JPH09134993A - Lead frame, semiconductor integrated circuit device using it and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lead frame for realizing its thinning, a semiconductor integrated circuit device using it and a method of manufacturing it. SOLUTION: This device has a chip receiving space 2a for receiving a semiconductor chip and a chip fit-in part 2b abutting on the outer peripheral side surface of the semiconductor chip, and the semiconductor chip is received in the chip receiving space 2a formed in the chip fit-in part 2b and the semiconductor chip is fixed. The chip fit-in part 2b is a chip fit-in frame 2d formed in a frame-like form. For that reason, the inner peripheral part 2c of the chip fit-in part 2b is made to abut on the outer peripheral side surface of the semiconductor chip, thereby fixing the semiconductor chip with the outer peripheral side surface of the semiconductor chip being fitted into the chip fit-in part 2b.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor chip fixing technique, and more particularly to a lead frame for fixing the outer peripheral side surface of a semiconductor chip, a semiconductor integrated circuit device using the same, and a manufacturing method thereof.

[0002]

2. Description of the Related Art The technology described below studies the present invention,
The present invention was studied by the present inventors upon completion, and its outline is as follows.

The lead frame, which is one of the constituent members of the semiconductor integrated circuit device, has a chip mounting portion. There are various methods for fixing the semiconductor chip, but silver paste or the like is used for the chip mounting portion of the lead frame. The main method is to apply the bonding agent (1) and fix the semiconductor chip to the chip mounting portion via the bonding agent.

A lead frame having a chip mounting portion called a tab is disclosed in JP-A-55-21128.
No. 6,086,045.

[0005]

However, in the above-mentioned technique, since the semiconductor chip is fixed to the chip mounting portion of the lead frame via the bonding agent or the like, the thickness of the peripheral portion of the semiconductor chip in the semiconductor integrated circuit device is In addition to the total thickness of the three members of the chip mounting portion of the lead frame, the bonding agent, and the semiconductor chip, the arch height of the bonding wire and the thickness of the resin portion on the front and back surfaces of the semiconductor chip are added.

Therefore, in realizing a thin semiconductor integrated circuit device, it is a problem that the thickness of the peripheral portion of the semiconductor chip cannot be reduced.

An object of the present invention is to provide a lead frame which realizes a thin structure, a semiconductor integrated circuit device using the same, and a manufacturing method thereof.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0009]

SUMMARY OF THE INVENTION Among the inventions disclosed in the present application, the outline of a representative one will be briefly described.
It is as follows.

That is, the lead frame according to the present invention is provided with a chip fitting portion which forms a chip housing space for housing a semiconductor chip and is in contact with the outer peripheral side surface of the semiconductor chip.

Since the semiconductor chip can be fixed on the outer peripheral side surface by fitting with the chip fitting portion of the lead frame, the chip mounting portion (tab) of the lead frame becomes unnecessary when fixing the semiconductor chip. The chip mounting part can be removed.

As a result, in manufacturing the semiconductor integrated circuit device, it is possible to reduce the thickness of the semiconductor chip and its peripheral portion, and the semiconductor integrated circuit device can be made thinner.

In the lead frame according to the present invention, the chip fitting portion is a chip fitting frame whose inner peripheral portion abuts on the outer peripheral side surface of the semiconductor chip.

Further, in the semiconductor integrated circuit device according to the present invention, the semiconductor chip is accommodated in a chip accommodating space formed in the chip fitting portion of the lead frame, and the outer peripheral side surface of the semiconductor chip and the chip fitting portion are accommodated. The semiconductor chips are fixed by abutting and fitting.

Further, in the method for manufacturing a semiconductor integrated circuit device according to the present invention, a lead frame provided with a chip fitting portion forming a chip housing space is prepared, and at least the chip fitting portion of the lead frame is heated. By expanding the size of the chip housing space, arranging the semiconductor chip in the chip housing space, by leaving or cooling the lead frame until the temperature of the lead frame returns to around room temperature The size is returned to the original state, and the outer peripheral side surface of the semiconductor chip and the chip fitting portion are fitted to fix the semiconductor chip.

