JPH09169891A - Epoxy resin composition for sealing material, its production and inorganic filler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an epoxy resin composition for a sealing material, excellent in both soldering crack resistance and temperature cycle resistance by using an inorganic filler in a specified amount and specified silane coupling agents as the constituents. SOLUTION: This epoxy resin composition for a sealing material, is obtained by blending an epoxy resin, a curing agent, an inorganic filler and silane coupling agents and contains the inorganic filler in an amount of 70-95 pts.wt. based on 100 pts.wt. of the composition, wherein the silane coupling agents blended comprise a silane compound represented by formula I (wherein R<1> , R<3> and R<4> are each H or a 1-12C hydrocarbon group; R<2> is a 1-12C hydrocarbon group; and (n) is 1 to 3) and a silane compound represented by formula II (wherein R<5> is a 1-12C hydrocarbon group; R<6> and R<7> are each H or a 1-12C hydrocarbon group; and (m) is 1 to 3). A crystalline silica in particular is preferably used as the inorganic filler. It is desirable to blend the silane coupling agents each in an amount of 0.05-1.5 pts.wt. based on 100 pts.wt. inorganic filler.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an epoxy resin composition for encapsulating materials used for encapsulating semiconductors and the like, and an inorganic filler used for the composition.

[0002]

2. Description of the Related Art As a method for sealing electronic components such as semiconductor devices, a method using ceramic or thermosetting resin has been conventionally used. Among them, encapsulation with an epoxy resin composition is more preferable than the balance between economic efficiency and performance,
Widely used. A semiconductor device sealed with this epoxy resin composition has, for example, a semiconductor chip mounted on a substrate having a wiring circuit or a lead frame metal, and the semiconductor chip and the lead frame are bonded with a bonding wire such as a gold wire. It is formed by connecting by a method such as welding and sealing the entire semiconductor chip and the bonding wire and a part of the lead frame with a sealing material. As the above-mentioned lead frame, a lead frame made of copper from the viewpoint of electric conductivity and a lead frame made of 42 alloy from the viewpoint of thermal expansion coefficient are generally used. Since these lead frames have low adhesiveness with bonding wires such as gold wires, the parts of the lead frame that are to be connected to the bonding wires are silver-plated or gold-plated in advance, and then connected to the bonding wires. Methods of improving reliability are being investigated.

In recent years, in order to reduce the size and thickness of electronic devices,
The semiconductor device mounting method is shifting from the conventional pin insertion mounting method to the surface mounting method. When a semiconductor device is mounted by the conventional pin insertion mounting method, the terminal of the semiconductor device is generally used (the part of the lead frame that is not sealed with the sealing material).
Only the solder is soaked in the encapsulant, not the solder.
The temperature of the encapsulant does not rise so much, but when mounting the semiconductor device by surface mounting method, due to solder reflow etc.
Since the encapsulant part and the terminal part are heated in the same way, the encapsulant part is exposed to a high temperature. In some cases, the encapsulant part is generally colored in black or the like, so the terminal part There were even times when temperatures were higher than. In the case of this surface mounting method, if the semiconductor device absorbs moisture, the absorbed moisture rapidly expands due to rapid heating during mounting,
There is a case where a crack occurs in the sealing material portion of the semiconductor device and the reliability is deteriorated. Therefore, an epoxy resin composition for a sealing material having excellent solder crack resistance is required.

In order to improve the solder crack resistance, an inorganic filler is filled in the encapsulating material to reduce the amount of epoxy resin, which is a component that easily absorbs moisture, in the encapsulating material to reduce the amount of moisture absorbed in the encapsulating material. A method of reducing the amount, a method of using an epoxy resin or the like having a low moisture absorption rate, a method of using an inorganic filler whose surface is treated with a silane coupling agent, and the like are being studied.

However, when a high proportion of an inorganic filler is added to the encapsulating material to improve the solder crack resistance, the temperature cycle exposed when the semiconductor device is actually used causes
It is presumed that the adhesiveness is low at the joint between the silver-plated or gold-plated part of the lead frame and the encapsulant and the part of the lead frame not silver-plated or gold-plated. , The cracks may occur, the adhesion between the lead frame and the encapsulant is high, and the encapsulant and the lead frame can be sealed without cracks even when exposed to a temperature cycle. There is a need for an epoxy resin composition for wood.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and provides an epoxy resin composition for a sealing material, which is excellent in both solder crack resistance and temperature cycle resistance. The purpose is to do. Moreover, it aims at providing the manufacturing method of such an epoxy resin composition for sealing materials. Moreover, it aims at providing the inorganic filler which becomes possible to obtain such an epoxy resin composition for sealing materials by using it.

