JPH0874090A - Copper foil for printed circuit board - Google Patents
Copper foil for printed circuit boardInfo
- Publication number
- JPH0874090A JPH0874090A JP24088694A JP24088694A JPH0874090A JP H0874090 A JPH0874090 A JP H0874090A JP 24088694 A JP24088694 A JP 24088694A JP 24088694 A JP24088694 A JP 24088694A JP H0874090 A JPH0874090 A JP H0874090A
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- layer
- base material
- alloy
- coupling agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプリント配線板用銅箔に
関し、さらに詳しくはポリフェニレンエーテル樹脂
［（ＰＰＥ）：ポリフェニレンオキサイド樹脂（ＰＰ
Ｏ）］を主成分とするプリント配線板基材との接着性を
向上させたプリント配線板用銅箔に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a copper foil for a printed wiring board, and more specifically to a polyphenylene ether resin [(PPE): polyphenylene oxide resin (PP).
O)] as a main component, and a copper foil for a printed wiring board having improved adhesiveness to a printed wiring board base material.
【０００２】[0002]
【従来の技術】プリント配線板を作成する場合、銅箔と
ガラスエポキシ含浸基材等の基材とを加熱圧着等により
接着し、導体回路形成のために不要な部分の銅箔を酸ま
たはアルカリのエッチング液により除去を行う。2. Description of the Related Art When making a printed wiring board, a copper foil and a base material such as a glass epoxy impregnated base material are adhered to each other by thermocompression bonding or the like, and an unnecessary portion of the copper foil for forming a conductor circuit is treated with an acid or an alkali. It is removed by the etching solution of.
【０００３】従来、このような銅箔は基材との接着強度
を増加させるために、粒状銅層が電着により設けられ、
さらに基材との接着性、耐薬品性、耐湿性等の改善のた
めに、この上に亜鉛または亜鉛合金メッキ、クロメート
処理、シランカップリング剤処理によって防錆層を形成
させている。Conventionally, such a copper foil is provided with a granular copper layer by electrodeposition in order to increase the adhesive strength with a substrate,
Further, in order to improve the adhesion to the substrate, the chemical resistance, the moisture resistance, etc., a rust preventive layer is formed thereon by zinc or zinc alloy plating, chromate treatment, and silane coupling agent treatment.
【０００４】最近、ポリフェニレンエーテル樹脂を主成
分とする特殊基材が電気特性改善のために使用され始め
ている。この基材は電気特性は従来の基材より優れるも
のの、従来の銅箔ではこの基材との接着強度の確保が難
しかった。そのため、銅箔の基材との接着面には粗さが
１０μｍ程度と高いものを使用し、ある程度の接着強度
を確保しているが、ポリフェニレンエーテル樹脂の特徴
である誘電特性を阻害している。Recently, a special base material containing a polyphenylene ether resin as a main component has begun to be used for improving electric characteristics. Although this base material is superior in electrical characteristics to the conventional base material, it was difficult to secure the adhesive strength with the base material using the conventional copper foil. Therefore, the surface of the copper foil to be bonded to the base material has a high roughness of about 10 μm to secure a certain level of bonding strength, but it hinders the dielectric properties that are characteristic of polyphenylene ether resin. .
【０００５】[0005]
【発明が解決しようとする課題】本発明は、これら従来
技術の課題を解決し、基材、特にポリフェニレンエーテ
ル樹脂基材の良好な誘電特性を損なうことなく、基材と
の高い接着性を有するプリント配線板用銅箔を提供する
ことにある。SUMMARY OF THE INVENTION The present invention solves these problems of the prior art and has high adhesiveness with a base material, particularly a polyphenylene ether resin base material, without impairing the good dielectric properties of the base material. It is to provide a copper foil for a printed wiring board.
【０００６】[0006]
【課題を解決するための手段】本発明の上記目的は、銅
箔の少なくとも基材との接着面に、鉄と特定元素の合金
層を設けることによって達成される。The above object of the present invention is achieved by providing an alloy layer of iron and a specific element on at least the adhesive surface of the copper foil to the substrate.