[0016]

Embodiments of the present invention will be described below in detail with reference to the drawings.

FIG. 1 is a partial plan view showing an example of an embodiment of a lead frame structure according to the present invention, and FIG. 2 is an enlarged view showing an example of an embodiment of a semiconductor chip fixing method using the lead frame of the present invention. 3 is a partial plan view, FIG. 3 is an enlarged partial sectional view showing an example of an embodiment of the structure of the AA cross section in the method of fixing the semiconductor chip shown in FIG. 2, and FIG. FIG. 6 is a cross-sectional view showing an example of the form of FIG.

Explaining the structure of the lead frame 2 of the present embodiment, a chip housing space 2a for housing the semiconductor chip 1 is formed and the outer peripheral side surface 1a of the semiconductor chip 1 is formed.
Is provided with a chip fitting portion 2b.

That is, the semiconductor chip 1 is attached to the chip fitting portion 2
The semiconductor chip 1 is fixed by being housed in the chip housing space 2a formed in b.

The chip fitting portion 2b of the lead frame 2 according to this embodiment is supported by, for example, four fitting portion suspension leads 2g, and the inner peripheral portion 2c of the chip fitting portion 2b is the semiconductor chip 1. The chip fitting portion 2b is to be in contact with the outer peripheral side surface 1a, and the chip fitting portion 2b is a frame-shaped chip fitting frame 2d.

Next, the structure of the semiconductor integrated circuit device according to the present embodiment will be described.

The semiconductor integrated circuit device uses the lead frame 2 of this embodiment, and the semiconductor chip 1 is housed in the chip housing space 2a formed in the chip fitting portion 2b of the lead frame 2. In addition, the semiconductor chip 1 is fixed by the outer peripheral side surface 1a of the semiconductor chip 1 and the chip fitting portion 2b abutting and fitting.

That is, in the semiconductor integrated circuit device, the semiconductor chip 1 is fixed to the chip fitting portion 2b of the lead frame 2, and the semiconductor chip 1 and its peripheral portion are sealed.

Here, the semiconductor integrated circuit device shown in FIG. 4 is of the QFJ (Quad Flat J-leaded Package) type, but the semiconductor integrated circuit device is the lead frame 2.
Other types of semiconductor integrated circuit devices may be used as long as they fix the outer peripheral side surface 1a of the semiconductor chip 1 to the chip fitting portion 2b.

The structure of the semiconductor integrated circuit device will be described with reference to FIGS.
a lead frame 2 provided with a chip fitting portion 2b forming a, a bonding wire 3 for electrically connecting the lead portion 2e of the lead frame 2 and the electrode 1b of the semiconductor chip 1, the semiconductor chip 1 and the bonding wire. Three
Further, it comprises a sealing member 4 for sealing the peripheral portion thereof.

Instead of the bonding wire 3, a solder bump or the like may be used.

Further, the sealing member 4 is, for example, a thermosetting resin or the like.

Next, a method of manufacturing the semiconductor integrated circuit device of this embodiment will be described.

First, the lead frame 2 provided with the chip fitting portion 2b forming the chip housing space 2a is prepared.

At this time, the size of the chip housing space 2a is slightly smaller than the outer size of the semiconductor chip 1.

After that, at least the chip fitting portion 2b of the lead frame 2 or the entire lead frame 2 is heated.

As a result, the chip housing space 2a formed in the chip fitting frame 2d, which is the chip fitting portion 2b, expands due to thermal expansion of the chip fitting frame 2d.

In this state, the semiconductor chip 1 is placed in the chip housing space 2a.

That is, the semiconductor chip 1 is placed in the chip housing space 2a so that the inner peripheral portion 2c of the chip fitting frame 2d, which is the inner peripheral portion 2c of the chip fitting portion 2b, and the outer peripheral side surface 1a of the semiconductor chip 1 face each other. To place.

After that, the lead frame 2 is left standing or cooled until the temperature of the lead frame 2 returns to around room temperature.

As a result, the chip fitting frame 2d cools and contracts, and the size of the chip housing space 2a returns to the original state (size) before heating.