[0007]

An epoxy resin composition for encapsulant according to claim 1 of the present invention is an encapsulant prepared by blending an epoxy resin, a curing agent, an inorganic filler and a silane coupling agent. In the epoxy resin composition for encapsulants containing 70 to 95 parts by weight of an inorganic filler in 100 parts by weight of an epoxy resin composition, a silane compound represented by the following formula (a) as a silane coupling agent and the following: A silane compound represented by the formula (b) is blended.

[0008]

Embedded image

[0009]

Embedded image

The epoxy resin composition for encapsulant according to claim 2 of the present invention is the epoxy resin composition for encapsulant according to claim 1, characterized in that the inorganic filler contains silica. And

An epoxy resin composition for encapsulant according to claim 3 of the present invention is the silane represented by the above formula (a) in the epoxy resin composition for encapsulant according to claim 1 or 2. The coupling agent and the silane coupling agent represented by the above formula (b) are added to 100 parts by weight of the inorganic filler.
Each of them is characterized by being mixed in an amount of 0.05 to 1.5 parts by weight.

An epoxy resin composition for a sealing material according to a fourth aspect of the present invention is the epoxy resin composition for a sealing material according to any one of the first to third aspects, wherein crystalline silica is used as an inorganic filler. It is characterized by containing 20 to 100 parts by weight with respect to 100 parts by weight.

An epoxy resin composition for a sealing material according to a fifth aspect of the present invention is the epoxy resin composition for a sealing material according to any one of the first to fourth aspects, wherein the epoxy resin is a biphenyl type. It is characterized by containing an epoxy resin.

An epoxy resin composition for encapsulant according to claim 6 of the present invention is the epoxy resin composition for encapsulant according to any one of claims 1 to 5, wherein the curing agent is an aralkyl type. It is characterized by containing a phenol resin.

A method for producing an epoxy resin composition for encapsulant according to claim 7 of the present invention is the method for producing the epoxy resin composition for encapsulant according to any one of claims 1 to 6. Then, the inorganic filler is treated with a silane coupling agent and then mixed with the epoxy resin composition for a sealing material.

The inorganic filler according to claim 8 of the present invention is an inorganic filler used in an epoxy resin composition for a sealing material, which comprises the silane coupling agent represented by the above formula (a) and the above formula. It is characterized by being treated with a silane coupling agent represented by (b).

According to the present invention, the silane coupling agent represented by the above formula (a) and the above formula (b) is blended with the epoxy resin composition for a sealing material, and the inorganic filler is added to the sealing material. Since 70 to 95 parts by weight is contained in 100 parts by weight of the epoxy resin composition for use, these silane coupling agents improve the adhesion between the inorganic filler and the lead frame, and the inorganic filler absorbs moisture. Since the rate is lowered, the solder crack resistance and the temperature cycle resistance are improved.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION The epoxy resin composition for encapsulant of the present invention comprises at least an epoxy resin, a curing agent, an inorganic filler and a silane coupling agent, and a silane compound represented by the above formula (a) and the above. It is prepared by blending a silane compound represented by the formula (b). It is important that the silane compound represented by the above formula (a) and the silane compound represented by the above formula (b) are blended together. If these silane coupling agents are not blended or only one of them is blended. When it is mixed, the adhesiveness to the lead frame is lowered and the temperature cycle resistance is lowered. In addition, among the silane compounds represented by the above formula (a), N-phenyl-γ-aminopropyltrimethoxysilane represented by the following formula (c) is used, and the silane compound represented by the above formula (b) is used. Among them, the use of γ-mercaptopropyltrimethoxysilane represented by the following formula (d) is preferable because the effect of improving the temperature cycle resistance is large.

