JPH09167813A - 集積回路パッケージ - Google Patents

集積回路パッケージ

Info

Publication number
JPH09167813A
JPH09167813A JP8291862A JP29186296A JPH09167813A JP H09167813 A JPH09167813 A JP H09167813A JP 8291862 A JP8291862 A JP 8291862A JP 29186296 A JP29186296 A JP 29186296A JP H09167813 A JPH09167813 A JP H09167813A
Authority
JP
Japan
Prior art keywords
layer
integrated circuit
signal
voltage
circuit chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8291862A
Other languages
English (en)
Japanese (ja)
Other versions
JPH09167813A5 (enExample
Inventor
Paul James Fischer
ジェームズ フィッシャー ポール
William George Petefish
ジョージ ペテフィッシュ ウィリアム
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WL Gore and Associates Inc
Original Assignee
WL Gore and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WL Gore and Associates Inc filed Critical WL Gore and Associates Inc
Publication of JPH09167813A publication Critical patent/JPH09167813A/ja
Publication of JPH09167813A5 publication Critical patent/JPH09167813A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3677—Wire-like or pin-like cooling fins or heat sinks
    • H—ELECTRICITY
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49811—Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads
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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
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Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP8291862A 1995-11-02 1996-11-01 集積回路パッケージ Pending JPH09167813A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/552,359 US5701032A (en) 1994-10-17 1995-11-02 Integrated circuit package
US08/552359 1995-11-02

Publications (2)

Publication Number Publication Date
JPH09167813A true JPH09167813A (ja) 1997-06-24
JPH09167813A5 JPH09167813A5 (enExample) 2004-10-21

Family

ID=24204993

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8291862A Pending JPH09167813A (ja) 1995-11-02 1996-11-01 集積回路パッケージ

Country Status (4)

Country Link
US (1) US5701032A (enExample)
EP (1) EP0772234A3 (enExample)
JP (1) JPH09167813A (enExample)
KR (1) KR970030749A (enExample)

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US6084777A (en) * 1997-04-23 2000-07-04 Texas Instruments Incorporated Ball grid array package
US6064116A (en) * 1997-06-06 2000-05-16 Micron Technology, Inc. Device for electrically or thermally coupling to the backsides of integrated circuit dice in chip-on-board applications
US5793668A (en) * 1997-06-06 1998-08-11 Timeplex, Inc. Method and apparatus for using parasitic capacitances of a printed circuit board as a temporary data storage medium working with a remote device
US5982633A (en) * 1997-08-20 1999-11-09 Compaq Computer Corporation Opposed ball grid array mounting
US6441487B2 (en) 1997-10-20 2002-08-27 Flip Chip Technologies, L.L.C. Chip scale package using large ductile solder balls
JP3031323B2 (ja) * 1997-12-26 2000-04-10 日本電気株式会社 半導体装置とその製造方法
US6222260B1 (en) 1998-05-07 2001-04-24 Vlsi Technology, Inc. Integrated circuit device with integral decoupling capacitor
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US6274224B1 (en) 1999-02-01 2001-08-14 3M Innovative Properties Company Passive electrical article, circuit articles thereof, and circuit articles comprising a passive electrical article
US6052045A (en) * 1999-03-12 2000-04-18 Kearney-National, Inc. Electromechanical switching device package with controlled impedance environment
US6271109B1 (en) * 1999-07-27 2001-08-07 Texas Instruments Incorporated Substrate for accommodating warped semiconductor devices
US6154366A (en) * 1999-11-23 2000-11-28 Intel Corporation Structures and processes for fabricating moisture resistant chip-on-flex packages
US6830462B1 (en) 1999-12-13 2004-12-14 Fci Americas Technology, Inc. Electrical connector housing
US6612852B1 (en) 2000-04-13 2003-09-02 Molex Incorporated Contactless interconnection system
US6362972B1 (en) * 2000-04-13 2002-03-26 Molex Incorporated Contactless interconnection system
USRE38381E1 (en) 2000-07-21 2004-01-13 Kearney-National Inc. Inverted board mounted electromechanical device
US6646521B1 (en) * 2000-09-15 2003-11-11 Hei, Inc. Connection for conducting high frequency signal between a circuit and a discrete electric component
US6674291B1 (en) * 2000-10-30 2004-01-06 Agere Systems Guardian Corp. Method and apparatus for determining and/or improving high power reliability in thin film resonator devices, and a thin film resonator device resultant therefrom
KR20010016095A (ko) * 2000-11-01 2001-03-05 김기대 프릭크 및 램프 표시장치
US6472251B1 (en) 2001-04-09 2002-10-29 Delphi Technologies, Inc. Method for integrated circuit packaging
US6894399B2 (en) 2001-04-30 2005-05-17 Intel Corporation Microelectronic device having signal distribution functionality on an interfacial layer thereof
US6888240B2 (en) * 2001-04-30 2005-05-03 Intel Corporation High performance, low cost microelectronic circuit package with interposer
US20020167804A1 (en) * 2001-05-14 2002-11-14 Intel Corporation Polymeric encapsulation material with fibrous filler for use in microelectronic circuit packaging
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KR970030749A (ko) 1997-06-26
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EP0772234A3 (en) 1998-06-03

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