As a result, the inner peripheral portion 2c of the chip fitting frame 2d is
Contracts and contacts the outer peripheral side surface 1a of the semiconductor chip 1.

That is, the outer peripheral side surface 1a of the semiconductor chip 1 and the chip fitting portion 2b are fitted to each other, whereby the semiconductor chip 1 can be fixed to the chip fitting portion 2b of the lead frame 2.

After that, the electrode 1b of the semiconductor chip 1 and the lead portion 2e of the lead frame 2 are bonded to each other by the bonding wire 3
Then, the semiconductor chip 1 and its peripheral portion are sealed by a sealing member 4 such as a thermosetting resin.

As a result, the semiconductor integrated circuit device according to this embodiment can be manufactured.

According to the lead frame, the semiconductor integrated circuit device using the same and the method of manufacturing the same of the present embodiment, the following operational effects are obtained.

That is, the chip fitting portion 2b which forms the chip housing space 2a for housing the semiconductor chip 1 in the lead frame 2 and abuts on the outer peripheral side surface 1a of the semiconductor chip 1.
Since the semiconductor chip 1 is fixed on the outer peripheral side surface 1a by fitting with the chip fitting portion 2b of the lead frame 2, it is called a tab of the lead frame 2 when fixing the semiconductor chip 1. The chip mounting part becomes unnecessary, and the chip mounting part can be removed.

Thus, in manufacturing the semiconductor integrated circuit device, it is possible to reduce the thickness of the semiconductor chip 1 and its peripheral portion, and the semiconductor integrated circuit device can be thinned.

Further, the inner peripheral portion 2c of the chip fitting portion 2b of the lead frame 2 is the outer peripheral side surface 1 of the semiconductor chip 1.
Since the chip fitting frame 2d is in contact with a, the semiconductor chip 1 is placed in the chip housing space 2a formed by the chip fitting part 2b by heating the chip fitting part 2b and using thermal expansion and contraction of the chip fitting part 2b. Can be accommodated.

As a result, the outer peripheral side surface 1 of the semiconductor chip 1 is
The semiconductor chip 1 can be fixed by fitting a with the chip fitting portion 2b.

As a result, since the semiconductor chip 1 can be fixed without using the bonding agent 9 (see FIG. 9 described later) such as silver paste or thermosetting resin, the lead frame 2 can be mounted on the chip. The bonding agent 9 can also be removed together with the parts.

Therefore, in manufacturing the semiconductor integrated circuit device, it is possible to further reduce the thickness of the semiconductor chip 1 and its peripheral portion, and the semiconductor integrated circuit device can be made thinner.

Further, since the bonding agent 9 can be removed together with the chip mounting portion of the lead frame 2, it becomes possible to relax the constraint condition regarding the arch height 3a of the bonding wire 3 and the semiconductor integrated circuit. The manufacturability of the circuit device can be improved.

Although the invention made by the present inventor has been specifically described based on the embodiment of the invention, the invention is not limited to the embodiment of the invention, and does not depart from the gist of the invention. It goes without saying that various changes can be made with.

For example, in the method of manufacturing a semiconductor integrated circuit device according to the above-mentioned embodiment, since the chip fitting portion of the lead frame is a chip fitting frame formed in a frame shape, the chip is heated by heating the chip. Although the semiconductor frame is accommodated and fixed in the chip fitting portion by thermally expanding and contracting the fitting frame, as in the semiconductor chip fixing method according to another embodiment shown in FIG. The outer peripheral side surface 1a may be the inclined surface 1c, and the chip fitting portion 2b of the lead frame 2 and the inclined surface 1c of the semiconductor chip 1 may be fitted to fix the semiconductor chip 1.

A method of manufacturing the semiconductor integrated circuit device in this case will be described with reference to FIGS.

First, at the time of dicing the semiconductor wafer 6 attached to the adhesive sheet 5, the semiconductor wafer 6 is cut using the blade 7 having a V-shaped blade.

As a result, the outer peripheral side surface 1 of the semiconductor chip 1 is
The a can be the inclined surface 1c.