[0019]

Embedded image

[0020]

[Chemical 6]

The silane coupling agent represented by the above formula (a) and the silane coupling agent represented by the above formula (b) are each contained in an amount of 0.05 to 1 with respect to 100 parts by weight of the inorganic filler. 0.5 parts by weight, more preferably 0.1-1.
It is preferable that 0 part by weight is blended. If it is less than 0.05 parts by weight, the effect of improving the temperature cycle resistance is small, and if it exceeds 1.5 parts by weight, the strength of the encapsulant is lowered, which is a problem.

The silane coupling agent is not limited to the one containing only the silane compound represented by the above formula (a) and the silane compound represented by the above formula (b). You may mix | blend epoxysilane, other aminosilane, etc. as needed. Further, these silane coupling agents may be added directly to the epoxy resin composition for encapsulant, but they may be sprayed directly on the inorganic filler in advance, or the inorganic filler may be added to the solution in which the silane coupling agent is dissolved. After the inorganic filler is treated with a silane coupling agent by a method such as dipping, the method of adding it to the epoxy resin composition for encapsulant is compared with the case of adding it directly to the epoxy resin composition for encapsulant. Therefore, it is preferable that the adhesiveness between the encapsulant and the lead frame and the temperature cycle resistance can be improved.

The inorganic filler used in the present invention is not particularly limited, and examples thereof include crystalline silica, amorphous silica, alumina, magnesia, titanium oxide, calcium carbonate, magnesium carbonate, silicon nitride, talc, calcium silicate. Etc. The inorganic filler may be used alone or in combination of two or more. In addition, the inorganic filler in 100 parts by weight of the epoxy resin composition for encapsulant,
It is important to contain 70 to 95 parts by weight, more preferably 80 to 93 parts by weight. If the amount of the inorganic filler is less than 70 parts by weight, the moisture absorption amount of the encapsulant may increase and the solder crack resistance may decrease, which is a problem. If the amount exceeds 95 parts by weight, the epoxy resin composition for an encapsulant may be used. Viscosity increases,
Formability at the time of sealing is lowered, which is a problem. In addition, in the epoxy resin composition for encapsulant, when an inorganic material is mixed as a flame retardant, a colorant, etc., in calculating the above-mentioned parts by weight,
Calculated in addition to weight as inorganic filler.

When silica such as crystalline silica or amorphous silica is used as the inorganic filler, the linear expansion coefficient of the encapsulant is small, which is preferable. In particular, when a copper lead frame is sealed with an epoxy resin composition for a sealing material containing crystalline silica, the linear expansion coefficient of the sealing material and the linear expansion coefficient of the copper lead frame are almost the same, Further, the solder crack resistance is improved, which is preferable. When 20 to 100 parts by weight of crystalline silica is contained with respect to 100 parts by weight of the inorganic filler, the linear expansion coefficient of the encapsulating material and that of the lead frame made of copper are almost the same, and the solder crack resistance is improved. The effect is obtained.

The epoxy resin used in the present invention is not particularly limited. For example, orthocresol novolac type epoxy resin, bisphenol A type epoxy resin, biphenyl type epoxy resin, linear aliphatic epoxy resin, alicyclic epoxy resin. , Heterocyclic epoxy resins and the like, and these may be used alone or in combination of two or more kinds. The biphenyl type epoxy resin represented by the following formula (e) is an epoxy resin having a low moisture absorption rate, and therefore, when this resin is contained, the solder crack resistance is further improved, which is preferable. In the formula, R ¹¹ , R ¹² , R ¹³ , and R ¹⁴ represent hydrogen or an alkyl group having 1 to 3 carbon atoms.

[0026]

Embedded image

The curing agent used in the present invention is not particularly limited as long as it cures by reacting with an epoxy resin. For example, phenol novolac resin, cresol novolac resin, naphthol novolac resin, aralkyl type phenol resin, etc. Various novolak resins, acid anhydrides such as phthalic anhydride and pyromellitic anhydride, aromatic amines such as diaminodiphenylmethane and metaphenylenediamine. The above curing agents may be used alone or in combination of two or more, and the compounding amount thereof is usually 0.1 to 10 in an equivalent ratio with respect to the epoxy resin.
It is blended in the range. In addition, when the aralkyl type phenol resin represented by the following formula (f) is contained, the strength of the resin is high, so that the solder crack resistance and the temperature cycle resistance are improved, which is preferable. In the formula, p represents 0 or a positive integer. The aralkyl-type phenol resin is a resin composition obtained by reacting phenols such as phenol and cresol with aralkyl ethers.

