JPH08778Y2 - 多層誘電体基板 - Google Patents

多層誘電体基板

Info

Publication number
JPH08778Y2
JPH08778Y2 JP1990031195U JP3119590U JPH08778Y2 JP H08778 Y2 JPH08778 Y2 JP H08778Y2 JP 1990031195 U JP1990031195 U JP 1990031195U JP 3119590 U JP3119590 U JP 3119590U JP H08778 Y2 JPH08778 Y2 JP H08778Y2
Authority
JP
Japan
Prior art keywords
dielectric substrate
substrate
circuit
connector
multilayer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP1990031195U
Other languages
English (en)
Japanese (ja)
Other versions
JPH03122580U (enrdf_load_stackoverflow
Inventor
信博 遠藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP1990031195U priority Critical patent/JPH08778Y2/ja
Publication of JPH03122580U publication Critical patent/JPH03122580U/ja
Application granted granted Critical
Publication of JPH08778Y2 publication Critical patent/JPH08778Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Multi-Conductor Connections (AREA)
JP1990031195U 1990-03-27 1990-03-27 多層誘電体基板 Expired - Lifetime JPH08778Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990031195U JPH08778Y2 (ja) 1990-03-27 1990-03-27 多層誘電体基板

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990031195U JPH08778Y2 (ja) 1990-03-27 1990-03-27 多層誘電体基板

Publications (2)

Publication Number Publication Date
JPH03122580U JPH03122580U (enrdf_load_stackoverflow) 1991-12-13
JPH08778Y2 true JPH08778Y2 (ja) 1996-01-10

Family

ID=31533933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990031195U Expired - Lifetime JPH08778Y2 (ja) 1990-03-27 1990-03-27 多層誘電体基板

Country Status (1)

Country Link
JP (1) JPH08778Y2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI239798B (en) * 1999-05-28 2005-09-11 Toppan Printing Co Ltd Photo electric wiring substrate, mounted substrate, and the manufacture method of the photo electric wiring substrate

Also Published As

Publication number Publication date
JPH03122580U (enrdf_load_stackoverflow) 1991-12-13

Similar Documents

Publication Publication Date Title
US4906198A (en) Circuit board assembly and contact pin for use therein
KR930020640A (ko) 배선기판 조립체와 그 전기적 접합부 형성방법
JPH08778Y2 (ja) 多層誘電体基板
JPH06268414A (ja) マイクロストリップ線路型サーキュレータ
JP2001102747A (ja) 多層基板とその製造方法および該多層基板への同軸コネクタ取り付け構造
JP3851513B2 (ja) 配線基板の製造方法
JPS5855671Y2 (ja) 配線基板
JPH09135117A (ja) スパイラルアンテナ
JPH066494Y2 (ja) プリントコイルトランス
JPH0351988Y2 (enrdf_load_stackoverflow)
JPH0432786Y2 (enrdf_load_stackoverflow)
JPS6312579Y2 (enrdf_load_stackoverflow)
JPH0617331Y2 (ja) 金属基板を用いたプリント配線板
KR20030027757A (ko) 필름 기판, 반도체 장치, 필름 기판의 제조 방법, 및반도체 장치를 갖는 회로 기판의 제조 방법
KR20220157493A (ko) 임베디드 회로기판 및 그 제조 방법
JPH0238458Y2 (enrdf_load_stackoverflow)
JPH045280B2 (enrdf_load_stackoverflow)
JPH0143877Y2 (enrdf_load_stackoverflow)
JPH01137803A (ja) マイクロ波ストリップアンテナ
JPS60184306U (ja) プリント化アンテナ
JPH0273763U (enrdf_load_stackoverflow)
JPS63191704U (enrdf_load_stackoverflow)
JPH0983171A (ja) シールド用シート
JPS63134573U (enrdf_load_stackoverflow)
JPS6032805U (ja) 同軸／ストリップ線路変換器