JP2686018B2 - How to connect a cover tape for packaging chip-type electronic components - Google Patents
How to connect a cover tape for packaging chip-type electronic componentsInfo
- Publication number
- JP2686018B2 JP2686018B2 JP4149200A JP14920092A JP2686018B2 JP 2686018 B2 JP2686018 B2 JP 2686018B2 JP 4149200 A JP4149200 A JP 4149200A JP 14920092 A JP14920092 A JP 14920092A JP 2686018 B2 JP2686018 B2 JP 2686018B2
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- tape
- cover
- type electronic
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packaging Frangible Articles (AREA)
Description
【0001】[0001]
【産業上の利用分野】本発明はチップ型電子部品を収納
する収納ポケットを形成したキャリアテープにシールす
るカバーテープの接続方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of connecting a cover tape for sealing a carrier tape having a storage pocket for storing chip type electronic parts.
【0002】[0002]
【従来の技術】チップ型電子部品等の収納等に用いられ
るキャリアテープは、成形によって連設された部品収納
ポケットに、カバー材をシールして用いられている。チ
ップ型電子部品をキャリアテープに自動装填及びプリン
ト基板に装着するなどの工程においては実装作業の自動
化、高速化が急速に進み、それぞれの工程でこれらの自
動機を長時間にわたってより効率よく稼動させる努力が
行われているが、チップ型電子部品をキャリアテープに
自動装填する時及びプリント基板に装着する時などの実
装する時のトラブルにおいて、キャリアテープ切断処理
及びカバーテープ切断処理に対してキャリアテープの接
続方法は確立されているが、カバーテープの接続方法は
まだ完成されていなかった。従来からのカバーテープの
接続は、図2示したように、実装時にトラブルが起きた
場合はスプロケット4及びチップ型電子部品を収納した
収納ポケット3を設けているキャリアテープ2にシール
したトラブルが起こった部分のカバーテープ1を剥離
し、継ぎ目部分は直線状に切断して再度新規のカバーテ
ープ1を再シールし、その切断面に付き合わせるように
次のカバーテープを接続してシールし、継ぎ目部分の上
に図3で示すような粘着テープ5を貼る等の処理が行わ
れていた。この方法においてはカバーテープを剥離する
際にカバーテープの継ぎ目部分が直線状であるため、こ
の継ぎ目部分の剥離が粘着テープ5とカバーテープ1と
の接着力が弱いと図3に示したように粘着テープ5とカ
バーテープ1の間で剥離してしまい連続的にカバーテー
プを剥離できない等の欠点があった。従ってカバーテー
プの接続部分が安定して剥離できるカバーテープの接続
方法が切望されていた。2. Description of the Related Art A carrier tape used for housing chip-type electronic parts and the like is used by sealing a cover material in a parts housing pocket which is continuously formed by molding. In the processes such as automatic loading of chip type electronic parts on carrier tape and mounting on printed circuit boards, automation of mounting work and speedup are rapidly progressing, and these automatic machines operate more efficiently for a long time in each process. Although efforts are being made, carrier tape cutting processing and cover tape cutting processing can be carried out when troubles such as automatic loading of chip type electronic components on a carrier tape and mounting on a printed circuit board are encountered. The connection method of the cover tape has been established, but the connection method of the cover tape has not been completed yet. Connection of the cover tape from the prior art, as shown FIG. 2, the trouble when the trouble occurs that sealed to the carrier tape 2 is provided with the storage pocket 3 which houses the sprockets 4 and the chip-type electronic component during mounting Peel off the cover tape 1 at the part where it happened , cut the seam part linearly, re-seal a new cover tape 1 again, and attach it to the cut surface.
And sealed by connecting the following cover tape, on top of the joint portion
Processing such as pasting the adhesive tape 5 as shown in Figure 3 has been performed to. In this method, since the joint portion of the cover tape is linear when the cover tape is peeled off, the peeling of this joint portion indicates that the adhesive force between the adhesive tape 5 and the cover tape 1 is weak, as shown in FIG. There is a defect that the cover tape cannot be continuously peeled off because it is peeled off between the adhesive tape 5 and the cover tape 1. Therefore, there has been a long-felt need for a method of connecting cover tapes that allows the connection portion of the cover tapes to be peeled off stably.
【0003】[0003]
【発明が解決しようとする課題】本発明の目的とすると
ころは、従来のこれらの問題を解決して接続方法が簡易
でありテープの再シールが可能で、かつ接続部分の剥離
強度が充分で経済的にもメリットがあるカバーテープの
接続方法を提供するに有る。SUMMARY OF THE INVENTION The object of the present invention is to solve these problems of the prior art, to simplify the connecting method, to reseal the tape, and to provide sufficient peeling strength at the connecting portion. This is to provide a cover tape connecting method that is economically advantageous.