[0028]

Embedded image

Further, the phenol portion of the aralkyl type phenol resin represented by the above formula (f) is used as a curing agent in α-
When a phenol resin represented by the following formula (g) is contained in place of naphthol, the resin has a low moisture absorption rate, and thus the solder crack resistance is improved, which is preferable. In the formula, q represents 0 or a positive integer.

[0030]

Embedded image

If desired, the epoxy resin composition for encapsulant of the present invention may contain a curing accelerator, a release agent, a coloring agent, a stress reducing agent, a flame retardant, and the like. As the curing accelerator, for example, 1,8-diaza-bicyclo (5,5
(4,0) tertiary amine compounds such as undecene-7, triethylenediamine, benzyldimethylamine, 2-methylimidazole, 2-ethyl-4-methylimidazole,
Examples thereof include imidazole compounds such as 2-phenylimidazole and 2-phenyl-4-methylimidazole, and organic phosphine compounds such as triphenylphosphine and tributylphosphine. Examples of the release agent include carnauba wax, stearic acid, montanic acid, carboxyl group-containing polyolefin and the like. Examples of the colorant include carbon black and titanium oxide.
Examples of the stress reducing agent include silicone gel, silicone rubber, silicone oil and the like. Examples of the flame retardant include antimony trioxide, halogen compounds, phosphorus compounds and the like. These curing accelerators, release agents,
Two or more kinds of colorants, stress reducing agents, flame retardants and the like can be used in combination.

The epoxy resin composition for encapsulant of the present invention is
It is preferable that they are uniformly mixed and kneaded. As a kneading method, for example, heating is performed using a roll, a kneader, a mixer, or the like, and then the epoxy resin composition for a sealing material is manufactured by a method such as cooling and pulverizing.

Next, an embodiment of the inorganic filler according to claim 8 of the present invention will be described. The inorganic filler according to claim 8 of the present invention is for a sealing material, which is treated with a silane coupling agent represented by the above formula (a) and a silane coupling agent represented by the above formula (b). It is an inorganic filler used in an epoxy resin composition. Epoxy resin composition for sealing material 10
When this inorganic filler is used in an epoxy resin composition for encapsulant, which contains 70 to 95 parts by weight of the inorganic filler in 0 parts by weight, the sealing has excellent solder crack resistance and temperature cycle resistance. An epoxy resin composition for a stopping material is obtained.

[0034]

【Example】

(Examples 1 to 7 and Comparative Examples 1 to 5) As epoxy resin compositions for encapsulants, the following three types of epoxy resins, two types of curing agents, four types of inorganic fillers, and three types of silane couplings. Table 1 shows the agents, curing accelerators, release agents, colorants and flame retardants
And the weight ratio shown in Table 2. Table 1 and Table 2
In the above, the ratio of the filler represents the total weight part of the inorganic filler and the flame retardant with respect to the weight part of the epoxy resin composition for encapsulant, and the ratio of the crystalline silica is the total weight part of the inorganic filler. Represents the parts by weight of crystalline silica. Epoxy resin A: represented by the above formula (e), R ¹¹ ,
Biphenyl type epoxy resin in which all of R ¹² , R ¹³ and R ¹⁴ are hydrogen [YX400H, trade name YX4000H] -Epoxy resin a: represented by the above formula (e), R ¹¹ ,
A biphenyl type epoxy resin in which R ¹² , R ¹³ and R ¹⁴ are all hydrogen and represented by the above formula (e), R ¹¹ , R ¹² , R ¹³ and R
^A resin in which biphenyl type epoxy resins in which ¹⁴ are all methyl groups are mixed in a weight ratio of 50% each [Yukaka Shell Co., trade name YL6121] -Epoxy resin C: Tetrabromobisphenol A type epoxy resin-Curing agent D: Above Aralkyl-type phenol resin represented by formula (f) [Sumikin Kako Co., Ltd., trade name HE-100] -Curing agent E: Phenolic resin represented by formula (g) [Mitsui Toatsu Co., Ltd. trade name αNX ] -Inorganic filler: amorphous silica [made by Denki Kagaku Kogyo, trade name FB74] -Inorganic filler Ki: amorphous silica [made by Denki Kagaku Kogyo, trade name FB30] -Inorganic filler Ku: non Crystalline silica [Tatsumori Co., trade name SO
25R] Inorganic filler K: crystalline silica [Tatsumori Co., product name 3K
S] -Silane coupling agent: N represented by the above formula (c)
-Phenyl-γ-aminopropyltrimethoxysilane [manufactured by Shin-Etsu Chemical Co., Ltd., trade name KBM573] -Silane coupling agent: γ represented by the above formula (d)
-Mercaptopropyltrimethoxysilane [Toshiba Silicone Co., Ltd., trade name TSL8380E] Silane coupling agent Si: Epoxy silane represented by the following formula (h) [Toray Dow Corning Co., trade name SH6
040]

