} 4.5 m ² / g The laminated material for printed wiring boards according to one item.

(8) The resin layer contains a cyclic or cage-type siloxane compound having at least two Si—H bonds or Si—OH bonds, according to any one of (1) to (7). Laminated material for printed wiring boards.

(9) The laminated material for a printed wiring board according to (8), wherein the cyclic siloxane compound is represented by the following general formula (1).

(In the formula, x represents an integer of 2 or more and 10 or less, and n represents 1 or 2. R ₁ may be the same or different and contains an atom selected from an oxygen atom, a boron atom or a nitrogen atom. R ₂ may be the same or different and each represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, provided that at least two of R ₁ and R ₂ are a hydrogen atom or a hydroxyl group .)

(10) The laminated material for a printed wiring board according to (8), wherein the cage siloxane compound is represented by the following general formula (2).

(In the formula, X represents a hydrogen atom, a hydroxyl group, a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, or a substituent containing an atom selected from an oxygen atom, a boron atom, a nitrogen atom and a silicon atom. However, at least two X are a hydrogen atom or a hydroxyl group.)

(11) The resin layer includes at least one selected from the group consisting of a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, and an adduct of a phosphonium compound and a silane compound. The laminated material for printed wiring boards according to any one of (1) to (10), which is characterized.

(12) The laminated material for a printed wiring board according to any one of (1) to (11), wherein the adhesive layer has a layer thickness of 0.5 to 10 μm.

(13) The laminated material for printed wiring boards according to any one of (1) to (12), wherein a resin constituting the resin layer is impregnated in a fiber base material.

(14) A metal-clad laminate obtained by pasting together the resin layers of the two laminated materials for printed wiring boards according to (13), wherein the supporting base material is a metal foil.

(15) The resin layer of the laminated material for printed wiring boards according to any one of (1) to (13) is brought into contact with the surface on which the inner layer circuit pattern of the inner layer circuit board is formed, and is heated and pressed. Obtained printed wiring board.

(16) A semiconductor device formed by mounting a semiconductor element on the printed wiring board according to (15).

  According to the laminate material for a printed wiring board of the present invention, the metal-clad laminate, the printed wiring board, which has excellent mounting reliability and connection reliability, and excellent adhesion between the adhesive layer and the plated metal layer, etc. A semiconductor device in which a semiconductor element is mounted on a printed wiring board can be provided.

It is sectional drawing which shows typically an example of the laminated material for printed wiring boards of 1st Embodiment. It is sectional drawing which shows typically the impregnation application equipment which immerses the fiber base material in the resin varnish in 1st Embodiment. It is process sectional drawing which shows the manufacture example of the metal-clad laminated board using the laminated material for printed wiring boards of 1st Embodiment. It is process sectional drawing which shows the manufacture example of the printed wiring board using the laminated material for printed wiring boards of 1st Embodiment. It is process sectional drawing which shows the other example of manufacture of the inner-layer circuit board using the laminated material for printed wiring boards of 1st Embodiment. It is sectional drawing which shows typically the semiconductor device produced using the printed wiring board of 1st Embodiment. It is sectional drawing which shows typically an example of the laminated material for printed wiring boards of 2nd Embodiment. It is process sectional drawing which shows the manufacture example of the metal-clad laminated board using the laminated material for printed wiring boards of 2nd Embodiment. It is sectional drawing which shows the manufacture example of the printed wiring board using the laminated material for printed wiring boards of 2nd Embodiment.

Hereinafter, embodiments of the present invention will be described with reference to the drawings. In all the drawings, the same components are denoted by the same reference numerals, and description thereof is omitted appropriately.
In the following embodiments, the first embodiment shows an example using a release sheet as a supporting substrate, and the second embodiment shows an example using a metal foil as a supporting substrate.

[First Embodiment]
As shown in FIG. 1, the laminated material 10 for a printed wiring board of the present embodiment includes an adhesive layer 14 and a resin layer 16 constituting an insulating layer of the printed wiring board on a support base material (release sheet 12). They are laminated in order. The resin layer 16 has a water absorption of 1 to 2.5% of the cured product excluding the inorganic filler, and includes 55 to 75% by weight of the inorganic filler when the resin layer 16 is 100% by weight.
The water absorption rate of the cured product of the resin layer 16 is preferably 1 to 2.3%, more preferably 1 to 2.0%. The lower limit is preferably 1.3% or more in the above numerical range.

  If the water absorption of the cured product of the resin layer 16 is less than the lower limit value, the content of the inorganic filler is outside the above range, so the laminated material for a printed wiring board of the present embodiment cannot be obtained, and insulation The low thermal expansion coefficient of the layer and the adhesiveness between the adhesive layer and the plating layer cannot be improved, and further smear removal after laser via processing becomes difficult.

  The water absorption rate of the cured product of the resin layer 16 can be calculated by measuring the water absorption rate of the entire resin layer 16 and converting it from the inorganic filler ratio to calculate the water absorption rate of the cured product excluding the inorganic filler. Specifically, the water absorption of the cured product of the resin layer 16 can be measured as follows.

  A cured resin plate made of a 90 μm adhesive layer 14 is cut into a 50 mm square and used as a sample. After being left in a dryer at 120 ° C. for 2 hours, and left in a bath at 121 ° C. and 100% humidity for 2 hours. Each sample weight is measured, and the water absorption rate of the cured product constituting the resin layer 16 is calculated from the following formula.

Formula: Water absorption rate of the cured product constituting the resin layer 16
= ((B−A) / A) × 100 × (100 / (100−X))
A: Weight after being left in a dryer at 120 ° C. for 2 hours (mg)
B: Weight after being left in a bath at 121 ° C. and 100% humidity for 2 hours (mg)
X:% by weight (%) of inorganic filler in the resin layer 16 (100% by weight)

  Furthermore, the resin layer 16 can contain 60 to 75 weight% of an inorganic filler, More preferably 60 to 70 weight%, when the resin layer 16 is 100 weight%. In the present embodiment, the water absorption rate and the content of the inorganic filler can be appropriately combined with the above numerical ranges.

  That is, when the resin layer 16 satisfies both the water absorption rate and the content of the inorganic filler as described above, the thermal expansion coefficient of the resin layer 16 can be lowered and further formed on the adhesive layer 14. Excellent adhesion to plated metal layers. Therefore, according to the laminated material 10 for a printed wiring board of the present embodiment, the metal-clad laminated board, the printed wiring board, which are excellent in mounting reliability and connection reliability, and excellent in adhesion with a metal pattern, A semiconductor device in which a semiconductor element is mounted on this printed wiring board can be provided.

<Peeling sheet 12>
As the release sheet 12, since the resin layer 16 is laminated via the adhesive layer 14, it is preferable to select a release sheet that is easy to handle during lamination. Moreover, since the release sheet 12 is removed after laminating the printed wiring board laminate material 10 with the resin layer 16 side in contact with the inner layer circuit, it is easy to peel off after lamination. preferable.

  Examples of such a release sheet 12 include polyester resins such as polyethylene terephthalate and polybutylene terephthalate, thermoplastic resin films having heat resistance such as fluorine-based resins and polyimide resins. Among these films, a film made of polyester is preferable from the viewpoint of the balance between adhesion to the adhesive layer 14 and peelability.

  Although the thickness of the peeling sheet 12 is not specifically limited, Usually, 10-200 micrometers, Preferably it is 20-75 micrometers. When the thickness of the release sheet 12 is within the above range, handling is easy and the flatness of the resin layer 16 is excellent.

<Resin layer 16>
As described above, the resin layer 16 has a water absorption rate of 1 to 2.5% of the cured product and contains 55 to 75% by weight of the inorganic filler (A).
The resin layer 16 is composed of an inorganic filler (A), an epoxy resin (from the viewpoint of reducing the thermal expansion coefficient of the resin layer 16 and further improving the adhesion with the plated metal layer or the like formed on the adhesive layer 14. It is preferable that B) and cyanate ester resin (C) are included, and it is more preferable that a coupling agent (D) and a hardening accelerator (E) are further included.
Hereinafter, each component will be described.

(Inorganic filler (A))
Inorganic filler (A) includes silicates such as talc, calcined clay, unfired clay, mica, glass, oxides such as titanium oxide, alumina, silica, fused silica, calcium carbonate, magnesium carbonate, hydrotalcite, etc. Carbonates, boehmite, hydroxides such as aluminum hydroxide, magnesium hydroxide, calcium hydroxide, sulfates or sulfites such as barium sulfate, calcium sulfate, calcium sulfite, zinc borate, barium metaborate, aluminum borate And borate salts such as calcium borate and sodium borate, nitrides such as aluminum nitride, boron nitride, silicon nitride and carbon nitride, titanates such as strontium titanate and barium titanate. One of these can be used alone, or two or more can be used in combination. Among these, silica is particularly preferable, and fused silica is preferable in that it has excellent low thermal expansion. Further, although crushed and spherical silica exists, spherical silica is preferable in terms of lowering the melt viscosity of the resin composition.

  It is preferable that the spherical silica is further treated with a treatment agent for surface treatment in advance. The treating agent is preferably at least one compound selected from the group consisting of functional group-containing silanes, cyclic oligosiloxanes, organohalosilanes, and alkylsilazanes.

  Among the treatment agents, the surface treatment of the spherical silica using the organohalosilanes and the alkylsilazanes is suitable for hydrophobizing the silica surface, and the spherical silica in the resin composition It is preferable in terms of excellent dispersibility. When using a combination of normal functional group-containing silanes and the above-mentioned organohalosilanes or alkylsilazanes, any of them may be used for the surface treatment first, but the organohalosilanes or alkylsilazanes are dispersed first. It is preferable to impart the organic material affinity to the spherical silica surface, and the surface treatment of the following functional group-containing silanes can be made effective. The ratio of the amount of the normal functional group-containing silane used here to the amount of the organohalosilane or alkylsilazane is preferably 500/1 to 50/1 (weight ratio). If it is out of the range, the mechanical strength may decrease.

Examples of the functional group-containing silanes include 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane, 3-glycidoxypropylmethyldiethoxysilane, and 2- (3,4-epoxycyclohexyl). ) Epoxy silane compounds such as ethyldimethoxysilane, 3-methacryloxypropyltrimethoxysilane, 3-methacryloxypropylmethyldimethoxysilane, 3-methacryloxypropyltriethoxysilane, and 3-methacryloxypropylmethyldiethoxysilane ( Mercaptosilanes such as (meth) acrylic silane, 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, and 3-mercaptopropylmethyldimethoxysilane, N-phenyl-3-aminopropyl Limethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, N-2 (aminoethyl) -3-aminopropyltrimethoxysilane, N-2 (aminoethyl) -3-aminopropyltriethoxy Silane, N-2 (aminoethyl) -3-aminopropylmethyldimethoxysilane, 3-triethoxysilyl-N- (1,3-dimethyl-butylidene) propylamine, and N- (vinylbenzyl) -2-aminoethyl Aminosilanes such as -3-aminopropyltrimethoxysilane, vinyltriethoxysilane, vinyltrimethoxysilane, and vinylsilanes such as vinyltrichlorosilane, isocyanate silanes such as 3-isocyanatopropyltriethoxysilane, 3-ureidopropyltrimeth Sisilanes, and ureidosilanes such as 3-ureidopropyltriethoxysilane, (5-norbornen-2-yl) trimethoxysilane, (5-norbornen-2-yl) triethoxysilane, and (5-norbornene-2-yl) ) (5-norbornen-2-yl) alkylsilane such as ethyltrimethoxysilane, and phenylsilane such as phenyltrimethoxysilane. These functional group-containing silanes are suitably selected in order to improve the dispersibility of the (A) inorganic filler and maintain the minimum dynamic viscosity of the resin composition at 4000 Pa · s or less.
Examples of the cyclic oligosiloxanes include hexamethylcyclotrisiloxane and octamethylcyclotetrasiloxane.

  Examples of the organohalosilanes include trimethylchlorosilane, dimethyldichlorosilane, and methyltrichlorosilane. Of these, dimethyldichlorosilane is more preferred.

  Examples of the alkylsilazanes include hexamethyldisilazane, 1,3-divinyl 1,1,3,3-tetramethyldisilazane, octamethyltrisilazane, and hexamethylcyclotrisilazane. Of these, hexamethyldisilazane is more preferred.

  A method of treating the spherical silica with a surface treating agent in advance can be performed by a known method. For example, it can be carried out by putting spherical silica in a mixer, spraying the treatment agent with stirring in a nitrogen atmosphere, and holding at a predetermined temperature for a certain time. The treatment agent to be sprayed may be dissolved in a solvent in advance. In addition, the spherical silica and the treatment agent are put into a mixer, and a solvent is further added and stirred. In order to promote the reaction between the silanol on the silica surface and the coupling agent, heating or a small amount of water is added. Acids and alkalis can also be used.

  Although the temperature at the time of the treatment depends on the kind of the treatment agent, it is necessary to perform the treatment at a temperature lower than the decomposition temperature of the treatment agent. On the other hand, if the treatment temperature is too low, the binding force between the treatment agent and spherical silica is low, and the treatment effect cannot be obtained. Therefore, it is necessary to perform the treatment at an appropriate temperature according to the treatment agent. Furthermore, the holding time can be appropriately adjusted depending on the type of processing agent or the processing temperature.

  The average particle diameter of the inorganic filler (A) is preferably 0.01 to 5 μm. More preferably, it is 0.1-2 micrometers. When the average particle diameter of the inorganic filler (A) is less than the above lower limit, the viscosity of the resin varnish increases when preparing the resin varnish using the resin composition, so a laminated material for a printed wiring board is produced. This may affect the workability when doing so. On the other hand, when the upper limit is exceeded, phenomena such as sedimentation of the inorganic filler (A) may occur in the resin varnish. By making the average particle diameter of the inorganic filler (A) within the above range, it is possible to achieve an excellent balance of these characteristics.

