JPH1140608A - Semiconductor device and its mounting method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To extend the connection life of a solder bump, and also, improve the connection reliability of the solder bump. SOLUTION: This device comprises a device body part 3 equipped with an element mounting board 2 on which a semiconductor chip 1 is mounted, a printed board 5 where the device body 3 is mounted through a solder bump 4, and a support member 6 which is made of material larger in thermal expansion coefficient than the solder to form the solder bump 4 and further is made lower than the level of the solder bump 4 after mounting of the device body part 3. Then, at fusion of the solder bump 4 at the time of mounting the device body part 3 on the printed board 5 through the solder bump 4, the support member 6 contacts with the element mounting board 2 and the printed board 5, and supports the device body part 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing technique, and more particularly, to an element mounting board and a mounting board (printed board).
And a method of mounting the semiconductor device, wherein the semiconductor device is connected to the semiconductor device by solder bumps as ball electrodes.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
Upon completion, they were examined by the inventor, and the outline is as follows.

High-performance, low-cost central processing unit (MPU)
Although personal computers (hereinafter, abbreviated to personal computers) that require a computer are used in various fields, demands for multifunctional and high performance from users are increasing.

[0004] The functions of the personal computer (especially speeding up) are as follows.
Most are determined by the central processing unit.

Therefore, a semiconductor device called a BGA (Ball Grid Array) is known as an example of a semiconductor device corresponding to high speed operation.

In the BGA, a device body including an element mounting board on which a semiconductor element is mounted is mounted on a printed board (mounting board) via solder bumps.
As the speed of the central processing unit increases, the amount of heat generated from the semiconductor element also increases. As a countermeasure, there is a method in which a heat radiating member such as a heat diffusion plate is attached to the semiconductor element to improve heat radiation.

The BGA is described in, for example, Nikkei BP, published on May 31, 1993, Susumu Kayama and Kunihiko Naruse (monitoring), “Practical Course VLSI Packaging Technology (Lower)”, page 174. ing.

[0008]

However, in the BGA of the above-described technology, when the device main body is mounted on a printed circuit board, the weight of the device main body is directly applied to the solder bumps due to its structure.

For this reason, attaching a large heat radiating member to a semiconductor element leads to bump collapse. Therefore, it is a problem that it is difficult to install a large heat radiation member.

In addition, even if the solder bumps are not crushed, when the heat radiating member is attached to the semiconductor element, the connection height of the solder bumps may be reduced due to the weight of the device main body. The problem is that the connection life of the bump is shortened.

SUMMARY OF THE INVENTION It is an object of the present invention to provide a semiconductor device and a method of mounting the same, which control the height of the bump when the solder bump is melted to extend the connection life of the solder bump and improve the connection reliability of the solder bump. is there.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0013]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the semiconductor device of the present invention comprises a device body having an element mounting board on which a semiconductor element is mounted;
A mounting board for mounting the device main body via the solder bumps, formed of a material having a larger coefficient of thermal expansion than the solder forming the solder bumps, and lower than the height of the solder bumps after mounting the device main body; Having a support member formed, when the solder bump is melted when mounting the device main body portion on the mounting board via the solder bump, the support member is attached to the element mounting board and the mounting board. The device supports the device main body in contact with the device.

Thus, even if the weight of the device main body increases, the height of the solder bump when the solder bump is melted can be controlled by the support member to mount the device main body on the mounting board.

Therefore, it is possible to prevent the bumps from being crushed when the solder bumps are melted. As a result, it is possible to prevent short-circuiting between the solder bumps and improve the connection reliability of the solder bumps.

Further, a method of mounting a semiconductor device according to the present invention comprises:
An element mounting board or a mounting board having a supporting member formed to be lower than the height of the solder bump after mounting the device body of the semiconductor device and having a larger thermal expansion coefficient than the solder of the solder bump is prepared. Forming a device body by mounting a semiconductor element on the element mounting board, forming a gap between the support member and the mounting board or the element mounting board, the semiconductor element is Arranging the device main body including the mounted element mounting board on the mounting board via the solder bumps, melting the solder bumps, and supporting the device main body by the support member; Electrically connecting the element mounting board and the mounting board by solder bumps; Shrinking the member and mounting the device body on the mounting board via the solder bumps in a state where a gap is formed between the support member and the mounting board or the element mounting board. Have

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a sectional view showing an embodiment of a structure of a semiconductor device according to the present invention, and FIG. 2 is an example of an embodiment of a mounting state of a support member on an element mounting board of the semiconductor device of the present invention. FIGS. 3A, 3B, and 3C are enlarged partial cross-sectional views illustrating an example of an embodiment of a method for mounting a semiconductor device according to the present invention.

