JPH08255814A - Semiconductor device of tape carrier type - Google Patents

Abstract

PURPOSE: To provide a semiconductor device of film carrier type which is simple in manufacturing process, high in connection reliability, and easily checked. CONSTITUTION: A semiconductor device of film carrier type is provided with a hole cut in an insulating film 2 where an LSI 1 is arranged, a wiring connected to the LSI 1, and an external connecting terminal, wherein the external connecting terminal 3 is composed of a through-hole 10 and a metal film formed on the inner wall of the through-hole 10, and solder fed onto a wiring board is made to creep up in the through-hole 10 for making mechanical and electrical connections.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device using an integrated circuit tape carrier represented by, for example, an LSI, which is used in electronic equipment such as an information processing device.

[0002]

2. Description of the Related Art In recent years, the degree of integration of integrated circuits used in information processing apparatuses and the like has been steadily increasing, and accordingly, LSI packages have also become dual in line packages (Dual in Line Packages).
age (hereinafter, referred to as DIP), Quad Flat Pack (hereinafter, referred to as QFP), Pin Grid Array (Pin Grid A)
The density has been increasing to rray (hereinafter PGA). In recent years, in order to further increase the density, LSI
To connect the tape carrier package (Tape
CarrierPackage (hereinafter referred to as TCP) is used.

One example is shown in US Pat. No. 4,658,331. Now, this example will be described with reference to FIG. According to this publication, the lead 106 attached to the IC chip 105 is connected to the circuit board 1 by the pressure pad 12.
Outer lead bonding on 03 (hereinafter OL
B) The pad 104 is pressed and electrically connected. The pressure pad 12 is integrated with the heat conducting plate 101, and the heat generated from the IC chip 105 is exhausted from the heat conducting plate 101.

[0004]

The PGA, which is called a high-density package, has input / output (I / O) pins on the back surface of the substrate and is mounted on a wiring substrate by soldering or the like. In the inspection of the soldering in the state described above, the PGA itself became invisible, and the inspection based on the external appearance could not be performed.

[0005] Also, the above-mentioned US Patent No. 4,658,331.
In the technique described in Japanese Patent Application Laid-Open Publication No.
4 and the lead 106 are pressed against each other to make an electrical connection.
The reliability of the connection was low, causing a great loss in the reliability of the device.

It is an object of the present invention to provide a semiconductor device using a tape carrier which simplifies the manufacturing process of the device.

Another object of the present invention is to provide a semiconductor device using a tape carrier which is capable of visually confirming the picking up of solder and improving the efficiency of inspection.

Another object of the present invention is to provide a semiconductor device using a tape carrier for improving the reliability of connection between a film carrier and a wiring board.

[0009]

A first semiconductor device using the tape carrier of the present invention is an insulating tape having a through hole and having wiring on its surface, and one end of the wiring on the insulating film. A semiconductor chip (hereinafter referred to as LSI) having connected input / output terminals, and a metal film provided on the side wall of the through hole connected to the other end of the wiring on the insulating film are included.

A second semiconductor device using the tape carrier of the present invention is in close contact with the metal film in the through hole in the first semiconductor device using the tape carrier and is electrically connected to a pad on the wiring board. Equipped with solder.

In a third semiconductor device using the tape carrier of the present invention, the composition of the solder in the second semiconductor device using the tape carrier contains at least one of tin, lead and gold as a main component. It is characterized by

[0012]

Embodiments of the present invention will now be described in detail with reference to the drawings.

Referring to FIG. 1 and FIG. 2, an embodiment of the present invention is an example of an insulating film 2 having a thickness of 100 μm (μm) and an example of a semiconductor chip mounted in a hole formed in the center of the insulating film 2. LSI1, this LSI1
The inner lead bonding portion (hereinafter referred to as ILB portion) 9 connected to the input / output terminals, the inner lead 4 having the ILB portion 9 at its tip, the LSI 1 and the wiring board 8 connected to the inner lead 4 together with the inner lead 4. Outer leads 5 to be electrically connected, through holes 10 located at the tips of outer leads 5 and penetrating insulating film 2, and the same type of metal as outer leads 5 provided on the side walls of through holes 10. An external connection terminal (OLB) 3 made of a metal film 6 is provided.

A conductor of copper (Cu) or the like has a width of 40 microns (μ) on the insulating film 2 having a thickness of 100 μm (μm).
The m) outer leads 5 are wired. Insulation film 2
A hole larger than the LSI1 is formed in the center of the so that the LSI1 can be mounted. The LSI 1 is set in this hole, the input / output terminals of the LSI 1 and the inner leads 4 are connected, and the LSI and the insulating film carrier 2 are mechanically and electrically connected. The inner lead 4 and the outer lead 5 electrically connect the LSI 1 and the wiring board 8, respectively.