  As the inorganic filler (A), an inorganic filler having a monodispersed average particle diameter can be used, or an inorganic filler having a polydispersed average particle diameter can be used. Furthermore, one type or two or more types of inorganic fillers having an average particle size of monodisperse and / or polydisperse can be used in combination.

  The content of the inorganic filler (A) is 55 to 75% by weight of the entire resin layer 16 (100% by weight), and the thermal expansion coefficient of the resin layer 16 can be adjusted to 10 ppm to 35 ppm.

In the inorganic filler (A), the total surface area of the inorganic filler (A) contained in the resin layer 16 per unit weight is 1.8 to 4.5 m ² / g, preferably 2.0 to 4.3 m. ² / g. The total surface area of the inorganic filler (A) can be calculated by the following equation.

Formula: Sum of surface areas of inorganic filler (A) contained in resin layer 16 per unit weight (m ² / g) = (X (%) / 100) × Y (m ² / g)
X: Ratio of inorganic filler in resin layer 16 (%)
Y: Specific surface area of the inorganic filler (m ² / g)

  In the present embodiment, the adhesiveness between the adhesive layer 14 and the plated metal layer is improved by setting the water absorption rate of the cured product of the insulating layer 16 within a predetermined range. Furthermore, when the total surface area of the inorganic filler (A) is within the above range, the adhesive layer 14 and the plated metal layer and the like, the moldability of the adhesive layer 14, and the insulation reliability are excellent.

(Epoxy resin (B))
As the epoxy resin (B), a resin having two or more epoxy groups in the molecule can be used. For example, novolak epoxy resins such as phenol novolac epoxy resin and cresol novolac epoxy resin, biphenyl epoxy resin, biphenyl aralkyl epoxy resin, aryl alkylene epoxy resin, naphthalene epoxy resin, naphthalene aralkyl epoxy resin, anthracene epoxy Examples thereof include epoxy resins such as resins, phenoxy type epoxy resins, dicyclopentadiene type epoxy resins, norbornene type epoxy resins, adamantane type epoxy resins, and fluorene type epoxy resins.

  Among these, from the viewpoint of reducing the water absorption rate of the resin layer 16 and setting the water absorption rate of the cured product within a predetermined range, it may include a biphenylaralkyl type epoxy resin, a naphthalene aralkyl type epoxy resin, and a dicyclopentadiene type epoxy resin. More preferably, a dicyclopentadiene type epoxy resin is preferably included.

  The epoxy resin (B) can be included in an amount of 10 to 90% by weight, preferably 25 to 75% by weight, when the entire resin layer 16 excluding the inorganic filler (A) is 100% by weight. If the content is less than the lower limit, the curability of the resin composition may be reduced, or the moisture resistance of the resulting product may be reduced. If the content exceeds the upper limit, the low thermal expansion and heat resistance are reduced. There is a case. Therefore, the above range is preferable from the viewpoint of balance of these characteristics.

(Cyanate ester resin (C))
Examples of the cyanate ester resin (C) include resins that can be obtained by reacting a halogenated cyanide compound with a phenol and prepolymerizing it by a method such as heating as necessary. Specific examples include novolak-type cyanate resins, bisphenol A-type cyanate resins, bisphenol E-type cyanate resins, and bisphenol-type cyanate resins such as tetramethylbisphenol F-type cyanate resins, and dicyclopentadiene-type cyanate resins. Among these, novolac type cyanate resin is preferable. Thereby, heat resistance can be improved.

  Further, as the cyanate ester resin (C), those obtained by prepolymerizing these resins can also be used. That is, the cyanate resin may be used alone, a cyanate resin having a different weight average molecular weight may be used in combination, or the cyanate resin and its prepolymer may be used in combination.

  The prepolymer is usually obtained by, for example, trimerizing the cyanate resin by a heat reaction or the like, and is preferably used for adjusting the moldability and fluidity of the resin composition. For example, when the prepolymer having a trimerization ratio of 20 to 50% by weight is used, good moldability and fluidity can be exhibited.

  Furthermore, it is preferable that the cyanate ester resin (C) has a viscosity at 80 ° C. of 15 to 550 mPa · s. This is to form an insulating resin layer with good flatness on the inner circuit pattern when laminated under heat and pressure in a vacuum, and to maintain compatibility with other components such as epoxy resin. If the upper limit is exceeded, the flatness of the surface of the insulating resin layer may be impaired. On the other hand, if it is less than the lower limit value, the compatibility is deteriorated, and there is a risk of separation and bleeding at the time of lamination.

  The content of the cyanate ester resin (C) is preferably 10 to 90% by weight, particularly preferably 25 to 75% by weight, based on the entire resin layer 16 excluding the inorganic filler (A). If the content is less than the lower limit, it may be difficult to form an insulating resin layer, and if the content exceeds the upper limit, the strength of the insulating resin layer may be reduced. Therefore, the above range is preferable from the viewpoint of balance of these characteristics.

(Coupling agent (D))
As the coupling agent (D), a cyclic or cage-type siloxane compound having at least two Si—H bonds or Si—OH bonds can be used.

By having at least two Si-H bonds or Si-OH bonds, the cyclic siloxane compounds are bonded to each other, and the strength of the laminated material for printed wiring boards is improved by covering the filler or the filler and the resin interface. Further, it is possible to realize low water absorption by hydrophobization.
As the cyclic siloxane compound, a compound represented by the following general formula (1) can be used.

In the formula, x represents an integer of 2 to 10, and n represents 1 or 2. R ₁ may be the same or different and represents a group containing an atom selected from an oxygen atom, a boron atom or a nitrogen atom. R ₂ may be the same or different and represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms. However, at least _two of R ₁ and R ₂ are a hydrogen atom or a hydroxyl group.

Examples of the saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms include methyl, ethyl, n-propyl, i-propyl, cyclopropyl, n-butyl, i-butyl, sec-butyl, tert. -Butyl, cyclobutyl, n-pentyl, tert. -Alkyl groups such as amyl, cyclopentyl, n-hexyl, cyclohexyl, 2-ethylhexyl; aryl groups such as phenyl, diphenyl, naphthyl; arylalkyl groups such as benzyl, methylbenzyl; o-toluyl, m-toluyl, p- Toluyl, 2,3-dimethylphenyl, 2,4-dimethylphenyl, 2,5-dimethylphenyl, 2,6-dimethylphenyl, 3,4-dimethylphenyl, 3,5-dimethylphenyl, 2,4,6- Alkylaryl groups such as trimethylphenyl, o-ethylphenyl, m-ethylphenyl, p-ethylphenyl; vinyl, allyl, 1-propenyl, 1-butenyl, 1,3-butadienyl, 1-pentenyl, 1-cyclo Pentenyl, 2-cyclopentenyl, cyclopentadienyl, methylcyclopenta Enyl, ethylcyclopentadienyl, 1-hexenyl, 1-cyclohexenyl, 2,4-cyclohexadienyl, 2,5-cyclohexadienyl, 2,4,6-cycloheptatrienyl, 5-norbornene-2- Alkenyl groups such as 2-phenyl-1-ethenyl; alkenyl aryl groups such as o-styryl, m-styryl, p-styryl; ethynyl, 1-propynyl, 2-propynyl, 1-butynyl, Alkynyl groups such as 2-butynyl, 3-butynyl, 1-pentynyl, 2-pentynyl, 3-pentynyl, 4-pentynyl, 1-hexynyl, 3-hexynyl, 5-hexynyl; aryl such as 2-phenyl-1-ethynyl Alkynyl groups; alkynyl aryl groups such as 2-ethynyl-2-phenyl .
The number average molecular weight of the cyclic siloxane compound is preferably 50 to 1,000.

  Examples of cyclic siloxane compounds include 1,3,5-trimethylcyclotrisiloxane, hexamethylcyclohexasiloxane, 1,3,5,7-tetramethylcyclotetrasiloxane, octamethylcyclotetrasiloxane, 1,3,5,7. , 9-pentamethylcyclopentasiloxane, decamethylcyclopentasiloxane, 1,3,5-triethylcyclotrisiloxane, 1,3,5,7-tetraethylcyclotetrasiloxane, 1,3,5,7,9-penta Examples thereof include ethylcyclopentasiloxane.

  The cage siloxane compound is represented by the following general formula (2).

In the formula, X represents a hydrogen atom, a hydroxyl group, a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, or a substituent containing an atom selected from an oxygen atom, a boron atom, a nitrogen atom and a silicon atom. However, at least two X are a hydrogen atom or a hydroxyl group.
The number average molecular weight of the cage siloxane compound is preferably 50 to 1000.

  Examples of the cage siloxane compound include polysilsesquioxane (T8), polysilsesquioxane-hydroxy substituted product, polysilsesquioxane-octahydroxy substituted product, polysilsesquioxane- (3-glycidyl) propoxy compound. -Heptahydroxy substitution product, polysilsesquioxane- (2,3-propanediol) propoxy-heptahydroxy substitution product, and the like.

  In the present embodiment, a coupling agent other than the cyclic or cage type siloxane compound may be used. Such a coupling agent is not particularly limited, and examples thereof include silane-based, titanate-based, and aluminum-based coupling agents. For example, N-phenyl-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-amino Ethyl) aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-anilinopropyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -3-aminopropyltrimethoxysilane and N-β Aminosilane compounds such as-(N-vinylbenzylaminoethyl) -3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane and 2- (3,4-epoxy) (Cyclohexyl) ethyltrimeth Epoxy silane compounds such as xysilane, and others include 3-mercaptopropyltrimethoxysilane, 3-mercatopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, and 3-methacryloxypropyl And trimethoxysilane. One of these can be used alone, or two or more can be used in combination.

  By using the coupling agent, the wettability of the interface between the epoxy resin (B) and cyanate ester resin (C) and the inorganic filler can be improved. As a result, heat resistance, particularly moisture-absorbing solder heat resistance, can be improved.

  Although content of a coupling agent (D) is not specifically limited, It is preferable that it is 0.05-5.00 weight part with respect to 100 weight part of inorganic fillers (A). Particularly preferred is 0.1 to 2.5 parts by weight. When the content of the coupling agent (D) is less than the lower limit, the effect of covering the inorganic filler and improving the heat resistance may not be sufficient. On the other hand, if the upper limit is exceeded, the bending strength of the insulating layer may decrease. By setting the content of the coupling agent within the above range, it is possible to achieve an excellent balance of these characteristics.

(Curing accelerator (E))
Specific examples of the curing accelerator (E) include phosphorus-containing compounds such as organic phosphines, tetra-substituted phosphonium compounds, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds, adducts of phosphonium compounds and silane compounds; Examples thereof include nitrogen atom-containing compounds such as 1,8-diazabicyclo (5,4,0) undecene-7, benzyldimethylamine, and 2-methylimidazole.

  Among these, a phosphorus atom-containing compound is preferable from the viewpoint of curability, and from the viewpoint of balance between fluidity and curability, a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, a phosphonium compound A catalyst having latency such as an adduct of silane compound and silane compound is more preferable. In view of fluidity, tetra-substituted phosphonium compounds are particularly preferable. From the viewpoint of solder resistance, phosphobetaine compounds, adducts of phosphine compounds and quinone compounds are particularly preferable, and in view of latent curability. An adduct of a phosphonium compound and a silane compound is particularly preferable. Further, from the viewpoint of moldability, a tetra-substituted phosphonium compound is preferable.

Examples of the organic phosphine include a first phosphine such as ethylphosphine and phenylphosphine; a second phosphine such as dimethylphosphine and diphenylphosphine; and a third phosphine such as trimethylphosphine, triethylphosphine, tributylphosphine, and triphenylphosphine.
Examples of the tetra-substituted phosphonium compound include a compound represented by the following general formula (3).

  In the general formula (3), P represents a phosphorus atom, R17, R18, R19 and R20 each independently represents an aromatic group or an alkyl group, and A represents a functional group selected from a hydroxyl group, a carboxyl group, and a thiol group. Represents an anion of an aromatic organic acid having at least one of the groups in the aromatic ring, and AH is an aromatic organic having at least one functional group selected from a hydroxyl group, a carboxyl group, and a thiol group in the aromatic ring Represents an acid, x and y are integers of 1 to 3, z is an integer of 0 to 3, and x = y.

Although the compound represented by General formula (3) is obtained as follows, for example, it is not limited to this. First, a tetra-substituted phosphonium halide, an aromatic organic acid and a base are mixed in an organic solvent and mixed uniformly to generate an aromatic organic acid anion in the solution system. Next, when water is added, the compound represented by the general formula (3) can be precipitated. In the compound represented by the general formula (3), R17, R18, R19, and R20 bonded to the phosphorus atom are phenyl groups and AH is bonded to the phosphorus atom from the viewpoint of excellent balance between the yield during synthesis and the curing acceleration effect. A compound having a hydroxyl group in an aromatic ring, that is, a phenol compound, and A is preferably an anion of the phenol compound.
Examples of the phosphobetaine compound include compounds represented by the following general formula (4).

  In General formula (4), X1 represents a C1-C3 alkyl group, Y1 represents a hydroxyl group, f is an integer of 0-5, g is an integer of 0-4.

The compound represented by the general formula (4) is obtained, for example, as follows. First, it is obtained through a step of bringing a triaromatic substituted phosphine, which is a third phosphine, into contact with a diazonium salt and replacing the triaromatic substituted phosphine with a diazonium group of the diazonium salt. However, the present invention is not limited to this.
Examples of the adduct of a phosphine compound and a quinone compound include compounds represented by the following general formula (5).