【０００７】すなわち、本発明のプリント配線板用銅箔
は、銅箔の少なくとも基材との接着面に、鉄とニッケ
ル、モリブテン、コバルト、タングステンから選ばれる
少なくとも１種との合金層を有し、該合金層上に化成処
理層、該化成処理層上にカップリング剤防錆層が設けら
れていることを特徴とする。That is, the copper foil for a printed wiring board of the present invention has an alloy layer of iron and at least one selected from nickel, molybdenum, cobalt and tungsten on at least the adhesive surface of the copper foil to the substrate. A chemical conversion treatment layer is provided on the alloy layer, and a coupling agent anticorrosive layer is provided on the chemical conversion treatment layer.
【０００８】本発明のプリント配線板用銅箔は、銅箔の
少なくとも基材との接着面に、鉄とニッケル、モリブテ
ン、コバルト、タングステンから選ばれる少なくとも１
種との合金層を有する。The copper foil for printed wiring board of the present invention has at least one selected from iron and nickel, molybdenum, cobalt and tungsten on at least the adhesive surface of the copper foil to the base material.
Has an alloy layer with the seed.
【０００９】なお、この合金層の形成の前に、銅箔の基
材との接着面に通常は粒状銅層（粗化処理層）を電着に
より形成する。また、合金層の形成前後に必要に応じて
１〜１００ｍｇ／ｍ2の薄い亜鉛または亜鉛合金層を形
成してもよく、特公昭６１−５２２４０号公報に記載さ
れているように耐熱性の改良が可能である。Prior to the formation of this alloy layer, a granular copper layer (roughening treatment layer) is usually formed by electrodeposition on the surface of the copper foil bonded to the base material. If necessary, a thin zinc or zinc alloy layer of 1 to 100 mg / m 2 may be formed before and after the formation of the alloy layer. As described in JP-B-61-52240, heat resistance is improved. Is possible.
【００１０】これら合金層の形成はメッキにより多種多
様のものが公知となっており、どのメッキ方法を使用し
ようとも構わない。これらの合金元素が主成分のメッキ
であれば第３種金属等が微量添加されていてもよい。Various kinds of alloy layers are known to be formed by plating, and any plating method may be used. If the plating is mainly composed of these alloy elements, a trace amount of a third type metal or the like may be added.
【００１１】これら合金層の各合金元素の含有量は鉄１
〜２００ｍｇ／ｍ2とニッケル１〜５００ｍｇ／ｍ2、モ
リブテン１〜１００ｍｇ／ｍ2、コバルト１〜５００ｍ
ｇ／ｍ2、タングステン１〜１００ｍｇ／ｍ2の少なくと
も１種である。The content of each alloy element in these alloy layers is iron 1
To 200 mg / m 2 and nickel 1-500 mg / m 2, molybdenum 1 to 100 mg / m 2, cobalt 1~500m
At least one of g / m 2 and tungsten 1 to 100 mg / m 2 .
【００１２】鉄の含有量が１ｍｇ／ｍ2未満ではポリフ
ェニレンエーテル樹脂を主成分とする基材との接着強度
が発現せず、鉄の含有量が２００ｍｇ／ｍ2超では接着
強度のそれ以上の向上が認められないばかりか、酸化に
よる赤錆が目立つようになりかえって接着性を阻害す
る。When the iron content is less than 1 mg / m 2 , the adhesive strength with the base material containing the polyphenylene ether resin as a main component is not developed, and when the iron content exceeds 200 mg / m 2 , the adhesive strength is more than that. Not only improvement is not recognized, but also red rust due to oxidation becomes conspicuous, which hinders adhesiveness.
【００１３】ニッケルの含有量が１ｍｇ／ｍ2未満では
鉄−ニッケル合金として鉄の酸化防止の役目ができず、
ニッケルの含有量が５００ｍｇ／ｍ2超では接着強度の
それ以上の向上は見られず経済的に不利となる。If the content of nickel is less than 1 mg / m 2, it cannot serve as an iron-nickel alloy to prevent the oxidation of iron.
