JPH087644Y2 - 半導体装置 - Google Patents
半導体装置Info
- Publication number
- JPH087644Y2 JPH087644Y2 JP1989046388U JP4638889U JPH087644Y2 JP H087644 Y2 JPH087644 Y2 JP H087644Y2 JP 1989046388 U JP1989046388 U JP 1989046388U JP 4638889 U JP4638889 U JP 4638889U JP H087644 Y2 JPH087644 Y2 JP H087644Y2
- Authority
- JP
- Japan
- Prior art keywords
- external leads
- semiconductor device
- lead
- external
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 title claims description 19
- 229910000679 solder Inorganic materials 0.000 claims description 21
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 238000007789 sealing Methods 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989046388U JPH087644Y2 (ja) | 1989-04-20 | 1989-04-20 | 半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989046388U JPH087644Y2 (ja) | 1989-04-20 | 1989-04-20 | 半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02136337U JPH02136337U (en, 2012) | 1990-11-14 |
| JPH087644Y2 true JPH087644Y2 (ja) | 1996-03-04 |
Family
ID=31561431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989046388U Expired - Lifetime JPH087644Y2 (ja) | 1989-04-20 | 1989-04-20 | 半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH087644Y2 (en, 2012) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS602777B2 (ja) * | 1983-10-21 | 1985-01-23 | 株式会社日立製作所 | 電子装置用リ−ドフレ−ム |
-
1989
- 1989-04-20 JP JP1989046388U patent/JPH087644Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02136337U (en, 2012) | 1990-11-14 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |