JPH09141650A - 材料の塊を切断する装置および方法 - Google Patents

材料の塊を切断する装置および方法

Info

Publication number
JPH09141650A
JPH09141650A JP8144297A JP14429796A JPH09141650A JP H09141650 A JPH09141650 A JP H09141650A JP 8144297 A JP8144297 A JP 8144297A JP 14429796 A JP14429796 A JP 14429796A JP H09141650 A JPH09141650 A JP H09141650A
Authority
JP
Japan
Prior art keywords
mass
wire
cutting
sleeve
cutting position
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP8144297A
Other languages
English (en)
Japanese (ja)
Inventor
Roy T Bonzo
トーマス ボンゾー ロイ
Jr H Gordon Shafer
ゴードン シャファー ジュニア ハロルド
Jackson P Trentelman
フェルプス トレントルマン ジャクソン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Corning Inc
Original Assignee
Corning Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corning Inc filed Critical Corning Inc
Publication of JPH09141650A publication Critical patent/JPH09141650A/ja
Withdrawn legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
    • B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Devices For Post-Treatments, Processing, Supply, Discharge, And Other Processes (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP8144297A 1995-06-06 1996-06-06 材料の塊を切断する装置および方法 Withdrawn JPH09141650A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/469,958 US5564409A (en) 1995-06-06 1995-06-06 Apparatus and method for wire cutting glass-ceramic wafers
US469958 1995-06-06

Publications (1)

Publication Number Publication Date
JPH09141650A true JPH09141650A (ja) 1997-06-03

Family

ID=23865703

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8144297A Withdrawn JPH09141650A (ja) 1995-06-06 1996-06-06 材料の塊を切断する装置および方法

Country Status (3)

Country Link
US (1) US5564409A (fr)
EP (1) EP0747187A3 (fr)
JP (1) JPH09141650A (fr)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025429A (ja) * 2009-07-22 2011-02-10 Sumitomo Metal Mining Co Ltd ワイヤソーによるサファイア単結晶の切断方法と単結晶サファイア基板
JP2011046593A (ja) * 2009-07-30 2011-03-10 Nippon Electric Glass Co Ltd ガラスリボン及びその製造方法
JP2011177849A (ja) * 2010-03-02 2011-09-15 Toyo Advanced Technologies Co Ltd ワイヤソー