If the nickel content exceeds 500 mg / m 2 , no further improvement in adhesive strength is seen, which is economically disadvantageous.
【００１４】同様にモリブテンの含有量が１ｍｇ／ｍ2
未満では鉄−モリブテン合金としての鉄の酸化防止の役
目ができず、モリブデン含有量が１００ｍｇ／ｍ2超の
合金電析は困難であり、かつ経済的ではない。Similarly, the molybdenum content is 1 mg / m 2.
If the amount is less than the above, the role of preventing oxidation of iron as the iron-molybdenum alloy cannot be achieved, and the alloy electrodeposition with the molybdenum content exceeding 100 mg / m 2 is difficult and not economical.
【００１５】コバルトの含有量が１ｍｇ／ｍ2未満では
鉄−コバルト合金として鉄の酸化防止の役目ができず、
コバルトの含有量が５００ｍｇ／ｍ2超では経済的に不
利となる。When the content of cobalt is less than 1 mg / m 2, it cannot serve as an iron-cobalt alloy to prevent the oxidation of iron.
If the cobalt content exceeds 500 mg / m 2, it is economically disadvantageous.
【００１６】タングステンの含有量が１ｍｇ／ｍ2未満
では鉄−タングステン合金として鉄の酸化防止の役目が
できず、タングステンの含有量が１００ｍｇ／ｍ2超の
合金電析は困難であり、析出皮膜が硬く実用的ではな
い。When the content of tungsten is less than 1 mg / m 2, it cannot serve as an iron-tungsten alloy to prevent the oxidation of iron, and when the content of tungsten exceeds 100 mg / m 2 , alloy deposition is difficult and the deposited film Is hard and not practical.
【００１７】ここに用いられる合金メッキ浴組成および
メッキ条件の一例を示す。この合金メッキ浴組成および
メッキ条件は一例を挙げたに過ぎず、銅箔上に同様の合
金層が得られるメッキであればどのようなメッキ方法を
とっても同様の結果が得られる。 ＜Ｆｅ−Ｎｉメッキ＞ 硫酸ニッケル １〜１５０ｇ／Ｌ 硫酸第一鉄 ０．０１〜５０ｇ／Ｌ ほう酸 １〜１００ｇ／Ｌ 液温 室温An example of the alloy plating bath composition and plating conditions used here is shown. The alloy plating bath composition and plating conditions are merely examples, and the same result can be obtained by any plating method as long as the same alloy layer can be obtained on the copper foil. <Fe-Ni plating> Nickel sulfate 1 to 150 g / L Ferrous sulfate 0.01 to 50 g / L Boric acid 1 to 100 g / L Liquid temperature Room temperature
【００１８】この合金組成は、鉄とニッケルの濃度の比
率および電流密度によって変えることができる。The alloy composition can be changed by the ratio of iron and nickel concentrations and the current density.
【００１９】本発明の銅箔では、この合金層の上に耐薬
品性改良のための防錆として化成処理層が設けられてい
る。化成処理としては通常使用されているクロメート処
理や燐酸クロメート処理が使用可能である。In the copper foil of the present invention, a chemical conversion treatment layer is provided on this alloy layer as a rust preventive for improving chemical resistance. As the chemical conversion treatment, a chromate treatment or a phosphoric acid chromate treatment which is usually used can be used.
【００２０】ここに用いられるクロメート処理液組成お
よび処理条件の一例を示す。このクロメート処理液組成
および処理条件は一例を挙げたに過ぎず、合金層上に同
様のクロメート処理層が得られればよい。 ＜クロメート処理＞ クロム酸 ０．０５〜１０ｇ／Ｌ ｐＨ ９〜１３ 電流密度 ０．１〜５Ａ／ｄｍ2 An example of the composition of the chromate treatment liquid and the treatment conditions used here will be shown. The composition of the chromate treatment solution and the treatment conditions are merely examples, and a similar chromate treatment layer may be obtained on the alloy layer. <Chromate treatment> Chromic acid 0.05 to 10 g / L pH 9 to 13 Current density 0.1 to 5 A / dm 2
【００２１】本発明の銅箔では、この化成処理層の上に
さらに耐薬品性改良のための防錆としてカップリング剤
防錆層が設けられている。カップリング剤防錆層として
はシランカップリング剤やチタネートカップリング剤が
使用可能である。In the copper foil of the present invention, a coupling agent anticorrosion layer is further provided on the chemical conversion treatment layer as an anticorrosion for improving chemical resistance. As the rust preventive layer for the coupling agent, a silane coupling agent or a titanate coupling agent can be used.
