JPH09162234A - Semiconductor integrated circuit device and its manufacturing method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the reliability upon bumps connecting a chip mounting substrate to a packaging substrate. SOLUTION: Within a semiconductor integrated circuit device composed of a sealing main body part 3 having a chip mounting substrate 2 while sealing a semiconductor chip 1 and a peripheral part 1a thereof, a printed substrate 5 packaging the sealing main body part 3 through the intermediary of bumps 4 to be ball electrodes as well as spacer members 6 supporting the sealing main body part 3 packaging the printed substrate 5 while maintaining a specific gap between the chip mounting substrate 2 and the printed substrate 5, the spacer members 6 are fitted to the angular parts 2b of the outer peripheries 2a of the chip mounting substrate 2.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technology, and more particularly, to an element mounting board and a mounting board (printed board).
The present invention relates to a semiconductor integrated circuit device and a method for manufacturing the semiconductor integrated circuit device, wherein

[0002]

2. Description of the Related Art The technology described below studies the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

A semiconductor integrated circuit device called BGA (Ball Grid Array) is known as an example of the semiconductor integrated circuit device which is compatible with the increase in the number of pins.

In the BGA, an element mounting board on which a semiconductor element is mounted is mounted on a printed board through bumps formed of solder or gold.

At this time, the distance between the device mounting board and the printed circuit board is determined by the surface tension of the solder, the diameter (or radius) of the bump, the land diameter of each board (bump mounting electrode) and the sealing body of the semiconductor integrated circuit device. Determined by the weight of the section.

Regarding BGA, for example, Nikkei B
Company P, published May 31, 1993, Shin Kayama, Kunihiko Naruse (supervisor), "Practical course VLSI packaging technology (below)", page 174.

[0007]

However, in the above-mentioned technique, since the weight of the sealing body of the semiconductor integrated circuit device differs depending on its type, various semiconductor integrated circuit devices are mounted on one printed circuit board. In this case, if the reflow process is performed once for each printed circuit board, a difference occurs in the bump shape of each semiconductor integrated circuit device.

As a result, there arises a problem in that the connection reliability of the bumps varies and causes a connection failure.

An object of the present invention is to provide a semiconductor integrated circuit device and a method for manufacturing the semiconductor integrated circuit device, in which the connection reliability of bumps connecting the element mounting substrate and the mounting substrate is improved.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the semiconductor integrated circuit device of the present invention has an element mounting substrate on which a semiconductor element is mounted, and a semiconductor body mounted on the element mounting substrate and a sealing main body portion sealing the peripheral portion thereof. A mounting board on which the sealing body is mounted via bumps, and which supports the sealing body when the sealing body is mounted and keeps the distance between the element mounting board and the mounting board substantially constant. And a spacer member for keeping the same.

Thus, by disposing the spacer member between the sealing body and the mounting substrate when soldering the bumps, the distance between the element mounting substrate and the mounting substrate can be kept substantially constant even after the bumps are melted. Can be kept.

That is, the sealing body is supported by the spacer member, and the distance between the element mounting board and the mounting board can be kept constant regardless of the weight of the sealing body.

Therefore, since the bumps are not directly influenced by the weight of the sealing body, the bumps can be prevented from being deformed by the load of the sealing body, and the shape of the bumps at the time of soldering (at the time of melting) can be prevented. Can be stabilized.

As a result, the occurrence of defective connection of the bumps can be reduced, so that the connection reliability of the bumps can be improved and the connection life of the bumps can be extended.

Furthermore, the semiconductor integrated circuit device of the present invention
The spacer member is attached to the element mounting substrate.

In the semiconductor integrated circuit device of the present invention, the radius of the bump is P, the radius of the bump mounting electrode on the element mounting substrate is Q, the radius of the bump mounting electrode on the mounting substrate is R, and the spacer member is When the height is set to H, the bump, the spacer member, the element mounting substrate and the mounting substrate are (4/3) × π × P ³ ≦ (1 /
3) × π × (Q ² + Q × R + R ² ) × H, H ≦ 2 × P.