Further, the lead frame 2 provided with the chip fitting portion 2b forming the chip housing space 2a is prepared.

At this time, the size of the chip housing space 2a is
The size of the entire outer periphery of the inclined surface 1c of the semiconductor chip 1 in the vicinity of the center in the height direction is formed to be substantially the same.

After that, one of the front surface 1d and the back surface 1e of the semiconductor chip 1 having the smaller area (in this case, the front surface 1d
By inserting the semiconductor chip 1 into the chip housing space 2a of the lead frame 2 from the side), the outer peripheral side surface 1a of the semiconductor chip 1 and the chip fitting portion 2b are fitted together.

As a result, the semiconductor chip 1 can be fixed.

For fixing the semiconductor chip, the semiconductor chip fixing method according to another embodiment of the present invention shown in FIG. 6, FIG. 7, FIG. 8 or FIG. 9 may be used.

In the lead frame 2 shown in FIG. 6, the inner peripheral portion 2c of the chip fitting portion 2b of the lead frame 2 is tapered by processing such as coining, and the outer peripheral side surface 1a shown in FIG. 1c semiconductor chip 1
Is the tip fitting portion 2b having the taper on the inner peripheral portion 2c.
It is to be fitted to.

Thus, the tapered inner peripheral portion 2c of the chip fitting portion 2b and the outer peripheral side surface 1a of the semiconductor chip 1 are provided.
Since the slanted surface 1c is fitted, the fixing of the semiconductor chip 1 can be further strengthened.

The lead frame 2 shown in FIG. 7 is the same as the lead frame 2 shown in FIG.
The semiconductor chip 1 having a and the inner peripheral portion 2c are fitted with the tapered chip fitting portion 2b.

As a result, even the semiconductor chip 1 having the flat outer peripheral side surface 1a can be fixed to the chip fitting portion 2b.

In the lead frame 2 shown in FIG. 8, the semiconductor chip 1 having a step on the outer peripheral side surface 1a is fitted to the chip fitting portion 2b of the lead frame 2.

That is, when the blade 7 shown in FIG. 5 is used during dicing of the semiconductor chip 1, a blade (the shape of the blade in this case is not V-shaped but flat)
The thickness of the semiconductor chip 1 is divided into two types (the semiconductor wafer 6 shown in FIG. 5 is cut in two steps, a thick blade 7 and a thin blade 7 in the cutting step), and the outer periphery of the semiconductor chip 1 is cut. The side surface 1a is provided with a step.

As a result, even when the inner peripheral portion 2c of the chip fitting portion 2b of the lead frame 2 has a flat surface, the outer peripheral side surface 1a of the semiconductor chip 1 and the chip fitting of the lead frame 2 are joined together. The semiconductor chip 1 can be fixed by fitting the portion 2b.

In the lead frame 2 shown in FIG. 9, when the outer peripheral side surface 1a of the semiconductor chip 1 is fitted and fixed to the chip fitting portion 2b of the lead frame 2 shown in FIG. 2, the outer peripheral side surface of the semiconductor chip 1 is fixed. A bonding agent 9 such as a silver paste or a thermosetting resin is applied to the contact portion 8 between the 1a and the chip fitting portion 2b.

As a result, the fixing of the semiconductor chip 1 can be further strengthened.

Further, in the above embodiment, the case where the chip fitting portion 2b of the lead frame 2 is the chip fitting frame 2d formed in a frame shape has been described, but FIGS.
As in the lead frame 2 of the other embodiment shown in FIG. 2, as long as the semiconductor chip 1 is fixed by fitting the chip fitting portion 2b of the lead frame 2 and the outer peripheral side surface 1a of the semiconductor chip 1, the frame The shape is not limited to a quadrangle, but may be another shape, and the tip fitting portion 2b may have a shape other than the frame shape.

For example, the chip fitting portion 2b may not be connected like a frame, and an example of this case is shown in FIGS.