  In General Formula (5), P represents a phosphorus atom, R21, R22, and R23 each independently represent an alkyl group having 1 to 12 carbon atoms or an aryl group having 6 to 12 carbon atoms, and R24, R25, and R26 independently represents a hydrogen atom or a hydrocarbon group having 1 to 12 carbon atoms, and R24 and R25 may be bonded to each other to form a ring.

  Examples of the phosphine compound used as an adduct of a phosphine compound and a quinone compound include an aromatic ring such as triphenylphosphine, tris (alkylphenyl) phosphine, tris (alkoxyphenyl) phosphine, trinaphthylphosphine, and tris (benzyl) phosphine. Those having a substituent such as a substituent or an alkyl group or an alkoxyl group are preferred, and examples of the substituent such as an alkyl group and an alkoxyl group include those having 1 to 6 carbon atoms. From the viewpoint of availability, triphenylphosphine is preferable.

  In addition, examples of the quinone compound used for the adduct of the phosphine compound and the quinone compound include o-benzoquinone, p-benzoquinone, and anthraquinones. Among them, p-benzoquinone is preferable from the viewpoint of storage stability.

  As a method for producing an adduct of a phosphine compound and a quinone compound, the adduct can be obtained by contacting and mixing in a solvent capable of dissolving both organic tertiary phosphine and benzoquinone. The solvent is preferably a ketone such as acetone or methyl ethyl ketone, which has low solubility in the adduct. However, the present invention is not limited to this.

In the compound represented by the general formula (5), R21, R22 and R23 bonded to the phosphorus atom are phenyl groups, and R24, R25 and R26 are hydrogen atoms, that is, 1,4-benzoquinone and triphenyl A compound to which phosphine has been added is preferable in that it reduces the thermal elastic modulus of the cured product of the resin composition for semiconductor encapsulation.
Examples of the adduct of a phosphonium compound and a silane compound include a compound represented by the following formula (6).

  In General formula (6), P represents a phosphorus atom and Si represents a silicon atom. R27, R28, R29 and R30 each independently represent an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group, and X2 is an organic group bonded to the groups Y2 and Y3. X3 is an organic group bonded to the groups Y4 and Y5. Y2 and Y3 represent a group formed by releasing a proton from a proton donating group, and groups Y2 and Y3 in the same molecule are bonded to a silicon atom to form a chelate structure. Y4 and Y5 represent a group formed by releasing a proton from a proton donating group, and groups Y4 and Y5 in the same molecule are bonded to a silicon atom to form a chelate structure. X2 and X3 may be the same or different from each other, and Y2, Y3, Y4, and Y5 may be the same or different from each other. Z1 is an organic group having an aromatic ring or a heterocyclic ring, or an aliphatic group.

  In the general formula (6), as R27, R28, R29 and R30, for example, phenyl group, methylphenyl group, methoxyphenyl group, hydroxyphenyl group, naphthyl group, hydroxynaphthyl group, benzyl group, methyl group, ethyl group, n-butyl group, n-octyl group, cyclohexyl group, and the like. Among these, an aromatic group having a substituent such as phenyl group, methylphenyl group, methoxyphenyl group, hydroxyphenyl group, hydroxynaphthyl group, or the like. A substituted aromatic group is more preferred.

  Moreover, in General formula (6), X2 is an organic group couple | bonded with Y2 and Y3. Similarly, X3 is an organic group bonded to the groups Y4 and Y5. Y2 and Y3 are groups formed by proton-donating groups releasing protons, and groups Y2 and Y3 in the same molecule are combined with a silicon atom to form a chelate structure. Similarly, Y4 and Y5 are groups formed by proton-donating groups releasing protons, and groups Y4 and Y5 in the same molecule are combined with a silicon atom to form a chelate structure. The groups X2 and X3 may be the same or different from each other, and the groups Y2, Y3, Y4, and Y5 may be the same or different from each other. The groups represented by -Y2-X2-Y3- and -Y4-X3-Y5- in general formula (6) are composed of groups in which a proton donor releases two protons. Examples of proton donors include catechol, pyrogallol, 1,2-dihydroxynaphthalene, 2,3-dihydroxynaphthalene, 2,2′-biphenol, 1,1′-bi-2-naphthol, and salicylic acid. 1-hydroxy-2-naphthoic acid, 3-hydroxy-2-naphthoic acid, chloranilic acid, tannic acid, 2-hydroxybenzyl alcohol, 1,2-cyclohexanediol, 1,2-propanediol and glycerin. . Among these, catechol, 1,2-dihydroxynaphthalene, and 2,3-dihydroxynaphthalene are more preferable from the viewpoint of easy availability of raw materials and a curing acceleration effect.

  Z1 in the general formula (6) represents an organic group or an aliphatic group having an aromatic ring or a heterocyclic ring, and specific examples thereof include a methyl group, an ethyl group, a propyl group, a butyl group, and a hexyl group. Reactions such as aliphatic hydrocarbon groups such as octyl group and aromatic hydrocarbon groups such as phenyl group, benzyl group, naphthyl group and biphenyl group, glycidyloxypropyl group, mercaptopropyl group, aminopropyl group and vinyl group Among them, a methyl group, an ethyl group, a phenyl group, a naphthyl group, and a biphenyl group are more preferable from the viewpoint of thermal stability.

  As a method for producing an adduct of a phosphonium compound and a silane compound, a silane compound such as phenyltrimethoxysilane and a proton donor such as 2,3-dihydroxynaphthalene are added to a flask containing methanol and dissolved, and then room temperature. Sodium methoxide-methanol solution is added dropwise with stirring. Furthermore, when a solution prepared by dissolving a tetra-substituted phosphonium halide such as tetraphenylphosphonium bromide in methanol in methanol is added dropwise with stirring at room temperature, crystals are precipitated. The precipitated crystals are filtered, washed with water, and vacuum dried to obtain an adduct of a phosphonium compound and a silane compound. However, it is not limited to this.

  The lower limit of the content of the curing accelerator (E) is preferably 0.1% by weight or more with respect to 100% by weight of the resin layer. When the lower limit value of the content of the curing accelerator (E) is within the above range, sufficient curability can be obtained. Moreover, it is preferable that the upper limit of content of a hardening accelerator (E) is 1 weight% or less with respect to 100 weight% of resin layers. When the upper limit value of the content of the curing accelerator (E) is within the above range, sufficient fluidity can be obtained in the resin composition.

In the present embodiment, the resin layer 16 is 55 to 75% by weight of the inorganic filler (A), preferably 60 to 75% by weight, and 5 to 35% by weight of the epoxy resin (B), preferably 5 to 25% by weight. The cyanate ester resin (C) is contained in an amount of 5 to 30% by weight, preferably 5 to 20% by weight.
Thereby, it is more excellent in the balance of the low thermal expansion coefficient of the resin layer 16, and the adhesive improvement with the metal plating layer etc. which are formed on the contact bonding layer 14.

(Other ingredients)
The resin layer 16 can further contain a thermoplastic resin. Thereby, the mechanical strength of the hardened | cured material obtained from the said resin composition can be improved.

  Examples of the thermoplastic resin include phenoxy resins and olefin resins. They can be used alone, or two or more kinds having different weight average molecular weights can be used in combination, or one kind or two or more kinds and a prepolymer thereof can be used in combination. Among these, a phenoxy resin is preferable. Thereby, the heat resistance and flame retardance of the resin layer 16 can be improved.

  The phenoxy resin is not particularly limited. For example, a phenoxy resin having a bisphenol A skeleton, a phenoxy resin having a bisphenol F skeleton, a phenoxy resin having a bisphenol S skeleton, and bisphenol M (4,4 ′-(1,3- Phenoxy resin having phenylenediisopridiene) bisphenol) skeleton, phenoxy resin having bisphenol P (4,4 ′-(1,4) -phenylenediisopridiene) bisphenol) skeleton, bisphenol Z (4,4′- A phenoxy resin having a bisphenol skeleton, a phenoxy resin having a novolak skeleton, a phenoxy resin having an anthracene skeleton, a phenoxy resin having a fluorene skeleton, and a dicyclopentadiene skeleton. To phenoxy resins, phenoxy resins having a norbornene skeleton, phenoxy resins having a naphthalene skeleton, phenoxy resins having a biphenyl skeleton include phenoxy resins having an adamantane skeleton. Further, as the phenoxy resin, a structure having a plurality of types of skeletons can be used, and phenoxy resins having different ratios of the skeletons can be used. Furthermore, a plurality of types of phenoxy resins having different skeletons can be used, a plurality of types of phenoxy resins having different weight average molecular weights can be used, or prepolymers thereof can be used in combination.

  The resin layer 16 can further contain a phenol resin. Phenol resin refers to monomers, oligomers, and polymers in general that have a phenolic hydroxyl group that can form a crosslinked structure by reacting with an epoxy resin, such as phenol novolac resin, aralkyl phenol resin, terpene-modified phenol resin, dicyclopentadiene-modified. A phenol resin, bisphenol A, triphenol methane, etc. are mentioned. These phenol resins can be used alone or in combination.

  The resin layer 16 may contain another curing accelerator as necessary. Examples of other curing accelerators include organic metal salts such as imidazole compounds, zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), and trisacetylacetonate cobalt (III). Tertiary amines such as triethylamine, tributylamine, diazabicyclo [2,2,2] octane, phenolic compounds such as phenol, bisphenol A, nonylphenol, organic acids such as acetic acid, benzoic acid, salicylic acid, p-toluenesulfonic acid, etc. Or this mixture is mentioned. One of these can be used alone, including derivatives thereof, or two or more of these can be used in combination.

  Among the other curing accelerators, an imidazole compound is particularly preferable. Thereby, moisture absorption solder heat resistance can be improved. When the imidazole compound is dissolved in the organic solvent with the epoxy resin (B) and the cyanate ester resin (C), the imidazole compound has such a property that it can be substantially dissolved or dispersed to a molecular level. It is what you point to.

  By using such an imidazole compound, the resin layer 16 can effectively promote the reaction between the epoxy resin (B) and the cyanate ester resin (C), and the amount of the imidazole compound is reduced. However, equivalent characteristics can be imparted.

  Furthermore, a resin composition using such an imidazole compound can be cured with high uniformity from a minute matrix unit with a resin component. Thereby, the insulation of the insulating resin layer formed in the printed wiring board, and heat resistance can be improved.

  Examples of the imidazole compound include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-4-methylimidazole, 2-ethyl-4-methylimidazole, and 2,4-diamino-6. -[2'-Methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- (2'-undecylimidazolyl) -ethyl-s-triazine, 2,4-diamino-6 -[2'-ethyl-4-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4-methyl-5-hydroxymethylimidazole, etc. Can be mentioned.

  Among these, an imidazole compound selected from 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 2-ethyl-4-methylimidazole is preferable. These imidazole compounds have particularly excellent compatibility, so that a highly uniform cured product can be obtained and a fine and uniform roughened surface can be formed, so that a fine conductor circuit can be easily formed. In addition, the printed wiring board can exhibit high heat resistance.

  The content of the imidazole compound is not particularly limited, but is preferably 0.01 to 5.00% by weight, particularly 0.05 to 100% by weight in total of the epoxy resin (B) and the cyanate ester resin (C). ~ 3.00 wt% is preferred. Thereby, especially heat resistance can be improved.

  In addition, the resin composition used when preparing the resin layer 16 has various additives such as a leveling agent, an antifoaming agent, an oxidation agent for improving various properties such as resin compatibility, stability, and workability. Inhibitors, pigments, dyes, antifoaming agents, flame retardants, UV absorbers, ion scavengers, non-reactive diluents, reactive diluents, thixotropic agents, thickeners, and the like may be added as appropriate.

<Adhesive layer 14>
The adhesive layer 14 can include an inorganic filler (a) having an average particle diameter of 0.1 μm or less.
When the adhesive layer 14 includes such a fine inorganic filler (a), fine irregularities are easily formed on the surface in the desmear treatment, and the adhesion to the plated metal is improved. Furthermore, since the unevenness of the surface of the adhesive layer 14 after the desmear treatment is fine, the surface of the plated metal layer formed on the surface of the adhesive layer 14 becomes smooth, and fine processing can be easily performed on the plated metal layer. it can. Therefore, a thin line can be formed in the plated metal layer.

The lower limit of the average particle diameter of the inorganic filler (a) can be 0.01 μm or more from the viewpoint of moldability.
The layer thickness of the adhesive layer 14 can be about 0.5 μm to 10 μm.

Specifically, the adhesive layer 14 includes an inorganic filler (a) having an average particle diameter of 0.1 μm or less, an aromatic polyamide resin (b) containing at least one hydroxyl group, a cyanate ester resin (c), an epoxy resin ( d) can be included.
Hereinafter, each component will be described.

(Inorganic filler (a))
The inorganic filler (a) can be the same as the inorganic filler (A) except that the average particle diameter is 0.1 μm or less.

  The inorganic filler (a) is contained in the adhesive layer 14 in an amount of 1 to 30% by weight, preferably 5 to 20% by weight, when the entire adhesive layer 14 is 100% by weight. Thereby, it is especially excellent in the adhesiveness with a plating metal, and the surface smoothness of a plating metal layer.

(Aromatic polyamide resin (b))
The aromatic polyamide resin (b) contains at least one hydroxyl group. By including an aromatic ring structure in the resin skeleton, high adhesion with a conductor circuit or the like can be obtained. Moreover, aromatic polyamide resin (b) can perform a curing reaction with (d) epoxy resin by containing a hydroxyl group.

  More preferably, the aromatic polyamide resin (b) preferably includes a segment in which at least four carbon chains having a diene skeleton are connected. As a result, the aromatic polyamide resin (b) is selectively roughened in the desmear treatment process when the resin sheet or prepreg is used for the production of the printed wiring board, thereby forming a fine roughened shape. Can do. Further, by providing the insulating layer with appropriate flexibility, it is possible to improve the adhesion with the conductor circuit.