Further, in the method for manufacturing a semiconductor integrated circuit device of the present invention, the bumps are temporarily fixed to the element mounting substrate of the encapsulating main body encapsulating the semiconductor element and its peripheral portion, and the bumps are soldered. At this time, a spacer member for maintaining the distance between the element mounting substrate and the mounting substrate substantially constant and supporting the sealing main body is arranged between the sealing main body and the mounting substrate, and the spacer member is interposed therebetween. To connect the sealing body and the mounting substrate.

[0020]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a partial sectional view showing an example of an embodiment of a structure of a semiconductor integrated circuit device according to the present invention, and FIG. 2 is a partial sectional view showing an example of an embodiment of a method for manufacturing a semiconductor integrated circuit device according to the present invention. 3 and 4 are partial cross-sectional views showing an example of an embodiment of a method for manufacturing a semiconductor integrated circuit device according to the present invention.

The structure of the semiconductor integrated circuit device according to the present embodiment will be described. A semiconductor chip 1 which is a semiconductor element having an element mounting substrate 2 and mounted on the element mounting substrate 2 and its peripheral portion 1a are sealed. The sealing body 3,
A printed circuit board 5 which is a mounting board on which the sealing body 3 is mounted via bumps 4 which are ball electrodes formed of solder, and a sealing body when the sealing body 3 is mounted on the printed board 5. It is composed of a spacer member 6 which supports 3 and keeps the distance between the element mounting substrate 2 and the printed circuit board 5 substantially constant.

That is, the semiconductor integrated circuit device of this embodiment has the same structure as the BGA, and the element mounting substrate 2 and the printed circuit board 5 of the sealing body 3 are electrically connected by the plurality of bumps 4. And the sealing main body 3 is mounted on the printed circuit board 5 by connecting them physically.

The semiconductor chip 1 is wire-bonded to the element mounting substrate 2 by a thin wire 7 made of gold or the like, and is electrically connected thereto.

Further, the sealing body 3 is the element mounting substrate 2
The semiconductor chip 1 mounted on the element mounting substrate 2 and its peripheral portion 1a are hermetically sealed by resin sealing, and the resin sealing is, for example, an epoxy thermosetting resin. And so on.

The device mounting board 2 is made of ceramic or the like, and the printed board 5 is made of epoxy resin or the like.

Here, in the semiconductor integrated circuit device according to the present embodiment, the case where the spacer member 6 is attached to the corner portion 2b of the outer peripheral portion 2a of the element mounting substrate 2 will be described.

That is, the four corners 2 of the device mounting board 2
Four spacer members 6 are attached to each of b.

The spacer member 6 is made of a material having a melting point higher than that of the solder, which is the material of the bump 4, such as copper, and its shape is such that the distance (eg, height) at a predetermined location is highly accurate. For example, a formed cylinder.

That is, each spacer member 6 is provided between the device mounting board 2 and the printed circuit board 5 of the sealing body 3 when the sealing body 3 is mounted on the printed circuit board 5 via the bumps 4. They are arranged and support the sealing body 3 and keep the distance between the element mounting substrate 2 and the printed circuit board 5 constant.

Further, in the semiconductor integrated circuit device according to the present embodiment, the radius of the bump 4 is P and the element mounting substrate 2 is
When the radius of the bump mounting electrode 2c in the above is Q, the radius of the bump mounting electrode 5a in the printed circuit board 5 is R, and the height of the spacer member 6 is H, the bump 4, the spacer member 6,
The bump mounting electrodes 2c and 5a on the element mounting substrate 2 and the printed circuit board 5 are (4/3) × π × P ³ ≦ (1/3)
By forming the sealing main body 3 on the printed circuit board 5 (after solder reflow), the bumps 4 are formed under the conditions of × π × (Q ² + Q × R + R ² ) × H, H ≦ 2 × P. Can be shaped like an hourglass with the central portion 4a constricted.

Next, a method of manufacturing the semiconductor integrated circuit device of this embodiment will be described.

First, the semiconductor chip 1 and its peripheral portion 1
A sealing body 3 in which a is sealed with a thermosetting resin or the like is prepared.

Further, the bumps 4 are temporarily fixed to the bump mounting electrodes 2c at predetermined locations on the element mounting substrate 2 of the sealing body 3 by using flux or the like.