In the lead frame 2 shown in FIG. 10, the chip fitting portion 2b is composed of two fitting accommodating portions 2f that face each other, and the two fitting accommodating portions 2f are two outer peripheries of the semiconductor chip 1 that face each other. It is arranged so as to contact the side surface 1a.

As a result, similar to the lead frame 2 of the above-described embodiment, the chip fitting portion 2b of the lead frame 2 is formed.
That is, the semiconductor chip 1 can be fixed to the lead frame 2 by fitting the two fitting accommodating portions 2 f and the outer peripheral side surface 1 a of the semiconductor chip 1.

Further, in the lead frame 2 shown in FIG. 11, the chip fitting portion 2b is composed of four fitting housing portions 2f which are opposed to each other on a diagonal line of the semiconductor chip 1, and the four fitting housing portions 2f are formed. The semiconductor chip 1 is arranged so as to come into contact with the four outer peripheral corner side faces 1f.

As a result, like the lead frame 2 of the above-described embodiment, the chip fitting portion 2b of the lead frame 2 is formed.
That is, it is possible to fix the semiconductor chip 1 to the lead frame 2 by fitting the four fitting accommodating portions 2f and the outer peripheral corner side surfaces 1f of the semiconductor chip 1.

The fixing method of the semiconductor chip 1 in which the bonding agent 9 is applied to the contact portion 8 between the outer peripheral side surface 1a of the semiconductor chip 1 and the chip fitting portion 2b shown in FIG.
The lead frame 2 shown in FIG. 5, FIG. 6, FIG. 7 or FIG.
When fixing the semiconductor chip 1 to the semiconductor chip 1, as shown in FIG.
It goes without saying that the lead frame 2 shown in FIG. 11 can also be used in combination with the method of applying the bonding agent 9.

[0075]

Advantageous effects obtained by typical ones of the inventions disclosed in the present application will be briefly described.
It is as follows.

(1). Since the lead frame is provided with the chip fitting portion that forms the chip housing space for housing the semiconductor chip and is in contact with the outer peripheral side surface of the semiconductor chip, the semiconductor chip can be fixed on the outer peripheral side surface. At the time of fixing, the chip mounting portion (tab) of the lead frame becomes unnecessary, and the chip mounting portion can be removed. As a result, when manufacturing a semiconductor integrated circuit device, it is possible to reduce the thickness of the semiconductor chip and its peripheral portion, and it is possible to realize a thin semiconductor integrated circuit device.

(2). Since the chip fitting portion of the lead frame is a chip fitting frame whose inner peripheral portion abuts the outer peripheral side surface of the semiconductor chip, heats the chip fitting portion,
The semiconductor chip can be fixed by utilizing the thermal expansion and contraction of the chip fitting portion. As a result, the semiconductor chip can be fixed without using a bonding agent, so that the bonding agent can be removed together with the chip mounting portion of the lead frame. As a result, in manufacturing the semiconductor integrated circuit device, the thickness of the semiconductor chip and its peripheral portion can be further reduced, and the semiconductor integrated circuit device can be thinned.

(3). Since the bonding agent can also be removed together with the chip mounting portion of the lead frame, the constraint condition regarding the arch height of the bonding wire can be relaxed, and the manufacturability of the semiconductor integrated circuit device can be improved. .

[Brief description of the drawings]

FIG. 1 is a partial plan view showing an example of an embodiment of a lead frame structure according to the present invention.

FIG. 2 is an enlarged partial plan view showing an example of an embodiment of a method of fixing a semiconductor chip using a lead frame according to the present invention.

FIG. 3A in the method of fixing a semiconductor chip shown in FIG.
It is an expanded partial sectional view showing an example of an embodiment of a structure of a -A section.

FIG. 4 is a sectional view showing an example of an embodiment of a structure of a semiconductor integrated circuit device according to the present invention.

5A and 5B are views showing an example of a semiconductor chip fixing method according to another embodiment of the present invention, in which FIG. 5A is an enlarged partial sectional view thereof, and FIG. 5B is a blade shape of a blade for cutting a semiconductor wafer. FIG.

FIG. 6 is an enlarged partial sectional view showing an example of a method of fixing a semiconductor chip according to another embodiment of the present invention.