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US5937844A (en) * 1996-03-26 1999-08-17 Shin-Etsu Handotai Co., Ltd. Method for slicing cylindrical workpieces by varying slurry conditions and wire feed rate during slicing
JPH09290358A (ja) * 1996-04-25 1997-11-11 Komatsu Electron Metals Co Ltd 半導体ウェハの製造方法および半導体インゴットの面 取り加工装置
DE69723151T2 (de) * 1996-04-27 2004-03-11 Nippei Toyama Corp. Drahtsäge und Abschneideverfahren
JP3273163B2 (ja) * 1996-09-06 2002-04-08 シャープ株式会社 マルチワイヤソー
DE19717379A1 (de) * 1997-04-24 1998-10-29 Wacker Siltronic Halbleitermat Drahtsäge und Montagestation für eine Drahtführungsrolle einer Drahtsäge sowie Verfahren zum Auswechseln einer Drahtführungsrolle
US5878737A (en) * 1997-07-07 1999-03-09 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
US6024080A (en) * 1997-07-07 2000-02-15 Laser Technology West Limited Apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
KR20010021539A (ko) * 1997-07-07 2001-03-15 존 비. 호드스덴 다이아몬드 함유 와이어를 이용하여 작업물을 얇게절단하기 위한 장치 및 방법
US6279564B1 (en) 1997-07-07 2001-08-28 John B. Hodsden Rocking apparatus and method for slicing a workpiece utilizing a diamond impregnated wire
JP4049900B2 (ja) * 1998-08-20 2008-02-20 株式会社スーパーシリコン研究所 ワイヤソー切断装置
DE19851070A1 (de) * 1998-11-05 2000-05-18 Wacker Siltronic Halbleitermat Verfahren und Vorrichtung zum gleichzeitigen Abtrennen einer Vielzahl von Scheiben von einem Werkstück
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US20050087181A1 (en) * 2003-09-29 2005-04-28 Wille Steven L. Method and apparatus of cutting crystalline material
JP4411062B2 (ja) * 2003-12-25 2010-02-10 株式会社アライドマテリアル 超砥粒ワイヤソー巻き付け構造、超砥粒ワイヤソー切断装置および超砥粒ワイヤソーの巻き付け方法
GB2414204B (en) * 2004-05-18 2006-04-12 David Ainsworth Hukin Abrasive wire sawing
US20070251516A1 (en) * 2006-04-28 2007-11-01 Nieber Albert R Precision slicing of large work pieces
US8291895B2 (en) * 2007-09-05 2012-10-23 University Of South Carolina Methods, wires, and apparatus for slicing hard materials
ITMO20080039A1 (it) * 2007-09-28 2009-03-29 Luigi Pedrini Dispositivo di supporto, guida e/o trasmissione del moto al filo diamantato di macchine per il taglio di pietre
US20090122637A1 (en) * 2007-11-14 2009-05-14 Jan Kruyer Sinusoidal mixing and shearing apparatus and associated methods
US20090139905A1 (en) * 2007-11-30 2009-06-04 Jan Kruyer Endless cable system and associated methods
US20090139906A1 (en) * 2007-11-30 2009-06-04 Jan Kruyer Isoelectric separation of oil sands
CN102079111A (zh) * 2009-11-26 2011-06-01 上海日进机床有限公司 蓝宝石硅棒的切割方法
CN101758561B (zh) * 2010-01-12 2011-06-15 大连连城数控机器有限公司 多线切割机线管理装置
US8991381B2 (en) * 2010-02-08 2015-03-31 Toyo Advanced Technologies Co., Ltd. Method of cutting workpiece with wire saw, and wire saw
MY159039A (en) * 2010-02-08 2016-12-15 Toyo Advanced Tech Co Ltd Wire saw
JP2013038116A (ja) * 2011-08-04 2013-02-21 Sumitomo Electric Ind Ltd Ｉｉｉ族窒化物結晶基板の製造方法
DE102011082366B3 (de) * 2011-09-08 2013-02-28 Siltronic Ag Einlagiges Wickeln von Sägedraht mit fest gebundenem Schneidkorn für Drahtsägen zum Abtrennen von Scheiben von einem Werkstück
KR101390794B1 (ko) * 2011-12-23 2014-05-07 주식회사 엘지실트론 잉곳 절단용 와이어 가이드, 이를 포함한 와이어 쏘 장치 및 잉곳 절단 방법
CN103586988B (zh) * 2013-11-25 2016-03-23 王金生 一种线锯切割机
US10882126B2 (en) * 2017-01-13 2021-01-05 ESCO Group, Inc. Take-up and payoff system for vertical profiling cutting saw (VPX)
TWI713832B (zh) * 2017-04-28 2020-12-21 友達晶材股份有限公司 晶圓切片機及其收放線裝置與晶圓切片的方法
DE102018221922A1 (de) * 2018-12-17 2020-06-18 Siltronic Ag Verfahren zur Herstellung von Halbleiterscheiben mittels einer Drahtsäge, Drahtsäge und Halbleiterscheibe aus einkristallinem Silizium
WO2022057296A1 (fr) * 2020-09-16 2022-03-24 天通日进精密技术有限公司 Machine de coupe-meulage de tige de silicium intégrée

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011025429A (ja) * 2009-07-22 2011-02-10 Sumitomo Metal Mining Co Ltd ワイヤソーによるサファイア単結晶の切断方法と単結晶サファイア基板
JP2011046593A (ja) * 2009-07-30 2011-03-10 Nippon Electric Glass Co Ltd ガラスリボン及びその製造方法
JP2015044742A (ja) * 2009-07-30 2015-03-12 日本電気硝子株式会社 ガラスリボン及びその製造方法
JP2011177849A (ja) * 2010-03-02 2011-09-15 Toyo Advanced Technologies Co Ltd ワイヤソー

Also Published As

Publication number Publication date
EP0747187A3 (fr) 1997-04-23
EP0747187A2 (fr) 1996-12-11
US5564409A (en) 1996-10-15

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Legal Events

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Effective date: 20030902