JPH09221192A - Carrier tape and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent whisker or fluff of a paper tape base material on an internal wall surface by melting a resin film in the vicinity of a punch so as to be turned around an internal wall surface of a hole for storage, and depositing the melted resin film on the internal wall surface. SOLUTION: A paper tape base material 2 is arranged on a die 10 with a resin film 4 side laminated on the paper tape base material 2 upward, and a punch 9 opposite to the die 10 is arranged on the paper tape base material. A plurality of holes 3 for storage of an electronic part item are formed by performing punching by the punch 9. In forming the holes 3 for storage, the punch 9 is heated, and the resin film 4 in the vicinity of the punch 9 is melted as indicated in (b) and (c), and the melted resin 4a is pulled into the peripheral part of the punch and turned around the internal wall surface of the holes 3 for storage to deposit the resin 4a on the internal wall surface.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a carrier tape used for taping and packaging electronic parts in the form of chips and a method for manufacturing the same, and more particularly to improvement of holes for storing the carrier tape.

[0002]

2. Description of the Related Art Chiped electronic components such as capacitors and resistors used in electronic devices such as computers and communication devices are generally used with a carrier tape when they are packaged in taping. The carrier tape is composed of a strip-shaped tape base material, and the tape base material is mainly made of paper, which is inexpensive and easy to process. Then, a plurality of storage holes for storing electronic components are formed in the carrier tape by punching the paper tape base material at predetermined intervals in the lengthwise direction and continuously, and Similarly, the plurality of feed holes are also formed along the length direction of the paper tape base material at one side in the lateral width direction at predetermined intervals.

When storing electronic parts in the carrier tape, a bottom film made of a resin such as polyethylene is heat-welded and attached to the lower surface of the tape, and then
After the electronic component is stored in the storage hole, a top film made of a resin such as polyethylene is heat-welded and attached to the upper surface of the carrier tape.

[0004]

However, since the raw material of the paper carrier tape is pulp, "beard" or "fluff" is generated at the time of punching to open the hole for storing the electronic component. Therefore, when the electronic components are stored in the storage holes in the taping process, it is difficult for the electronic components to be stored because they are obstructed by the "whiskers" or "fluffs". However, when the electronic component is taken out from the storage hole by using the automatic insertion machine, there is a problem that a mistake is made in taking out the electronic component. These defects are more likely to occur especially when the electronic component is smaller. Further, when the storage hole is punched and formed in the step of forming the carrier tape, paper dust is generated and scattered, so that the working environment is deteriorated. Further, since the taped electronic component comes into contact with the paper on the inner wall of the storage hole, the external electrodes of the electronic component are discolored by the chlorine and sulfur components contained in the paper, which causes a problem that the solderability deteriorates. Further, since the water content and the surface roughness of the carrier tape made of paper tend to vary, the joining strength of the top film attached to the carrier tape by heat welding tends to vary. Therefore, in the process of peeling the top film from the carrier tape, which is performed before taking out the electronic component from the storage hole of the paper carrier tape in which the electronic components are stored, it is difficult for the top film to partially peel off. May occur.

The present invention has been made to solve the above problems, and improves the production efficiency in the taping process and mounting process of electronic parts, and at the same time, creates a working environment using paper dust in the process of making a carrier tape. The deterioration of
An object of the present invention is to provide a paper carrier tape which can prevent the deterioration of the solderability of the external electrodes of the electronic component due to the influence of the components of the paper and further reduce the variation in the bonding strength of the top film, and a manufacturing method thereof.

[0006]

In order to achieve the above object,
The present invention is to form a hole for storing electronic parts by punching the surface of a paper tape base material having one surface laminated with a resin film by using a heated punch, and at the same time, at the peripheral portion of the heated punch. It is a method for manufacturing a carrier tape, characterized in that a resin film is melted and circulated around the inner wall surface of the accommodation hole, and the melted resin film is welded to the inner wall surface. Further, the present invention is a carrier tape formed by the above-mentioned manufacturing method, wherein one surface of a paper tape substrate having a hole for storing an electronic component therein is laminated with a resin film and The carrier tape is characterized in that the inner wall surface of the hole is covered with a resin obtained by melting the resin film. According to the present invention, since the inner wall surface of the hole for storing the electronic component formed in the paper tape base material is covered with the resin, the "beard" of the paper tape base material is formed on the inner wall surface.
No fluff and no paper is exposed. Further, since the surface of the paper tape base material is laminated with the resin film, both the surface film of the paper tape base material and the top film which is heat-welded and attached to the surface are both made of resin. Therefore, the bonding strength of the top film can be reduced and stabilized without being affected by the water content or the surface roughness of the paper tape substrate.

[0007]

1 (a), 1 (b) and 1 (c) are explanatory views of a manufacturing process of a carrier tape 1 according to an embodiment of the present invention. A method for manufacturing the carrier tape 1 of the present invention will be described below with reference to this drawing. First, a belt-shaped paper tape substrate 2 having a resin film 4 such as polyethylene laminated on one surface by heat welding, a punch 9 for punching, and a die 10 are prepared. Then, as shown in FIG. 1A, the paper tape substrate 2 is placed on the die 10 with the resin film 4 side laminated on the paper tape substrate 2 facing upward. A punch 9 facing the die 10 is arranged on the upper side of the die 2.

