JPH088257A - Bump electrode testing part - Google Patents

Abstract

PURPOSE:To provide a part for testing bump electrodes that makes it possible to simply conduct continuity tests on bump electrodes in a short time regardless of the arrangement of the bump electrodes, and that reduces cost of continuity tests. CONSTITUTION:A part for testing bump electrodes consists of electrode pads 13 placed in positions corresponding to bump electrodes, wiring 14a-14c that makes the electrodes pads 13 communicate with external parts; and pads 11 for interfacing with outside.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bump electrode inspection component for electrically inspecting a bump electrode formed on a multilayer wiring board used for a multi-chip module or the like.

[0002]

2. Description of the Related Art Due to downsizing of electronic equipment in recent years, it is required to downsize electronic parts and boards mounted on the electronic equipment while maintaining high functionality. In order to deal with this, there is a demand for a method capable of increasing the functionality of the LSI itself, mounting the LSI on a substrate at a high density, and reducing the size of the substrate. A multi-chip module (MCM) has been developed as a means capable of realizing the method. The MCM is a module in which a plurality of LSIs are collectively mounted on a single substrate or a package, and has a function by itself.

An example of MCM is shown in FIG. 9A and 9B are schematic views showing an MCM in which LSI bare chips A to D are mounted on a multilayer wiring board 90 by a flip chip (FC) method. FIG. 9A is a top view and FIG. 9B is a side view. is there. LS
When mounting the I bare chips A to D on the multilayer wiring board 90, the following steps are performed. That is, the multilayer wiring board 90
Gold or solder bump electrodes 100 are formed in advance at the positions where the upper LSI bare chips A to D are mounted, and the LSI bare chips A to D are faced down with respect to the bump electrodes 100 to form electrodes of the LSI bare chips A to D. Pads (not shown) and bump electrodes 10 corresponding to the electrode pads
And 0 are thermocompression bonded and mounted. Reference numeral 91 denotes a contact pin formed on the multilayer wiring board 90.

Conventionally, an inspection needle has been used to test whether the bump electrodes 100 on the multilayer wiring substrate 90 before mounting the LSI bare chips A to D are correctly connected as designed. The schematic diagram is shown in FIGS. 10 is a top view showing the multilayer wiring substrate 90 before the LSI bare chips A to D are mounted, and FIG. 11 is a sectional view showing a method of testing the continuity of the bump electrodes 100.

As shown in FIG. 10, a multilayer wiring board 90 is provided.
Bump electrodes 100 are formed at predetermined positions on the upper surface where the LSI bare chips A to D are mounted. These bump electrodes 100 are between the bump electrodes 100, and the bump electrodes 1
When testing whether the connection between 00 and the contact pin 91 was made as designed, the test was performed as follows. A brief description will be given based on FIG. In FIG. 11, reference numerals 92 and 93 denote inspection needles, 94 denotes a jig for inspection needles, and 95 denotes a tester.

For example, in the case of the bump electrode 100c connected to the pin 91 as shown in FIG. 11, the continuity test is performed via the pin 91. On the other hand, when there is no connection to the pin 91 due to only the connection between the LSI bare chips, such as the connection between the bump electrodes 100a and 100b, the inspection needle 92 is directly attached to the bump electrode 100a and the bump electrode 100b.
Continuity test is performed by bringing 93 into contact. In addition, after actually mounting the LSI bare chips A to D on the multilayer wiring board 90, it may be possible to perform a continuity test of the bump electrodes 100 when testing the module function of the MCM.

[0007]

The conventional continuity test method described above has the following problems. Continuity (connection) in the functional test after mounting the LSI bare chip
When testing It is not always possible to find all the defects in addition to the test cost for finding the conduction defects. In addition, even if the conduction failure can be found after mounting, it cannot be repaired, and the LSI bare chip becomes useless.

Conducting a test by contacting a bump electrode with a test needle before a test for mounting an LSI bare chip. When each test needle 92, 93, etc. contacts the corresponding bump electrode 100, a temporary test is performed. If the inspection needle of the book is deformed, the entire inspection tool cannot be used, and the deformed inspection needle needs to be repaired, which is costly.

When the arrangement of the bump electrodes for the continuity test is complicated. For example, when the arrangement of the bump electrodes is as shown in FIG. 12, it is necessary to install an inspection needle corresponding to the bump electrode 101 spreading in the two-dimensional plane. It is difficult, and it becomes difficult to manufacture the inspection jig itself, or it is necessary to separately conduct the continuity test using a plurality of inspection jigs. In this case, the continuity test time becomes long, the cost for the inspection jig becomes large, and the cost increases.

The present invention has been made in view of the above problems, and it is possible to easily and quickly conduct a continuity test for all bump electrodes, no matter how the bump electrodes are arranged. It is an object of the present invention to provide a bump electrode inspection component that can reduce costs.

[0011]

In order to achieve the above object, a component for bump electrode inspection according to the present invention comprises an electrode pad arranged at a position facing a bump electrode, and these electrode pad and an external component. It is characterized in that a wiring for conducting is formed.