The semiconductor device according to the present embodiment has a BGA
A device main body 3 having the same structure as that of the above is mounted on a printed circuit board 5 via solder bumps 4, and the device mounting board 2 and the printed circuit board 5 of the device main body 3 are arranged in a grid pattern. The device body 3 is mounted on the printed circuit board 5 by being electrically connected by the solder bumps 4.

The structure of the semiconductor device shown in FIG. 1 will be described.
(Large Scale Integration)) and a printed circuit board 5 on which the device body 3 is mounted via solder bumps 4 (mounting board).
And a support member 6 formed of a material having a larger coefficient of thermal expansion than the solder forming the solder bumps 4, and formed to be lower than the height of the solder bumps 4 after mounting the device body 3.
When the device body 3 is mounted on the printed circuit board 5 via the solder bumps 4 and the solder bumps 4 are melted, the support member 6 comes into contact with the element mounting board 2 and the printed circuit board 5 and 3 is supported.

Here, the semiconductor chip 1 is mounted on the element mounting board 2 by CCB (Controlled Collapse) made of solder or the like.
Bonding) CCB bumps are connected by the bumps 7, thereby being surface-mounted on the element mounting board 2 and electrically connected to the element mounting board 2.

Further, the device main body 3 includes the element mounting board 2.
The semiconductor chip 1 mounted on the element mounting substrate 2 is sealed with a sealing resin 8 (resin for underfill), the CCB bump 7 is reinforced by the sealing resin 8, and the surface 1b of the semiconductor chip 1 is sealed. The sealing resin 8 is formed of, for example, an epoxy-based thermosetting resin.

The element mounting board 2 is also called a BGA base, and is formed of, for example, glass epoxy resin and has a square planar shape, and is formed by a plurality of solder bumps 4 arranged in a grid. The printed circuit board 5 is mounted.

The printed board 5 is a mounting board on which various semiconductor devices and electronic components are mounted, and is formed of, for example, an epoxy resin.

The supporting member 6 is for preventing the bumps of the solder bumps 4 from being crushed when the solder bumps 4 are melted, and is made of a material having a larger coefficient of thermal expansion than the solder forming the solder bumps 4, for example, an element mounting board. 2 and is formed so as to be lower than the height of the solder bumps 4 after the device main body 3 is mounted on the printed circuit board 5.

The coefficient of thermal expansion of the glass epoxy resin is as follows:
As an example, 30 × 10 ⁻⁶ / ° C.
The coefficient of thermal expansion of the solder used for is, for example, 24 × 1
0 ^-6 / ° C.

The melting point of the solder is, for example, about 183 when the composition of the solder is Pb-63 wt% Sn.
° C.

Here, in the semiconductor device of the present embodiment, the support member 6 is provided on the element mounting board 2 of the apparatus main body 3, and after the apparatus main body 3 is mounted on the printed board 5, the support member 6 A gap a (FIG. 3)
(C) will be described.

That is, as shown in FIG. 3C, the height of the solder bumps 4 after mounting the device body 3 is H, the height of the support member 6 is h, and the support member 6 and the printed circuit board 5 are connected to each other. If a gap is represented by a, then H 表 h + a.

The support member 6 is formed in a rectangular frame shape (see FIG. 2) with a vertical section, and as shown in FIG.
The outer peripheral portion 6 a of the frame-shaped support member 6 is formed to have the same size as the outer peripheral portion 2 a of the element mounting substrate 2.

Further, in the present embodiment, when manufacturing the element mounting board 2, the support member 6
The case where it is integrally formed will be described.

That is, the outer shape of the support member 6 is formed in a frame shape substantially along the outer peripheral portion 2a of the element mounting substrate 2, and the frame-shaped support member 6 is previously formed in the manufacturing process of the element mounting substrate 2. It is formed integrally with the element mounting board 2.

In the semiconductor device of the present embodiment, the electrode forming surface 1a of the semiconductor chip 1 in the device body 3 is provided.
A heat dissipating member 9 made of aluminum or the like is attached to the back surface opposite to (the surface 1b in the present embodiment, hereinafter referred to as the surface 1b).