FIG. 7 is an enlarged partial sectional view showing an example of a method of fixing a semiconductor chip according to another embodiment of the present invention.

FIG. 8 is an enlarged partial sectional view showing an example of a method of fixing a semiconductor chip according to another embodiment of the present invention.

FIG. 9 is an enlarged partial sectional view showing an example of a method of fixing a semiconductor chip according to another embodiment of the present invention.

FIG. 10 is an enlarged partial plan view showing an example of the structure of a lead frame which is another embodiment of the present invention.

FIG. 11 is an enlarged partial plan view showing an example of the structure of a lead frame which is another embodiment of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 semiconductor chip 1a outer peripheral side surface 1b electrode 1c inclined surface 1d front surface 1e back surface 1f outer peripheral corner side surface 2 lead frame 2a chip accommodating space 2b chip fitting portion 2c inner peripheral portion 2d chip fitting frame 2e lead portion 2f fitting accommodating portion 2g Fitting part suspension lead 3 Bonding wire 3a Arch height 4 Sealing member 5 Adhesive sheet 6 Semiconductor wafer 7 Blade 8 Contact part 9 Bonding agent

Claims (8)

[Claims] 1. A lead frame for fixing a semiconductor chip, comprising a chip fitting portion for forming a chip housing space for housing the semiconductor chip and abutting on an outer peripheral side surface of the semiconductor chip. And lead frame. 2. The lead frame according to claim 1, wherein the chip fitting portion is a chip fitting frame whose inner peripheral portion abuts an outer peripheral side surface of the semiconductor chip. 3. The lead frame according to claim 1, wherein the chip fitting portion is composed of two fitting accommodating portions facing each other, and the two fitting accommodating portions are opposed to each other in the semiconductor chip. A lead frame, which is arranged so as to abut on two outer peripheral side surfaces. 4. The lead frame according to claim 1, wherein the chip fitting portion is composed of four fitting accommodating portions that are opposed to each other on a diagonal line of the semiconductor chip, and the four fitting accommodating portions are formed. A lead frame, which is arranged so as to come into contact with the four side surfaces of the outer peripheral corners of the semiconductor chip. 5. A semiconductor integrated circuit device using the lead frame according to claim 1, 2, 3 or 4, wherein the semiconductor chip is housed in a chip housing space formed in a chip fitting portion of the lead frame. Further, the semiconductor integrated circuit device is characterized in that the semiconductor chip is fixed by abutting and fitting the outer peripheral side surface of the semiconductor chip and the chip fitting portion. 6. The method of manufacturing a semiconductor integrated circuit device according to claim 5, wherein a lead frame provided with a chip fitting portion forming the chip housing space is prepared, and at least the chip fitting of the lead frame is performed. By expanding the size of the chip housing space by heating a portion, arranging the semiconductor chip in the chip housing space, and leaving or cooling the lead frame until the temperature of the lead frame returns to around room temperature. The size of the chip housing space is returned to the original state, and the semiconductor chip is fixed by fitting the outer peripheral side surface of the semiconductor chip and the chip fitting portion to each other. Production method. 7. The method for manufacturing a semiconductor integrated circuit device according to claim 5, wherein the dicing of the semiconductor wafer is performed by cutting the semiconductor wafer with a blade having a V-shaped blade shape.
An outer peripheral side surface of the semiconductor chip is an inclined surface, and a lead frame provided with a chip fitting portion forming the chip housing space is prepared. A method for manufacturing a semiconductor integrated circuit device, characterized in that the semiconductor chip is fixed by fitting the outer peripheral side surface of the semiconductor chip and the chip fitting part by inserting the chip into the chip housing space. 8. The method for manufacturing a semiconductor integrated circuit device according to claim 6, wherein when fixing the semiconductor chip by fitting the outer peripheral side surface of the semiconductor chip and the chip fitting portion, A method of manufacturing a semiconductor integrated circuit device, comprising applying a bonding agent to a contact portion between an outer peripheral side surface of the semiconductor chip and the chip fitting portion.