【００２２】ここに用いらるシランカップリング剤処理
液組成および処理条件の一例を示す。 ＜シランカップリング剤処理＞ シランカップリング剤 ０．１〜１０ｇ／Ｌ ｐＨ ２〜１２An example of the treatment liquid composition and treatment conditions of the silane coupling agent used here is shown. <Silane coupling agent treatment> Silane coupling agent 0.1 to 10 g / L pH 2 to 12
【００２３】本発明のプリント配線板用銅箔に用いられ
る銅箔は、電解銅箔、圧延銅箔等のいずれであってもよ
く、銅箔の厚みについても特に限定するものではない。
また基材との接着面は、電解銅箔の場合には析出面側
（粗面側）、光沢面側のどちらでもよいが、誘電特性の
面から好ましくは光沢面側がよい。また、銅箔の基材と
の非接着面は通常の防錆処理がなされる。The copper foil used in the copper foil for a printed wiring board of the present invention may be either an electrolytic copper foil or a rolled copper foil, and the thickness of the copper foil is not particularly limited.
In the case of electrolytic copper foil, the adhesion surface to the substrate may be either the deposition surface side (rough surface side) or the glossy surface side, but from the viewpoint of dielectric properties, the glossy surface side is preferable. In addition, the non-adhesive surface of the copper foil with the base material is subjected to ordinary rust prevention treatment.
【００２４】[0024]
【実施例】以下、実施例等に基づいて本発明を具体的に
説明する。EXAMPLES The present invention will be specifically described below based on Examples and the like.
【００２５】実施例１ 一般電解銅箔の粗面側を基材との接着面としてその上に
電着により粒状銅層を形成し、鉄２０ｍｇ／ｍ2・ニッ
ケル１ｍｇ／ｍ2の合金メッキを施し、その上にクロメ
ート処理、シランカップリング剤処理を施した。 Example 1 A rough copper side of a general electrolytic copper foil was used as an adhesive surface with a base material, and a granular copper layer was formed thereon by electrodeposition, and an alloy plating of iron 20 mg / m 2 · nickel 1 mg / m 2 was performed. Then, a chromate treatment and a silane coupling agent treatment were applied thereon.
【００２６】実施例２ 一般電解銅箔の粗面側を基材との接着面としてその上に
電着により粒状銅層を形成し、鉄１００ｍｇ／ｍ2・ニ
ッケル５００ｍｇ／ｍ2の合金メッキを施し、その上に
クロメート処理、シランカップリング剤処理を施した。 Example 2 A granular copper layer was formed by electrodeposition on the rough surface side of a general electrolytic copper foil as an adhesive surface to a base material, and 100 mg / m 2 of iron and 500 mg / m 2 of nickel were plated with an alloy. Then, a chromate treatment and a silane coupling agent treatment were applied thereon.
【００２７】実施例３ 一般電解銅箔の光沢面側を基材との接着面としてその上
に電着により粒状銅層を形成し、鉄２０ｍｇ／ｍ2・コ
バルト１ｍｇ／ｍ2の合金メッキを施し、その上にクロ
メート処理、シランカップリング剤処理を施した。 Example 3 A granular copper layer was formed by electrodeposition on the glossy side of a general electrolytic copper foil as an adhesive surface to a substrate, and an alloy plating of iron 20 mg / m 2 · cobalt 1 mg / m 2 was performed. Then, a chromate treatment and a silane coupling agent treatment were applied thereon.