Next, the belt-shaped paper tape base material 2 is punched at equal intervals in the longitudinal direction thereof and continuously with the punch 9 to form a plurality of holes 3 for storing electronic parts ((in FIG. 2). See a)). When forming the housing hole 3, the punch 9 is heated to form (b) and (c) of FIG.
As shown in FIG. 4, when punching, the resin film 4 around the punch 9 is melted, and the melted resin 4a is dragged into the punch 9 around and the inner wall surface of the storage hole 3 is swung. The resin 4a is welded to the inner wall surface. When the material of the resin film 4 is polyethylene, the temperature of the punch 9 to be heated is set to about 180 ° C. at which polyethylene melts. Further, along the length direction of the strip-shaped paper tape base material 2, a plurality of tape feed holes 5 are formed at equal intervals on one side in the width direction, and the tape feed holes 5 are formed by the above-mentioned storage. Simultaneously with the formation of the holes 3 for punching, punching is performed with another punch. In this way, the carrier tape 1 of the present invention is produced.

A partial perspective view of the carrier tape 1 produced by the above manufacturing method is shown in FIG. 2 (a), and a cross-sectional view taken along the line AA 'in FIG. 2 (a) is shown in FIG. 2 (b). Show. The carrier tape 1 has a plurality of storage holes 3 for electronic parts formed at equal intervals and continuously in the longitudinal direction of the carrier tape 1, and a paper tape substrate 2 having the storage holes 3 formed therein. A resin film 4 laminated on one surface of the paper tape base 2 and a resin 4a covering the inner wall surface of the storage hole 3 formed in the paper tape base 2.

When electronic components are stored in the carrier tape 1, as shown in the cross-sectional view of the carrier tape 1 in which the electronic components 7 are stored in FIG. The bottom film 6 made of a resin such as polyethylene is heat-welded and attached to the lower side), and then the electronic component 7 is housed in the housing hole 3 and then the surface of the resin film 4 laminated on the paper tape base material 2. (Upper side of the figure)
A top film 8 made of a resin such as polyethylene is heat-welded and attached.

According to the carrier tape 1 and the method for manufacturing the same of the present invention as described above, the inner wall surface of the hole 3 for storing the electronic component formed in the paper tape base material 2 is covered with the resin 4a, so that the inner wall surface thereof. There is no "beard" or "fluff" on the paper tape base, and no paper is exposed. Further, since the surface of the paper tape base 2 is laminated with the resin film 4, both the surface of the paper tape base 2 and the top film 8 which is heat-welded and attached to the surface are both made of resin. Therefore, the bonding strength of the top film 8 can be reduced and stabilized without being affected by the water content of the paper tape substrate and the surface roughness. The material of the resin film 4 is not limited to polyethylene (PE), but may be polypropylene (P).
P), polystyrene (PS), polyethylene terephthalate (PET), polycarbonate (PC), or the like.

Further, the present invention is not limited to the contents described above, and can be arbitrarily changed within a range not departing from the gist of the present invention. For example, the materials of the resin film 4 and the top film 8 laminated on the paper tape base material 2 are not limited to the same ones like the polyethylene of the above-mentioned embodiment, but may be a combination of resins of different materials. It may be. Further, the method of laminating the resin film on the surface of the paper tape substrate is not limited to the method of heating and welding in the above embodiment, and other methods may be used.

[0013]

As described above, according to the present invention, "beard" or "fluff" of the paper tape base material 2 is formed on the inner wall surface of the hole 3 for storing electronic parts formed in the paper tape base material 2. No paper comes out and the paper is not exposed. Further, the bonding strength of the top film 8 attached to the carrier tape 1 can be reduced and stabilized. Therefore, when the electronic component is stored in the storage hole 3 in the taping process, it becomes difficult to store the electronic component, and in the mounting process, when the electronic component is taken out from the storage hole 3 using the automatic insertion machine. In addition, there is no problem of taking out mistakes, and the production efficiency of the taping process and the mounting process is improved. Further, in the process of making the carrier tape 1, no paper dust is generated when the storage hole 3 is punched to form the work environment. Furthermore, taped electronic components 7
Since it does not come into contact with the paper on the inner wall of the storage hole 3, deterioration of the solderability of the external electrodes of the electronic component 7 due to chlorine, sulfur, etc. contained in the paper can be eliminated.
Further, in the step of peeling the top film 8 from the carrier tape 1 performed before taking out the electronic component from the storage hole 3 of the paper carrier tape 1 in which the electronic components are stored, the top film 8 is partially peeled off. Trouble such as becoming difficult can be eliminated.

[Brief description of drawings]

FIG. 1 is an explanatory diagram of a manufacturing process of a carrier tape according to an embodiment of the present invention.

FIG. 2 is a partial perspective view (a) of a carrier tape according to an embodiment of the present invention and a cross-sectional view taken along the line AA ′ of the perspective view (a).

FIG. 3 is a cross-sectional view of the carrier tape of the present invention in which electronic components are stored.

[Explanation of symbols]

 1 ... Carrier tape 2 ... Paper tape substrate 3 ... Storage hole 4 ... Resin film 4 '... Resin of resin film 4 5 ... Feed hole 6 ... Bottom film 7 ... ..Electronic parts 8 ... Top film 9 ... Punch 10 ... Die

Claims (2)

[Claims] 1. A paper tape base material, one surface of which is laminated with a resin film, is punched with a heated punch to form a hole for storing an electronic component, and at the same time, a peripheral portion of the heated punch. A method of manufacturing a carrier tape, characterized in that the resin film is melted and spilled around the inner wall surface of the storage hole, and the melted resin film is welded to the inner wall surface. 2. A paper tape substrate having a storage hole for an electronic component therein, one surface of which is laminated with a resin film, and an inner wall surface of the storage hole is obtained by melting the resin film. The carrier tape formed by the manufacturing method according to claim 1, wherein the carrier tape is covered with a resin.