Here, when soldering the bumps 4 by reflowing or the like, a distance between the element mounting substrate 2 and the printed circuit board 5 is kept substantially constant and sealed between the sealing body 3 and the printed circuit board 5. A spacer member 6 that supports the stopper body 3 is arranged.

In the semiconductor integrated circuit device of the present embodiment, the bumps 4 are temporarily fixed to the element mounting substrate 2 and then the four corners 2b of the outer peripheral portion 2a of the element mounting substrate 2 of the sealing body 3 are provided. The four spacer members 6 are attached to.

At this time, for example, an adhesive is used to fix the spacer member 6.

After that, the bumps 4 are soldered by reflowing or the like, and the sealing body 3 and the printed circuit board 5 are electrically connected via the bumps 4.

According to the semiconductor integrated circuit device and the method of manufacturing the same of the present embodiment, the following operational effects can be obtained.

That is, when the bumps 4 are soldered (reflowed), the spacer member 6 is arranged between the sealing body 3 and the printed circuit board 5, so that the element mounting substrate 2 is melted even after the bumps 4 are melted. The distance between the printed circuit board 5 and the printed circuit board 5 can be maintained at a substantially constant distance.

That is, since the sealing body 3 is supported by the spacer member 6, the distance between the element mounting substrate 2 and the printed board 5 can be kept constant regardless of the weight of the sealing body 3. .

Therefore, since the bumps 4 are not directly affected by the weight of the sealing body 3, the bumps 4 can be prevented from being deformed by the load of the sealing body 3, and the bumps at the time of soldering (when melting) can be prevented. The shape of 4 can be stabilized.

As a result, the occurrence of defective connection of the bumps 4 can be reduced, so that the connection reliability of the bumps 4 can be improved and the connection life of the bumps 4 can be extended.

Further, since the shape of the bump 4 is stable, the shape of the bump 4 can be controlled.

When mounting a plurality of sealing main bodies 3 having various weights due to the size and material of the device mounting board 2 on one printed circuit board 5, the printed circuit boards 5 are soldered together at one time. Even if (reflow) is performed, the bumps 4 are not directly affected by the load of the sealing body 3, so that it is possible to prevent the bumps 4 connected to the respective sealing bodies 3 from changing in shape.

As a result, when a plurality of sealing main body portions 3 having various weights are mounted on one printed circuit board 5, even if each printed circuit board 5 is soldered at once, each bump 4
Since the connection reliability does not vary and the deformation of each bump 4 can be suppressed, the occurrence of connection failure of the bump 4 can be reduced.

Therefore, the connection reliability of the bumps 4 can be improved and the connection life of the bumps 4 can be extended.

In particular, when the large-sized sealing body 3 and the small-sized sealing body 3 are mounted on one printed circuit board 5 and reflowed at once, a greater effect can be obtained.

It should be noted that the radius of the bump 4 is P, the radius of the bump mounting electrode 2c on the element mounting substrate 2 is Q, the radius of the bump mounting electrode 5a on the printed circuit board 5 is R, and the height of the spacer member 6 is H. 4, the spacer member 6, the element mounting substrate 2 and the printed circuit board 5 are (4/3) × π ×
P ³ ≦ (1/3) × π × (Q ² + Q × R + R ² ) × H,
By forming under the condition that H ≦ 2 × P,
It is possible to control the shape of the bump 4 after melting into a drum shape in which the central portion 4a is constricted.

As a result, the shape of the bump 4 can be made to absorb the difference in thermal expansion between the element mounting substrate 2 and the printed circuit board 5, so that the stress acting on the connecting portion of the bump 4 can be reduced. .

As a result, the occurrence of defective connection of the bumps 4 can be reduced, and the connection reliability of the bumps 4 can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiment of the invention, the invention is not limited to the embodiment of the invention, and does not depart from the gist of the invention. It goes without saying that various changes can be made with.

For example, in the semiconductor integrated circuit device described in the above embodiment, the case where the spacer member is attached to the element mounting substrate of the sealing body has been described.
Alternatively, like the semiconductor integrated circuit device according to another embodiment of the present invention shown in FIG. 5, the spacer member 6 may be attached to the printed board 5 which is a mounting board (FIG. 4).
Further, it may be sandwiched between the element mounting board 2 and the printed board 5 (FIG. 5).