The heat dissipating member 9 attached to the semiconductor device of the present embodiment has the same planar size as the element mounting board 2.

In the semiconductor device, a signal from the semiconductor chip 1 is expanded and propagated in the element mounting board 2 and then transmitted to the printed board 5.

Next, a method of mounting the semiconductor device according to the present embodiment will be described.

In the present embodiment, the frame-shaped support member 6 is provided integrally with the element mounting board 2, and after the apparatus main body 3 is mounted on the printed board 5, the support member 6 and the printed board 5 A case where a gap a is formed between the two will be described.

First, as shown in FIG. 3, a material which is formed to be lower than the height H of the solder bump 4 after mounting the device body 3 of the semiconductor device and has a larger coefficient of thermal expansion than the solder of the solder bump 4 ( In the present embodiment, an element mounting substrate 2 having a supporting member 6 having a height h formed of glass epoxy resin) is prepared (H> h).

Here, in this embodiment, since the frame-shaped support member 6 is provided integrally with the element mounting substrate 2, when manufacturing the element mounting substrate 2, a method of forming a multilayer substrate is used. The frame-shaped support member 6 (see FIG. 2) is also formed integrally with the element mounting substrate 2 by utilizing the above.

It should be noted that the frame-shaped supporting member 6 is
And not as an integral part, but as a separate piece
When bonding is performed later, the outer peripheral portion 2a of the element mounting substrate 2 is used.
The frame-shaped support member 6 is attached to the element mounting board 2 with an adhesive by aligning the position with the outer peripheral portion 6a of the frame-shaped support member 6.

Thus, the element mounting board 2 provided with the supporting member 6 having the height h can be prepared.

Thereafter, as shown in FIG. 1, the semiconductor chip 1 is mounted on the element mounting board 2 and the heat radiating member 9 is attached to the semiconductor chip 1 to form the device main body 3.

When mounting the chip, the CCB bump 7
The semiconductor chip 1 is connected to the element mounting board 2 by CCB bumping.

Thus, chip mounting is performed, and the semiconductor chip 1 and the element mounting board 2 are electrically connected.

Subsequently, a sealing resin 8 is applied (supplied) to the joint between the CCB bumps 7 and the periphery of the semiconductor chip 1 so that the joint between the semiconductor chip 1 and the CCB bumps 7 is sealed.
Protect by.

Thereafter, the heat radiating member 9 is attached to the back surface, that is, the front surface 1b of the semiconductor chip 1 by using an epoxy adhesive or the like.

Further, the solder bumps 4 are supplied on predetermined positions on the printed circuit board 5, and then, as shown in FIG. A space slightly larger than a) is formed, and the device main body 3 including the element mounting board 2 on which the semiconductor chip 1 (see FIG. 1) is mounted is arranged on the printed board 5 via the solder bumps 4.

At this time, the predetermined bump mounting electrode 2b of the element mounting board 2 and the predetermined bump mounting electrode 5a of the printed board 5 are arranged at positions corresponding to each other via the solder bumps 4.

Thereafter, at a predetermined temperature, for example, 200 to 24
Reflow furnace (not shown) with high temperature atmosphere of 0 ° C
Then, the apparatus body 3 and the element mounting substrate 2 in the state shown in FIG. 3A are carried in, and they are passed through the reflow furnace.

Subsequently, when the solder bumps 4 are heated and melted in the reflow furnace, the device main body 3 is slightly lowered due to the weight of the heat radiation member 9 and the weight of the element mounting board 2 itself.

At this time, since the thermal expansion coefficient of the support member 6 is larger than the thermal expansion coefficient of the solder bump 4, the support member 6 is also thermally expanded.

Then, when the solder bumps 4 melt and the apparatus main body 3 descends, as shown in FIG. 3B, the support member 6 comes into contact with the printed circuit board 5, and the support body 6 causes the apparatus main body 3 to move. Can be supported.

As a result, since the apparatus main body 3 is supported by the support member 6, it does not descend further. Therefore, the occurrence of bump crushing when the solder bumps 4 are melted can be prevented.

In other words, the connection height of the solder bump 4 (the height of the solder bump 4 in FIG. 3B) does not become lower than the height h of the support member 6.

