JPH089774B2 - 薄膜形成装置 - Google Patents

薄膜形成装置

Info

Publication number
JPH089774B2
JPH089774B2 JP2164184A JP16418490A JPH089774B2 JP H089774 B2 JPH089774 B2 JP H089774B2 JP 2164184 A JP2164184 A JP 2164184A JP 16418490 A JP16418490 A JP 16418490A JP H089774 B2 JPH089774 B2 JP H089774B2
Authority
JP
Japan
Prior art keywords
substrate
thin film
cathode
crucible
vapor deposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP2164184A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0456761A (ja
Inventor
弘基 伊藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP2164184A priority Critical patent/JPH089774B2/ja
Priority to US07/718,367 priority patent/US5180477A/en
Priority to DE4120941A priority patent/DE4120941A1/de
Priority to GB9113636A priority patent/GB2248340B/en
Publication of JPH0456761A publication Critical patent/JPH0456761A/ja
Publication of JPH089774B2 publication Critical patent/JPH089774B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/221—Ion beam deposition
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J27/00—Ion beam tubes
    • H01J27/02—Ion sources; Ion guns
    • H01J27/08—Ion sources; Ion guns using arc discharge
    • H01J27/14—Other arc discharge ion sources using an applied magnetic field

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Combustion & Propulsion (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Physical Vapour Deposition (AREA)
JP2164184A 1990-06-25 1990-06-25 薄膜形成装置 Expired - Lifetime JPH089774B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2164184A JPH089774B2 (ja) 1990-06-25 1990-06-25 薄膜形成装置
US07/718,367 US5180477A (en) 1990-06-25 1991-06-20 Thin film deposition apparatus
DE4120941A DE4120941A1 (de) 1990-06-25 1991-06-25 Vorrichtung zum aufbringen von duennschichten
GB9113636A GB2248340B (en) 1990-06-25 1991-06-25 Thin film deposition apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2164184A JPH089774B2 (ja) 1990-06-25 1990-06-25 薄膜形成装置

Publications (2)

Publication Number Publication Date
JPH0456761A JPH0456761A (ja) 1992-02-24
JPH089774B2 true JPH089774B2 (ja) 1996-01-31

Family

ID=15788300

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2164184A Expired - Lifetime JPH089774B2 (ja) 1990-06-25 1990-06-25 薄膜形成装置

Country Status (4)

Country Link
US (1) US5180477A (US06633600-20031014-M00021.png)
JP (1) JPH089774B2 (US06633600-20031014-M00021.png)
DE (1) DE4120941A1 (US06633600-20031014-M00021.png)
GB (1) GB2248340B (US06633600-20031014-M00021.png)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2278952B (en) * 1993-06-12 1997-03-26 James Harry Freeman Improvements in or relating to surface ionisation ion sources
DE10019720A1 (de) * 2000-04-20 2001-10-31 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum elektrischen Kontaktieren von plattenförmigem Behandlungsgut bei elektrolytischen Prozessen
JP4728882B2 (ja) * 2006-06-09 2011-07-20 長州産業株式会社 薄膜堆積用分子線源用坩堝の製造方法
CN101908458B (zh) * 2009-06-05 2012-03-07 马利民 一种矩形刻蚀离子枪
KR101432514B1 (ko) * 2013-01-29 2014-08-21 한국기초과학지원연구원 플라즈마 보조 물리 기상 증착원
DE102016114480B4 (de) * 2016-08-04 2023-02-02 VON ARDENNE Asset GmbH & Co. KG Ionenstrahlquelle und Verfahren zur Ionenstrahlbehandlung
KR102461901B1 (ko) * 2017-12-12 2022-11-01 어플라이드 머티어리얼스, 인코포레이티드 이온 소스 및 간접적으로 가열된 캐소드 이온 소스
US11404254B2 (en) 2018-09-19 2022-08-02 Varian Semiconductor Equipment Associates, Inc. Insertable target holder for solid dopant materials
US11170973B2 (en) 2019-10-09 2021-11-09 Applied Materials, Inc. Temperature control for insertable target holder for solid dopant materials
US10957509B1 (en) 2019-11-07 2021-03-23 Applied Materials, Inc. Insertable target holder for improved stability and performance for solid dopant materials
US11854760B2 (en) 2021-06-21 2023-12-26 Applied Materials, Inc. Crucible design for liquid metal in an ion source

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB685269A (en) * 1951-02-02 1952-12-31 Nat Res Corp Apparatus and process for coating a substrate with a metal
BE762681A (nl) * 1971-02-09 1971-07-16 Bekaert Sa Nv Inrichting voor het opdampen van een metalen deklaag op een langwerpig substraat met behulp van tenminste een elektronenkanon.
US3908183A (en) * 1973-03-14 1975-09-23 California Linear Circuits Inc Combined ion implantation and kinetic transport deposition process
JPS5181791A (ja) * 1975-01-13 1976-07-17 Osaka Koon Denki Kk Ionkapureeteinguhoho
US4424104A (en) * 1983-05-12 1984-01-03 International Business Machines Corporation Single axis combined ion and vapor source
JPS6115965A (ja) * 1984-07-03 1986-01-24 Hitachi Ltd クラスタイオンビ−ム発生方法およびその装置
JPS61174370A (ja) * 1985-01-29 1986-08-06 Mitsubishi Electric Corp 蒸着装置
JPS6214416A (ja) * 1985-07-12 1987-01-23 Victor Co Of Japan Ltd 薄膜形成装置
JPS63176460A (ja) * 1987-01-13 1988-07-20 Matsushita Electric Ind Co Ltd 薄膜製造装置
GB8701414D0 (en) * 1987-01-22 1987-02-25 Matthews A Heating enhancement in physical vapour deposition
JPS63297559A (ja) * 1987-08-22 1988-12-05 Tokuda Seisakusho Ltd 高周波電源を用いたグロ−放電装置のア−クしゃ断方法および装置
JP2619068B2 (ja) * 1989-09-08 1997-06-11 三菱電機株式会社 薄膜形成装置

Also Published As

Publication number Publication date
GB2248340A (en) 1992-04-01
US5180477A (en) 1993-01-19
GB9113636D0 (en) 1991-08-14
JPH0456761A (ja) 1992-02-24
DE4120941C2 (US06633600-20031014-M00021.png) 1993-09-09
GB2248340B (en) 1994-09-28
DE4120941A1 (de) 1992-01-09

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