  Examples of the aromatic polyamide resin (b) include KAYAFLEX BPAM01 (manufactured by Nippon Kayaku Co., Ltd.), KAYAFLEX BPAM155 (manufactured by Nippon Kayaku Co., Ltd.), and the like.

The weight average molecular weight (Mw) of the aromatic polyamide resin (b) is preferably 2.0 × 10 ⁵ or less. Thereby, adhesiveness with copper etc. can be obtained. When the weight average molecular weight (Mw) is higher than 2.0 × 10 ⁵ , when the adhesive layer 14 is produced from the resin composition, the fluidity of the adhesive layer 14 may be lowered, and press molding and circuit embedding can be performed. It may disappear or solvent solubility may deteriorate.

  The equivalent ratio of the active hydrogen equivalent of the aromatic polyamide resin (b) to the epoxy equivalent of the epoxy resin (d) is preferably 0.02 or more and 0.2 or less. If it is larger than the upper limit, the aromatic polyamide resin (b) containing at least one hydroxyl group cannot be sufficiently crosslinked with the epoxy resin, so that the heat resistance may be deteriorated. Since the property becomes too high, the fluidity or press moldability of the adhesive layer 14 may deteriorate.

  The aromatic polyamide resin (b) is contained in the adhesive layer 14 in an amount of 5 to 60% by weight, preferably 20 to 45% by weight. If the content is smaller than the lower limit value, the peel strength may be lowered. If the content is larger than the upper limit value, the heat resistance may be lowered, and the thermal expansion coefficient may be increased.

(Cyanate ester resin (c))
As the cyanate ester resin (c), the same resin as the cyanate ester resin (C) contained in the resin layer 16 can be used.

  The content of the cyanate ester resin (c) is preferably 10 to 90% by weight, particularly preferably 25 to 75% by weight, based on the entire adhesive layer 14 excluding the inorganic filler. If the content is less than the lower limit value, the low thermal expansion may not be improved, and if the content exceeds the upper limit value, the moisture resistance reliability may be lowered.

(Epoxy resin (d))
As the epoxy resin (d), a resin having two or more epoxy groups in the molecule can be used. For example, novolak epoxy resins such as phenol novolac epoxy resin and cresol novolac epoxy resin, biphenyl epoxy resin, biphenyl aralkyl epoxy resin, aryl alkylene epoxy resin, naphthalene epoxy resin, naphthalene aralkyl epoxy resin, anthracene epoxy Examples thereof include epoxy resins such as resins, phenoxy type epoxy resins, dicyclopentadiene type epoxy resins, norbornene type epoxy resins, adamantane type epoxy resins, and fluorene type epoxy resins.

  Among these, from the viewpoint of moisture resistance reliability, aralkyl epoxy resins such as phenol novolac epoxy resins and cresol novolac epoxy resins, novolak epoxy resins, biphenyl aralkyl epoxy resins, naphthalene aralkyl epoxy resins, aryl alkylene epoxy resins and the like. Dicyclopentadiene type epoxy resins are preferable, and aralkyl type epoxy resins and dicyclopentadiene type epoxy resins are particularly preferable.

  The epoxy resin (d) is 10 to 90% by weight, preferably 25 to 25% when the entire adhesive layer 14 excluding the inorganic filler is 100% by weight from the viewpoints of curability, thermal expansion coefficient and moisture resistance reliability. It can be included in an amount of 75% by weight.

(Other ingredients)
The adhesive layer 14 may contain a curing accelerator as necessary. Examples of the curing accelerator include imidazole compounds, zinc naphthenate, cobalt naphthenate, tin octylate, cobalt octylate, bisacetylacetonate cobalt (II), trisacetylacetonate cobalt (III), and other organic metal salts, triethylamine , Tertiary amines such as tributylamine and diazabicyclo [2,2,2] octane, phenolic compounds such as phenol, bisphenol A and nonylphenol, organic acids such as acetic acid, benzoic acid, salicylic acid and p-toluenesulfonic acid, or the like A mixture is mentioned. One of these can be used alone, including derivatives thereof, or two or more of these can be used in combination.

  Among the curing accelerators, an imidazole compound is particularly preferable. Thereby, moisture absorption solder heat resistance can be improved. The imidazole compound can be dissolved up to a molecular level or dispersed to a state close to the molecular level when both the cyanate ester resin (c) and the epoxy resin (d) are dissolved in an organic solvent. It points to.

  By using such an imidazole compound, the reaction between the cyanate ester resin (c) and the epoxy resin (d) can be effectively promoted, and equivalent characteristics can be obtained even if the amount of the imidazole compound is reduced. Can be granted. Furthermore, a resin composition using such an imidazole compound can be cured with high uniformity from a minute matrix unit with a resin component. Thereby, the insulation of the adhesive layer 14 formed in the printed wiring board, and heat resistance can be improved.

  When the surface of the adhesive layer 14 is roughened using an oxidizing agent such as permanganate or dichromate, for example, the surface of the insulating layer after the roughening treatment has a fine uneven shape with high uniformity. Can be formed in large numbers.

  When a metal plating process is performed on the surface of the insulating resin layer after such a roughening process, the smoothness of the roughened surface is high, so that a fine conductor circuit can be accurately formed. Further, the anchor effect can be enhanced by the minute uneven shape, and high adhesion can be imparted between the insulating resin layer and the plated metal.

  Examples of the imidazole compound used in the resin composition of the present invention include 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, 2-phenyl-4-methylimidazole, and 2-ethyl-4-methylimidazole. 2,4-diamino-6- [2'-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2,4-diamino-6- (2'-undecylimidazolyl) -ethyl-s-triazine 2,4-diamino-6- [2'-ethyl-4-methylimidazolyl- (1 ')]-ethyl-s-triazine, 2-phenyl-4,5-dihydroxymethylimidazole, 2-phenyl-4- Examples thereof include methyl-5-hydroxymethylimidazole.

  Among these, an imidazole compound selected from 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 2-ethyl-4-methylimidazole is preferable. These imidazole compounds have particularly excellent compatibility, so that a highly uniform cured product can be obtained and a fine and uniform roughened surface can be formed, so that a fine conductor circuit can be easily formed. In addition, the printed wiring board can exhibit high heat resistance.

  Although content of the said imidazole compound is not specifically limited, 0.01-5.00 weight% is preferable with respect to the sum total of cyanate ester resin (c) and an epoxy resin (d), 0.05-3 especially. 0.000% by weight is preferred. Thereby, especially heat resistance can be improved.

  It is preferable that the adhesive layer 14 further includes a coupling agent. The coupling agent is not particularly limited, and examples thereof include silane-based, titanate-based, and aluminum-based coupling agents. For example, N-phenyl-3-aminopropyltrimethoxysilane, 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3- (2-aminoethyl) aminopropyltrimethoxysilane, 3- (2-amino Ethyl) aminopropyltriethoxysilane, 3-anilinopropyltrimethoxysilane, 3-anilinopropyltriethoxysilane, N-β- (N-vinylbenzylaminoethyl) -3-aminopropyltrimethoxysilane and N-β Aminosilane compounds such as-(N-vinylbenzylaminoethyl) -3-aminopropyltriethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyltriethoxysilane and 2- (3,4-epoxy) (Cyclohexyl) ethyltrimeth Epoxy silane compounds such as xysilane, and others include 3-mercaptopropyltrimethoxysilane, 3-mercatopropyltriethoxysilane, 3-ureidopropyltrimethoxysilane, 3-ureidopropyltriethoxysilane, and 3-methacryloxypropyl And trimethoxysilane. One of these can be used alone, or two or more can be used in combination. By using a coupling agent, the wettability of the interface of cyanate ester resin (c), an epoxy resin (d), and an inorganic filler (a) can be improved. As a result, heat resistance, particularly moisture-absorbing solder heat resistance, can be improved.

  Although content of a coupling agent is not specifically limited, It is preferable that it is 0.05-5.00 weight part with respect to 100 weight part of inorganic fillers (a). Particularly preferred is 0.1 to 2.5 parts by weight. When the content of the coupling agent is less than the lower limit, the effect of improving the heat resistance by covering the inorganic filler (a) may not be sufficient. On the other hand, if the upper limit is exceeded, the bending strength of the insulating layer 16 may be lowered. By setting the content of the coupling agent within the above range, it is possible to achieve an excellent balance of these characteristics.

<Method for Producing Laminate Material 10 for Printed Wiring Board>
The laminated material for printed wiring boards (insulating resin sheet with film) 10 of the present invention can be manufactured as follows.
First, the resin composition used for creating the adhesive layer 14 or the resin layer 16 is adjusted.

  The resin composition for the adhesive layer 14 comprises the above components contained in the adhesive layer 14 with acetone, methyl ethyl ketone, methyl isobutyl ketone, toluene, ethyl acetate, cyclohexane, heptane, cyclohexane, cyclohexanone, tetrahydrofuran, dimethylformamide, dimethylacetamide, In organic solvents such as dimethyl sulfoxide, ethylene glycol, cellosolve, carbitol, and anisole, ultrasonic dispersion method, high-pressure collision dispersion method, high-speed rotation dispersion method, bead mill method, high-speed shear dispersion method, and rotation-revolution dispersion The resin varnish A can be obtained by dissolving, mixing, and stirring using various types of mixers such as a method.

The resin varnish A is an aromatic polyamide containing 1 to 30% by weight of the inorganic filler (a) and at least one hydroxyl group when the total amount of the components (a) to (d) is 100% by weight. The resin (b) can be contained in an amount of 5 to 60% by weight, the cyanate ester resin (c) in an amount of 10 to 90% by weight, and the epoxy resin (d) in an amount of 10 to 90% by weight.
Moreover, the resin composition for the resin layer 16 can also be obtained as the resin varnish B in the same manner as the above-described components contained in the resin layer 16.

  The resin varnish B is 55 to 75% by weight of the inorganic filler (A) and 3 to 40% by weight of the epoxy resin (B) when the total amount of the components (A) to (E) is 100% by weight. %, Cyanate ester resin (C) 3 to 40% by weight, coupling agent (D) 0.05 to 1% by weight, and curing accelerator (E) 0.1 to 1% by weight. it can.

  And after coating the resin varnish A on the peeling sheet 12 using various coating apparatuses, this is dried. Or after spray-coating the resin varnish A on the peeling sheet 12 with a spray device, this is dried. Thereby, the adhesive layer 14 can be formed on the release sheet 12. Furthermore, after coating the resin varnish B on the adhesive layer 14 using various coating apparatuses, this is dried. Alternatively, the resin varnish B is spray-coated on the adhesive layer 14 with a spray device and then dried. Thereby, the resin layer 16 can be formed on the adhesive layer 14.

  Although the said coating apparatus is not specifically limited, For example, a roll coater, a bar coater, a knife coater, a gravure coater, a die coater, a comma coater, a curtain coater, etc. can be used. Among these, a method using a die coater, a knife coater, and a comma coater is preferable. Thereby, it is possible to efficiently produce a laminated material for a printed wiring board having no voids and a uniform insulating resin layer thickness.

  In the laminated material 10 for a printed wiring board thus obtained, the layer thickness of the adhesive layer 14 can be usually 0.5 to 10 μm, preferably 2 to 10 μm, and the layer thickness of the resin layer 16 is usually 1 to 1. The thickness can be 60 μm, preferably 5 to 40 μm.

  On the other hand, the layer thickness of the resin layer 16 is preferably equal to or greater than the lower limit for improving insulation reliability, and is preferably equal to or smaller than the upper limit for achieving thinning, which is one of the purposes in a multilayer wiring board. Thereby, when manufacturing a printed wiring board, while being able to fill the unevenness | corrugation of an inner-layer circuit and shaping | molding, suitable insulation resin layer thickness can be ensured.

(Prepreg)
The laminated material for a printed wiring board can also be obtained as a prepreg with a carrier provided on one side with a release sheet 12 in which a fiber base material is impregnated with a resin constituting the resin layer 16. In the present embodiment, both “a prepreg with a carrier having a release sheet 12” and “a prepreg obtained by impregnating and drying a resin base material with a resin varnish B” may be simply referred to as a “prepreg”. .

  Although it does not specifically limit as a material of a fiber base material, For example, glass fiber base materials, such as a glass fiber cloth and a glass non-fiber cloth, inorganic fiber base materials, such as a fiber cloth or a non-fiber cloth which uses inorganic compounds other than glass, and aromatic polyamide Examples thereof include organic fiber base materials composed of organic fibers such as resins, polyamide resins, aromatic polyester resins, polyester resins, polyimide resins, and fluororesins. Among these, when the glass woven fabric which is a glass fiber base material is used, the mechanical strength and heat resistance of a printed wiring board can be made favorable.

  As a method for producing a prepreg with a carrier, for example, a resin varnish B constituting the resin layer 16 is impregnated into a fiber base material in advance, a prepreg in which a solvent is volatilized by heating and drying is prepared, and a resin constituting the adhesive layer 14 is further prepared. Varnish A is applied to the prepreg, then the solvent is volatilized by heating and drying, and the release sheet 12 is bonded to the adhesive layer 14 to form a prepreg with a carrier, or the resin varnish B constituting the resin layer 16 is made of fiber. Immediately after impregnating the base material, the resin varnish A constituting the adhesive layer 14 is applied, and then the solvent is volatilized by heating and drying, and the release sheet 12 is bonded to the adhesive layer 14 to form a prepreg with a carrier. Is mentioned.

  Examples of the method of impregnating the resin base material with the resin varnish B include a method of immersing the fiber base material in the resin varnish B, a method of applying with various coaters, and a method of spraying with a spray. Among these, the method of immersing the fiber base material in the resin varnish B is preferable. Thereby, the impregnation property of the resin varnish B (epoxy resin composition) with respect to a fiber base material can be improved. In addition, when a fiber base material is immersed in the resin varnish B, a normal impregnation coating equipment can be used.