Thus, the device mounting board 2 and the printed board 5 are electrically connected by the solder bumps 4 while supporting the apparatus main body 3 by the support member 6.

Thereafter, the semiconductor device is carried out of the reflow furnace.

After a lapse of a predetermined time, the solder bump 4 cools down to room temperature and hardens.

Further, as shown in FIG. 3C, as the solder bumps 4 are hardened, the support member 6 also cools and contracts.

At this time, the support member 6 made of glass epoxy resin is formed so as to have a larger coefficient of thermal expansion than solder and to be lower than the height of the solder bumps 4 after the device main body 3 is mounted. , To a height h, whereby a gap a is formed between the support member 6 and the printed board 5.

As a result, the device body 3 can be mounted on the printed circuit board 5 via the solder bumps 4 with the gap a formed between the support member 6 and the printed circuit board 5. 3 and the printed board 5 are electrically connected by the solder bumps 4.

Since the gap a is formed, the solder bumps 4 are not subjected to any stress other than the load from the device main body 3 itself, and are bonded to each other with the degree of freedom maintained.

According to the semiconductor device of this embodiment and the method of mounting the same, the following operation and effect can be obtained.

That is, the device main body 3 of the semiconductor device
When the solder bumps 4 are melted, the supporting members 6 that support the device body 3 when the solder bumps 4 are melted are provided even when the weight of the device body 3 increases. The apparatus main body 3 can be mounted on the printed circuit board 5 by controlling the height of the bumps 4 with the support member 6.

As a result, bump crushing when the solder bumps 4 are melted can be prevented. As a result, short-circuiting between the solder bumps 4 can be prevented, and connection reliability of the solder bumps 4 can be improved.

Further, by supporting the apparatus main body 3 by the supporting member 6 when the solder bumps 4 are melted, the solder bumps 4 are not crushed even if the weight of the apparatus main body 3 increases.
The device main body 3 can be supported.

As a result, a large heat radiating member 9 (for example, the heat radiating member 9 shown in FIG. 6) can be attached to the semiconductor chip 1, so that the heat radiating property of the semiconductor chip 1 can be improved and the device main body 3 is provided. The performance of the semiconductor device can be improved.

Further, the height of the solder bumps 4 is controlled by the support member 6 to mount the apparatus main body 3, whereby the height of the solder bumps 4 at the time of mounting (here, the height H
) Can be secured.

As a result, the height of the solder bumps 4 can be prevented from being lower than the design value, so that the connection life of the solder bumps 4 can be extended.

The supporting member 6 is formed of a material having a larger coefficient of thermal expansion than the solder (in this embodiment, glass epoxy resin), and is lower than the height of the solder bumps 4 after the device main body 3 is mounted. Due to the formation, when the support member 6 cools and shrinks as the solder bumps 4 cure, a gap a can be formed between the support member 6 and the printed board 5.

As a result, it is possible to prevent the stress caused by the support member 6 from acting on the solder bumps 4 after mounting the device main body 3. That is, the solder bumps 4 are not restricted in the degree of freedom in the bump height direction which the solder bumps 4 originally have.

Accordingly, since the solder bumps 4 do not adversely affect the connection, the connection life of the solder bumps 4 can be extended, and the connection reliability of the solder bumps 4 can be improved.

Further, since the supporting member 6 is formed integrally with the element mounting substrate 2 of the apparatus main body 3, the supporting member 6 can be formed together when the element mounting substrate 2 is formed as a multilayer substrate. , Support member 6 in device body 3
Can be simplified.

Further, the supporting member 6 is formed in a frame shape, and the outer peripheral portion 6a of the frame-shaped supporting member 6 is
Is formed to have the same size as the outer peripheral portion 2a, the positioning at the time of attaching the support member 6 to the element mounting substrate 2 can be simplified.

Thus, the mounting of the support member 6 on the apparatus main body 3 can be simplified as described above.

Although the invention made by the present inventor has been specifically described based on the embodiments of the present invention, the present invention is not limited to the embodiments of the present invention, and does not depart from the gist of the invention. It is needless to say that various changes can be made.

For example, in the semiconductor device described in the above embodiment, the case where the supporting member 6 is frame-shaped and formed integrally with the element mounting substrate 2 has been described. As in the installation state of the support member 6 according to the embodiment, each of the four corners 2c of the element mounting substrate 2 (see FIG. 4) or each near the center of the four sides of the element mounting substrate 2 (see FIG. 5), and four support members 6 having a height h may be attached.