[0035]

Embedded image

Curing accelerator: triphenylphosphine Release agent: carnauba wax Colorant: carbon black Flame retardant: antimony trioxide

[0037]

[Table 1]

[0038]

[Table 2]

The above-mentioned silane coupling agent was blended after being directly sprayed directly on the inorganic filler for surface treatment. After mixing each of the above raw materials, the mixture was kneaded with a heating roll at a temperature of 85 ° C. for 5 minutes and then cooled. Then, it pulverized and obtained the epoxy resin composition for sealing materials.

The epoxy resin compositions for encapsulants obtained in Examples 1 to 7 and Comparative Examples 1 to 5 were molded at a temperature of 170 ° C. for 90 seconds using a transfer molding machine, and then 175 ° C.
After curing at the temperature of 6 hours, a sample for evaluation was prepared.
The temperature cycle resistance, solder crack resistance, adhesion, moisture absorption coefficient, linear expansion coefficient, and bending strength of the obtained evaluation sample were measured by the following methods.

The temperature cycle resistance is 9.6 × 9.6 ×.
A 0.4 mm semiconductor chip was bonded to a 150 μm-thick silver-plated copper lead frame with silver paste, and then a 28 × 28 × 3.2 mm 160-pin QFP type evaluation sample was prepared by the above method. Next, the 10 samples for evaluation were treated with a temperature cycle tester for 500 cycles with treatment of -65 ° C for 30 minutes and 150 ° C for 30 minutes as one cycle. Next, the evaluation sample was cut in half, the cut surface was polished, and the size of cracks was observed with a microscope. A crack having a size of 75 μm (half the thickness of the lead frame) or more was determined as defective.

The solder crack resistance is 9.6 ×
A 9.6 × 0.4 mm semiconductor chip is bonded to a 150 μm-thick silver-plated copper lead frame with silver paste, followed by 15 × 19 × 1.8 mm 60-pin QFP.
A mold evaluation sample was prepared by the above method. Then, 10 of these evaluation samples were used under conditions of 85 ° C./85% RH for 72 hours.
After the time treatment, it was heated by a solder reflow device having a maximum temperature of 245 ° C. Next, the evaluation sample was cut in half, the cut surface was polished, and the size of cracks was observed with a microscope. Those having a crack size of 75 μm or more were determined as defective.

Adhesion was measured by using a push-pull gauge after preparing a pudding-type evaluation sample on one surface of a 0.5 mm-thick copper plate plated on the entire surface with the above method.
The strength at the time of breaking by pulling in the shearing direction was obtained.

The coefficient of linear expansion was 50 to 100 ° C. using a thermomechanical measurement (TMA) device (TAS200, manufactured by Rigaku Denki Co., Ltd.) after a cylindrical evaluation sample having a diameter of 5 mm and a length of 20 mm was prepared by the above method. The coefficient of linear expansion between the two was determined.

Regarding the moisture absorption rate, a disk-type evaluation sample having a diameter of 50 mm and a thickness of 3 mm was prepared by the above method, dried at a temperature of 125 ° C. for 16 hours, and then treated at 85 ° C./85% RH for 72 hours. The difference from the weight immediately after drying at a temperature of 125 ° C. for 16 hours was measured and the rate of increase was calculated.

The flexural strength was measured in accordance with JIS-K691 after preparing an evaluation sample of 10 × 4 × 100 mm by the above method.
It was measured at room temperature according to 1.