【００２８】実施例４ 一般電解銅箔の粗面側を基材との接着面としてその上に
電着により粒状銅層を形成し、鉄１ｍｇ／ｍ2・コバル
ト５００ｍｇ／ｍ2の合金メッキを施し、その上にクロ
メート処理、シランカップリング剤処理を施した。 Example 4 A grainy copper layer was formed by electrodeposition on the rough surface side of a general electrolytic copper foil as an adhesive surface to a substrate, and an alloy plating of iron 1 mg / m 2 · cobalt 500 mg / m 2 was performed. Then, a chromate treatment and a silane coupling agent treatment were applied thereon.
【００２９】実施例５ 一般電解銅箔の光沢面側を基材との接着面としてその上
に電着により粒状銅層を形成し、鉄２０ｍｇ／ｍ2・モ
リブデン１ｍｇ／ｍ2の合金メッキを施し、その上にク
ロメート処理、シランカップリング剤処理を施した。な
お、合金メッキ液中に第３種元素として微量の亜鉛を添
加した。 Example 5 A granular copper layer was formed by electrodeposition on the glossy side of a general electrolytic copper foil as an adhesive surface to a substrate, and 20 mg / m 2 of iron and 1 mg / m 2 of molybdenum were plated with an alloy. Then, a chromate treatment and a silane coupling agent treatment were applied thereon. A small amount of zinc was added as a third type element to the alloy plating solution.
【００３０】実施例６ 一般電解銅箔の粗面側を基材との接着面としてその上に
電着により粒状銅層を形成し、鉄５０ｍｇ／ｍ2・モリ
ブテン１００ｍｇ／ｍ2の合金メッキを施し、その上に
クロメート処理、シランカップリング剤処理を施した。 Example 6 A rough copper side of a general electrolytic copper foil is used as an adhesive surface with a substrate to form a granular copper layer thereon by electrodeposition, and an alloy plating of iron 50 mg / m 2 · molybdenum 100 mg / m 2 is performed. Then, a chromate treatment and a silane coupling agent treatment were applied thereon.
【００３１】実施例７ 粗面側の粗さの低い電解銅箔の粗面側を基材との接着面
としてその上に電着により粒状銅層を形成し、２０ｍｇ
／ｍ2の亜鉛メッキを施し、鉄５ｍｇ／ｍ2・タングステ
ン１ｍｇ／ｍ2の合金メッキを施し、その上にクロメー
ト処理、シランカップリング剤処理を施した。 Example 7 A granular copper layer was formed by electrodeposition on the rough surface side of an electrolytic copper foil having a low roughness on the rough surface side as an adhesive surface to a substrate, and 20 mg
/ M 2 zinc plating, iron 5 mg / m 2 · tungsten 1 mg / m 2 alloy plating, and chromate treatment and silane coupling agent treatment thereon.
【００３２】実施例８ 一般電解銅箔の粗面側を基材との接着面としてその上に
電着により粒状銅層を形成し、鉄１００ｍｇ／ｍ2、タ
ングステン１００ｍｇ／ｍ2の合金メッキを施し、その
上にクロメート処理、シランカップリング剤処理を施し
た。 Example 8 A granular copper layer was formed by electrodeposition on the rough surface side of a general electrolytic copper foil as an adhesive surface to a substrate, and an alloy plating of iron 100 mg / m 2 and tungsten 100 mg / m 2 was performed. Then, a chromate treatment and a silane coupling agent treatment were applied thereon.
【００３３】実施例９ 粗面側の粗さの非常に低い電解銅箔の粗面側を基材との
接着面としてその上に電着により粒状銅層を形成し、鉄
２０ｍｇ／ｍ2・ニッケル２０ｍｇ／ｍ2の合金メッキを
施し、その上にクロメート処理、シランカップリング剤
処理を施した。 Example 9 A grainy copper layer was formed by electrodeposition on the rough surface side of an electrolytic copper foil having a very low roughness on the rough surface side as an adhesive surface to a substrate, and iron 20 mg / m 2 · An alloy plating of nickel 20 mg / m 2 was applied, and chromate treatment and silane coupling agent treatment were applied thereon.