[0012]

In the bump electrode inspection component having the above structure, the electrode pad having the same arrangement as the bump electrode is formed on the substrate having one or more wiring layers, and the electrode pad and the external component are connected to each other. Wiring for conducting is formed. When conducting a bump electrode continuity test using this bump electrode inspection component, the bump electrode is contacted with the electrode pad formed on the substrate of the bump electrode inspection component, and the wiring is routed through the external component. Connected to the tester. Therefore, if the bump electrode inspecting component according to the above configuration is used, no matter how the bump electrodes are arranged in a complicated manner, all bump electrodes formed by bringing the bump electrodes into contact with the electrode pads It is possible to perform the continuity test at once.

[0013]

Embodiments of the bump electrode inspection component according to the present invention will be described below with reference to the drawings. First, a bump electrode inspection component according to the first embodiment will be described with reference to FIG. FIG. 1 illustrates a bump electrode inspection component according to the first embodiment.
FIG. 3 is a top view schematically showing the probe 10.
Is a program on a silicon substrate having one or more wiring layers.
An electrode pad 13 is formed in the probe area 12, an external interface pad 11 is formed around the probe area 12, and the electrode pad 13 and the external interface pad 11 are wired 14a. , 14b, 14c and the like. The arrangement of the electrode pads 13 is the bump electrodes 101 formed on the multilayer wiring board 90 (see FIG. 12).
When the MCM substrate having the bump electrodes 101 shown in FIG. 12 is placed face down on the probe 10, the bump electrodes 101 and the electrode pads 13 are in contact with each other. It is supposed to do.

Next, a bump electrode inspection component according to the second embodiment will be described with reference to FIGS. Second Embodiment
FIG. 3 is a top view schematically showing a probe 20 which is a bump electrode inspection component according to the present invention, and FIG. 3 is a side view schematically showing the probe 20. In the case of the probe 20, each LSI
Small probes 22 to 29 having an electrode pad for each bare chip bump electrode and an external interface pad are formed around the electrode pad (generally, bump electrodes to be inspected are A small probe is formed for each group by dividing it into a certain group), and these small probes 22 to
29 is mounted on the probe substrate 30 having one or more wiring layers, and the small probes 22 to 29 are the probe substrates 3
It is connected to the external interface pad 21 formed on the outer peripheral portion of 0. Small probe 22 ~
The method of connecting 29 to the external interface pad 21 will be described in more detail as follows.

As an example, the case of the small probe 22 will be described. For example, if the external interface pads 22a and 22b of the small probe 22 are connected to the external interface pads 21a and 21b of the probe board 30, respectively, the external interface pads are connected. 22
a and 22b are wire bonding 31a and 3b, respectively.
1b is connected to the wiring pads 32a, 32b formed on the probe substrate 39, and the wiring pads 32a,
32b is connected to the external interface pads 21a and 21b by wirings 33a and 33b, respectively.

On the other hand, in the case of a small probe arranged in the vicinity of the external interface pad 21, the external interface pad of the small probe and the probe substrate 30 are provided. The external interface pad 21 is directly connected by wire bonding. An example of the connection is shown in FIG. Of the small probe 29 and the small probe 28 shown in FIG. 3, the pad 28a for the external interface of the small probe 28 is used for the external interface of the probe substrate 30 by the wire bonding 34. Pad 21
Is directly connected to. The connection relationship between the external interface pads in the small probe 29 is the same as the connection relationship in the case of the small probe 22 described above.

Next, an example of the test system for conducting the continuity test of the bump electrode formed on the MCM by using the probe 10 or the probe 20 will be described with reference to FIG. In FIG. 4, reference numeral 40 denotes a handler device.
The handler apparatus 40 is provided with a substrate transfer section 41. The substrate transfer section 41 transfers an uninspected board (MCM 56) from the uninspected board storage section 42 and the MCM 56 is faced down on the probe 55. The MCM 56 is placed on the probe 55 so that the upper bump electrode 57 and the electrode pad (not shown) on the probe 55 are in contact with each other. Then, the device interface board 54 and the signal line 5
Tester 5 connected to probe 55 via 2, 53
1, the continuity test of the bump electrode 57 is performed. When the test is completed, the MCM 56 is selected as a good product or a defective product according to the result. That is, when the continuity test is completed, whether the MCM 56 is a good product or a defective product is transmitted from the tester 51 to the handler device via the signal line 50. If the MCM 56 is a good product, the handler device 41 is sent. Are stored in the non-defective substrate storage portion 44, and if they are defective, they are stored in the defective substrate storage portion 43.

FIG. 5 is a side view schematically showing an inspection section 60 when the probe 10 which is the bump electrode inspection component according to the first embodiment is used as the probe. Professional
The bump 10 is wire-bonded 6 to the inspection board body 70.
The inspection board main body 70 is connected to the device interface board 54. Further, the probe 10 is made larger than the MCM 56 which is the substrate to be inspected, and the wire bondings 61 and 62 connecting the inspecting substrate body 70 and the probe 10 are MCM 56 during the continuity test.
It does not get in the way.