  For example, as shown in FIG. 2, the roll-shaped fiber substrate 1 is unwound and immersed in the resin varnish B 3 of the impregnation tank 2. The impregnation tank 2 is provided with dip rolls 4 (three in FIG. 2). The fiber base 1 is continuously passed through the resin varnish B 3 by the dip rolls 4, and the resin varnish 3 is passed through the fiber base 1. Impregnate. Next, the fiber base material 1 impregnated with the resin varnish B 3 is pulled up in the vertical direction and passed between a pair of squeeze rolls 5 and 5 that are arranged in parallel in the horizontal direction and face each other. Adjust the amount of resin varnish B3 impregnated into. A comma roll can be used instead of the squeeze roll. Thereafter, the fiber base material 1 impregnated with the resin varnish B 3 is heated at a predetermined temperature with a dryer 6 to volatilize the solvent in the applied varnish, and the resin varnish B 3 is semi-cured to prepare a prepreg. 7 is manufactured. In addition, the upper roll 8 in FIG. 1 rotates in the same direction as the traveling direction of the prepreg 7 in order to move the prepreg 7 in the traveling direction. Moreover, the conditions which dry the solvent of resin varnish B3 can obtain the semi-hardened prepreg 7 by drying at the temperature of 90-180 degreeC, and time 1 to 10 minutes.

Moreover, the prepreg with a carrier can also be manufactured by a manufacturing method including the following steps.
(A) Step of superimposing the surface on the resin layer 16 side of the laminated material 10 for printed wiring board on one or both sides of the fiber base material and bonding them under reduced pressure conditions (b) After bonding, the resin layer 16 is formed The process of producing the prepreg with a carrier by heat-processing at the temperature more than the glass transition temperature of the insulating resin component to be performed First, (a) process is demonstrated.
In the step (a), the laminated material 10 for printed wiring board and the fiber base material are bonded under reduced pressure conditions.

  By carrying out under reduced pressure conditions, even if there is an unfilled portion in the inside of the fiber base material or in the joint portion between the resin layer 16 of the printed wiring board laminate material 10 and the fiber base material, It can be a substantial vacuum void.

  Although it does not specifically limit as a method of joining the laminated material 10 for printed wiring boards, and a fiber base material, For example, it joins, supplying a fiber base material and the laminated material 10 for printed wiring boards continuously, and overlapping. A method is mentioned.

  In the step (a), when the resin layer 16 side of the laminated material 10 for printed wiring board and the fiber base material are joined, it is preferable to heat to a temperature at which the fluidity of the resin component of the resin layer 16 is improved. . Thereby, a fiber base material and the resin layer 16 can be joined easily. Moreover, when at least a part of the resin layer 16 is melted and impregnated inside the fiber base material, it becomes easy to obtain a prepreg with a carrier having good impregnation property.

Although it does not specifically limit as a method to heat here, For example, the method of using the laminate roll heated to predetermined temperature at the time of joining etc. can be used suitably. Although it changes with kinds and mixing | blending of resin which forms an insulating resin layer as temperature to heat here, it can implement at 60-100 degreeC.
Next, step (b) will be described.

  In the step (b), after joining in the step (a), heat treatment is performed at a temperature equal to or higher than the glass transition temperature of the insulating resin component constituting the resin layer 16 to produce a prepreg.

  Thereby, in the step (a), the reduced-pressure void or the substantial vacuum void remaining at the time when the carrier with the insulating resin layer and the fiber base material are joined can be eliminated, and the unfilled portion is very much A prepreg with a double-sided carrier with few or substantially no unfilled portions can be produced.

  Although it does not specifically limit as a method to heat-process, For example, it can implement using a hot air drying apparatus, an infrared heating apparatus, a heating roll apparatus, a flat platen hot platen press apparatus, etc.

<Application>
A metal-clad laminate or a printed wiring board can be obtained using the laminated material 10 for a printed wiring board of the present embodiment, and a semiconductor device can be manufactured using the printed wiring board. Hereinafter, a method for manufacturing a metal-clad laminate, a printed wiring board, and a semiconductor device will be described. In the printed wiring board manufacturing method, a metal-clad laminate in which both surfaces of the first and second embodiments are made of copper foil can be used as a core substrate.

(Metal-clad laminate)
A method for producing a metal-clad laminate using the printed wiring board laminate material (insulating resin sheet with film) of the present embodiment will be described below.

First, as described above, an insulating resin sheet with a first film in which the adhesive layer 14 and the resin layer 16 are sequentially laminated on the release sheet 12 is prepared. Further, an insulating resin sheet with a second film in which the resin layer 16 is laminated on the release sheet 12 is prepared. And it arrange | positions so that the resin layer 16 of an insulating resin sheet with a film may oppose both surfaces of the sheet-like fiber base material 40 (FIG. 3 (a)).
Examples of the fiber base material 40 include glass fiber base materials such as glass fiber cloth and glass non-woven cloth, inorganic fiber base materials such as fiber cloth and non-fiber cloth containing inorganic compounds other than glass, aromatic polyamide resin, polyamide resin, aromatic Examples thereof include organic fiber base materials composed of organic fibers such as polyester resin, polyester resin, polyimide resin, and fluorine resin. Among these, when the glass woven fabric which is a glass fiber base material is used, the mechanical strength and heat resistance of a printed wiring board can be made favorable.

And it laminates from both sides of an insulating resin sheet with a film at 60-130 degreeC and pressurization 0.1-5 MPa in a vacuum, and the fiber base material 40 is impregnated with the resin which comprises the resin layer 16. FIG. Thereby, the prepreg 42 with a film can be obtained (FIG.3 (b)). Next, the release sheet 12 of the prepreg 42 with a polymer film sheet is peeled off to obtain a prepreg (FIG. 3C). And while arrange | positioning so that the resin layers 16 of two prepregs may oppose, it arrange | positions so that the contact bonding layer 14 and the metal foil 44 may oppose (FIG.3 (d)). And the metal-clad laminated board 50 can be obtained by heat-press-molding from both sides (FIG.3 (e)).
The metal foil 44 is preferably made of copper or aluminum.

  The temperature at the time of heat and pressure molding is not particularly limited, but is preferably 120 to 220 ° C, particularly preferably 150 to 200 ° C. The pressure at the time of heat and pressure molding is not particularly limited, but is preferably 0.1 to 5 MPa, and particularly preferably 0.5 to 3 MPa. In this embodiment, since the prepreg is prepared with a base material, the surface smoothness of the prepreg is high and low-pressure molding is possible. Moreover, you may perform post-curing at the temperature of 150-300 degreeC with a high temperature tank etc. as needed.

  In the present embodiment, two prepregs with a single-sided metal foil are produced using the resin sheet with a metal foil of the second embodiment instead of the insulating resin sheet with the first film, the release sheet 12 is peeled off, and A metal-clad laminate can also be produced by joining the resin layers 16 together.

Further, by using a plurality of the prepregs in FIG. 3C, a metal-clad laminate in which three or more layers of prepregs are laminated can be manufactured.
In this embodiment, without using the fiber base material 40, the resin layers 16 of the two insulating resin sheets with the first film are directly bonded to each other, and after the release sheet 12 is peeled off, the exposed adhesive layer 14 is exposed. A metal-clad laminate can also be obtained by laminating the metal foil 44.

(Printed wiring board)
FIG. 4 illustrates a method for producing a printed wiring board using the laminated material for printed wiring board (insulated resin sheet with film) 10 of the present embodiment.
FIG. 4A shows an inner layer circuit board 18 in which a circuit pattern is formed on a core board (for example, a double-sided copper foil of FR-4).

  First, an opening 21 is formed by opening a hole in the core substrate using a drilling machine. Resin residue after opening is subjected to desmear treatment to remove with an oxidizing agent such as permanganate, dichromate, etc., but by using the metal-clad laminate of this embodiment as a core substrate, desmear treatment Even later, the adhesion between the adhesive layer 14 and the metal layer 16 is maintained.

  Then, the opening 21 is plated by electroless plating so that both surfaces of the inner circuit board 18 are electrically connected. Then, the inner layer circuit 17 is formed by etching the copper foil of the core substrate.

  In addition, the inner layer circuit board used when obtaining the said printed wiring board can use suitably what roughened processing, such as blackening processing, of the inner layer circuit part, for example. The opening 21 can be appropriately filled with a conductor paste or a resin paste.

  The material of the inner layer circuit 17 is preferably removable by a method such as etching or peeling in forming the inner layer circuit. In the etching, those having chemical resistance against the chemical solution used for the etching are preferable. Examples of the material of the inner layer circuit 17 include copper foil, copper plate, copper alloy plate, 42 alloy, nickel, and the like. In particular, the copper foil, the copper plate, and the copper alloy plate are most preferable for use as the inner layer circuit 17 because not only electrolytic plated products and rolled products can be selected, but also various thicknesses can be easily obtained.

  Next, using a laminated material for a printed wiring board, the resin layer 16 is laminated on the inner layer circuit board 18 side so as to cover the inner layer circuit 17 (FIG. 4B). The method for laminating the laminated material for printed wiring boards is not particularly limited, but a method of laminating using a vacuum press, a normal pressure laminator, and a laminator that is heated and pressurized under vacuum is preferable, and more preferably under vacuum. This is a method using a laminator for heating and pressurizing.

  Next, the formed resin layer 16 is cured by heating. Although the temperature to harden | cure is not specifically limited, The range of 100 to 250 degreeC is preferable. In particular, 150 ° C to 200 ° C is preferable. Moreover, in order to facilitate the next laser irradiation and removal of the resin residue, it may be in a semi-cured state. The first-layer resin layer 16 is partially cured (semi-cured) by heating at a temperature lower than the normal heating temperature, and one or more resin layers 16 are further formed on the adhesive layer 14 to form a semi-cured resin layer. The adhesive force between the resin layers 16 and between the resin layer 16 and the circuit can be improved by heating and curing again 16 to such an extent that there is no practical problem. The semi-curing temperature in this case is preferably 80 ° C to 200 ° C, more preferably 100 ° C to 180 ° C. In the next step, the laser is irradiated to form the via opening 22 in the resin, but it is necessary to peel off the release film 12 before that. The release film 12 is peeled off after the insulating resin layer is formed and then cured by heating. There is no particular problem even if it is performed either before or after heat curing.

  Next, the adhesive layer 14 and the resin layer 16 are irradiated with laser to form a via opening 22 (FIG. 4C). As the laser, an excimer laser, a UV laser, a carbon dioxide laser, or the like can be used. Formation of the via opening 22 by the laser can easily form a fine via opening 22 regardless of whether the material of the resin layer 16 is photosensitive or non-photosensitive. Therefore, it is particularly preferable when it is necessary to form fine openings in the resin layer 16.

  In addition, the desmear process which removes the resin residue etc. after laser irradiation with oxidizing agents, such as permanganate and dichromate, is performed. By the desmear process, the surface of the smooth resin layer 16 can be simultaneously roughened, and the adhesion of the conductive wiring circuit formed by subsequent metal plating can be improved. According to the laminated material 10 for a printed wiring board of this embodiment, the adhesiveness between the adhesive layer 14 and the outer layer circuit 20 is maintained after the desmear process. Since the surface of the adhesive layer 14 is uniformly provided with fine irregularities in the desmear process, adhesion with the outer layer circuit 20 is improved. Moreover, since the smoothness of the resin layer surface is high, a fine wiring circuit can be formed with high accuracy.

  Next, the outer layer circuit 20 is formed (FIG. 4D). The outer layer circuit 20 can be formed by, for example, a known method such as a semi-additive method, but the present invention is not limited thereto. Next, the conductor post 23 is formed (FIG. 4E). As a method of forming the conductor post 23, it can be formed by a known method such as electrolytic plating. For example, copper electrolytic plating can be performed using the outer layer circuit 20 as a lead for electrolytic plating, and the via opening 22 can be filled with copper to form a copper post.

  Furthermore, by repeating the steps shown in FIGS. 4B to 4E, a multi-layer structure can be obtained. When the insulating resin layer is in a semi-cured state as described above, post-curing may be performed.

  Next, a solder resist 24 is formed (FIG. 4F). In addition, in FIG.4 (f), the process shown in FIG.4 (b)-FIG.4 (e) is repeated again, and it has a multilayer structure provided with the resin layer 16 of two layers.

  The method for forming the solder resist 24 is not particularly limited. For example, a method of laminating a dry film type solder resist and forming it by exposure and development, or a method of forming a liquid resist printed by exposure and development. Is made by In addition, the electrode part for a connection can be suitably coat | covered with metal films, such as gold plating, nickel plating, and solder plating. A printed wiring board can be manufactured by such a method.

  Moreover, the other method of manufacturing the inner-layer circuit board using the laminated material for printed wiring boards (insulated resin sheet with a film) of this embodiment is shown below.

  First, two insulating resin sheets with a film in which an adhesive layer 14 and a resin layer 16 are sequentially laminated on the release sheet 12 are prepared. And it arrange | positions so that the resin layer 16 of an insulating resin sheet with a film may oppose both surfaces of the sheet-like fiber base material 40 (FIG.5 (a)).

  And it laminates from both sides of an insulating resin sheet with a film at 60-130 degreeC and pressurization 0.1-5 MPa in a vacuum, and the fiber base material 40 is impregnated with the resin which comprises the resin layer 16. FIG. Thereby, the prepreg 45 with a film can be obtained (FIG.5 (b)). Next, the release sheet 12 of the prepreg 45 with a film sheet is peeled off to obtain a prepreg (FIG. 5C). And it opens to a prepreg using a drill machine and forms the opening part 21 (FIG.5 (d)).