【００３４】比較例１ 一般電解銅箔の粗面側を基材との接着面としてその上に
電着により粒状銅層を形成し、亜鉛２０ｍｇ／ｍ2のメ
ッキを施し、その上にクロメート処理、シランカップリ
ング剤処理を施した。 Comparative Example 1 Using the rough surface side of a general electrolytic copper foil as an adhesive surface to a substrate, a granular copper layer was formed thereon by electrodeposition, zinc 20 mg / m 2 was plated, and chromate treatment was performed on it. , Silane coupling agent treatment was performed.
【００３５】比較例２ 一般電解銅箔の光沢面を基材との接着面としてその上に
電着により粒状銅層を形成し、亜鉛４０ｍｇ／ｍ2のメ
ッキを施し、その上にクロメート処理、シランカップリ
ング剤処理を施した。 Comparative Example 2 A grainy copper layer was formed by electrodeposition on the glossy surface of a general electrolytic copper foil as an adhesive surface to a substrate, zinc 40 mg / m 2 was plated, and chromate treatment was performed on it. A silane coupling agent treatment was applied.
【００３６】比較例３ 粗面側の粗さの非常に低い電解銅箔の粗面側を基材との
接着面としてその上に電着により粒状銅層を形成し、亜
鉛５００ｍｇ／ｍ2のメッキを施し、その上にクロメー
ト処理、シランカップリング剤処理を施した。[0036] The electrodeposition thereon the matte side of the very low electrolytic copper foil roughness of Comparative Example 3 rough surface as a bonding surface with the substrate to form a granular copper layer, a zinc 500 mg / m 2 Plating was performed, and then chromate treatment and silane coupling agent treatment were performed thereon.
【００３７】このようにして得られた実施例１〜９およ
び比較例１〜３の銅箔について接着強度、耐塩酸性を下
記の方法で評価し、結果を防錆元素含有量、銅箔粗さと
共に表１に示す。With respect to the copper foils of Examples 1 to 9 and Comparative Examples 1 to 3 thus obtained, the adhesive strength and hydrochloric acid resistance were evaluated by the following methods, and the results were evaluated as rust preventive element content and copper foil roughness. It is shown in Table 1 together with.
【００３８】＜評価試験方法＞作成された銅箔は、ポリ
フェニレンエーテル樹脂基材に加熱圧着し、接着強度お
よび耐塩酸性を評価した。接着強度は、１０ｍｍ幅の銅
箔回路をエッチングによって作成し、その引剥し強度を
測定した。耐塩酸性は、０．２ｍｍ幅の銅箔回路を作成
し、１８％の塩酸に１時間浸漬した後の劣化率を求め
た。<Evaluation Test Method> The prepared copper foil was heated and pressure-bonded to a polyphenylene ether resin substrate to evaluate the adhesive strength and the hydrochloric acid resistance. The adhesive strength was obtained by etching a copper foil circuit having a width of 10 mm and measuring the peeling strength. Regarding the hydrochloric acid resistance, a copper foil circuit having a width of 0.2 mm was prepared, and the deterioration rate after immersing in a 18% hydrochloric acid for 1 hour was determined.
【００３９】[0039]
【表１】 [Table 1]
【００４０】[0040]
【発明の効果】以上説明したように、本発明のプリント
配線板用銅箔は、基材、特にポリフェニレンエーテル樹
脂基材の良好な誘電特性を損なうことなく、基材との高
い接着性を有し、かつ耐薬品性も良好である。As described above, the copper foil for a printed wiring board of the present invention has high adhesiveness to a base material, particularly a polyphenylene ether resin base material, without impairing the good dielectric properties of the base material. And also has good chemical resistance.