【0004】[0004]
【課題を解決するための手段】本発明者らは、キャリア
テープへチップ型電子部品を自動装填シール時に生じる
トラブルによりキャリアテープ切断、カバーテープ切
断、チップ電子部品のトラブルなどにおけるカバーテー
プ切除処理に対してのカバーテープの有効な接続方法に
ついて種々鋭意研究した結果カバーテープ母材と同等あ
るいはこれを上回る物理的強度を得るには母材樹脂の表
面材の粘着テープによる方法が適切であること、テープ
の接続端の切断作業が簡単で容易に行えること、カバー
材のシール及び剥離がテープの接続で支障をきたさない
ことなどが必須条件であることを見いだし本発明を完成
するに至ったものである。即ち本発明は、チップ型電子
部品を収納する収納ポケットを連続的に形成したキャリ
アテープに、既にシールされたカバーテープを剥離し収
納ポケットよりチップ型電子部品を取り出す包装体であ
って、カバーテープ同士の接続をカバーテープの切断面
同士を付き合わせ、該接続部分の上に粘着テープを張り
合わせて行う方法において、カバーテープの接続部分が
カバーテープ幅を2分するセンターもしくはカバーテー
プの幅方向の1点を起点とした山型形状の付き合わせで
カバーテープの剥離方向に末広がりに粘着テープにより
接続するカバーテープの接続方法である。DISCLOSURE OF THE INVENTION The inventors of the present invention have carried out a cover tape cutting process for cutting a carrier tape, a cover tape, a chip electronic part trouble, etc. due to a trouble that occurs when a chip type electronic part is automatically loaded and sealed in a carrier tape. As a result of various studies on effective connection method of the cover tape to the above, it is appropriate to use the adhesive tape of the surface material of the base material resin in order to obtain physical strength equal to or higher than the base material of the cover tape, cutting operation of the tape connection end is simple and easily be, completed the present invention found that etc. such as <br/> this the seal and the separation of the cover member does not hinder tape connection is a prerequisite It has come to do. The present invention provides a chip-type electronic component continuously-formed carrier tape storage pocket for accommodating and separating the cover tape that has been previously sealed yield
A package that takes out chip-type electronic components from the delivery pocket.
Connect the cover tapes together and cut the cover tapes.
Butt each other and stick adhesive tape over the connection.
In the combined method, the adhesive tape spreads toward the end in the peeling direction of the cover tape by the mountain-shaped butting in which the connecting portion of the cover tape divides the cover tape width into two parts or the starting point is one point in the width direction of the cover tape. It is a method of connecting the cover tapes connected by
【0005】図面によって本発明を詳しく説明すると、
スプロケット4及びチップ型電子部品を収納した収納ポ
ケット3を設けているキャリアテープ2にシールされた
カバーテープ1がトラブルにより剥離切断された部分を
切断治具により左側のカバーテープと右側のカバーテー
プの継ぎ目部分が剥離進行方向に末広がりの山型になる
ように山型の治具等で切断し、左側と右側のカバーテー
プの切断端を継ぎ目部分が重なり合わないようにしてつ
き合わせ上面から粘着テープ(図示せず)で接続する。
キャリアテープから剥離された部分を接続されたカバー
テープでキャリアテープに再シールして、カバーテープ
の接続を完成させる。ここで肝要なことは剥離を開始す
る側(図面においては剥離を開始する方を右側としてい
る。)の接続する継ぎ目部分は逆山型の切断端になって
おり、剥離を続行する側(左側)の接続する継ぎ目部分
は山型の切断端になっていなければならない。接続され
た継ぎ目部分は直線状でなく山型になっており、継ぎ目
部分では粘着テープが右側及び左側のカバーテープの両
側を接着しているので、カバーテープが剥離されていき
次いで継ぎ目部分が剥離される際には、仮に粘着テープ
とカバーテープとの接着力が弱くても継ぎ目部分は均等
な接着力を有するためカバーテープはキャリアテープか
らスムーズに安定して剥離される。The present invention will be described in detail with reference to the drawings.
The portion of the cover tape 1 sealed by the carrier tape 2 having the sprocket 4 and the storage pocket 3 for storing the chip-type electronic components peeled off due to a trouble is cut by a cutting jig to remove the left cover tape and the right cover tape. Cut with a jig such as a mountain-shaped jig so that the seam becomes a mountain shape that spreads toward the end in the direction of peeling, and cut the cut edges of the left and right cover tapes so that the seam does not overlap. (Not shown).