On the other hand, an outer lead bonding portion (OLB portion) 3 is provided at the tip of the outer lead. The OLB portion 3 is a through hole 10 penetrating the insulating film 2, and its side wall is metallized with the same conductor as the outer lead 5. The shape of the through hole 10 is not limited, such as a circular shape or a square shape. Also,
The cross-sectional shape of the through hole 10 is not limited to a rectangle, a trapezoid, or the like, but the size of the opening of the through hole on the surface facing the wiring board is preferably about φ100 μm (μm).

Next, a method of filling the through hole 10 of the OLB portion 3 with solder (solder) will be described in detail with reference to FIG.

Referring to FIG. 3, solder (solder) 7 is provided on the side wall of through hole 10 formed in insulating film 2.
Is provided with a metal film 6 which is easy to get wet. The metal film 6 surrounds the through hole not only at the through hole 10 but also around the through hole on the front and back of the insulating film 2. This is for further increasing the contact area of the solder (solder). The solder (solder) 7 is filled in the through hole 10 to electrically and mechanically connect the wiring board 8 and the OLB portion 3 on the insulating film 2. The composition of the solder (solder) 7 is tin (Sn) 6
3% / lead (Pb) 37% eutectic solder, tin (Sn) 5
% / Lead (Pb) 95%, gold (Au) 20% / tin (S
n) High-temperature solder (solder) such as 80% is used.

Next, the process of connecting the film carrier to the wiring board 8 will be described in detail with reference to FIG.

Referring to FIG. 4A, solder (solder) 7 is supplied to pads 11 of wiring board 8. The pad 11 is connected to an inner layer pattern wired in the wiring board 8, and is further connected to the outside.

Next, referring to FIG. 4B, the positioning of the wiring board 8 and the tape carrier is performed so that the OLB portion 3 and the pad 11 of the board are 11: 1. next,
The whole is heated to 200 to 250 ° C and solder (solder)
7 is melted, and solder (solder) 7 is formed in the through hole 10.
Let it rise. Since the through-hole 10 is provided with the metal film 6 which makes it easy for the solder (solder) to get wet, it is very easy to lift up. Further, since the metal film 6 is connected to the wiring (outer lead 5) on the film carrier, it can be electrically connected to the LSI 1.
As described above, the embodiment of the present invention has an effect that the manufacturing process is simplified. In addition, since it is easy to confirm the state where the solder (solder) 7 is filled in the through hole 10, there is an effect that the inspection method is simplified.

[0021]

As described above, the through hole is provided in the tape carrier, and the connection between the substrate and the film carrier is made by connecting the solder (solder) in the through hole to thereby increase the manufacturing process of the device. It was very simple and easy to manufacture. Also, solder (solder) 8
There is also an effect that the inspection can be performed very easily because the appearance of the rising state can be confirmed. Further, since the film carrier and the wiring board are connected by solder (solder), the reliability can be improved. Also, the connection can be confirmed by confirming the solder (solder) pick-up in the through hole. This made the inspection much easier.

[Brief description of drawings]

FIG. 1 is a perspective view showing an embodiment of the present invention.

FIG. 2 is a cross-sectional view showing a state cut along AA ′ in the embodiment of FIG.

FIG. 3 is an enlarged sectional view showing an enlarged section of an outer lead bonding portion shown in FIG. 2;

4 (A) to 4 (C) are views showing a manufacturing process of an outer lead bonding portion shown in FIG. 3;

FIG. 5 is a diagram showing an example of a conventional technique.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 LSI 2 Insulating film 3 OLB part 4 Inner lead 5 Outer lead 6 Metallization 7 Solder (solder) 8 Wiring board 9 ILB part 10 Through hole 11 Pad 12 Pressure pad 101 Heat conduction plate 103 Circuit board 104 OLB pad 105 IC chip 106 Lead

Claims (3)

[Claims] 1. An insulating tape having a through hole and having wiring on its surface, a semiconductor chip having an input / output terminal connected to one end of the wiring on the insulating film, and the wiring on the insulating film. And a metal film provided on the side wall of the through hole connected to the other end of the semiconductor device using the tape carrier. 2. A semiconductor device using a tape carrier according to claim 1, further comprising a solder which is in close contact with the metal film in the through hole and is electrically connected to a pad on the wiring board. 3. A semiconductor device using a tape carrier according to claim 2, wherein the composition of the solder contains at least one of tin, lead and gold as a main component.