Here, the semiconductor integrated circuit device shown in FIG. 4 is one in which the spacer member 6 is attached to the printed board 5.

In this case, at least before soldering (reflowing) the bumps 4, the spacer member 6 is attached to a predetermined portion of the printed board 5 with an adhesive or the like.

Further, the semiconductor integrated circuit device shown in FIG.
This is a case where the spacer member 6 is sandwiched between the element mounting substrate 2 of the sealing body 3 and the printed circuit board 5.

In this case, when soldering the bumps 4, the spacer member 6 is inserted between the device mounting board 2 and the printed circuit board 5 of the encapsulating main body 3 so that the device mounting circuit board 2 and the printed circuit board 5 are connected to each other. The spacer member 6 is sandwiched by and soldered.

Therefore, the spacer member 6 is not fixed to the device mounting board 2 or the printed circuit board 5, but the spacer member 6 is sandwiched between the device mounting circuit board 2 and the printed circuit board 5 and supported by both.

The semiconductor integrated circuit device of the other embodiments shown in FIGS. 4 and 5 can also provide the same effects as the semiconductor integrated circuit device of the embodiment of the present invention.

Further, in the semiconductor integrated circuit device of the above-mentioned embodiment or another embodiment, the semiconductor chip 1
I explained about the case where the sealing of is the resin sealing by the resin,
The sealing is not limited to resin sealing and may be sealing using a cap or the like as long as it is hermetically sealed.

Further, the semiconductor chip 1 and the element mounting substrate 2
The connection with and is not limited to wire bond connection, and may be connection by a small bump or the like.

Further, the spacer member 6 may be arranged at a position other than the outer peripheral portion 2a of the element mounting substrate 2, and it supports the sealing main body 3 and distances between the element mounting substrate 2 and the printed circuit board 5. As long as it is possible to keep it constant, for example, it may be arranged inside the element mounting substrate 2, that is, in the lower part of the semiconductor chip 1 or the like.

Further, the number of spacer members 6 to be installed is not particularly limited as long as it is possible to support the sealing body 3 and keep the distance between the element mounting board 2 and the printed board 5 constant. It may be installed individually.

Regarding the shape of the spacer member 6,
As long as the distance (for example, height) of the predetermined place is formed with high accuracy, it may be a prism or a cylinder other than a cylinder, or a sphere (the predetermined place in the case of a sphere is a diameter or a radius).

Regarding the material of the spacer member 6,
A material with a higher melting point than the solder that is the material of the bump 4,
In addition, the material is not limited to copper and may be another material as long as it has a strength enough to support the sealing body 3.

[0066]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). By placing a spacer member between the sealing body and the mounting board when soldering bumps, the distance between the device mounting board and the mounting board is kept constant regardless of the weight of the sealing body. be able to. As a result, it is possible to prevent the bumps from being deformed by the load of the sealing main body portion, and thus it is possible to stabilize the shape of the bumps during soldering (when melting). As a result, the occurrence of defective connection of the bumps can be reduced, so that the connection reliability of the bumps can be improved and the connection life of the bumps can be extended.

(2). The stable shape of the bumps makes it possible to control the shape of the bumps. As a result, when mounting a plurality of sealing main bodies of various weights on one mounting board, even if the mounting boards are soldered at the same time, the connection reliability of each bump does not vary. ,
Since it is possible to suppress the deformation of each bump, it is possible to reduce the occurrence of defective connection of the bumps. Therefore, the connection reliability of the bump can be improved.

(3). Let P be the radius of the bump, Q be the radius of the bump mounting electrode on the device mounting board, R be the radius of the bump mounting electrode on the mounting substrate, and H be the height of the spacer member. (4/3) × π × P ³ ≦ (1/3) × π × (Q ² +
By forming under the conditions of Q × R + R ² ) × H and H ≦ 2 × P, the shape of the bump after the melting of the bump can be controlled in a drum shape. As a result, it is possible to reduce the stress acting on the connection portion of the bump, so that it is possible to reduce the occurrence of defective connection of the bump.