Claims (1)
とニッケル、モリブテン、コバルト、タングステンから
選ばれる少なくとも１種との合金層を有し、該合金層上
に化成処理層、該化成処理層上にカップリング剤防錆層
が設けられていることを特徴とするプリント配線板用銅
箔。1. A copper foil has an alloy layer of iron and at least one selected from nickel, molybdenum, cobalt and tungsten on at least a surface of the copper foil which is adhered to a substrate, and a chemical conversion treatment layer is formed on the alloy layer. A copper foil for printed wiring boards, characterized in that a coupling agent rustproof layer is provided on the chemical conversion treatment layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24088694A JPH0874090A (en) | 1994-09-09 | 1994-09-09 | Copper foil for printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24088694A JPH0874090A (en) | 1994-09-09 | 1994-09-09 | Copper foil for printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0874090A true JPH0874090A (en) | 1996-03-19 |
Family
ID=17066163
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24088694A Pending JPH0874090A (en) | 1994-09-09 | 1994-09-09 | Copper foil for printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0874090A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002030481A (en) * | 2000-07-19 | 2002-01-31 | Nippon Denkai Kk | Copper or copper alloy foil and its production method |
| JP2007165674A (en) * | 2005-12-15 | 2007-06-28 | Fukuda Metal Foil & Powder Co Ltd | Copper foil for flexible printed wiring board for cof |
| JP2009242945A (en) * | 2008-03-31 | 2009-10-22 | Ls Mtron Ltd | Surface treating method of copper foil for printed circuit, copper foil produced by the same, and plating apparatus |
| WO2013042438A1 (en) * | 2011-09-21 | 2013-03-28 | Dic株式会社 | Epoxy resin, curable resin composition and cured product thereof, and printed wiring substrate |
| JP2015173302A (en) * | 2013-07-16 | 2015-10-01 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed-circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58115047A (en) * | 1981-12-28 | 1983-07-08 | 石川島播磨重工業株式会社 | Powder raw material baking equipment |
| JPS60636U (en) * | 1983-06-17 | 1985-01-07 | 日本電気株式会社 | multiplication circuit |
| JPH0416706A (en) * | 1990-05-11 | 1992-01-21 | Hitachi Ltd | Image inspecting apparatus |
-
1994
- 1994-09-09 JP JP24088694A patent/JPH0874090A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58115047A (en) * | 1981-12-28 | 1983-07-08 | 石川島播磨重工業株式会社 | Powder raw material baking equipment |
| JPS60636U (en) * | 1983-06-17 | 1985-01-07 | 日本電気株式会社 | multiplication circuit |
| JPH0416706A (en) * | 1990-05-11 | 1992-01-21 | Hitachi Ltd | Image inspecting apparatus |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002030481A (en) * | 2000-07-19 | 2002-01-31 | Nippon Denkai Kk | Copper or copper alloy foil and its production method |
| JP4524026B2 (en) * | 2000-07-19 | 2010-08-11 | 日本電解株式会社 | Copper or copper alloy foil and method for producing the same |
| JP2007165674A (en) * | 2005-12-15 | 2007-06-28 | Fukuda Metal Foil & Powder Co Ltd | Copper foil for flexible printed wiring board for cof |
| JP4660819B2 (en) * | 2005-12-15 | 2011-03-30 | 福田金属箔粉工業株式会社 | Copper foil for flexible printed wiring boards for COF |
| JP2009242945A (en) * | 2008-03-31 | 2009-10-22 | Ls Mtron Ltd | Surface treating method of copper foil for printed circuit, copper foil produced by the same, and plating apparatus |
| WO2013042438A1 (en) * | 2011-09-21 | 2013-03-28 | Dic株式会社 | Epoxy resin, curable resin composition and cured product thereof, and printed wiring substrate |
| JP5293911B1 (en) * | 2011-09-21 | 2013-09-18 | Ｄｉｃ株式会社 | Epoxy resin, curable resin composition, cured product thereof, and printed wiring board |
| CN103492450A (en) * | 2011-09-21 | 2014-01-01 | Dic株式会社 | Epoxy resin, curable resin composition and cured product thereof, and printed wiring substrate |
| US9125309B2 (en) | 2011-09-21 | 2015-09-01 | Dic Corporation | Epoxy resin, curable resin composition and cured product thereof, and printed wiring board |
| JP2015173302A (en) * | 2013-07-16 | 2015-10-01 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed-circuit board |
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