According to this, the same operation and effect as those described in the above embodiment can be obtained.

Further, in the semiconductor device of the above embodiment, as shown in FIG.
Although the case where the size is about the same as that described above, a semiconductor device to which a heat dissipating member 9 larger than the element mounting substrate 2 is attached as in the semiconductor device according to another embodiment shown in FIG.

Also in this semiconductor device, since the supporting member 6 is provided on the element mounting substrate 2, the same operation and effect as those of the semiconductor device shown in FIG. 1 are obtained, and the heat radiation effect of the semiconductor device is further improved. As a result, the performance of the semiconductor device can be improved.

In the above embodiment and the other embodiments shown in FIGS. 4 to 6, the case where the supporting member 6 is provided on the element mounting board 2 has been described. However, in the other embodiment shown in FIG. The support member 6 may be provided on the motherboard 10 (mounting substrate) as in the semiconductor device of the embodiment.

That is, a motherboard 10 provided with a support member 6 at a predetermined position is prepared in advance, and then the device main body 3 is mounted on the motherboard 10 by the same method as the semiconductor device mounting method of the above-described embodiment. To manufacture a semiconductor device.

In the case of the semiconductor device according to another embodiment shown in FIG. 7, since the support member 6 is provided on the motherboard 10 which is a mounting substrate, the support member 6 is mounted after the device body 3 is mounted. A between the device and the substrate 2
(See FIG. 3C).

As a result, the same function and effect as those described in the above embodiment can be obtained by the semiconductor device shown in FIG.

The support member 6 is not limited to those described in the above embodiment and the other embodiments. The support member 6 has a larger coefficient of thermal expansion than the solder of the solder bump 4, and is mounted on the device body 3 in advance. The shape, the number of installations, and the installation positions are not particularly limited as long as they are formed so as to be lower than the height of the later solder bump 4.

For example, the shape of the support member 6 may be a cylinder, a prism, a sphere, or the like.

Further, the material of the support member 6 may be other than glass epoxy resin.

Further, the material of the element mounting board 2 is not limited to glass epoxy resin, either.
For example, alumina or ceramic may be used.

Further, in the semiconductor device according to the above embodiment or another embodiment, the case where the semiconductor chip 1 is sealed (protected) with the sealing resin 8 is described. The present invention is not limited to resin sealing, but may be sealing using a cap or the like.

The electrical connection between the semiconductor chip 1 and the element mounting substrate 2 is not limited to the CCB bump connection, but the semiconductor chip 1 is mounted on the element mounting substrate 2 with its front and back inverted, and thereafter, wire bonding is performed. Wire bonding connection may be used.

[0091]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). When the device main body of the semiconductor device is mounted on the mounting board, the support member that supports the device main body when the solder bump is melted can prevent bump crushing when the solder bump melts. As a result, a short circuit between the solder bumps can be prevented, and the connection reliability of the solder bumps can be improved.

(2). By supporting the apparatus main body by the supporting member when the solder bumps are melted, the apparatus main body can be supported without crushing the solder bumps even if the weight of the apparatus main body increases. This makes it possible to attach a large heat radiation member to the semiconductor element, thereby improving the heat radiation of the semiconductor element and improving the performance of the semiconductor device.

(3). By mounting the device body by controlling the height of the solder bumps by the support member, the height of the solder bumps during mounting can be ensured. As a result, the height of the solder bump can be prevented from being reduced, and as a result, the connection life of the solder bump can be extended.

(4). Since the supporting member is formed of a material having a larger coefficient of thermal expansion than solder and is formed to be lower than the height of the solder bump after mounting the device main body, the stress caused by the supporting member after mounting the device main body. Prevents working on solder bumps. Therefore, since the solder bump does not adversely affect the connection, the connection life of the solder bump can be extended,
In addition, the connection reliability of the solder bump can be improved.

[Brief description of the drawings]

FIG. 1 is a sectional view showing an example of an embodiment of a structure of a semiconductor device according to the present invention.

FIG. 2 is a bottom view showing an example of an embodiment in which a support member is installed on an element mounting substrate of the semiconductor device of the present invention.

FIGS. 3A, 3B, and 3C are enlarged partial cross-sectional views illustrating an example of an embodiment of a method of mounting a semiconductor device according to the present invention.