FIG. 6 is a side view schematically showing the inspection section 60 when the probe 20 which is the bump electrode inspection component according to the second embodiment is used as the probe. FIG. 6 shows a case where a continuity test is performed by using a plurality of small probes. The wires in the small probes 25 to 27 are shown in FIG.
Bonding 25a, 25b to 27a, 27b is MCM
Electrode bumps 65 to 67 are formed on the electrode pads of the small probes 25 to 27 so as not to contact 56.

FIG. 7 shows the electrode pad 13 and M of the probe 10.
It is a partial expanded sectional view showing roughly a contact state of CM56 and bump electrode 57. In FIG. 7, reference numeral 77 indicates an insulating protective film. On the other hand, FIG. 8 shows the small probe 2 in the case of conducting the continuity test using the small probe (see FIG. 6).
6 is a partially enlarged sectional view schematically showing a contact state between the electrode pad 81 of No. 6 and the bump electrode 57 of the MCM 56. FIG. FIG.
As shown in FIG. 5, the electrode bumps 66 are formed on the electrode pads 81, and the electrode bumps 66 come into contact with the bump electrodes 57.

In the above-mentioned embodiment, a Si substrate can be used as the substrate of the probe 10 and the small probes 25 to 29, but not limited to the Si substrate, other semiconductors, insulators, metals, etc. can be used as the substrate. Can also be used as
Although FIGS. 6 and 8 show an example in which the electrode bumps 66 are formed in order to increase the withdrawal from the electrode pads 81, the invention is not limited to the electrode bumps 65 to 67, and the MCM 56 is not limited thereto. The bump electrode 57 and the wire bonding 25a, 25b to 27 can be electrically connected to each other.
Another shape may be used as long as it is higher than a and 27b and can contact the bump electrode 57.

As described above, in the bump electrode inspecting component (probe 10) according to the first embodiment and the bump electrode inspecting component (probe 20) according to the second embodiment, Si is used.
Since it is only necessary to form an electrode pad facing the bump electrode 57 of the MCM 56 on a substrate such as MCM 56, it is possible to easily manufacture, and even if the bump electrode 57 is arranged on the MCM 56, the bump electrode 57 The continuity test can be easily performed in a short time (at one time). As a result, the cost for the continuity test can be reduced as compared with the conventional continuity test method.

[0023]

As described above in detail, if the bump electrode continuity test is performed using the bump electrode inspection component according to the present invention, the defect can be easily detected by the continuity test before mounting the LSI bare chip. The LSI bare chip is not wasted unlike the conventional continuity test in which a conduction defect can be found after mounting but cannot be repaired.

Further, in the bump electrode inspection component according to the present invention, unlike the conventional continuity test method using the inspection needle, the inspection needle is not deformed, and a stable continuity test can be performed. You can

Further, in the bump electrode inspection component according to the present invention, the inspection probe can be easily produced regardless of the arrangement of the bump electrodes, and it is possible to perform all inspections with a single contact. The continuity test of the bump electrode can be performed. As a result, the continuity test time can be shortened and the cost required for the test can be reduced.

[Brief description of drawings]

FIG. 1 is a top view schematically showing a bump electrode inspection component according to a first embodiment of the present invention.

FIG. 2 is a top view schematically showing a bump electrode inspection component according to a second embodiment of the present invention.

FIG. 3 is a side view schematically showing a bump electrode inspection component according to a second embodiment.

FIG. 4 is a system diagram showing an example of a test system for conducting a bump electrode continuity test using the bump electrode inspection component according to the first or second embodiment.

FIG. 5 is a side view schematically showing an inspection section when a continuity test is performed using the bump electrode inspection component according to the first embodiment.

FIG. 6 is a side view schematically showing an inspection unit when a continuity test is performed using the bump electrode inspection component according to the second embodiment.

FIG. 7 is a partially enlarged cross-sectional view schematically showing a contact state between an electrode pad and a bump electrode when a conduction test is performed using the bump electrode inspection component according to the first embodiment.

FIG. 8 is a partially enlarged cross-sectional view schematically showing a contact state between an electrode pad and a bump electrode when a conduction test is performed using the bump electrode inspection component according to the second embodiment.

9A is a top view schematically showing a multilayer wiring board on which an LSI bare chip is mounted, and FIG. 9B is a side view schematically showing the multilayer wiring board.

FIG. 10 is a top view schematically showing an example of arrangement of bump electrodes formed on a multilayer wiring board.

FIG. 11 is a schematic cross-sectional view showing a conventional bump electrode continuity test method.

FIG. 12 is a top view schematically showing an example in which bump electrodes are arranged intricately on a multilayer wiring board.

[Explanation of symbols]

10, 20, 55 probe 11, 21, 21a, 21b, 22a, 22b, 28a
External interface pad 13 Electrode pad 14a, 14b, 14c, 33a, 33b Wiring 22, 23, 24, 25, 26, 27, 28, 29 Small probe 30 Probe substrate 31a, 31b, 34 wire-bonding 32a, 32b wiring pad 56 MCM 57 bump electrode

Claims (1)

[Claims] 1. A bump electrode inspecting component, characterized in that electrode pads arranged at positions facing the bump electrodes and wirings for electrically connecting these electrode pads to an external component are formed.