And the plating metal layer 46 is formed in the inner wall of the surface of the contact bonding layer 14 exposed on both surfaces, and the opening part 21 by electroless plating (FIG.5 (e)). The plated metal layer 46 is preferably made of copper or aluminum. Next, the inner metal layer circuit 17 is formed by patterning and etching the plated metal layer 46 on the adhesive layer 14 (FIG. 5F).
In the present embodiment, it is possible to form the fine inner layer circuit 17 and the like by using the plated metal layer 46 having a small layer thickness.

(Semiconductor device)
Next, a semiconductor device in which a semiconductor element is mounted on the printed wiring board of this embodiment will be described. FIG. 6 is a cross-sectional view showing an example of the semiconductor device 25 of the present invention.

  As shown in FIG. 6, a plurality of connection electrode portions 27 are provided on one surface of the printed wiring board 26. The semiconductor element 28 having the solder bump 29 provided corresponding to the connection electrode portion 27 of the printed wiring board is connected to the printed wiring board 26 via the solder bump 29.

  A liquid sealing resin 30 is filled between the printed wiring board 26 and the semiconductor element 28 to form the semiconductor device 25. The printed wiring board 26 includes an inner layer circuit 17, an insulating layer 16, an adhesive layer 14, and an outer layer circuit 20 on the inner layer circuit board 18. The inner layer circuit 17 and the outer layer circuit 20 are connected via a conductor post 23. The insulating layer 16 is covered with a solder resist 24.

  The solder bump 29 is preferably made of an alloy made of tin, lead, silver, copper, bismuth or the like. The semiconductor element 28 and the printed wiring board 26 are connected by aligning the connection electrode portion on the substrate with the metal bumps of the semiconductor element using a flip chip bonder or the like, and then using an IR reflow apparatus, a hot plate, or other heating. The solder bumps 29 are heated to a melting point or higher by using an apparatus, and the printed wiring board 26 and the solder bumps 29 on the substrate are connected by fusion bonding. In order to improve connection reliability, a metal layer having a relatively low melting point such as solder paste may be formed in advance on the connection electrode portion on the printed wiring board 26. Prior to this joining step, the connectivity can also be improved by applying a flux to the solder bumps and / or the surface layer of the connection electrode portion on the printed wiring board.

[Second Embodiment]
As shown in FIG. 7, the laminated material 10 for a printed wiring board according to the present embodiment includes an adhesive layer 14 and a resin layer 16 constituting an insulating layer of the printed wiring board on a supporting base material (metal foil 13). They are laminated in order. The resin layer 16 has a water absorption of 1 to 2.5% of the cured product and includes 55 to 75% by weight of an inorganic filler. Since the adhesive layer 14 and the resin layer 16 constituting the insulating layer of the printed wiring board can be the same as those in the first embodiment, description thereof will be omitted below.

  When the resin layer 16 satisfies both the water absorption rate and the content of the inorganic filler as described above, the thermal expansion coefficient of the resin layer 16 can be lowered, and the metal foil 13 and the adhesive layer 14 can be reduced. Excellent adhesion. Therefore, according to the laminated material 10 for a printed wiring board of the present embodiment, the metal-clad laminated board, the printed wiring board, which are excellent in mounting reliability and connection reliability, and excellent in adhesion with a metal pattern, A semiconductor device in which a semiconductor element is mounted on a printed wiring board can be provided.

<Metal foil 13>
Similarly to the release sheet 12 of the first embodiment, the metal foil 13 may be used after being peeled after the laminated material 10 for the printed wiring board is laminated on the inner layer circuit. It may be used as a circuit. When used as a conductor circuit, the metal foil 13 is preferably made of copper or aluminum.

Although the thickness of the metal foil 13 is not specifically limited, Usually, 1-100 micrometers, Preferably it is 2-35 micrometers. When the thickness of the metal foil 13 is within the above range, the handling is easy and the flatness of the resin layer 16 is excellent.
Moreover, the laminated material 10 for printed wiring boards and the prepreg can be manufactured in the same manner as in the first embodiment.

  The metal foil 13 can also be an ultrathin metal foil with a carrier foil. The ultrathin metal foil with a carrier foil is a metal foil obtained by laminating a peelable carrier foil and an ultrathin metal foil. Since an ultra-thin metal foil layer can be formed on both sides of the insulating layer by using an ultra-thin metal foil with a carrier foil, for example, when forming a circuit by a semi-additive method, etc. By electroplating the metal foil directly as the power feeding layer, the ultrathin copper foil can be flash etched after the circuit is formed. By using an ultra-thin metal foil with a carrier foil, even with an ultra-thin metal foil having a thickness of 10 μm or less, for example, a reduction in handling properties of the ultra-thin metal foil in a pressing process, and cracking or cutting of the ultra-thin copper foil are prevented. Can do.

<Application>
A metal-clad laminate or a printed wiring board can be obtained using the laminated material 10 for a printed wiring board of the present embodiment, and a semiconductor device can be manufactured using the printed wiring board. Hereinafter, a method for manufacturing a metal-clad laminate, a printed wiring board, and a semiconductor device will be described. In addition, in the manufacturing method of a printed wiring board, the metal-clad laminated board by which both surfaces of 2nd Embodiment were created with copper foil can also be used.

(Metal-clad laminate)
A method for producing a metal-clad laminate using the laminated material for printed wiring boards of this embodiment (insulating resin sheet with metal foil) will be described below.

  First, as described above, two insulating resin sheets with metal foil in which the adhesive layer 14 and the resin layer 16 are sequentially laminated on the metal foil 13 are prepared. And it arrange | positions so that the resin layer 16 of an insulating resin sheet with metal foil may oppose both surfaces of the sheet-like fiber base material 40 (FIG. 8 (a)). And it laminates from the both sides of the insulating resin sheet with metal foil at 60-130 degreeC and pressurization 0.1-5 MPa in a vacuum, and the fiber base material 40 is impregnated with the resin which comprises the resin layer 16. FIG. Thereby, the prepreg 52 with metal foil can be obtained (FIG.8 (b)). Next, the metal-clad laminate 54 can be obtained by directly heating and pressing the prepreg 52 with metal foil (FIG. 8C).

(Printed wiring board)
FIG. 9 illustrates a method for producing a printed wiring board using a laminated material for printed wiring boards (insulating resin sheet with metal foil). As shown in FIG. 9A, the resin layer 16 of the laminated material for printed wiring board is laminated on the inner circuit board 18 side so as to cover the inner circuit 17. The method for laminating the laminated material for the printed wiring board is not particularly limited as in the first embodiment, but a method of laminating using a vacuum press, a normal pressure laminator, and a laminator that is heated and pressurized under vacuum is preferable. More preferably, it is a method of laminating using a laminator that is heated and pressurized under vacuum.
Next, a via opening is provided in the printed wiring board laminate material.

  First, the metal foil 13 is etched by a predetermined etching method to form an opening. Then, the resin layer 16 exposed at the bottom of the opening is irradiated with a laser to form a via opening (FIG. 9C).

  After the laser irradiation, desmear treatment is performed with an oxidizing agent such as permanganate or dichromate in order to remove a resin residue or the like in the via opening. By the desmear process, the adhesion of the conductive wiring circuit formed by the subsequent metal plating can be improved. According to the printed wiring board laminate material 10 of the present embodiment, the adhesion between the adhesive layer 14 and the metal layer 16 is maintained even after the desmear treatment.

  Then, the insulating resin layers are connected by metal plating, and the outer layer circuit pattern is formed by etching (FIG. 9D). Thereafter, a printed wiring board can be obtained in the same manner as in the first embodiment.

  In addition, if an insulating resin sheet with a metal foil using a thick copper foil is used, it becomes difficult to make a fine pitch in the subsequent circuit pattern production, so use an ultrathin copper foil of 1 to 5 μm, or a copper of 12 to 18 μm. In some cases, the foil is half-etched to a thickness of 1 to 5 μm by etching. In some cases, the copper foil and the insulating layer may be pierced together. At this time, the copper foil is preferably thin, and half etching or ultrathin copper foil is used.

On the other hand, when the copper foil is entirely etched using the fact that fine irregularities on the surface of the copper foil are transferred to the surface of the insulating resin layer, a printed wiring board can be produced in the same manner as in the first embodiment. Thereby, the adhesion between the circuit and the resin layer 16 can be improved by the fine unevenness formed in the adhesive layer 14.
By using such a printed wiring board, a semiconductor device can be manufactured as in the first embodiment.

  EXAMPLES Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited to these examples.

Example 1
1. Production of varnish
1.1. Production of Adhesive Layer Forming Resin Varnish (1A) 30 parts by weight of a hydroxyl group-containing polyamide resin (Nippon Kayaku Co., Ltd., BPAM01), and spherical silica slurry (manufactured by Admatechs Co., Ltd., SX009) 15 parts by weight of an average particle size), 35 parts by weight of HP-5000 (manufactured by DIC) as an epoxy resin, 19.4 parts by weight of phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin, 0.1 parts by weight of an epoxy silane coupling agent (manufactured by Nihon Unicar Co., Ltd., A187) as a coupling agent, and 0.5 parts by weight of imidazole (manufactured by Shikoku Kasei Co., Ltd., Curazole 1B2PZ) as a curing catalyst are dimethylacetamide using a high-speed stirring device And mixed with methyl ethyl ketone for 60 minutes The resin varnish for forming an adhesive layer (1A) in contact with a base material having a solid content of 30% was stirred.

1.2. Production of Resin Varnish (1B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS as cyclic siloxane compound (Reagent) 0.5 parts by weight, 20 parts by weight of dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin 10 parts by weight, 3.8 parts by weight of a phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275), 0.5 parts by weight of an epoxy silane coupling agent (Nihon Unicar Co., A187) as a coupling agent, and imidazole as a curing catalyst ( Shikoku Kasei Co., Ltd., Curazole 1B2PZ) By adding parts, then stirred for 60 minutes using a high speed stirrer to prepare a 70% solids resin varnish (1B).

2. Production of Resin Sheet (Laminated Material for Printed Wiring Board) Adhesive layer after drying the resin varnish (1A) obtained above on one side of a PET (polyethylene terephthalate) film having a thickness of 36 μm using a comma coater device The film was coated to a thickness of 5 μm and dried for 3 minutes with a drying apparatus at 160 ° C. to form an adhesive layer.
Next, a resin varnish (1B) is applied to the upper surface of the adhesive layer using a comma coater device so that the total thickness of the resin layer after drying is 30 μm, and this is applied with a drying apparatus at 160 ° C. It dried for 3 minutes and obtained the resin sheet by which the contact bonding layer and the resin layer were laminated | stacked on PET film.

3. Preparation of cured resin plate A Resin varnish (1B) was directly coated on a PET film, and this was dried for 3 minutes with a drying device at 160 ° C., thereby forming a resin layer having a thickness of 30 μm on the PET film. Three were created. The resin layers of two of these resin sheets were bonded together, and one PET film was peeled off to expose the resin layer on one side. Furthermore, the resin layer of the remaining resin sheet was bonded to the exposed adhesive layer. The PET on both sides was peeled off, and the glossy surfaces of the copper foil were laminated on both sides, and heated and pressurized with a vacuum press at 200 ° C. and 1.5 MPa to obtain a cured resin plate A having a thickness of 90 μm in which three resin layers were laminated. It was.

4). Production of cured resin plate B The resin layers of the two resin sheets obtained above were bonded together, the PET on both sides was peeled off, the glossy surfaces of the copper foil were laminated on both sides, and 200 ° C., 1.5 MPa of vacuum press. Heated and pressurized under the conditions to obtain a cured resin plate B having an adhesive layer on both sides.

5. Production of Printed Wiring Board A printed wiring board was first manufactured in order to measure the surface roughness (Ra) and plating peel strength described later.
The printed wiring board is superposed on the front and back of the inner layer circuit board on which the predetermined inner layer circuit pattern is formed on both sides with the insulating layer surface of the resin sheet obtained above inside, and this is applied using a vacuum pressure laminator device. Then, vacuum heating and pressing were performed at a temperature of 100 ° C. and a pressure of 1 MPa, and then heat-curing was performed at 170 ° C. for 60 minutes in a hot air drying apparatus to produce a printed wiring board.
In addition, the following copper clad laminated board was used for the inner layer circuit board.
-Insulating layer: Halogen-free FR-4 material, thickness 0.4mm
Conductor layer: copper foil thickness 18 μm, L / S = 120/180 μm, clearance holes 1 mmφ, 3 mmφ, slit 2 mm

6). Production of Semiconductor Device The substrate was peeled off from the printed wiring board obtained above to form a φ60 μm opening (blind via hole) using a carbonic acid laser device, and a 60 ° C. swelling liquid (manufactured by Atotech Japan Co., Ltd., It was immersed in Swelling Dip Securigant P) for 10 minutes, and further immersed in an aqueous solution of potassium permanganate at 80 ° C. (Atotech Japan Co., Ltd., Concentrate Compact CP) for 20 minutes, followed by neutralization and roughening treatment. .
After passing through the steps of degreasing, applying a catalyst, and activating this, an electroless copper plating film was formed to have a thickness of about 1 μm and an electroplating copper film of 30 μm, and annealed at 200 ° C. for 60 minutes in a hot air drying apparatus.
Next, a solder resist (manufactured by Taiyo Ink Manufacturing Co., Ltd., PSR-4000 AUS703) is printed, exposed with a predetermined mask so that the semiconductor element mounting pads and the like are exposed, developed and cured, and then on the circuit. The solder resist layer was formed to have a thickness of 12 μm.
Finally, an electroless nickel plating layer of 3 μm is formed on the circuit layer exposed from the solder resist layer, and further, an electroless gold plating layer of 0.1 μm is formed thereon. Cut to × 50 mm size to obtain a printed wiring board for a semiconductor device.
The semiconductor device is mounted with a semiconductor element (TEG chip, size 15 mm × 15 mm, thickness 0.8 mm) having solder bumps on the printed wiring board for the semiconductor device by means of thermocompression bonding using a flip chip bonder device, After melting and bonding the solder bumps in an IR reflow furnace, a liquid sealing resin (manufactured by Sumitomo Bakelite Co., Ltd., CRP-4152S) was filled and the liquid sealing resin was cured. The liquid sealing resin was cured at a temperature of 150 ° C. for 120 minutes.
In addition, the solder bump of the said semiconductor element used what was formed with the eutectic of Sn / Pb composition.