As a result, as shown in Table 3, it was confirmed that each example had better solder crack resistance than Comparative Example 1 and Comparative Examples 3 to 5. It was also confirmed that each example had better temperature cycle resistance than Comparative Examples 2 to 4. Further, each of the examples has better adhesion than Comparative Examples 1 to 4 in which one or both of the silane coupling agents represented by the above formula (a) and the above formula (b) are not mixed, and each It was confirmed that the example has a lower moisture absorption rate and is better than the comparative example 5 in which the amount of the inorganic filler is small. Also,
Examples 1 to 3 containing crystalline silica as an inorganic filler in a range of 20 to 100 parts by weight with respect to 100 parts by weight of the inorganic filler are compared with Examples 4, 5 and 7.
Linear expansion coefficient of copper lead frame about 1.7 × 10 ^-5 / ℃
It was confirmed to be almost equivalent to. It was also confirmed that the bending strength of each example was not different from that of the comparative example.

[0048]

[Table 3]

[0049]

The epoxy resin composition for encapsulants according to claims 1 to 6 of the present invention contains an inorganic filler in an amount of 70 to 95 parts by weight per 100 parts by weight of the epoxy resin composition for encapsulant. Part, and since the silane coupling agent represented by the above formula (a) and the above formula (b) is blended in the epoxy resin composition for encapsulant, the epoxy resin composition for encapsulant is When used for sealing, a sealed product excellent in both solder crack resistance and temperature cycle resistance can be obtained.

When the epoxy resin composition for encapsulant according to claim 5 of the present invention is used for encapsulation, in addition to the above effects, a linear expansion coefficient similar to that of the copper lead frame is obtained. .

According to the method for producing an epoxy resin composition for encapsulant according to the seventh aspect of the present invention, the epoxy for encapsulant which can surely obtain the effects of both excellent solder crack resistance and temperature cycle resistance. A resin composition is obtained.

An epoxy resin composition for encapsulants, wherein the inorganic filler according to claim 8 of the present invention contains 70 to 95 parts by weight of the inorganic filler in 100 parts by weight of the epoxy resin composition for encapsulant. When used for, a sealed product excellent in both solder crack resistance and temperature cycle resistance can be obtained.

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location H01L 23/31

Claims (8)

[Claims] 1. An inorganic filler is added in an amount of 70 to 95 in 100 parts by weight of an epoxy resin composition for a sealing material, which comprises an epoxy resin, a curing agent, an inorganic filler and a silane coupling agent.
In the epoxy resin composition for sealing material containing by weight,
An epoxy resin composition for encapsulant, comprising a silane compound represented by the following formula (a) and a silane compound represented by the following formula (b) as a silane coupling agent. Embedded image (In the formula, R ¹ , R ³ , and R ⁴ are hydrogen or a monovalent hydrocarbon group having 1 to 12 carbon atoms, R ² is a divalent hydrocarbon group having 1 to 12 carbon atoms, and n is an integer of 1 to 3 Is represented.) (In the formula, R ⁵ is a divalent hydrocarbon group having 1 to 12 carbon atoms, R ⁶ ,
R ⁷ is hydrogen or a monovalent hydrocarbon group having 1 to 12 carbon atoms, m
Represents an integer of 1 to 3. ) 2. The epoxy resin composition for a sealing material according to claim 1, wherein the inorganic filler contains silica. 3. The silane coupling agent represented by the above formula (a) and the silane coupling agent represented by the above formula (b) are each added to 100 parts by weight of the inorganic filler, respectively.
The epoxy resin composition for encapsulants according to claim 1 or 2, wherein the epoxy resin composition is blended in an amount of 05 to 1.5 parts by weight. 4. The epoxy for encapsulant according to claim 1, wherein the crystalline silica is contained in an amount of 20 to 100 parts by weight with respect to 100 parts by weight of the inorganic filler. Resin composition. 5. The epoxy resin composition for a sealing material according to claim 1, wherein the epoxy resin contains a biphenyl type epoxy resin. 6. The curing agent contains an aralkyl type phenol resin, as claimed in any one of claims 1 to 5.
An epoxy resin composition for a sealing material according to any one of 1. 7. The encapsulant according to claim 1, wherein the inorganic filler is treated with a silane coupling agent and then added to the epoxy resin composition for encapsulant. For producing epoxy resin composition for automobile. 8. An inorganic material used in an epoxy resin composition for a sealing material, which is treated with a silane coupling agent represented by the above formula (a) and a silane coupling agent represented by the above formula (b). Filling material.