The part separated from the carrier tape is resealed to the carrier tape with the connected cover tape to complete the connection of the cover tape. What is important here is that the side where the peeling starts (the side where the peeling starts is the right side in the drawing) is the inverted mountain-shaped cut end, and the side where the peeling continues (left side) ) The connecting seam part must have a mountain-shaped cut end. The connected seams are not straight, but mountain-shaped. At the seams, the adhesive tape adheres to both sides of the right and left cover tapes, so the cover tape is peeled off and then the seam is peeled off. At this time, even if the adhesive force between the adhesive tape and the cover tape is weak, the joint tape has a uniform adhesive force, so that the cover tape is smoothly and stably separated from the carrier tape.
【0006】[0006]
【発明の効果】本発明に従うと、チップ型電子部品をキ
ャリアテープに実装トラブルにより接続補修が行われた
部分の剥離は、カバーテープの接続部分の剥離がシール
されていない部分から始まり通常のカバテープと同じ剥
離効果が得られる。According to the present invention, the peeling of the portion where the connection repair is performed due to the mounting trouble of the chip type electronic component on the carrier tape starts from the portion where the peeling of the connecting portion of the cover tape is not sealed, and the usual cover tape. The same peeling effect as is obtained.
【図1】本発明によるカバーテープの接続形態を示す斜
視図FIG. 1 is a perspective view showing a connection form of a cover tape according to the present invention.
【図2】従来の接続方法によるカバーテープの接続形態
を示す斜視図FIG. 2 is a perspective view showing a connection form of cover tapes according to a conventional connection method.
【図3】従来の接続方法によるカバーテープの接続形態
を示す斜視図FIG. 3 is a perspective view showing a connection form of cover tapes according to a conventional connection method.
【図4】FIG. 4
粘着テープをカバーテープの接続部に貼り合わAttach the adhesive tape to the connection part of the cover tape
せた状態を示す斜視図Perspective view showing the state
Claims (1)
トを連続的に形成したキャリアテープに、既にシールさ
れたカバーテープを剥離し収納ポケットよりチップ型電
子部品を取り出す包装体であって、カバーテープ同士の
接続をカバーテープの切断面同士を付き合わせ、該接続
部分の上に粘着テープを張り合わせて行う方法におい
て、カバーテープの接続部分がカバーテープ幅を2分す
るセンターもしくはカバーテープの幅方向の1点を起点
とした山型形状の付き合わせでカバーテープの剥離方向
に末広がりに接続するカバーテープの接続方法。1. A carrier tape in which a storage pocket for storing a chip-type electronic component is continuously formed, and a cover tape which has already been sealed is peeled off from the storage pocket.
It is a package that takes out child parts,
Connect the cut surfaces of the cover tape to each other and connect
Odor that sticks adhesive tape on the part
Te, the connection of the cover tape connecting portion of the cover tape are connected to the divergent to the peeling direction of the cover tape alignment per chevron shape starting from the one point in the width direction of the center or cover tape for 2 minutes cover tape width Method.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4149200A JP2686018B2 (en) | 1992-06-09 | 1992-06-09 | How to connect a cover tape for packaging chip-type electronic components |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4149200A JP2686018B2 (en) | 1992-06-09 | 1992-06-09 | How to connect a cover tape for packaging chip-type electronic components |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH05338618A JPH05338618A (en) | 1993-12-21 |
JP2686018B2 true JP2686018B2 (en) | 1997-12-08 |
Family
ID=15470017
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4149200A Expired - Lifetime JP2686018B2 (en) | 1992-06-09 | 1992-06-09 | How to connect a cover tape for packaging chip-type electronic components |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2686018B2 (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006151447A (en) * | 2004-11-30 | 2006-06-15 | Hitachi High-Tech Instruments Co Ltd | Method for connecting storage tapes |
JP4450772B2 (en) | 2005-06-30 | 2010-04-14 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
JP4450788B2 (en) | 2005-11-30 | 2010-04-14 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
JP4922014B2 (en) | 2007-02-28 | 2012-04-25 | 株式会社日立ハイテクインスツルメンツ | Electronic component mounting device |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61196903U (en) * | 1985-05-31 | 1986-12-09 | ||
JPH089369B2 (en) * | 1988-01-13 | 1996-01-31 | ローム株式会社 | Electronic component magazine loading device |
JP3108609U (en) * | 2004-11-05 | 2005-04-28 | 船井電機株式会社 | Mold structure |
-
1992
- 1992-06-09 JP JP4149200A patent/JP2686018B2/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH05338618A (en) | 1993-12-21 |
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