FIG. 4 is a bottom view showing an installation state of a support member on an element mounting board of a semiconductor device according to another embodiment of the present invention.

FIG. 5 is a bottom view showing an installation state of a support member on an element mounting board of a semiconductor device according to another embodiment of the present invention.

FIG. 6 is a cross-sectional view illustrating a structure of a semiconductor device according to another embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating a structure of a semiconductor device according to another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Semiconductor chip (semiconductor element) 1a Electrode formation surface 1b Surface 2 Element mounting board 2a Perimeter 2b Bump mounting electrode 2c Corner 3 Device main body 4 Solder bump 5 Printed board (mounting board) 5a Bump mounting electrode 6 Supporting member 6a Outer circumference Part 7 CCB bump 8 Sealing resin 9 Heat dissipating member 10 Mother board (mounting board) H Height of solder bump after mounting device body h Height of supporting member a Gap

Claims (8)

[Claims] 1. A semiconductor device in which an element mounting board is mounted via solder bumps, wherein the apparatus main body includes the element mounting board on which a semiconductor element is mounted, and the device main body is connected via the solder bumps. And a support member formed of a material having a larger coefficient of thermal expansion than the solder forming the solder bumps, and formed lower than the height of the solder bumps after mounting the device main body, When the solder bumps are melted when the device body is mounted on the mounting board via the solder bumps, the support member contacts the element mounting board and the mounting board to support the device body. A semiconductor device characterized by the above-mentioned. 2. The semiconductor device according to claim 1, wherein the support member is provided on the element mounting board of the device main body, and the support member is mounted on the device main body after the device main body is mounted on the mounting board. A semiconductor device, wherein a gap is formed between the semiconductor device and the mounting substrate. 3. The semiconductor device according to claim 1, wherein the support member is provided on the mounting board, and the support member and the element mounting board are connected to each other after the device body is mounted on the mounting board. A semiconductor device, wherein a gap is formed between the semiconductor devices. 4. The semiconductor device according to claim 1, wherein the support member is formed integrally with the element mounting board of the device main body, and after the device main body is mounted on the mounting substrate. A semiconductor device, wherein a gap is formed between the support member and the mounting substrate. 5. The semiconductor device according to claim 1, wherein said support member is formed in a frame shape, and said frame-shaped outer peripheral portion has the same size as the outer peripheral portion of said element mounting substrate. A semiconductor device characterized by being formed in the above. 6. The semiconductor device according to claim 1, wherein a heat radiating member is attached to a rear surface of the device main body opposite to an electrode forming surface of the semiconductor element. A semiconductor device characterized by the above-mentioned. 7. A method of mounting a semiconductor device having an element mounting board, wherein the semiconductor device is formed to have a height lower than a height of a solder bump after mounting a device main body of the semiconductor device, and is thermally expanded more than solder of the solder bump. A step of preparing an element mounting board or a mounting board having a support member formed of a material having a large coefficient; a step of mounting a semiconductor element on the element mounting board to form the device main body; Forming a gap between the mounting board or the element mounting board, and arranging the device main body including the element mounting board on which the semiconductor element is mounted via the solder bumps on the mounting board; and Melting the solder bumps and supporting the device main body by the support member while the element mounting board and the mounting board by the solder bumps; Electrically connecting the device body; and curing the solder bumps and contracting the support member to form a gap between the support member and the mounting board or the element mounting board. Mounting a portion on the mounting board via the solder bumps. 8. A method of mounting a semiconductor device having an element mounting substrate, wherein the semiconductor device is formed to have a height lower than a height of a solder bump after mounting a device main body of the semiconductor device, and is thermally expanded more than solder of the solder bump. A step of preparing an element mounting substrate having a supporting member formed of a material having a large coefficient; a step of mounting a semiconductor element on the element mounting substrate to form the device main body; and the supporting member and the mounting substrate. Form a gap between
Arranging the device main body including the element mounting board on which the semiconductor element is mounted via the solder bumps on the mounting board; melting the solder bumps; and supporting the device main body by the support member. Electrically connecting the element mounting board and the mounting board by the solder bumps while supporting, and hardening the solder bumps and shrinking the support member, so that the space between the support member and the mounting board is reduced. Mounting the device body on the mounting board via the solder bumps in a state where a gap is formed in the semiconductor device.