(Example 2)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (2A) was used instead of the resin varnish (1A).

Preparation of resin varnish (2A) for forming an adhesive layer 35 parts by weight of a polyamide resin containing hydroxyl groups (manufactured by Nippon Kayaku Co., Ltd., BPAM01), 40 parts by weight of HP-5000 (manufactured by DIC) as an epoxy resin, phenol as a cyanate ester resin 24.5 parts by weight of a novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) and 0.5 parts by weight of imidazole (manufactured by Shikoku Kasei Co., Ltd., Curazole 1B2PZ) as a curing catalyst were mixed between dimethylacetamide and methyl ethyl ketone using a high-speed stirrer. The mixture was stirred with a mixed solvent for 60 minutes to prepare a varnish (2A) in contact with a substrate having a solid content of 30%.

(Example 3)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (3A) was used instead of the resin varnish (1A).

Preparation of Resin Varnish (3A) for Adhesive Layer Formation 30 parts by weight of a polyamide resin containing hydroxyl groups (manufactured by Nippon Kayaku Co., Ltd., BPAM01), 15 parts by weight of spherical silica slurry (manufactured by Admatechs, SC1030, average particle size 300 nm), 35 parts by weight of HP-5000 (manufactured by DIC) as an epoxy resin, 19.4 parts by weight of a phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin, and an epoxy silane coupling agent (as a coupling agent) Nippon Unicar Co., Ltd., A187) 0.1 parts by weight, and a curing catalyst, 0.5 parts by weight of imidazole (manufactured by Shikoku Kasei Co., Ltd., Curazole 1B2PZ) was stirred for 60 minutes with a mixed solvent of dimethylacetamide and methyl ethyl ketone using a high-speed stirrer. In contact with a substrate with a solid content of 30% Vinegar (3A) was prepared.

Example 4
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (4B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (4B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, PMCPS (reagents) as cyclic siloxane compound ) 0.5 parts by weight, 20 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 10 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst Co., Ltd., Curazole 1B2PZ) 0.2 layer An amount part was added, and it stirred for 60 minutes using the high-speed stirring apparatus, and prepared varnish (4B) of 70% of solid content.

(Example 5)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (5B) was used instead of the resin varnish (1B).

Production of Resin Varnish (5B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 20 parts by weight of methoxynaphthalene aralkyl type epoxy resin (manufactured by DIC, HP-5000) as an epoxy resin, 10 parts by weight of phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst (Corazole 1B2PZ) 0.2 part by weight was added, and the mixture was stirred for 60 minutes using a high-speed stirrer to prepare a varnish (5B) having a solid content of 70%.

(Example 6)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (6B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (6B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 20 parts by weight of dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, 10 parts by weight of dicyclopentadiene type cyanate resin (manufactured by LONZA, DT-4000) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst 0.2 parts by weight of Curesol 1B2PZ) , Stirred for 60 minutes using a high speed stirrer to prepare a 70% solids varnish (6B).

(Example 7)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (7B) was used instead of the resin varnish (1B).

Production of Resin Varnish (7B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 20 parts by weight of dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as epoxy resin, 3.8 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-4275), phenol resin ( Nippon Kayaku Co., Ltd., GPH-103) 10 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole as a curing catalyst (Shikoku Kasei Co., Ltd., Curazole 1B2PZ) 0.2 part by weight was added and stirred for 60 minutes using a high-speed stirrer. Varnish (7B) was prepared.

(Example 8)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (8A) was used instead of the resin varnish (1A).

Preparation of Resin Varnish (8A) for Adhesive Layer Formation Polyamide resin containing hydroxyl group (Nippon Kayaku Co., Ltd., BPAM01) 40 parts by weight, epoxy resin HP-5000 (manufactured by DIC) 58 parts by weight, curing catalyst imidazole ( 2 parts by weight of Shikoku Kasei Co., Ltd., Curazole 1B2PZ) was stirred with a mixed solvent of dimethylacetamide and methyl ethyl ketone for 60 minutes using a high-speed stirrer to prepare a varnish (8A) in contact with a substrate having a solid content of 30%.

Example 9
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (9A) was used instead of the resin varnish (1A).

Preparation of resin varnish (9A) for forming an adhesive layer 25 parts by weight of spherical silica slurry (manufactured by Admatechs, SC1030, average particle size 300 nm), 45 parts by weight of HP-5000 (manufactured by DIC) as an epoxy resin, and cyanate ester resin 29.6 parts by weight of a phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) and 0.4 parts by weight of imidazole (manufactured by Shikoku Kasei Co., Ltd., Curazole 1B2PZ) as a curing catalyst were mixed with dimethylacetamide using a high-speed stirrer. The mixture was stirred for 60 minutes with a mixed solvent of methyl ethyl ketone to prepare an insulating layer varnish (9A) in contact with a substrate having a solid content of 30%.

(Example 10)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (10B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (10B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 20 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 10 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, 3.5 parts by weight of a phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275), 0.5 parts by weight of an epoxy silane coupling agent (Nihon Unicar Co., A187) as a coupling agent, and tetraphenylphosphonium as a curing accelerator And bis (naphthalene-2,3-di 0.5 part by weight of an adduct of oxy) phenyl silicate (manufactured by Sumitomo Bakelite Co., Ltd., C05-MB) was added, and the mixture was stirred for 60 minutes using a high-speed stirrer to prepare a varnish (10B) having a solid content of 70%. .

(Example 11)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (11B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (11B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-31R, average particle size 1.0 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 20 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 10 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst (Corazole 1B2PZ) 0.2 Part by weight was added, and the mixture was stirred for 60 minutes using a high-speed stirring device to prepare a resin varnish (11B) having a solid content of 70%.

(Example 12)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (12B) was used instead of the resin varnish (1B).

Production of Resin Varnish (12B) for Resin Layer Formation As inorganic filler, 50 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) and spherical fused silica (manufactured by Admatechs, SO -22R, average particle size 0.3 μm) 15 parts by weight, methyl ethyl ketone as solvent, TMCTS (reagent) 0.5 part by weight as cyclic siloxane compound, dicyclopentadiene type epoxy resin as epoxy resin (manufactured by DIC, HP-7200) 20 parts by weight, phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as cyanate ester resin, 3.8 parts by weight, phenoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-4275), epoxy as coupling agent Silane coupling agent (made by Nihon Unicar Company, A187 0.5 part by weight, 0.2 part by weight of imidazole (Curesol 1B2PZ, manufactured by Shikoku Kasei Co., Ltd.) is added as a curing catalyst, and the mixture is stirred for 60 minutes using a high-speed stirrer, and a resin varnish (12B) having a solid content of 70% Was prepared.

(Example 13)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (13B) was used instead of the resin varnish (1B).

Production of Resin Varnish (13B) for Resin Layer Formation 65 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, dicyclopentadiene type as epoxy resin 26 parts by weight of an epoxy resin (manufactured by DIC, HP-7200), 5 parts by weight of a phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin, phenoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-4275) 3.3 parts by weight, 0.5 parts by weight of an epoxy silane coupling agent (manufactured by Nihon Unicar Co., A187) as a coupling agent, and 0.2 parts by weight of imidazole (manufactured by Shikoku Kasei Co., Ltd., Curazole 1B2PZ) are added as a curing catalyst. And stir for 60 minutes using a high speed stirrer. A 0% resin varnish (13B) was prepared.

(Example 14)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (14B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (14B) for Resin Layer Formation 55 parts by weight of spherical fused silica (manufactured by Admatechs, SO-31R, average particle size 1.0 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 43 parts by weight of an epoxy resin dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200), 0.5 parts by weight of an epoxy silane coupling agent (manufactured by Nihon Unicar, A187) as a coupling agent 1 part by weight of an adduct of tetraphenylphosphonium and bis (naphthalene-2,3-dioxy) phenyl silicate (manufactured by Sumitomo Bakelite Co., Ltd., C05-MB) is added as a curing accelerator, and a high-speed stirring device is used to add 60 parts by weight. The mixture was stirred for a minute to prepare a varnish (14B) having a solid content of 70%.

(Example 15)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (15B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (15B) for Resin Layer Formation 60 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 23 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 12 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst (Corazole 1B2PZ) 0.2 A part by weight was added and stirred for 60 minutes using a high-speed stirrer to prepare a resin varnish (15B) having a solid content of 70%.

(Example 16)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (16B) was used instead of the resin varnish (1B).

Preparation of resin varnish for resin layer formation (16B) Spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) 70 parts by weight as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 18 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 7 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst Co., Ltd., Curazole 1B2PZ) 0.2 layer An amount part was added, and it stirred for 60 minutes using the high-speed stirring apparatus, and prepared the resin varnish (16B) of solid content 70%.

(Example 17)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (17B) was used instead of the resin varnish (1B).

Production of Resin Varnish (17B) for Resin Layer Formation As inorganic filler, 10 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) and spherical fused silica (manufactured by Admatechs, SO -C6, average particle diameter 2.2 μm) 55 parts by weight, methyl ethyl ketone as solvent, TMCTS (reagent) 0.5 part by weight as cyclic siloxane compound, dicyclopentadiene type epoxy resin as epoxy resin (manufactured by DIC, HP-7200) 20 parts by weight, phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as cyanate ester resin, 3.8 parts by weight, phenoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-4275), epoxy as coupling agent Silane coupling agent (manufactured by Nihon Unicar Company, A187) 0.5 part by weight, 0.2 part by weight of imidazole (Curesol 1B2PZ, manufactured by Shikoku Kasei Co., Ltd.) is added as a curing catalyst, and the mixture is stirred for 60 minutes using a high-speed stirrer to give a resin varnish (17B) having a solid content of 70% Prepared.

(Example 18)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (18B) was used instead of the resin varnish (1B).

Production of Resin Varnish (18B) for Resin Layer Formation As inorganic filler, 35 parts by weight of spherical fused silica (manufactured by Admatechs, SO-31R, average particle size 1.0 μm) and spherical fused silica (manufactured by Admatechs, SO -C6, average particle size 2.2 μm) 25 parts by weight, methyl ethyl ketone as solvent, TMCTS (reagent) 0.5 part by weight as cyclic siloxane compound, dicyclopentadiene type epoxy resin as epoxy resin (manufactured by DIC, HP-7200) 28 parts by weight, 12 parts by weight of phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as cyanate ester resin, 3.8 parts by weight of phenoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-4275), epoxy as coupling agent Silane coupling agent (manufactured by Nihon Unicar Company, A187) 0.5 part by weight, 0.2 part by weight of imidazole (Curesol 1B2PZ, manufactured by Shikoku Kasei Co., Ltd.) is added as a curing catalyst, and the mixture is stirred for 60 minutes using a high-speed stirrer to give a resin varnish (18B) having a solid content of 70% Prepared.

(Example 19)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (19B) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (19B) for Resin Layer Formation 72 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.7 parts by weight, 20 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, 3 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.6 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst Co., Ltd., Curazole 1B2PZ) 0.2 layer An amount part was added, and it stirred for 60 minutes using the high-speed stirring apparatus, and prepared the resin varnish (19B) of solid content 70%.

(Example 20)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (20B) was used instead of the resin varnish (1B).

Production of Resin Varnish (20B) for Resin Layer Formation As inorganic fillers, 59 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) and spherical fused silica (manufactured by Admatechs, SO -22R, average particle size 0.3 μm) 6 parts by weight, methyl ethyl ketone as solvent, TMCTS (reagent) 0.5 part by weight as cyclic siloxane compound, dicyclopentadiene type epoxy resin as epoxy resin (manufactured by DIC, HP-7200) 20 parts by weight, phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as cyanate ester resin, 3.8 parts by weight, phenoxy resin (manufactured by Mitsubishi Chemical Corporation, jER-4275), epoxy as coupling agent Silane coupling agent (manufactured by Nihon Unicar Company, A187) 0.5 part by weight, 0.2 part by weight of imidazole (Curesol 1B2PZ, manufactured by Shikoku Kasei Co., Ltd.) is added as a curing catalyst, and the mixture is stirred for 60 minutes using a high-speed stirrer, and a resin varnish (12B) having a solid content of 70% Prepared.

(Comparative Example 1)
A resin sheet and a cured resin plate were obtained in the same manner as in Example 1 except that the following resin varnish (1C) was used instead of the resin varnish (1B). In addition, plating swelling occurred during the production of the printed wiring board, and the printed wiring board and the semiconductor device could not be obtained.

Production of Resin Varnish (1C) for Resin Layer Formation 80 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 10 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, 5 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, 3.5 parts by weight of a phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275), 0.5 parts by weight of an epoxy silane coupling agent (Nihon Unicar Co., A187) as a coupling agent, and tetraphenylphosphonium as a curing accelerator And bis (naphthalene-2,3-dioxy Ii) Add 0.5 parts by weight of an adduct of phenyl silicate (manufactured by Sumitomo Bakelite Co., C05-MB) and stir for 60 minutes using a high-speed stirrer to prepare a resin varnish (1C) with a solid content of 70%. did.

(Comparative Example 2)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (2C) was used instead of the resin varnish (1B).