[Brief description of the drawings]

FIG. 1 is a partial sectional view showing an example of an embodiment of the structure of a semiconductor integrated circuit device according to the present invention.

FIG. 2 is a partial cross-sectional view showing an example of an embodiment of a method for manufacturing a semiconductor integrated circuit device according to the present invention.

FIG. 3 is a partial cross-sectional view showing an example of an embodiment of a method for manufacturing a semiconductor integrated circuit device according to the present invention.

FIG. 4 is a partial cross-sectional view showing an example of the structure of a semiconductor integrated circuit device according to another embodiment of the present invention.

FIG. 5 is a partial cross-sectional view showing an example of the structure of a semiconductor integrated circuit device according to another embodiment of the present invention.

[Explanation of symbols]

 1 semiconductor chip (semiconductor element) 1a peripheral portion 2 element mounting substrate 2a outer peripheral portion 2b corner portion 2c bump mounting electrode 3 sealing main body portion 4 bump 4a central portion 5 printed circuit board (mounting substrate) 5a bump mounting electrode 6 spacer member 7 wire P Radius of bump Q Radius of bump mounting electrode on element mounting board R Radius of bump mounting electrode on mounting board H Height of spacer member

Claims (9)

[Claims] 1. A semiconductor integrated circuit device in which an element mounting substrate on which a semiconductor element is mounted is mounted via bumps, the semiconductor element having the element mounting substrate, and the semiconductor element mounted on the element mounting substrate, and the same. A sealing main body that seals the peripheral portion, a mounting substrate that mounts the sealing main body via the bumps, supports the sealing main body when mounting the sealing main body, and A semiconductor integrated circuit device comprising: a device mounting board and a spacer member for keeping a distance between the mounting board and the mounting board substantially constant. 2. The semiconductor integrated circuit device according to claim 1, wherein the spacer member is attached to the element mounting substrate. 3. The semiconductor integrated circuit device according to claim 1, wherein the spacer member is attached to the mounting substrate. 4. The semiconductor integrated circuit device according to claim 1, wherein the spacer member is sandwiched between the element mounting substrate of the sealing body and the mounting substrate. . 5. The semiconductor integrated circuit device according to claim 1, 2, 3 or 4, wherein a radius of the bump is P, a radius of a bump mounting electrode on the element mounting substrate is Q, and a bump mounting on the mounting substrate is mounted. When the radius of the electrode is R and the height of the spacer member is H, the bump, the spacer member, the element mounting substrate and the mounting substrate are (4 /
3) × π × P ³ ≦ (1/3) × π × (Q ² + Q × R + R
² ) A semiconductor integrated circuit device characterized in that it is formed under the conditions of H × ² , H ≦ 2 × P. 6. A method of manufacturing a semiconductor integrated circuit device having an element mounting substrate on which a semiconductor element is mounted, wherein bumps are provided on an element mounting substrate included in a sealing main body that seals the semiconductor element and its peripheral portion. Temporarily fixed, and when the soldering of the bumps is performed, the distance between the element mounting board and the mounting board is kept substantially constant between the sealing body and the mounting board, and the sealing body is supported. A spacer member is disposed, and the sealing main body portion and the mounting substrate are connected via the bump, and a method for manufacturing a semiconductor integrated circuit device. 7. The method for manufacturing a semiconductor integrated circuit device according to claim 6, wherein the bump is temporarily fixed to the element mounting substrate, and then the spacer member is attached to the element mounting substrate of the sealing body. A method for manufacturing a semiconductor integrated circuit device, comprising: 8. The method of manufacturing a semiconductor integrated circuit device according to claim 6, wherein before soldering the bumps,
A method of manufacturing a semiconductor integrated circuit device, comprising: mounting the spacer member on the mounting substrate. 9. The method for manufacturing a semiconductor integrated circuit device according to claim 6, wherein the spacer member is provided between the element mounting substrate and the mounting substrate of the sealing main body when soldering the bumps. Is inserted, and the spacer member is sandwiched between the element mounting substrate and the mounting substrate and soldered, and a method for manufacturing a semiconductor integrated circuit device.