Preparation of resin varnish (2C) for resin layer formation 30 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 30 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 15 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 8.2 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, tetraphenylphosphonium as a curing accelerator And bis (naphthalene-2,3-dio Xyl) Adduct of phenyl silicate (Sumitomo Bakelite Co., Ltd., C05-MB) (0.8 part by weight) was added, and the mixture was stirred for 60 minutes using a high-speed stirrer to prepare a resin varnish (2C) having a solid content of 70%. did.

(Comparative Example 3)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (3C) was used instead of the resin varnish (1B).

Preparation of resin varnish for resin layer formation (3C) Spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) 70 parts by weight as inorganic filler, methyl ethyl ketone as solvent, dicyclopentadiene type as epoxy resin 3 parts by weight of an epoxy resin (manufactured by DIC, HP-7200), 26 parts by weight of a phenol novolac-type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin, an epoxy silane coupling agent (Nihon Unicar) as a coupling agent A187) 0.5 parts by weight, and 0.5 part by weight of an adduct of tetraphenylphosphonium and bis (naphthalene-2,3-dioxy) phenyl silicate (manufactured by Sumitomo Bakelite Co., C05-MB) as a curing accelerator Add and stir for 60 minutes using a high speed stirrer The mixture was stirred to prepare a resin varnish (3C) having a solid content of 70%.

(Comparative Example 4)
A resin sheet and a cured resin plate were obtained in the same manner as in Example 1 except that the adhesive layer was formed directly on the PET film without forming the adhesive layer. In addition, plating swelling occurred during the production of the printed wiring board, and the printed wiring board and the semiconductor device could not be obtained.

(Comparative Example 5)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (5C) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (5C) for Resin Layer Formation 70 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.5 parts by weight, 13 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, 13 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 2.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst Co., Ltd., Curazole 1B2PZ) 0.2 layer An amount part was added, and it stirred for 60 minutes using the high-speed stirring apparatus, and prepared the resin varnish (5C) of 70% of solid content.

(Comparative Example 6)
A resin sheet, a cured resin plate, a printed wiring board, and a semiconductor device were obtained in the same manner as in Example 1 except that the following resin varnish (6C) was used instead of the resin varnish (1B).

Preparation of Resin Varnish (6C) for Resin Layer Formation 50 parts by weight of spherical fused silica (manufactured by Admatechs, SO-25R, average particle size 0.5 μm) as inorganic filler, methyl ethyl ketone as solvent, TMCTS (reagent) ) 0.4 parts by weight, 30 parts by weight of a dicyclopentadiene type epoxy resin (manufactured by DIC, HP-7200) as an epoxy resin, and 15 parts by weight of a phenol novolac type cyanate resin (manufactured by LONZA, Primaset PT-30) as a cyanate ester resin Parts, phenoxy resin (Mitsubishi Chemical Co., Ltd., jER-4275) 3.8 parts by weight, epoxy silane coupling agent (Nihon Unicar Co., A187) 0.5 part by weight as a coupling agent, imidazole (Shikoku Chemicals) as a curing catalyst Co., Ltd., Curazole 1B2PZ) 0.3 layer An amount part was added, and it stirred for 60 minutes using the high-speed stirring apparatus, and prepared the resin varnish (6C) of 70% of solid content.

  Tables 1 to 3 show the composition tables of the resin varnishes used in each example and comparative example, and the evaluation results obtained for the resin sheet, prepreg, printed wiring board, and semiconductor device obtained in each example and comparative example.

Each evaluation item was performed by the following method.
(1) Water absorption rate of the cured product constituting the resin layer The obtained cured resin plate A was cut into a 50 mm square and used as a sample, and the sample weight after being left in a dryer at 120 ° C. for 2 hours, and 121 ° C., humidity 100 % Of the sample after being left in a tank for 2 hours was measured, and the water absorption rate of the cured product was calculated from the following formula.
Water absorption rate (%) of the cured product constituting the resin layer
= ((B−A) / A) × 100 × (100 / (100−X))
A: Weight after being left in a dryer at 120 ° C. for 2 hours (mg)
B: Weight after being left in a bath at 121 ° C. and 100% humidity for 2 hours (mg)
X:% by weight (%) of inorganic filler in the resin layer (100% by weight)

(2) Thermal expansion coefficient A sample for evaluation of 4 mm × 20 mm was collected from the obtained cured resin plate B, and was used at 10 ° C./min using a TMA (thermomechanical analysis) apparatus (TA Instruments). The temperature was raised from 0 ° C. to 260 ° C. and measured, and the expansion coefficient from 50 ° C. to 100 ° C. was calculated.

(3) Workability (laminate)
On a circuit board having a circuit layer with line width / interline / thickness = 20 μm / 20 μm / 10 μm, the insulating resin sheet with film obtained above is laminated by a vacuum laminating apparatus under the conditions of a temperature of 120 ° C. and a pressure of 1.0 MPa After (laminate), the film was peeled off and heat-treated with a dryer at a temperature of 170 ° C. for 1 hour to cure the resin composition to form an insulating resin layer. The cross section of the obtained circuit board having the insulating resin layer was observed, and the embedding property of the resin between the lines was evaluated according to the following criteria.
◎: Good Resin is embedded without gaps ○: Substantially no problem Small circular void of less than 2 μm △: Virtually not usable Void of 2 μm or more
×: Unusable Embedding failure

(4) Surface roughness after desmear treatment (desmear property)
After roughening the printed wiring board obtained above, the surface roughness (Ra) was measured with a laser microscope (manufactured by KEYENCE, VK-8510, conditions; PITCH 0.02 μm, RUNmode color ultra-deep). Ra was measured at 10 points, and an average value of 10 points was obtained.

(5) Plating peel The peel strength of the plated copper film was measured from the printed wiring board based on JIS C-6481.

(6) Insulation reliability between vias Fabricate 50 μm and 100 μm printed wiring boards between via walls, apply a voltage of 20 V under the condition of PCT-130 ° C / 85%, and confirm the insulation after 200 hours. The evaluation was based on the following criteria.
：: 1E08Ω or more was maintained after treatment for 200 hours in both 50 μm and 100 μm between the via walls.
○: 1E08Ω or more was maintained after 200 hours of treatment at 100 μm between via walls.
Δ: Either 50 μm or 100 μm between the via walls is not short-circuited, but 1E08Ω cannot be maintained.
X: A short circuit occurred at either 50 μm or 100 μm between the via walls.

(7) Thermal shock test The semiconductor device obtained above is treated in 1000 cycles for 1 cycle at -55 ° C for 30 minutes and 125 ° C for 30 minutes in Fluorinert, and cracks are not generated on the substrate or semiconductor element. Confirmed and evaluated according to the following criteria.
○: No abnormality ×: Crack occurred

(8) Heat resistance The semiconductor device obtained above was passed through a 260 ° C. reflow furnace, the presence or absence of swelling was confirmed by cross-sectional observation, and evaluated according to the following criteria. The semiconductor device was passed through a reflow furnace 30 times.
As the reflow conditions, the temperature is gradually raised from room temperature (25 ° C.) to 160 ° C. (50 to 60 seconds). Next, the temperature is increased from 160 ° C. to 200 ° C. over 50 to 60 seconds. Thereafter, the temperature is raised from 200 ° C. to 260 ° C. in 65 to 75 seconds, and further heated (reflowed) at a temperature of 260 to 262 ° C. for 5 to 10 seconds. Then, it is the conditions (cooling) to cool to 30 degreeC over 15 minutes.
○: No abnormality ×: There is swelling between copper and resin in cross-sectional observation

  From the above results, in Examples 1 to 20 using the resin sheet (laminated material for printed wiring board) of the present invention, the water absorption of the cured product constituting the resin layer is in the range of 1 to 2.5%. In addition, since the inorganic filler is contained in the range of 55 to 75% by weight, it has a low thermal expansion coefficient and excellent adhesion between the adhesive layer and the plated metal layer (plating peel strength).

On the other hand, as shown in Comparative Examples 1-3, 4 and 5, when the water absorption rate of the cured product constituting the resin layer or the content of the inorganic filler deviates from the above numerical range, the low thermal expansion coefficient and adhesion It was confirmed that compatibility of adhesion between the layer and the plated copper film could not be achieved. Further, from the results of Comparative Example 4, even if the water absorption rate of the cured product constituting the resin layer and the content of the inorganic filler are within the above numerical range, plating swelling occurs when the adhesive layer is not provided. A multilayer wiring board could not be formed.
The laminated material for printed wiring board of Comparative Example 1 or 3 is a conventional low thermal expansion material in which the inorganic filler ratio exceeds 70%, and the water absorption rate of the cured product constituting the resin layer is about 3%. Therefore, it was confirmed that the adhesiveness between the adhesive layer and the plated copper film was low.

Furthermore, when the adhesive layer contains an inorganic filler having an average particle size of 0.1 μm or less, it was confirmed that moderately fine irregularities were formed on the surface in the desmear treatment, and the adhesion to the plated metal was improved.
Further, from the results of Examples 17 to 20, the sum of the surface area of the inorganic filler contained in the resin layer per unit weight ^is within a range of 1.8m ² /g~4.5m 2 / g, plating It was confirmed that it was particularly excellent in the balance between the adhesiveness of the metal layer, the moldability of the adhesive layer 14, and the insulation reliability.

  In addition, from the results of Examples using an insulating resin sheet with a film that is a laminated material for a printed wiring board according to the present invention, even when a semiconductor device is manufactured using an insulating resin sheet with a metal foil, the low thermal expansion coefficient and adhesion It was inferred that all physical properties such as adhesion (plating peel strength) between the layer and the plated metal layer were excellent.

DESCRIPTION OF SYMBOLS 1 Fiber base material 2 Impregnation tank 3 Epoxy resin varnish 4 Dip roll 5 Squeeze roll 6 Dryer 7 Prepreg 8 Upper roll 10 Laminated material 12 for printed wiring boards Release sheet 13 Metal foil 14 Adhesive layer 16 Resin layer 17 Inner circuit 18 Inner circuit Substrate 20 Outer layer circuit 21 Opening portion 22 Via opening portion 23 Conductor post 24 Solder resist 25 Semiconductor device 26 Printed wiring board 27 Connecting electrode portion 28 Semiconductor element 29 Solder bump 30 Liquid sealing resin 40 Fiber base material 42 Prepreg with film 44 Metal Foil 45 Prepreg with film 46 Metal plating layer 50 Metal-clad laminate 52 Metal prepreg 54 with metal foil Metal-clad laminate

Claims (16)

A laminated material for a printed wiring board in which an adhesive layer and a resin layer constituting an insulating layer of a printed wiring board are sequentially laminated on a supporting substrate,
The said resin layer is 1-2.5% of the water absorption rate of the hardened | cured material except an inorganic filler, and contains 55-75 weight% of inorganic fillers, The laminated material for printed wiring boards characterized by the above-mentioned.   The laminated material for a printed wiring board according to claim 1, wherein the adhesive layer contains an inorganic filler having an average particle diameter of 0.1 μm or less.   The laminated material for a printed wiring board according to claim 1, wherein the adhesive layer contains an aromatic polyamide resin containing at least one hydroxyl group.   The laminated material for a printed wiring board according to claim 3, wherein the aromatic polyamide resin containing at least one hydroxyl group includes a segment in which four or more carbon chains having a diene skeleton are connected.   The laminated material for a printed wiring board according to any one of claims 1 to 4, wherein the resin layer includes a dicyclopentadiene type epoxy resin.   The laminate material for a printed wiring board according to any one of claims 1 to 5, wherein the resin layer includes a cyanate ester resin. The sum of the surface area of the inorganic filler contained in the resin layer per unit weight, to any one of claims 1 to 6, characterized in that a 1.8m ² /g~4.5m ² / ^g The laminated material for printed wiring boards as described.   8. The printed wiring board according to claim 1, wherein the resin layer contains a cyclic or cage-type siloxane compound having at least two Si—H bonds or Si—OH bonds. 9. Laminated material. The laminated material for a printed wiring board according to claim 8, wherein the cyclic siloxane compound is represented by the following general formula (1).

(In the formula, x represents an integer of 2 or more and 10 or less, and n represents 1 or 2. R ₁ may be the same or different and contains an atom selected from an oxygen atom, a boron atom or a nitrogen atom. R ₂ may be the same or different and each represents a hydrogen atom or a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, provided that at least two of R ₁ and R ₂ are a hydrogen atom or a hydroxyl group .) The laminated material for a printed wiring board according to claim 8, wherein the cage-type siloxane compound is represented by the following general formula (2).

(In the formula, X represents a hydrogen atom, a hydroxyl group, a saturated or unsaturated hydrocarbon group having 1 to 20 carbon atoms, or a substituent containing an atom selected from an oxygen atom, a boron atom, a nitrogen atom and a silicon atom. However, at least two X are a hydrogen atom or a hydroxyl group.)   The resin layer includes at least one selected from the group consisting of a tetra-substituted phosphonium compound, a phosphobetaine compound, an adduct of a phosphine compound and a quinone compound, and an adduct of a phosphonium compound and a silane compound. The laminated material for printed wiring boards according to any one of claims 1 to 10.   The layered material for a printed wiring board according to any one of claims 1 to 11, wherein the adhesive layer has a thickness of 0.5 to 10 µm.   The laminated material for a printed wiring board according to any one of claims 1 to 12, wherein a fiber base material is impregnated with a resin constituting the resin layer.   The metal-clad laminated board formed by bonding together the resin layers of the two laminated materials for printed wiring boards of Claim 13 in which the said support base material is metal foil.   The printed wiring board obtained by making the resin layer of the laminated material for printed wiring boards as described in any one of Claims 1 thru | or 13 contact | abut to the surface in which the inner layer circuit pattern of the inner layer circuit board was formed, and heat-pressing. .   A semiconductor device obtained by mounting a semiconductor element on the printed wiring board according to claim 15.

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